2BFYM-TWS122LOPEN EAR SPORT HOOK TRUE WIRELESS EARBUDS

Left earbud: FCC ID: 2BFYM-TWS122L Right earbud: FCC ID: 2BFYM-TWS122R

BLOCK DIAGRAM SPEAKER ANT 2402MHZ-2480MHZ XTAL 24MHZ FLASH OSCILLATOR DAC AC7023D BATTERY 3.3V-4.2V POWER

JINGSHAN JINGYANG ELECTRONICS CO., LTD ADD: Group 1, Sanyang Village, Sanyang Town, Jingshan City, Jingmen City, Hubei Province, China Tel: +86-15212750567 Email: [email protected] Product Similarity Declaration Date: 2024-8-6 To: FEDERAL COMMUNICATIONS COMMISSIONS Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 Dear Sir/Madam, We, JINGSHAN JINGYANG ELECTRONICS CO., LTD, hereby declare that we have a product named as OPEN EAR SPORT HOOK TRUE WIRELESS EARBUDS, model: PATW-1031-BK, FCC ID: 2BFYM-TWS122L, was tested by Bay Area Compliance Laboratories Corp. (Shenzhen), Meanwhile, for our marketing purpose, we would like to list a series model (TWS122) on reports and certificate, all the models are identical in electrically. The difference between PATW-1031-BK and TWS122 are the model name(PATW-1031-BK is the customer's model, TWS122 is the model of the applicant). We confirm that all information above is true, and we’ll be responsible for all the consequences. Please contact me if you have any question. Sincerely, Signature: Printed Name: Ella Fang Title: SALES

Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page1 of 3 EUT EXTERNAL PHOTOGRAPHS Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page2 of 3 Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page3 of 3

Bay Area Compliance Laboratories Corp. (Shenzhen) Project No.: 2401U59519E-RF EXHIBIT A - FCC ID LABEL AND LOCATION FCC ID Label FCC ID Label Location Information The label shown shall be permanently affixed at a conspicuous location on the device and be readily visible to the user at the time purchase (Labeling requirements per 2.925)

Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page1 of 3 EUT INTERNAL PHOTOGRAPHS Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page2 of 3 Antenna Bay Area Compliance Laboratories Corp. (Shenzhen) No.:2401U59519E-RF Page3 of 3

Circuit Description The 24MHz crystal oscillator drives the base of Y1. The modulation provided by AC7023D (U2). The output of AC7023D module has the matching network consisting of C1 and R7 and R5 that limit the harmonic content and effect the proper coupling of the antenna to the output stage. Antenna, Ground and Power Source The antenna consists of a 2.4GHz Chip antenna There is no external ground connection. The ground is only that of the printed circuit board. Electric current is supplied by a 3.7 Volt primary battery Feature: Frequency Range: 2402MHz-2480MHz Modulation Type: GFSK, π/4-DQPSK Antenna Type: Chip antenna Antenna Gain: 1.72dBi

Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.: 2401U59519E-RF-00 TR-EM-RF001 Page 55 of 57 Version 1.0 (2023/10/07) RF EXPOSURE EVALUATION RF EXPOSURE Applicable Standard According to FCC §2.1093 and §1.1307(b) (1), systems operating under the provisions of this section shall be operated in a manner that ensure that the public is not exposed to radio frequency energy level in excess of the Commission’s guideline. According to KDB 447498 D01 General RF Exposure Guidance The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] • [√f(GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR, where 1. f(GHz) is the RF channel transmit frequency in GHz. 2. Power and distance are rounded to the nearest mW and mm before calculation. 3. The result is rounded to one decimal place for comparison. 4. When the minimum test separation distance is < 5 mm, a distance of 5 mm is applied to determine SAR test Exclusion. Measurement Result For worst case: Mode Frequency (MHz) Max tune-up conducted power # (dBm) Max tune-up conducted power # (mW) Distance (mm) Calculated value Threshold (1-g SAR) SAR Test Exclusion BT 2402-2480 0.5 1.12 5 0.4 3 Yes Result: Compliant

B 11 REV: SIZE: CODE: DRAWN: DATED: DATED: CHECKED:QUALITY CONTROL: DATED: DATED: RELEASED: COMPANY:TITLE: DRAWING NO: SHEET: OF SCALE: REVISION RECORD APPROVED: ECO NO: ABD DATE: 1 2 3 4 5 6 DCAB C LTR BLUE TOOTH MCU DC/DC 1243 Y1 C1 0R R7 NC C6 105/16V C7 105/16V 1 DM 1 DP C11 NC/16V R10 NC C14 105 1 VCOM 2 VDDIO 3 PB8/PB6/ADC9 4 PGND 5 SW 6 VBAT 7 LDO_IN 8 BT_AVDD 9 PB2/ADC7/LP_TH1 10 PB1/ADC6/LP_TH0 11 BT_RF 12 BT_OSCI 13 BT_OSCO 14 PC2/USBDM 15 PC0/USBDP 16 MIC0/PA1 17 MIC_LDO 18 DACR 19 DACL 20 DACVSS 0 GND U2 AC7023D C19 106/16V L1 4.7UH/150MA C2 105/16V 1 L- 1 L+ 1 V+ 1 V- 1 TP1 R5 0R 2 1 LED2 WHITE R8 L:0R,R:NC 12 D1 ST0651D4 1 2 3 ANT1 2 1 LED1 BLUE 1 OUTPUT 2 GND MIC1 C21 0R 1 VDD 2 GND1 3 GND2 5 GND3 4 VM U6 SWD1811A C15 104 R26 100R 1 B+ 1 B- C3 NC R1 120NH R2 120NH C4 105 R3 NC 1 VDD 1 GND GND GND OSC24MI OSC24MO BT-ANT-IC BT-ANT GND BT-ANT GND DMDP VCOM DC+5V BAT+3V7 WKUP DPOSC24MIOSC24MO 3V3 DM DACL VCOM DACR MIC-BIAS MIC LEDR/B SW BT-ANT-IC BT-AVDD SW GND R/L-SEL BT-AVDD 3V3 BAT+3V7 DC+5V BT-AVDD DACLDACR DC+5V WKUP LEDR/B R/L-SEL 3V3 MIC MIC-BIAS BAT+3V7 BATT- MIC-BIAS BAT+3V7 S-S+

Not tes t This sam This This e: The information t report. Customer m s report cannot be r mple(s) tested. This s report must not be s report may contai TR-EM-R Applica Addres Report FCC ID Test S t FCC PA Sampl e Produc Model Multip l Trade M Date R Issue D Test R e ▲ In the Prepa r Jojo G u RF Eng marked # is provide model name, addre reproduced except report is valid onl y e used by the custo n data that are not 5F(B-West ) RF001 ant Name: ss: Number: : tandard (s ART 15.247 e Descript ct Type: No.: le Model(s Mark: eceived: Date: esult: e configurat red and Ch uo ineer ed by the applicant, esses, names, trade in full, without prior y with a valid digital omer to claim produ covered by the NV Bay ) , 6F, 7F, the 3rd P Tel: +86- s) 7 tion ) No.: tion tested, hecked By: the laboratory is n emarks etc. are inc r written approval o signature. The digi uct certification, app VLAP accreditation y Area Compli Phase of Wan Li Ind -755-33320018 TEST JINGSHAN Group 1, S Jingmen C 2401U595 2BFYM-TW OPEN EA PATW-1 TWS12 2 Prime Au 2024-06 2024-08 Pass ▲ the EUT co : ot responsible for it luded. of the Company. Un ital signature may b proval, or endorsem and are marked wit ance Laborat o dustrial Building D, Fax: +86-755-33 3 Page 1 of 57 T RE N JINGYAN Sanyang V City, Hubei 519E-RF-00 WS122L AR SPORT 031-BK 2 udio 6-21 8-20 omplied with ts authenticity and t nless otherwise stat be available only un ment by NVLAP or a th an asterisk “▼” ories Corp. (S Shihua Rd, FuTian 320008 www.ba POR NG ELECTR Village, San i Province, 0 HOOK TR U h the standa Ap Na RF this information can ted the results show nder the Adobe soft any agency of the U ”. Shenzhen) Free Trade Zone, aclcorp.com.cn RT RONICS CO yang Town China UE WIRELE ards above. proved By ncy Wang Superviso r n affect the validity wn in this test repor tware above versio U.S. Government. Shenzhen, China Version 1.0 ( O., LTD n, Jingshan SS EARBUD y: r of the result in the rt refer only to the on 7.0. (2023/10/07) n City, DS Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.: 2401U59519E-RF-00 TR-EM-RF001 Page 2 of 57 Version 1.0 (2023/10/07) TABLE OF CONTENTS DOCUMENT REVISION HISTORY ......................................................................................................................... 3 GENERAL INFORMATION ....................................................................................................................................... 4 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ..................................................................................... 4 OBJECTIVE ................................................................................................................................................................... 4 TEST METHODOLOGY .................................................................................................................................................. 4 MEASUREMENT UNCERTAINTY .................................................................................................................................... 5 TEST FACILITY ............................................................................................................................................................. 5 SYSTEM TEST CONFIGURATION .......................................................................................................................... 6 SUMMARY OF TEST RESULTS ............................................................................................................................... 8 TEST EQUIPMENT LIST ........................................................................................................................................... 9 REQUIREMENTS AND TEST PROCEDURES ..................................................................................................... 10 AC LINE CONDUCTED EMISSIONS .............................................................................................................................. 10 RADIATED EMISSIONS ................................................................................................................................................ 12 20 DB EMISSION BANDWIDTH .................................................................................................................................... 15 CHANNEL SEPARATION TEST ..................................................................................................................................... 17 QUANTITY OF HOPPING CHANNEL TEST .................................................................................................................... 18 TIME OF OCCUPANCY (DWELL TIME) ........................................................................................................................ 19 PEAK OUTPUT POWER MEASUREMENT ...................................................................................................................... 20 BAND EDGES .............................................................................................................................................................. 21 ANTENNA REQUIREMENT .................................................................................................................................... 22 TEST DATA AND RESULTS .................................................................................................................................... 23 RADIATED EMISSIONS ................................................................................................................................................ 23 20 DB EMISSION BANDWIDTH .................................................................................................................................... 37 CHANNEL SEPARATION .............................................................................................................................................. 40 NUMBER OF HOPPING FREQUENCY ...........…

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN2012F245C04 規格 DESCRIPTION ： Chip Antenna 2012 L Ant 2.45G Type 04 版本 VERSION ： V1.0 日期 ISSUE DATE ： 2019/11/27 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 2012 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 2.05 ± 0.20 W 1.23 ± 0.20 T 0.45 ± 0.20 P/N: WAN2012F245C04 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 2012 F 245 C 04 A B C D E F A Product Series Antenna B Dimension L x W 2.05X1.23mm ( ± 0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type=04 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN2012F245C04 Central Frequency 2450 MHz Bandwidth 85 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.72 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension (board size 80x40mm) 2 nd Evaluation Board Dimension Evaluation Board Dimension (board size 80x40mm) Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 1.0pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=3.0*5.0mm) FootPrint (Unit : mm)  2 nd Layout Dimensions in Clearance area( Size=8.0*2.5mm) Matching circuit Tuning Component Matching circuit Tuning Component 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2450MHz 70.56 % 1.72dBi 2.26 dBi Chamber Coordinate System Z X Y 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 4000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended produ…

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Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.:2401U59519E-RF-00 Page 1 of 2 TEST SETUP PHOTOGRAPHS Radiated Emissions View (Below 30MHz) Radiated Emissions View (Below 1 GHz) Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.:2401U59519E-RF-00 Page 2 of 2 Radiated Emissions View ( 1-18 GHz) Radiated Emissions View (18-25 GHz)