2AOZMYYK-Q30Bluetooth headset

Shenzhen KingAnDa Technology Development Co., Ltd. 2.911 (d)(5)(i) Equipment Type Attestation v1.2 Section 2.911(d)(5)(i) Certification – Equipment Type Company name: Shenzhen KingAnDa Technology Development Co., Ltd. Address: East Block NO. 2, Shangxue Industrial Zone, Bantian Street, Longgang District, Shenzhen, China Product Name: Bluetooth headset FCC ID: 2AOZMYYK-Q30 Model(s): YYK-Q30 2.911(d)(5)(i) Equipment Type We, [Shenzhen KingAnDa Technology Development Co., Ltd. ] (“the applicant”) certify that the equipment for which authorization is sought through certification is not:  Prohibited from receiving an equipment authorization pursuant to § 2.903; of the FCC rules.  Identified as an equipment type in the “Covered List” NOTE 1 Yours sincerely, Name: Li Weilin Date: 2024-10-14 Title and Company name: Director NOTE 1 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Shenzhen KingAnDa Technology Development Co., Ltd. 2.911 (d)(5)(ii) Applicant Attestation v1.2 Section 2.911(d)(5)(ii) Certification – Applicant (Covered List ) Company name: Shenzhen KingAnDa Technology Development Co., Ltd. Address: East Block NO. 2, Shangxue Industrial Zone, Bantian Street, Longgang District, Shenzhen, China Product Name: Bluetooth headset FCC ID: 2AOZMYYK-Q30 Model(s): YYK-Q30 2.911(d)(5)(ii) Applicant filing We, [Shenzhen KingAnDa Technology Development Co., Ltd.] (“the applicant”) certify that, as of the date of the filing of the application, the applicant is not identified NOTE 1 on the “Covered List” NOTE 2 , established pursuant to § 1.50002 of this chapter, as an entity producing covered communications equipment. Yours sincerely, Name: Li Weilin Date: 2024-10-14 Title and Company name: Director NOTE 1 Delete option not applicable to this application. NOTE 2 “Covered List”; is the List of Equipment and Services Covered By Section 2 of The Secure Networks Act, available at https://www.fcc.gov/supplychain/coveredlist References; 1) 986446 D01 Covered Equipment v01 https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=325672 2) Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threats-to-the-com munications-supply-chain-through-the

Shenzhen KingAnDa Technology Development Co., Ltd. 2.911 (d)(7)USA Agent v1.2 Section 2.911(d)(7) USA Agent for Service of Process Company name: Shenzhen KingAnDa Technology Development Co., Ltd. Address: East Block NO. 2, Shangxue Industrial Zone, Bantian Street, Longgang District, Shenzhen, China Product Name: Bluetooth headset FCC ID: 2AOZMYYK-Q30 Model(s): YYK-Q30 2.911(d)(7) USA Designated Agent for Service of Process We, [Shenzhen KingAnDa Technology Development Co., Ltd. ] (“the applicant”) designate [THREE STONES MEDIA LLC] NOTE1 for the purpose of accepting service of process on behalf of the applicant. Applicant consent: We Acknowledge our consent to accept service of process in the United States for matters related to the applicable equipment, and at the physical U.S. address and email address of the designated agent and acknowledge our acceptance of our obligation to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. Agent obligation: We Acknowledge our obligation to accept service of process in the United States for matters related to the applicable equipment at our physical U.S. address and email address for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. USA Agent Company name: THREE STONES MEDIA LLC Address: 1200 Broadway St. APT 329, Los Angeles, CA90015 FRN: 0033401761 Contact Name: Sijie Zhang Telephone No: +1 267 909 3692 Email: [email protected] Applicant Company name: Shenzhen KingAnDa Technology Development Co., Ltd. Address: East Block NO. 2, Shangxue Industrial Zone, Bantian Street, Longgang District, Shenzhen, China FRN: 0027206952 FCC Grantee Code: 2AOZM Contact Name: Li Weilin Telephone No: +86-15989444337 Email: [email protected] Signature: Signature: S俨沪� Shenzhen KingAnDa Technology Development Co., Ltd. 2.911 (d)(7)USA Agent v1.2 Title: Manager Title: Manager Date: 2024-10-14 Date: 2024-10-14 NOTE 1: An applicant located in the United States may designate itself as the agent for service of process. Reference; Federal Register document 2022-28263 published on 02/06/23 https://www.federalregister.gov/documents/2023/02/06/2022-28263/protecting-against-national-security-threat s-to-the-communications-supply-chain-through-the

Shenzhen KingAnDa Technology Development Co., Ltd. Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Date: 2024-10-14 Subject; Request for Long Term Confidentiality FCC ID: 2AOZMYYK-Q30 To Whom It May Concern, Pursuant to the provisions of the Commission’s rules Title 47 Sections §0.457 and §0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Operational Description It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Name: Li Weilin Title: Director

Letter of Authorization Company: Shenzhen KingAnDa Technology Development Co., Ltd. Address: East Block NO. 2, Shangxue Industrial Zone, Bantian Street, Longgang District, Shenzhen, China Product Name: Bluetooth headset Model Number: YYK-Q30 FCC Identifier: 2AOZMYYK-Q30 We authorize MiCOM Labs Inc, 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the above named equipment. Any individual within MiCOM Labs is authorized to act on our behalf and take action on the application. We declare that MiCOM Labs Inc, 575 Boulder Court, Pleasanton, California 94566, USA, is allowed to forward all information related to the approval project to the Federal Communication Commission and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Name: Li Weilin Date: 2024-10-14 Title: Director

Model:YYK-Q30 External Model:YYK-Q30

Label&Location

Model:YYK-Q30 Internal Model:YYK-Q30 Model:YYK-Q30

RFExposureReport For ApplicantName:ShenzhenKingAnDaTechnologyDevelopmentCo.,Ltd. Address: EastBlockNO.2,ShangxueIndustrialZone,Bantian Street,LonggangDistrict,Shenzhen,China EUTName:Bluetoothheadset BrandName:YYK ModelNumber:YYK-Q30 IssuedBy CompanyName:BTFTestingLab(Shenzhen)Co.,Ltd. Address: F101,201and301,Building1,Block2,TantouIndustrialPark, TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen, China ReportNumber:BTF240705R00302 TestStandards:47CFRPart2SubpartJSection2.1093 FCCID:2AOZMYYK-Q30 TestConclusion:Pass Samplereceiptdate: 2024-07-05 TestDate:2024-07-06to2024-10-09 DateofIssue: 2024-10-10 Testby: Ssxx.guo/Tester Preparedby:Approvedby: AriaZhang /Projectengineer Ryan.CJ/EMCmanager Note:Allthetestresultsinthisreportonlyrelatedtothetestingsamples.Whichcanbeduplicatedcompletelyforthelegalusewithapprovalof applicant;itshallnotbereproducedexceptinfullwithoutthewrittenapprovalofBTFTestingLab(Shenzhen)Co.,Ltd.,Alltheobjectionsshouldbe raisedwithinthirtydaysfromthedateofissue.Tovalidatethereport,youcancontactus. TestReportNumber:BTF240705R00302 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 2 of 7 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China RevisionHistory VersionIssueDateRevisionsContent R_V02024-10-10Original Note:Oncetherevisionhasbeenmade,thenpreviousversionsreportsareinvalid. TestReportNumber:BTF240705R00302 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 3 of 7 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China TableofContents 1.Introduction.............................................................................................................................................................................................4 1.1IdentificationofTestingLaboratory..................................................................................................................................4 1.2IdentificationoftheResponsibleTestingLocation......................................................................................................4 1.3LaboratoryCondition............................................................................................................................................................4 1.4Announcement........................................................................................................................................................................4 2.ProductInformation...............................................................................................................................................................................5 2.1ApplicationInformation........................................................................................................................................................5 2.2ManufacturerInformation.....................................................................................................................................................5 2.3FactoryInformation...............................................................................................................................................................5 2.4GeneralDescriptionofEquipmentunderTest(EUT)...................................................................................................5 3.TestRequirement..................................................................................................................................................................................6 3.1AssessmentResult................................................................................................................................................................6 TestReportNumber:BTF240705R00302 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 4 of 7 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China 1.Introduction 1.1IdentificationofTestingLaboratory CompanyName:BTFTestingLab(Shenzhen)Co.,Ltd. Address: F101,201and301,Building1,Block2,TantouIndustrialPark,Tantou Community,SonggangStreet,Bao'anDistrict,Shenzhen,China PhoneNumber:+86-0755-23146130 FaxNumber:+86-0755-23146130 1.2IdentificationoftheResponsibleTestingLocation TestLocation:BTFTestingLab(Shenzhen)Co.,Ltd. Address: F101,201and301,Building1,Block2,TantouIndustrialPark,Tantou Community,SonggangStreet,Bao'anDistrict,Shenzhen,China Description: Allmeasurementfacilitiesusedtocollectthemeasurementdataarelocated atF101,201and301,Building1,Block2,TantouIndustrialPark,Tantou Community,SonggangStreet,Bao'anDistrict,Shenzhen,China FCCRegistrationNumber:518915 DesignationNumber:CN1330 1.3LaboratoryCondition AmbientTemperature:20°Cto25°C AmbientRelativeHumidity:45%to55% AmbientPressure:100kPato102kPa 1.4Announcement (1)Thetestreportreferencetothereporttemplateversionv0. (2)Thetestreportisinvalidifnotmarkedwiththesignaturesofthepersonsresponsibleforpreparing, reviewingandapprovingthetestreport. (3)Thetestreportisinvalidifthereisanyevidenceand/orfalsification. (4)ThisdocumentmaynotbealteredorrevisedinanywayunlessdonesobyBTFandallrevisionsareduly notedintherevisionssection. (5)Contentofthetestreport,inpartorinfull,cannotbeusedforpublicityand/orpromotionalpurposeswithout priorwrittenapprovalfromthelaboratory. (6)Thelaboratoryisonlyresponsibleforthedatareleasedbythelaboratory,exceptforthepartprovidedbythe applicant. TestReportNumber:BTF240705R00302 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 5 of 7 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China 2.ProductInformation 2.1ApplicationInformation CompanyName:Shenzhen…

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2.4GHz1608ChipAntenna:RANT1608F245C04 _ Application: WLAN,802.11b/g,Bluetooth,WLAN,etc... Features SMD,highreliability,ultraImpact,Omni-directional... PartnumberInformation RANT1608F245C04 (A)(B)(C)(D)(E)(F) ElectricalSpecification DimensionandTerminalConfiguration No.TerminalName 1Feeding/GNG 2GND/Feeding (A)ProductTypeChipAntenna (B)SizeCode 1.6x0.8mm( ± 0.1mm) (C)MaterialHighKmaterial (D)Frequency2.4~2.5GHz (E)FeedingmodePIFA&SingleFeeding (F)AntennatypeType=04 WorkingFrequencyRange2400~2500MHz Bandwidth120MHz(Min.) PeakGain2.7dBi(Typ.) Impedance50Ohm Returnloss10dB(Min) PolarizationLinear AzimuthBeamwidthOmni-directional OperationTemperature( °C )-40~85 °C ResistancetoSolderingHeats 10sec.(@280 °C ) TerminationNi/Au(Leadless) Dimension(mm) L 1.60±0.10 W 0.80 ± 0.10 T 0.80 ± 0.10 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz1608ChipAntenna:RANT1608F245C04 _ 1 EvaluationBoardReference PCBDimensionAntennaLayoutReference Unit:mm ElectricalCharacteristics ReturnLoss&Radiation ELECTRICALCHARACTERISTICSS11 Radiation ElectricalCharacteristics Freque ncy EfficPercenGain 2400-1.6472.27%2.38 2450-1.3375.34%2.7 2500-1.5972.98%2.59 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz1608ChipAntenna:RANT1608F245C04 _ TapingSpecifications ReelandTapingSpecification ReelSpecification TYPESIZEABCD 16087”4K/Reel 4.0±0.5 4.0±213.5±0.5178±2 TappingSpecification PackagingTypeABWEFGHTψDP PaperType1608 1.90±0.203.50±0.208.0±0.201.75±0.103.5±0.054.0±0.102.0±0.050.75±0.10 1.50±0.10 4.0±0.1 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz1608ChipAntenna:RANT1608F245C04 _ ReliabilityTable TestItemProcedure Requirements CeramicType Remark (Reference) Electrical Characterization Fulfilltheelectrical specification UserSpec. Thermal Shock 1.Preconditioning: 50±10°C/1hr,thenkeepfor24±1hrsatroomtemp. 2.Initialmeasure:Spec:referInitialspec. 3.Rapidchangeoftemperaturetest: -30°Cto+85°C;100cycles; 15minutesatLowercategorytemperature; 15minutesatUppercategorytemperature. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 107 Temperature Cycling 1.Initialmeasure:Spec:referInitialspec. 2.100Cycles(-30°Cto+85°C),SoakMode=1(2Cycle/hours). 3.Measurementat24±2Hoursaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. JESD22 JA104 HighTemperature Exposure 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered;500hours@T=+85°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 LowTemperature Storage 1.Initialmeasure:Spec:referInitialspec. 2.Unpowered:500hours@T=-30°C. 3.Measurementat24±2hoursaftertest. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 108 Solderability (SMDBottomSide) Dippingmethod: a.Temperature:235±5°C b.Dippingtime:3±0.5s Thesoldershouldcover over95%ofthecritical areaofbottomside. IEC60384-21/22 4.10 SolderingHeat Resistance (RSH) Preheatingtemperature:150±10°C. Preheatingtime:1~2min. Soldertemperature:260±5°C. Dippingtime:5±0.5s NoVisibleDamage.IEC60384-21/22 4.10 Vibration5g'sfor20min.,12cycleseachof3orientations Note:Use8"X5"PCB.031"thick7securepointson,onelong sideand2securepointsatcornersofoppositesides.Parts mountedwithin2"fromanysecurepoint.Testfrom10-2000 Hz. NoVisibleDamage.MIL-STD-202 Method204 Mechanical Shock Threeshocksineachdirectionshallbeappliedalongthethree mutuallyperpendicularaxesofthetestspecimen(18shocks) Peakvalue:1,500g’s Duration:0.5ms Velocitychange:15.4ft/s Waveform:Half-sine NoVisibleDamage.MIL-STD-202 Method213 Humidity Bias 1.Humidity:85%R.H.,Temperature:85±2°C. 2.Time:500±24hours. 3.Measurementat24±2hrsaftertestcondition. NoVisibleDamage. Fulfilltheelectrical specification. MIL-STD-202 Method106 Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen. 2.4GHz 1 6 0 8 Chip Antenna: RANT1608F245C04 _ Board Flex (SMD) 1.Mountingmethod: IR-Reflow.PCBSize(L:100×W:40×T:1.6mm) 2.Applytheloadindirectionofthearrowuntilbendingreaches 2mm. NoVisibleDamage.AEC-Q200 005 AdhesionForceof1.8Kgfor60seconds.NoVisibleDamage Magnificationof20Xor greatermaybeemployed forinspectionofthe mechanicalintegrityofthe devicebodyterminalsand body/terminaljunction. AEC-Q200 006 Physical Dimension Anyapplicablemethodusingx10magnification,micrometers, calipers,gauges,contourprojectors,orothermeasuring equipment,capableofdeterminingtheactualspecimen dimensions. Inaccordancewith specification. JESD22 JB100 RevisionHistory RevisionDateContent 12019/03/01NewDatasheet 22020/02/22Add2Dradiationcharacteristic Add:Room 707, Building F, Tongan Zhichuangyuan, xixiang street, Baoan District, Shenzhen.

BTF240705R00301 Page1 / 51 1. Bandwidth 1.1 Test Result 1.1.1OBW Mode TX Type Frequency (MHz) Packet Type ANT 99% OccupiedBandwidth(MHz) Verdict ResultLimit GFSKSISO 2402DH510.843/Pass 2441DH510.841/Pass 2480DH510.847/Pass Pi/4DQPSKSISO 24022DH511.165/Pass 24412DH511.163/Pass 24802DH511.161/Pass 8DPSKSISO 24023DH511.180/Pass 24413DH511.173/Pass 24803DH511.170/Pass 1.1.220dBBW Mode TX Type Frequency (MHz) Packet Type ANT 20dBBandwidth(MHz) Verdict ResultLimit GFSKSISO 2402DH510.956/Pass 2441DH510.955/Pass 2480DH510.956/Pass Pi/4DQPSKSISO 24022DH511.292/Pass 24412DH511.324/Pass 24802DH511.292/Pass 8DPSKSISO 24023DH511.309/Pass 24413DH511.313/Pass 24803DH511.309/Pass BTF240705R00301 Page2 / 51 1.2 Test Graph 1.2.1OBW GFSK_DH5_LCH_2402MHz_Ant1_NTNV GFSK_DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page3 / 51 GFSK_DH5_HCH_2480MHz_Ant1_NTNV Pi/4DQPSK_2DH5_LCH_2402MHz_Ant1_NTNV BTF240705R00301 Page4 / 51 Pi/4DQPSK_2DH5_MCH_2441MHz_Ant1_NTNV Pi/4DQPSK_2DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page5 / 51 8DPSK_3DH5_LCH_2402MHz_Ant1_NTNV 8DPSK_3DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page6 / 51 8DPSK_3DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page7 / 51 1.2.220dBBW GFSK_DH5_LCH_2402MHz_Ant1_NTNV GFSK_DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page8 / 51 GFSK_DH5_HCH_2480MHz_Ant1_NTNV Pi/4DQPSK_2DH5_LCH_2402MHz_Ant1_NTNV BTF240705R00301 Page9 / 51 Pi/4DQPSK_2DH5_MCH_2441MHz_Ant1_NTNV Pi/4DQPSK_2DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page10 / 51 8DPSK_3DH5_LCH_2402MHz_Ant1_NTNV 8DPSK_3DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page11 / 51 8DPSK_3DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page12 / 51 2. MaximumConductedOutputPower 2.1 Test Result 2.1.1Power Mode TX Type Frequency (MHz) Packet Type MaximumPeakConductedOutputPower(dBm) Verdict ANT1Limit GFSKSISO 2402DH5-0.72<=30Pass 2441DH50.20<=30Pass 2480DH5-0.10<=30Pass Pi/4DQPSKSISO 24022DH51.59<=20.97Pass 24412DH52.45<=20.97Pass 24802DH52.18<=20.97Pass 8DPSKSISO 24023DH52.16<=20.97Pass 24413DH53.08<=20.97Pass 24803DH52.76<=20.97Pass Note1:AntennaGain:Ant1:2.70dBi; BTF240705R00301 Page13 / 51 2.2 Test Graph 2.2.1Power GFSK_DH5_LCH_2402MHz_Ant1_NTNV GFSK_DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page14 / 51 GFSK_DH5_HCH_2480MHz_Ant1_NTNV Pi/4DQPSK_2DH5_LCH_2402MHz_Ant1_NTNV BTF240705R00301 Page15 / 51 Pi/4DQPSK_2DH5_MCH_2441MHz_Ant1_NTNV Pi/4DQPSK_2DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page16 / 51 8DPSK_3DH5_LCH_2402MHz_Ant1_NTNV 8DPSK_3DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page17 / 51 8DPSK_3DH5_HCH_2480MHz_Ant1_NTNV BTF240705R00301 Page18 / 51 3. CarrierFrequencySeparation 3.1 Test Result 3.1.1Ant1 Ant1 Mode TX Type Frequency (MHz) Packet Type ChannelSeparation (MHz) 20dBBandwidth (MHz) Limit (MHz) Verdict GFSKSISOHOPPDH51.0100.956>=0.956Pass Pi/4DQPSKSISOHOPP2DH51.0011.324>=0.883Pass 8DPSKSISOHOPP3DH51.0011.313>=0.875Pass BTF240705R00301 Page19 / 51 3.2 Test Graph 3.2.1Ant1 GFSK_DH5_HOPP_Ant1_NTNV Pi/4DQPSK_2DH5_HOPP_Ant1_NTNV BTF240705R00301 Page20 / 51 8DPSK_3DH5_HOPP_Ant1_NTNV BTF240705R00301 Page21 / 51 4. Numberof HoppingFrequencies 4.1 Test Result 4.1.1HoppNum Mode TX Type Frequency (MHz) Packet Type Numof HoppingFrequencies Verdict ANT1Limit GFSKSISOHOPPDH579>=15Pass Pi/4DQPSKSISOHOPP2DH579>=15Pass 8DPSKSISOHOPP3DH579>=15Pass BTF240705R00301 Page22 / 51 4.2 Test Graph 4.2.1HoppNum GFSK_DH5_HOPP_Ant1_NTNV Pi/4DQPSK_2DH5_HOPP_Ant1_NTNV BTF240705R00301 Page23 / 51 8DPSK_3DH5_HOPP_Ant1_NTNV BTF240705R00301 Page24 / 51 5. Timeof Occupancy(DwellTime) 5.1 Test Result 5.1.1Ant1 Ant1 Mode TX Type Frequency (MHz) Packet Type Durationof SinglePulse(ms) Observation Period(s) Numof Pulsein ObservationPeriod Dwell Time(ms) Limit (ms) Verdict GFSKSISOHOPP DH10.40631.600320129.920<=400Pass DH31.66631.600156259.896<=400Pass DH52.91031.600120349.200<=400Pass Pi/4DQPSKSISOHOPP 2DH10.41831.600319133.342<=400Pass 2DH31.66831.600156260.208<=400Pass 2DH52.91831.600116338.488<=400Pass 8DPSKSISOHOPP 3DH10.41631.600320133.120<=400Pass 3DH31.66831.600165275.220<=400Pass 3DH52.92031.600103300.760<=400Pass BTF240705R00301 Page25 / 51 5.2 Test Graph 5.2.1Ant1 GFSK_DH1_HOPP_Ant1_NTNV GFSK_DH1_HOPP_Ant1_NTNV BTF240705R00301 Page26 / 51 GFSK_DH3_HOPP_Ant1_NTNV GFSK_DH3_HOPP_Ant1_NTNV BTF240705R00301 Page27 / 51 GFSK_DH5_HOPP_Ant1_NTNV GFSK_DH5_HOPP_Ant1_NTNV BTF240705R00301 Page28 / 51 Pi/4DQPSK_2DH1_HOPP_Ant1_NTNV Pi/4DQPSK_2DH1_HOPP_Ant1_NTNV BTF240705R00301 Page29 / 51 Pi/4DQPSK_2DH3_HOPP_Ant1_NTNV Pi/4DQPSK_2DH3_HOPP_Ant1_NTNV BTF240705R00301 Page30 / 51 Pi/4DQPSK_2DH5_HOPP_Ant1_NTNV Pi/4DQPSK_2DH5_HOPP_Ant1_NTNV BTF240705R00301 Page31 / 51 8DPSK_3DH1_HOPP_Ant1_NTNV 8DPSK_3DH1_HOPP_Ant1_NTNV BTF240705R00301 Page32 / 51 8DPSK_3DH3_HOPP_Ant1_NTNV 8DPSK_3DH3_HOPP_Ant1_NTNV BTF240705R00301 Page33 / 51 8DPSK_3DH5_HOPP_Ant1_NTNV 8DPSK_3DH5_HOPP_Ant1_NTNV BTF240705R00301 Page34 / 51 6. UnwantedEmissionsIn Non-restrictedFrequencyBands 6.1 Test Result 6.1.1Ref Mode TX Type Frequency (MHz) Packet Type ANT Levelof Reference (dBm) GFSKSISO 2402DH51-1.14 2441DH51-0.17 2480DH51-0.49 Pi/4DQPSKSISO 24022DH51-1.04 24412DH51-0.15 24802DH51-0.46 8DPSKSISO 24023DH51-0.91 24413DH510.04 24803DH51-0.29 Note1:Referto FCCPart 15.247(d) and ANSIC63.10-2020,the channelcontainsthe maximumPSDlevelwas usedto establishthe referencelevel. 6.1.2CSE Mode TX Type Frequency (MHz) Packet Type ANT Levelof Reference (dBm) Limit (dBm) Verdict GFSKSISO 2402DH51-0.17-20.17Pass 2441DH51-0.17-20.17Pass 2480DH51-0.17-20.17Pass HOPPDH51 -0.17-20.17Pass -0.17-20.17Pass Pi/4DQPSKSISO 24022DH51-0.15-20.15Pass 24412DH51-0.15-20.15Pass 24802DH51-0.15-20.15Pass HOPP2DH51 -0.15-20.15Pass -0.15-20.15Pass 8DPSKSISO 24023DH510.04-19.96Pass 24413DH510.04-19.96Pass 24803DH510.04-19.96Pass HOPP3DH51 0.04-19.96Pass 0.04-19.96Pass Note1:Referto FCCPart 15.247(d) and ANSIC63.10-2020,the channelcontainsthe maximumPSDlevelwas usedto establishthe referencelevel. BTF240705R00301 Page35 / 51 6.2 Test Graph 6.2.1Ref GFSK_DH5_LCH_2402MHz_Ant1_NTNV GFSK_DH5_MCH_2441MHz_Ant1_NTNV BTF240705R00301 Page36 / 51 GFSK_DH5_HCH_2480MHz_A…

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TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 1 of 24 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RFTestReport For Applicantname: ShenzhenKingAnDaTechnologyDevelopmentCo.,Ltd. Address: EastBlockNO.2,ShangxueIndustrialZone,Bantian Street,LonggangDistrict,Shenzhen,China EUTname: Bluetoothheadset Brandname: YYK Modelnumber: YYK-Q30 IssuedBy Companyname: BTFTestingLab(Shenzhen)Co.,Ltd. Address: F101,201and301,Building1,Block2,TantouIndustrialPark, TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen, China Reportnumber: BTF240705R00301 Teststandards: FCCCFRTitle47Part15SubpartC(§15.247) FCCID: 2AOZMYYK-Q30 Testconclusion: Pass Samplereceiptdate:2024-07-05 Testdate: 2024-07-06to2024-10-09 Dateofissue: 2024-10-10 Testby: Ssxx.guo/Tester Preparedby: Approvedby: AriaZhang/Project engineer Ryan.CJ/EMCmanager Note:Allthetestresultsinthisreportonlyrelatedtothetestingsamples.Whichcanbeduplicatedcompletelyforthelegalusewithapprovalof applicant;itshallnotbereproducedexceptinfullwithoutthewrittenapprovalofBTFTestingLab(Shenzhen)Co.,Ltd.,Alltheobjectionsshouldbe raisedwithinthirtydaysfromthedateofissue.Tovalidatethereport,youcancontactus. ReportNumber:BTF240705R00301 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 2 of 24 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 RevisionHistory VersionIssuedateRevisionscontent R_V02024-10-10Original Note: Oncetherevisionhasbeenmade,thenpreviousversionsreportsareinvalid. ReportNumber:BTF240705R00301 TotalorpartialreproductionofthisdocumentwithoutpermissionoftheLaboratoryisnotallowed.Page 3 of 24 BTFTestingLab(Shenzhen)Co.,Ltd. F101,201and301,Building1,Block2,TantouIndustrialPark,TantouCommunity,SonggangStreet,Bao'anDistrict,Shenzhen,China Email:[email protected]:+86-755-23146130http://www.btf-lab.comVersion:1/00 TableofContents 1Introduction...............................................................................................................................................................4 1.1LaboratoryLocation..........................................................................................................................................4 1.2LaboratoryFacility............................................................................................................................................4 1.3Announcement..................................................................................................................................................4 2ProductInformation..................................................................................................................................................5 2.1ApplicationInformation.....................................................................................................................................5 2.2ManufacturerInformation.................................................................................................................................5 2.3FactoryInformation...........................................................................................................................................5 2.4GeneralDescriptionofEquipmentunderTest(EUT)......................................................................................5 2.5TechnicalInformation.......................................................................................................................................5 3TestInformation........................................................................................................................................................6 3.1TestStandards.................................................................................................................................................6 3.2SummaryofTest..............................................................................................................................................6 3.3UncertaintyofTest............................................................................................................................................7 3.4Additionsto,deviations,orexclusionsfromthemethod..................................................................................7 3.5TestAuxiliaryEquipment..................................................................................................................................7 3.6TestEquipmentList..........................................................................................................................................7 4TestConfiguration....................................................................................................................................................9 4.1EnvironmentCondition.....................................................................................................................................9 4.2Testmode.........................................................................................................................................................9 4.3TestChannelofEUT........................................................................................................................................9 4.4Testproced…

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