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AZY-HF-LPB100Embedded WiFi Module

High-Flying Electronics Technology Co.,Ltd
Embedded WiFi Module - FCC ID AZY-HF-LPB100 - High-Flying Electronics Technology Co.,Ltd
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Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
Dec 22, 2013
Application Purpose
Original Equipment
Date of Application
Dec 22, 2013
Equipment Note
Embedded WiFi Module
Frequency Range
2422.00000000 - 2452.00000000
Company
High-Flying Electronics Technology Co.,Ltd
Country
China

Documents & Files

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Users Manual

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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RF Exposure Info

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

High-Flying HF-LPB100 Low Power WiFi Module User Manual Shanghai High-Flying Electronics Technology Co., Ltd www.hi-flying.com - 1 - HF-LPB100 Low Power WiFi Module User Manual V 1.3 Overview of Characteristic  Support IEEE802.11b/g/n Wireless Standards  Based on Self-developed High Cost Effective MCU  Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme  Support UART/SPI/PWM/GPIO Data Communication Interface  Support Work As STA/AP/AP+STA Mode  Support Smart Link Function (APP program provide)  Support Wireless and Remote Firmware Upgrade Function  Support WPS Function  Support Multi-TCP Link (5 Channel) Apllication  Support Soft Key Power Control  Support Internal/External Antenna Option  Single +3.3V Power Supply  Smallest Size: 23.1mm x 32.8mm x2.7mm  FCC/CE Certificated High-Flying HF -LP B100 Low Power WiFi Module User Manual Shanghai High-Flying Electronics Technology Co., Ltd www.hi-flying.com - 2 - TABLE OF CONTENTS LIST OF FIGURES ............................................................................................................................. 6 LIST OF TABLES ............................................................................................................................... 7 HISTORY............................................................................................................................................ 8 1. PRODUCT OVERVIEW ........................................................................................................... 9 1.1. General Description ............................................................................................................ 9 1.1.1 Device Features ............................................................................................................. 9 1.1.2 Device Paremeters ....................................................................................................... 10 1.1.3 Key Application ............................................................................................................ 10 1.2. Hardware Introduction ...................................................................................................... 11 1.2.1. Pins Definition .............................................................................................................. 11 1.2.2. Electrical Characteristics .............................................................................................. 13 1.2.3. Mechanical Size ........................................................................................................... 14 1.2.4. On -board Chip Antenna ............................................................................................... 14 1.2.5. External Antenna ......................................................................................................... 15 1.2.6. Evaluation Kit ............................................................................................................... 15 1.2.7. Order Information ......................................................................................................... 17 1.3. Typical Application ........................................................................................................... 18 1.3.1. Hardware Typical Application ....................................................................................... 18 2. FUNCTIONAL DESCRIPTION .............................................................................................. 20 2.1. Wireless Networking ......................................................................................................... 20 2.1.1. Basic Wireless Network Based On AP (Infrastructure) .................................................. 20 2.1.2. Wireless Network Based On AP+STA .......................................................................... 20 2.2. Work Mode : Transparent Transmission Mode ................................................................ 21 2.3. UART Frame Scheme ........................................................................................................ 22 2.3.1. UART Free-Frame ....................................................................................................... 22 2.3.2. UART Auto-Frame ....................................................................................................... 22 2.4. Encryption ......................................................................................................................... 23 2.5. Power Save Scheme ......................................................................................................... 23 2.6. Parameters Configuration ................................................................................................ 24 2.7. Firmware Update ............................................................................................................... 24 2. 8. GPIO/PWM Function ......................................................................................................... 25 2.9. SOCKET B Function ......................................................................................................... 26 2.10. Multi -TCP Link Connection ........................................................................................... 26 3. OPERATION GUIDELINE ..................................................................................................... 28 3.1. Configuration via Web Accessing .................................................................................... 28 3.1.1. Open Web Management Interface ................................................................................ 28 3.1.2. System Page ............................................................................................................... 28 3.1.3. Work Mode Page ......................................................................................................... 29 3.1.4. STA Setting Page.…

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Cover Letter(s)

High-Flying Electronics Technology Co., Ltd FCC Confidentiality Request Number: CF303 Version: V05 Date: 21-05-2012 (Permanent or also called long term confidentiality is the normal method to keep certain docuements confidential, and may apply to schematics, block diagrams, operational description and bill of materials.) To: Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Pursuant to 47 CFR Section 0.459(a) & (b), we, (the applicant / grantee) Company name High-Flying Electronics Technology Co., Ltd Address Room 511, #7Building, No.365 Chuanhong Road, Pudong, City Shanghai, Country China request for this certification filing under: Grantee Code Product Number FCC ID: AZY -HF-LPB100 to maintain permanent confidentiality for the following documents submitted within this application: (please cross what is applicable, or add other documents, provide the file name and description) Exhibit File Name Description √ Operational Description Operational Description explaining the functioning of the block diagram √ Block Diagrams Block Diagrams showing the systematic building blocks of the EUT √ Schematics Diagrams Schematics showing components, their values and interconnection Bill of Materials List of components used on the PCB’s of the EUT Above materials crossed contain secrets, proprietary and technical information, which would customarily be guarded from competitors under 47 CFR, section 0.457(d)(2). Disclosure or publication or any portion of this company confidential material to other parties could cause substantial competitive harm and provide unjustified benefits for competitors. We understand that pursuant to 47 CFR section 0.457(d)(1)(ii) disclosure of the applicant and all accompanying documentation will not be made before the date of the grant. The documents indicated as confidential above, are not publicly available elsewhere. Attestation: City and Country: Date: Name: (this must be a person) Function:Signature: (or official company stamp) Shanghai, China 2013-12-10 Sen XieGeneral Manager

Cover Letter(s)

High-Flying Electronics Technology Co., Ltd FCC Authorization Letter Number: CF304 Version: V03 Date: 01-08-2011 We, (the approval holder) Company name High-Flying Electronics Technology Co., Ltd Address Room 511, #7Building, No.365 Chuanhong Road, Pudong, City Shanghai, Country China declare that the following representative (agent): Name (person) Tom Chen Company name Shenzhen Anbotek Compliance Laboratory Limited Addresss 1/F., Building 1, SEC Industrial Park, No.0409 Qianhai Road, Nanshan District, City Shenzhen Country China is hereby authorized to apply the following equipment for certification on our behalf: Product Description Embedded Wi-Fi Module Type or Model(s) HF-LPB100 Tradename or Brand(s) High-Flying We also authorize Teleconformity (Mr. M. Koop, Manager Certification, Address: Rietven 31, 7534NH Enschede, the Netherlands) to apply and sign this application for certification, registration or filing on our behalf (as representative agent or certifier). Attestation: City and Country: Date: Name: (this must be a person) Function:Signature: (or official company stamp) Shanghai, China 2013-12-10 Sen XieGeneral Manager

Cover Letter(s)

High-Flying Electronics Technology Co., Ltd FCC Modular Approval Request Number:CF305 Version: V04 Date: 07-08-2012 To the FCC or FCC TCB handling this application Hereby we, Company name (grantee) High-Flying Electronics Technology Co., Ltd Addresss Room 511, #7Building, No.365 Chuanhong Road, Pudong, City / ZIP / State / Country Shanghai, China request modular approval for the certification of our equipment within this application, identified by: FCC ID: AZY-HF-LPB100 The table below contains the justification for modular approval of this equipment: Requirement per 15.212 and KDB 996369 D01 Module Certification Guide v01r03Explanation from grantee (do not write yes / no, but explain why it complies / how it is achieved) 1. The modular transmitter must have its own RF shielding. The module has its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is integrated in chip 88WE8782. 3. The modular transmitter must have its own power supply regulation. Yes, the modular transmitter(88WE8782) chipset has internal PMU (Power Management Unit) which generates power supplies required by the internal circuitry from the battery or support device. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable).. The module meets the FCC antenna requirements, It has an unique connector. 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. The module was tested in a stand-alone configuration via a 10M/100M Ethernet network card. 6. The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: XYZMODEL1” or “Contains FCC ID: XYZMODEL1.” Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. The label position of FCC ID is clearly indicated. Please see the label location. 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. The module is compliant with all applicable FCC rules. Datail instructions are given in the Users Manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. The module complies with the mobile and fixed 20cm separation distance location requirements. Attestation (by grantee) City and Country: Date: Name: (this must be a person) Function: Signature: (or official company stamp) Shanghai, China 2013-12-10 Sen Xie General Manager

Cover Letter(s)

High-Flying Electronics Technology Co., LtdLimited Channel Declaration Number: CF309 Version: V01 Date: 08-09-2011 (This form must be used and submitted for applications concerning equipment that may risk operating on non-U.S. frequencies that not allowed to use in the U.S., or equipment that may risk operating beyond the frequency channels for which it is certified.) To: Federal Communications Commission 7345 Oakland Mills Road Columbia MD 21046 Attention: Application Examiner / Review Engineer Subject: Amount of Channels limited for devices marketed in the US Hereby, we: (the applicant company) Company NameHigh-Flying Electronics Technology Co., Ltd Address:Room 511, #7Building, No.365 Chuanhong Road, Pudong, Postal/Zip:City:ShanghaiState/Province:Country:China declare that this device identified by: Grantee Code (CG)Product Code FCC ID:AZY-HF-LPB100 (below, please provide the channels and frequencies supported by this device) only supports IEEE802.11b/g/n(HT20) channel 1-11 (2412–2462 MHz) and IEEE802.11n(HT40) channel 3-9 (2422–2452 MHz) for marketing and use in the US. The end user will not be able to select any other channel or non US frequency that could violate the restricted bands in the US. (Attestation) (the applicant company or its authorized representative) City and Country:Date:Name: (this must be a person) Function:Signature: (or official company stamp) Enschede, The Netherlands2013-12-17M. Koop (authorized) Manager

External Photos

APPENDIX I (External Photos) Figure 1 The Overall View Figure 2 The Overall View EUT is placed on the host Figure 3 The EUT-Overall View EUT

ID Label/Location Info

Label Location On EUT

ID Label/Location Info

Model Name: Embedded Wi-Fi Module Model No.: HF-LPB100 FCC ID: AZY-HF-LPB100

Internal Photos

APPENDIX II(Internal Photos) Figure 4 PCB of the EUT-Front View Figure 5 PCB of the EUT-Back View Antenna

RF Exposure Info

MPE Calculation FCC ID: AZY-HF-LPB100 Remark: Average ≤ Peak, which means that calculating the power density applying Peak power is worst case. The worst case operation mode generating the highest power in each frequency range is taken for calculation. Frequency range:2412-2462MHzTypical use distance: d ≥20cm Power density limit for mobile devices at 2.4 GHz: S ≤1mW/cm 2 Maximum measured conducted power (Peak): Pconducted =20.94dBm =124.17mW Antenna Gain: G = 2dBi =1.58on the linear scale Calculation: P radiated = P conducted + G linear =20.94dBm +2dBi =22.94dBm =196.79mW Power density S = (P radiated ) / (4π x d 2 ) =196.79/5026 =0.0392mW/cm 2 <1=> below limit Frequency range:2422-2452MHzTypical use distance: d ≥20cm Power density limit for mobile devices at 2.4 GHz: S ≤1mW/cm 2 Maximum measured conducted power (Peak): Pconducted =20.56dBm =113.76mW Antenna Gain: G = 2dBi =1.58on the linear scale Calculation: P radiated = P conducted + G linear =20.56dBm +2dBi =22.56dBm =180.3mW Power density S = (P radiated ) / (4π x d 2 ) =180.3/5026 =0.0359mW/cm 2 <1=> below limit

Test Report

Shenzhen Anbotek Compliance Laboratory Limited FCC ID: AZY-HF-LPB100 Page 1 of 63 Report No.: 201311816F Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com FCC TEST REPORT for High-Flying Electronics Technology Co., Ltd Embedded Wi-Fi Module Model No.: HF-LPB100 Report Number : 201311816F Date of Test : Nov. 18~ Dec. 04, 2013 Date of Report : Dec. 05, 2013 Prepared for : High-Flying Electronics Technology Co., Ltd Address : Room 511, #7Building, No.365 Chuanhong Road, Pudong, Shanghai, China Prepared By : Shenzhen Anbotek Compliance Laboratory Limited Address : 1/F., Building 1, SEC Industrial Park, No.0409 Qianhai Road, Nanshan District, Shenzhen, Guangdong, China Tel: (86) 755-26066544 Fax: (86) 755-26014772 Shenzhen Anbotek Compliance Laboratory Limited FCC ID: AZY-HF-LPB100 Page 2 of 63 Report No.: 201311816F Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com TABLE OF CONTENT Description Page Test Report 1. GENERAL INFORMATION ......................................................................................................... 4 1.1. Description of Device (EUT) .................................................................................................................... 4 1.2. Auxiliary Equipment Used during Test .................................................................................................... 5 1.3. Description of Test Facility ...................................................................................................................... 5 1.4. Measurement Uncertainty ......................................................................................................................... 5 2. TEST METHODOLOGY ............................................................................................................... 6 2.1. Summary of Test Results .......................................................................................................................... 6 2.2. Description of Test Modes ........................................................................................................................ 6 2.3. List of channels: ........................................................................................................................................ 7 3. CONDUCTED EMISSION TEST.................................................................................................. 8 3.1. Block Diagram of Test Setup ................................................................................................................... 8 3.2. Power Line Conducted Emission Measurement Limits (15.207) ............................................................. 8 3.3. Configuration of EUT on Measurement ................................................................................................... 8 3.4. Operating Condition of EUT .................................................................................................................... 8 3.5. Test Procedure .......................................................................................................................................... 9 3.6. Test equipment ......................................................................................................................................... 9 3.7. Power Line Conducted Emission Measurement Results .......................................................................... 9 4. FCC PART 15.247 REQUIREMENTS FOR DSSS & OFDM MODULATION ..................... 12 4.1 Test Setup ................................................................................................................................................ 12 4.2 6dB Bandwidth ........................................................................................................................................ 12 4.3. Maximum Peak output power test .......................................................................................................... 20 4.4. Band Edges Measurement ...................................................................................................................... 28 4.5. Peak Power Spectral Density .................................................................................................................. 41 4.6. Radiated Emissions ................................................................................................................................. 49 5. PHOTOGRAPH ............................................................................................................................. 60 5.1. Photo of Conducted Emission Measurement .......................................................................................... 60 5.2. Photo of Radiation Emission Test .......................................................................................................... 60 Appendix I (2 Pages) Appendix II (1 Page) Shenzhen Anbotek Compliance Laboratory Limited FCC ID: AZY-HF-LPB100 Page 3 of 63 Report No.: 201311816F Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com TEST REPORT Applicant : High-Flying Electronics Technology Co., Ltd Manufacturer : High-Flying Electronics Technology Co., Ltd EUT : Embedded Wi-Fi Module Model No. : HF-LPB100 Serial No. : N/A Trade Mark : High-Flying Rating : DC 3.1V-3.6V, 240mA Measurement Procedure Used: FCC Part15 Subpart C, Paragraph 15.247 The device described above is tested by Shenzhen Anbotek Compliance Laboratory Limited to determine the maximum emission levels emanating from the device and the severe levels of the device can endure and its performance criterion. The measurement results are contained in this test report and Shenzhen Anbotek Compliance Laboratory Limited is assumed full of responsibility for the accuracy and completeness of these measurements. Also, this report shows that the EUT (Eq…

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Test Setup Photos

1. Photo of Conducted Emission Test 2. Photo of Radiated Emission Test

Contact Information

Applicant

Sen Xie(General Manager)
[email protected]86-21-31151498Fax: 86-21-31151498-8008

Technical Contact

TeleconformityMark Koop
[email protected](31)848395876

Rietven 31 · Enschede, Overyssel · Netherlands

Test Firm

Shenzhen Anbotek Compliance Laboratory LimitedDaniel zhu
[email protected]86-755-26014771

Technical Specifications

#Rule PartsFrequency RangePower Output
215C2.42 GHz - 2.45 GHz127.00 mW
Modular Type
Single Modular Approval
Confidentiality
Long Term
Grant Notes
Power Output Listed is Conducted. Modular Approval. The antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with accepted multi-transmitter product procedures. End-users and OEM integrators must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

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