2BCI9-YT6500thickness gauge

GuangdongSanenshiIntelligentTechnologyCo., Ltd. Theinformationprovidedin thisletteris basedon thereferencedrulepartsof Title47 of theCFRas wellas KDB986446D01. Anexpirationdateforthisletterdoesnotexist.In casetheU.S.agentchanges,thegranteeis obligatedto notifytheFCC. FederalCommunicationsCommission Authorizationand EvaluationDivision EquipmentAuthorizationBranch 7435 OaklandMills Road Columbia,MD 21046 11/17/23 U.S. AgentDesignation FIBRAINsp. z o.o. acknowledgestheir consentfor the followingcontactlocatedin the UnitedStatesto act as their agent for serviceof processfor the equipmentfor whichauthorizationis sought(FCC ID: 2BCI9 -YT6500): Applicant:GuangdongSanenshiIntelligentTechnologyCo., Ltd. Companyname: GuangdongSanenshiIntelligentTechnologyCo., Ltd. ProductDescription:thicknessgauge Granteecode:2BCI9 FCC ID:2BCI9-YT6500 FRN: 0034135319 ContactName:ZhiyongHuang Address:6-8/F,BuildingB33,Low-CarbonHeadquartersPark,400XinchengAvenue,Zengcheng District,Guangzhou,P.R.China. TelephoneNo: +86-18207556812 Email: [email protected] Nameand companyof U.S. agent:REP AmericaLLC PhysicalU.S. addressof agent:REP AmericaLLC, Ben XU, 6510 S AcademyBlvd, Ste A #523, ColoradoSprings,CO 80906 FRN of U.S. agent:0034192500 Email addressof U.S. agent:[email protected] REP AmericaLLCacknowledgestheir obligationto acceptserviceof processon behalfof the Applicant. The Applicantacceptsits obligationto maintainan agent for serviceof processin the UnitedStatesfor no less than one year after either the granteehas permanentlyterminatedall marketingand importationof the applicable equipmentwithinthe U.S., or the conclusionof any Commission-relatedadministrativeor judicialproceeding involvingthe equipment,whicheveris later. By signingthis form, we confirmthe aboveand that we are awareof the applicationrequirementslisted under§ 2.911 (d)(7) . Sincerely, U.S. agent Applicant SignatureSi gnature Name :Mr Ben XuName :ZhiyongHuang Title :ManagerTitle :Manager Company:REP AmericaLLCDate: 2023/11/17 48_[model] US_Agent_2.911(d)(7)-U, V03

DATE:2023/11/17 FederalCommunicationsCommission Authorization&EvaluationDivision 7345OaklandMillsRoad Columbia,Maryland21046 AuthoritytoActasAgent Onourbehalf,IappointShenzhenPOCETechnologyCo.,Ltd.Address:102BuildingH1 &1/F.,BuildingH,HongfaScience&TechnologyPark,Tangtou,Shiyan,Bao’anDistrict, Shenzhen,Guangdong,Chinatoactasouragentinthepreparationofthisapplicationfor equipmentcertification.Icertifythatsubmitteddocumentsproperlydescribethedeviceor systemforwhichequipmentcertificationissought.Ialsocertifythateachunit manufactured,importedormarketed,asdefinedintheFederalCommunications Commission’sregulationswillhaveaffixedtoitalabelidenticaltothatsubmittedfor approvalwiththisapplication. Forinstanceswhereourauthorizedagentsignstheapplicationforcertificationonour behalf,Iacknowledgethatallresponsibilityforcomplyingwiththetermsandconditionsfor certification,stillresideswithGuangdongSanenshiIntelligentTechnologyCo.,Ltd. Address:6-8/F,BuildingB33,Low-CarbonHeadquartersPark,400Xincheng Avenue,ZengchengDistrict,Guangzhou,P.R.China.(ApplicantNameandaddress) <Signature> Name:ZhiyongHuang Title:manager Company:GuangdongSanenshiIntelligentTechnologyCo.,Ltd.

DATE:2023/11/17 EquipmentAutorisationDivision FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 FCCID:2BCI9-YT6500 ProductName:thicknessgauge RequestforConfidentiality PursuanttoSections0.457and0.459ofthecommission’srules,weherebyrequestthat thefollowingdocumentsbeheldconfidential: (Listherethedocumentsforwhichyouareseekingconfidentiality–forexample...) Schematics Blockdiagram  Operationdescription Thesematerialscontaintradesecretsandproprietaryinformationandarenot customarilyreleasedtothepublic.Thepublicdisclosureofthisinformationmightbe harmfultothecompanyandprovideunjustifiedbenefitstoourcompetitors. <Signature> Name:ZhiyongHuang Title:manager Company:GuangdongSanenshiIntelligentTechnologyCo.,Ltd.

FCCID:2BCI9-YT6500 GuangdongSanenshiIntelligentTechnologyCo.,Ltd. ModelConfirmationLetter We,GuangdongSanenshiIntelligentTechnologyCo.,Ltd.,certifythe product:thicknessgauge,ModelNo.:YT6500,YT5100 、 YT5110 、 YT5200 、 YT5280 、 YT6300 、 YT8200 、 YT8280 、 YT8300 、 YT8500 Theproducthasmanymodels,onlythemodelnameisdifferent, andtheotherpartssuchasthecircuitprinciple,pcbandelectrical structurearethesame..Testsamplemodel:YT6500 Signiture:ZhiyongHuang GranteeContact:+86-18207556812 CompanyName:GuangdongSanenshiIntelligentTechnologyCo., Ltd. Date:2023/11/17

FCCID:2BCI9-YT6500 External FCCID:2BCI9-YT6500 FCCID:2BCI9-YT6500 FCCID:2BCI9-YT6500

Label:50*30mm ProductName:thicknessgauge Model/Typereference:YT6500 FCCID:2BCI9-YT6500 Sanenshi

FCCID:2BCI9-YT6500 Internal FCCID:2BCI9-YT6500 FCCID:2BCI9-YT6500 FCCID:2BCI9-YT6500

Page1of1 RFExposureEvaluationReport 1RFEXPOSURE ProductName:thicknessgauge ModelNo: YT6500,YT5100,YT5110,YT5200,YT5280,YT6300,YT8200,YT8280, YT8300,YT8500 FCCID:2BCI9-YT6500 1.1LIMITS The1-gand10-gSARtestexclusionthresholdsfor100MHzto6GHzattestseparationdistances ≤50mmaredeterminedby: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance,mm)]· [√f(GHz)]≤3.0for1-gSARand≤7.5for10-gextremitySAR,where f(GHz)istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation 17 Theresultisroundedtoonedecimalplaceforcomparison Thetestexclusionsareapplicableonlywhentheminimumtestseparationdistanceis≤50mmand fortransmissionfrequenciesbetween100MHzand6GHz.Whentheminimumtestseparation distanceis<5mm,adistanceof5mmisappliedtodetermineSARtestexclusio 1.2EUTRFEXPOSUREEVALUATION OperationalMode:EDR Channel (MHz) MaximumPeak Conducted OutputPower (dBm) Tuneup tolerance (dB) Maximum tune-up Power (dBm) Maximum tune-up Power (mW) Calculated value Exclusion threshold 2402-3.49 ±1 -2.490.5640.1753 Conclusion:thecalculatedvalue≤3.0,SARisexempted.

承認書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245W36 規格 DESCRIPTION ： Antenna 3216 M-Ant 2.45G Type 36 版本 VERSION ： V2.2 日期 ISSUE DATE ： 2018/01/30 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 LUCKY SOUND TECHNOLOGY CO.,LTD ONEWAVE TECHNOLOGY CO., LTD. 2/11 For Bluetooth / WLAN A 3216 antenna pplications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 1.23 ± 0.20 P/N: WAN3216F245W36 ONEWAVE TECHNOLOGY CO., LTD. 3/11 Part Number Information WAN 3216 F 245 W 36 A B C D E F A Product Series Antenna B Dimension L x W 3.2X1.6mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type=36 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245W36 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.34dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) ONEWAVE TECHNOLOGY CO., LTD. 4/11 2. Recommended PCB Pattern 1.Evaluation Board Dimension 2.Evaluation Board Dimension (若淨空區夠大，建議使用此Layout，效能較佳) Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度±1%以下的電感、電容、電阻 ONEWAVE TECHNOLOGY CO., LTD. 5/11 1.Layout Dimensions in Clearance area(Size=5.2*5.0mm) 50 ohm transmission Line Matching Circuit 2.Layout Dimensions in Clearance area(Size=8.2*5.0mm) (若淨空區夠大，建議使用此Layout，效能較佳) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) ONEWAVE TECHNOLOGY CO., LTD. 6/11 3. Measurement Results Return Loss ONEWAVE TECHNOLOGY CO., LTD. 7/11 Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 55.21 % 1.25 dBi5.32 dBi 2450MHz 66.45 % 1.34 dBi5.21 dBi 2500MHz 57.53 % 1.28 dBi5.29 dBi Chamber Coordinate System Y Z X ONEWAVE TECHNOLOGY CO., LTD. 8/11 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C ONEWAVE TECHNOLOGY CO., LTD. 9/11 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 ONEWAVE TECHNOLOGY CO., LTD. 10/11 6.Packaging Information  Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 8.0 ±0.30 1.80 ±0.05 3.51 ±0.10 1.59 ±0.10 4.00 ±0.05 3.50 ±0.05 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.25 ±0.05  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2…

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FCCID:2BCI9-YT6500 ConductedEmissionatACpowerline Emissionsinfrequencybands(below1GHz) FCCID:2BCI9-YT6500 Emissionsinfrequencybands(above1GHz)