2APRQ-T1EARBUDS FOR SPORT WITH EARHOOK

Shenzhen Winnershine Electronics Co.,Ltd (2023.03.01) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: CONFIDENTIALITY REQUEST FOR (EARBUDS FOR SPORT WITH EARHOOK / T1 / FCC ID: 2APRQ-T1) To Whom It May Concern: This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the Exhibits Long-Term Confidentiality Short-Term Confidentiality NOTE 2 ID Label/Location No No Attestation Statement No No External Photos No ☐ Block Diagram ☒ ☐ Schematics ☒ ☐ Test Report No No Test Setup Photos No ☐ User’s Manual ☐ NOTE 1 ☐ Internal Photos ☐ NOTE 1 ☐ Parts List / Tune Up ☐ ☐ RF Exposure Info No No Operational Description ☒ ☐ Cover Letter(s) No No SDR Software / Security Info ☐ No required to be submitted with this application be permanently withheld from public review. Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. Please contact me if there is any information you may need. Sincerely, Signature: Name: Sean Wong Title: Manager

Shenzhen Winnershine Electronics Co.,Ltd (2023.03.01) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern: We, the undersigned, hereby authorize (Shenzhen CTB Testing Technology Co., Ltd.) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely, Signature: Name: Sean Wong Title: Manager

External Photos

FCC ID LABEL: Label Location: Model No.: T1 FCC ID: 2APRQ-T1 IC: 29089-T1 HVIN: T1

Internal Photos R ANT L ANT

Shenzhen CTB Testing Co., Ltd. FCC ID: 2APRQ-T1 Portable device According to §15.247(e)(i) and §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to KDB447498 D01 General RF Exposure Guidance V06 The 1-g SAR and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)]·[√f(GHZ)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR, where: • f(GHZ) is the RF channel transmit frequency in GHz • Power and distance are rounded to the nearest mW and mm before calculation • The result is rounded to one decimal place for comparison When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test exclusion. EDR: Modulation Channel Freq. (GHz) Conduct ed power (dBm) Conducte d power (mW) Tune-up power (dBm) Max tune-up power (dBm) Max tune-up power (mW) Distance (mm) Result calculatio n SAR Exclusion threshold SAR test exclusion 2.402 -0.522 0.89 0±1 1.00 1.26 <5 0.39023 3.00 YES 2.441 -0.499 0.89 0±1 1.00 1.26 <5 0.39338 3.00 YES 2.480 0.084 1.02 0±1 1.00 1.26 <5 0.39651 3.00 YES 2.402 0.31 1.07 0±1 1.00 1.26 <5 0.39023 3.00 YES 2.441 0.294 1.07 0±1 1.00 1.26 <5 0.39338 3.00 YES 2.480 0.943 1.24 0±1 1.00 1.26 <5 0.39651 3.00 YES 2.402 0.66 1.16 0±1 1.00 1.26 <5 0.39023 3.00 YES 2.441 0.741 1.19 0±1 1.00 1.26 <5 0.39338 3.00 YES 2.480 1.303 1.35 1±1 2.00 1.58 <5 0.49918 3.00 YES GFSK π /4DQPSK 8DQPSK BLE: Modulation Channel Freq. (GHz) Conduct ed power (dBm) Conducte d power (mW) Tune-up power (dBm) Max tune-up power (dBm) Max tune-up power (mW) Distance (mm) Result calculatio n SAR Exclusion threshold SAR test exclusion 2.402 -1.106 0.78 -1±1 0.00 1.00 <5 0.30997 3.00 YES 2.44 -1.457 0.71 -1±1 0.00 1.00 <5 0.31241 3.00 YES 2.480 -1.527 0.70 -1±1 0.00 1.00 <5 0.31496 3.00 YES GFSK Conclusion: For the max result : 0.49918≤ FCC Limit 3.0 for 1g SAR.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245H08 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type H08 版本 VERSION ： V1.6 日期 ISSUE DATE ： 2022/01/05 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 11261台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245H08 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 H 08 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 08 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245H08 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.75 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 81.46% 1.67 dBi 2.56 dBi 2450MHz 84.75% 1.75 dBi 2.46 dBi 2500MHz 82.68% 1.70 dBi 2.52 dBi Chamber Coordinate System X Y Z 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products shoul…

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Shenzhen CTB Testing Technology Co., Ltd. Report No.: CTB230222030RFX Report Tel: 4008-707-283Web: http://www.ctb-lab.net Page 1 of 35 TEST REPORT Compiled by: Reviewed by: Approved by: Chen Zheng Arron Liu Bin Mei / Director Note: If there is any objection to the inspection results in this report, please submit a written report to the company within 15 days from the date of receiving the report. The test report is effective only with both signature and specialized stamp. This result(s) shown in this report refer only to the sample(s) tested. Without written approval of Shenzhen CTB Testing Technology Co., Ltd. this report can’t be reproduced except in full. The tested sample(s) and the sample information are provided by the client. “*” indicates the testing items were fulfilled by subcontracted lab. “#” indicates the items are not in CNAS accreditation scope. Product Name: EARBUDS FOR SPORT WITH EARHOOK FCC ID: 2APRQ-T1 Trademark: N/A Model Number: T1 Prepared For: Shenzhen Winnershine Electronics Co., Ltd Address: Floor 3, Building 1, 32# JIAHUA Road, BAO'AN Community, YuanShan Street, Long Gang district, Shenzhen 518115 China Manufacturer: Shenzhen Winnershine Electronics Co.,Ltd Address: Floor 3, Building 1, 32# JIAHUA Road, BAO'AN Community, YuanShan Street, Long Gang district, Shenzhen 518115 China Prepared By: Shenzhen CTB Testing Technology Co., Ltd. Address: 1&2/F., Building A, No.26, Xinhe Road, Xinqiao, Xinqiao Street, Bao'an District, Shenzhen, Guangdong, China Sample Received Date: Feb. 13, 2023 Sample tested Date: Feb. 13, 2023 to Feb. 23, 2023 Issue Date: Feb. 23, 2023 Report No.: CTB230222030RFX Test Standards FCC Part15.247 ANSI C63.10:2013 Test Results PASS Remark: This is Bluetooth radio test report. Shenzhen CTB Testing Technology Co., Ltd. Report No.: CTB230222030RFX Report Tel: 4008-707-283 Web: http://www.ctb-lab.net Page 2 of 35 TABLE OF CONTENT Test Report Declaration Page 1. VERSION ........................................................................................................................................ 3 2. TEST SUMMARY ........................................................................................................................... 4 3. MEASUREMENT UNCERTAINTY ................................................................................................. 5 4. PRODUCT INFORMATION AND TEST SETUP ............................................................................ 6 4.1 Product Information .......................................................................................................................... 6 4.2 Test Setup Configuration .................................................................................................................. 6 4.3 Support Equipment........................................................................................................................... 6 4.4 Channel List ..................................................................................................................................... 7 4.5 Test Mode ........................................................................................................................................ 7 4.6 Test Environment ............................................................................................................................. 7 5. TEST FACILITY AND TEST INSTRUMENT USED ....................................................................... 8 5.1 Test Facility ...................................................................................................................................... 8 5.2 Test Instrument Used ....................................................................................................................... 8 6. AC POWER LINE CONDUCTED EMISSION ................................................................................ 10 6.1 Block Diagram Of Test Setup ......................................................................................................... 10 6.2 Limit ................................................................................................................................................ 10 6.3 Test procedure ............................................................................................................................... 10 6.4 Test Result ..................................................................................................................................... 12 7. RADIATED SPURIOUS EMISSION ............................................................................................. 14 7.1 Block Diagram Of Test Setup ......................................................................................................... 14 7.2 Limit ................................................................................................................................................ 14 7.3 Test procedure ............................................................................................................................... 15 7.4 Test Result ..................................................................................................................................... 16 8. BAND EDGE AND RF COUNDUCTED SPURIOUS EMISSIONS ............................................... 23 8.1 Block Diagram Of Test Setup ......................................................................................................... 23 8.2 Limit ................................................................................................................................................ 23 8.3 Test procedure ............................................................................................................................... 23 8.4 Test Result ..................................................................................................................................... 24 9. COUDUCTED OUTPUT POWER ......................................…

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Radiated Emission Below 1G Above 1G Conducted emissions