BEJDT-CGPersonal Computer

Thank you for using the LG product. LG has manufactured and tested this product to provide you with a reliable computing environment. Please read this manual carefully before using the computer. This sign calls attention to features and operations that may be dan- gerous to the user. Follow the instruction closely to reduce the risk of bodily harm or damage to the equipment. Danger:Not following the instruction will result in immediate death or serious injury. Warning:Not following the instruction could result in death or serious injury. Caution:Not following the instruction could result in minor or moderate injury and/or damage to the product. Microsoft, MS, MS-DOS, and Windows are trademarks of Microsoft Corporation in the United States and/or other countries. is a trademark of LG. Copyright 2004 LG Electronics, Inc., DigitalMate Co., Ltd. Information in this manual may include technical inaccuracies or typographical errors. Images in this manual are for illustrative purposes only and may be different from the actual product. LG reserves the rights to make improvements and/or changes to the product without notice. Reproducing any or all of the information contained in this publication without written permission is prohibited. MultiNet computer complies with the radio frequency and safety standards of any country or region in which it has been approved for wireless use. 3Contents Contents Contents.................................................................................................................. 3 1. Components ............................................................................................................. 4 2. Installing the computer ............................................................................................. 8 3. Attaching external devices (customer purchased devices) .................................... 10 1. Basics 1. Starting the system setup....................................................................................... 12 2. Booting with a bootable floppy disk........................................................................ 14 3. Setting a password................................................................................................. 15 4. Changing or removing the password ..................................................................... 16 5. Recovering the factory default settings .................................................................. 18 6. Power management setup ..................................................................................... 19 2. System Setup 1. Opening the computer case ................................................................................... 20 2. Main board ............................................................................................................. 21 3. Connectors ............................................................................................................. 22 4. Replacing the CPU................................................................................................. 24 5. Increasing memory................................................................................................. 28 6. Adding a hard disk drive......................................................................................... 32 7. Installing expansion cards...................................................................................... 39 3. System Expansion 1. Basics 4 1-1. Components FG CG DG/CM EG Basics ⓞ ⓞ ⓟ ⓟ ⓡ ⓡ ⓠ ⓡ ⓠ ⓟ ⓣ ⓢ ⓢ ⓣ ⓢ ⓣ ⓞ ⓞ ⓟ ⓡ ⓠ ⓢ ⓤ ⓣ Front view 5Basics ⓞPower buttonturns the power on/off the computer. ⓟPower/ Hard disk drive status indicatorindicates whether the computer is on and the hard disk drive is in use(blinking indicates the hard disk drive is in use). Note:Depending on the hard disk drive, the indicator may not blink and simply goes off during multiple operations. ⓠFloppy disk driveenables reading from and writing to a 3.5 inch floppy disk. ⓡCD-ROM driveenables reading a data, video, or audio CD. (Your computer may have a CD-RW or DVD-ROM drive depending on the model) ⓢAudio jacks Headphone jackconnects to headphones. Microphone jackconnects to a microphone. ⓣUSB connectorsconnects to a USB device or HUB. For example, you can con- nect to a USB mouse, digital camera, or external hard disk drive. Note:Your computer supports USB 2.0. ⓤIEEE 13944 pin connector connects to IEEE 1394 4 pin devices such as digital camcorder. Note: Your computer may have different features and configuration from the comput- ers shown above. 6Basics Rear view CG/DG/CM EG FG Note: Your computer may have different features and configuration from the computers shown above. ⓞ ⓞ ⓞ ⓟ ⓠ ⓟ ⓠ ⓣ ⓤ ⓟ ⓠ ⓡ ⓢ ⓡ ⓡ ⓢ ⓥ ⓥ ⓦ ⓢ ⓣ ⓤ ⓧ ⓧ ⓨⓩ ⓨⓩ ⓣ ⓤ ⓡ ⓥ ⓦ ⓦ ⓧ 7Basics ⓞPower jackconnects to the power cord for supplying power to your computer. ⓟKey board connectorconnects to a PS/2 keyboard. ⓠMouse connectorconnects to a PS/2 mouse. ⓡUSB connectorsconnect to USB devices or hubs. For example, you can connect to a USB mouse, digital camera, or external hard disk drive. Note: Your computer supports USB 2.0. ⓢParallel connectorconnects to a parallel device such as printer or scanner. ⓣSerial connectorconnects to a serial device. ⓤVideo connectorconnects to a monitor. ⓥAudio jacks Microphone jack connects to a microphone. Line-in connects to an external audio device. Speaker jack connects to an external speaker. ⓦLANenables network connection between HUB and UTP (wire connection). ⓧIEEE 1394 6 pin connectorconnects to IEEE 1394 6 pin devices, such as exter-nal hard disk or CD-RW drive. ⓨTV-Out connectorconnects to external devices such as Television. ⓩVideo connectorconnects to a monitor cable. Never disassemble the power supply. There is the risk of fire, electric shock, and/or injuries. 8Basics 1-2. Installing the computer Installing your computer may be easier than you think. Before the installation, be sure to turn off the computer and other peripheral d…

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23System Expansion ℘Power switch, power/ hard disk activity LED connector (JFP1) connects to the power supply. ℜPower connector(JPW1: 4 pins) ℙPower connector (CONN1: 20 pins) connects to the USB on the front of the comput- er. ℝUSB connector(JUSB1: 10 pins) JFP1 ATX1 JPW1 JUSB 1 ,connects to the IEEE 1394(6 pins) on the front of the computer. ℞1394 connector J1394 connects to the head- phone and microphone jacks on the front of the computer. ℟Audio connector(JAUD1: 7 pins) JAUD1 connects and supplies power to the CPU fan. ℠CPU fan(C_FAN1: 3 pins) CPU_FAN If you are attaching only one hard disk drive, be sure to connect it to IDE1. connects to the floppy disk drive. ℚHard disk/CD-ROM drive connectors (IDE1, IDE2: 40 pins) ℛFloppy disk drive connector(FDD1: 34 pins) IDE1 IDE2 FDD1 connects and supplies power to the system fan at the bottom of the computer. TELSystem fan (S_FAN1: 3 pins) SYSTEM_FAN connects 6$7$GHYLFH ⌅6$7$FRQQHFWRU SATA connects VFD. ⌆VFD connector VFD 24System Expansion 3-4 Replacing the CPU (CG/DG/CM/EG models) The shape and replacement method of the CPU fan may be different depending on the model. 1. Clamps on both sides of the CPU fasten the fan tightly to the CPU socket. raise the handle(1) , release the clamps, and then spread them outward(2). 2. After releasing the clamps, lift and remove the CPU fan from the socket. 3. Raise the handle on the CPU socket to unlock the CPU. ℘ Consult your service representatives before replacing the CPU. ℙ 25System Expansion 5. Align the identifying marks at the corners of the new CPU and socket, and carefully install the CPU in the socket. Lower the handle to lock the CPU in place. 6. Lift the clamps and slide them into the rails at the corners of the CPU socket, and place the fan into the socket. Push down the handles to lock the clamps. 4. Lift the CPU straight up. Be careful not to damage the pins at the bottom of the CPU. In some models, you can not lower one of the handles of the clamps all the way down. For removing CPUs in these models, release the clamp on the other side first. For installing CPUs in these models, lock this clamp first. 26System Expansion The shape and replacement method of the CPU fan may be different depending on the model. Replacing the CPU (FG model) ⓞ5elease the clamps as arrows indicate. ⓟAfter releasing the clamps, lift and remove the CPU fan from the socket. ⓠRaise the handle on the CPU socket to unlock the CPU. 27System Expansion ⓡGently lift the CPU straight up to remove. ⓢAlign the identifying marks at the corners of the new CPU and socket, and carefully install the CPU in the socket. Lower the handle to lock the CPU in place. ⓣ 3XVKthe clamps as arrows indicate. 28System Expansion 3-5. Increasing the memory If you run out of memory while using the computer, you may want to increase the amount of memory in your computer. Note Use a 2.5V DDR SDRAM DIMM.(The shape of the memory may be different depend- ing on the model) DDR SDRAM enhances the rate of data transmission of the SDRAM and looks different from SDRAM. DDR About memory Your computer uses DDR(Double Data Rate) SDRAM DIMM(Dual In-Line Memory Module) with 184 pins. Your computer supports Unbuffered DDR SDRAM DIMM of 128MB up to 1024MB in size in each socket, and 2048MB total. Note:Windows 95, 98SE, ME supports memory up to 512MB total. Increasing the memory beyond 512MB in these systems may cause errors while using the computer. Before increasing the memory Static electricity can damage memory modules; be sure to minimize the static electric- ity when replacing memory. Make sure to replace the memory of the same type as the installed memory. DIMM is different from SIMM in that it is configured for 64 bit operation; therefore, your computer can operate with only one DIMM installed. 29System Expansion Purchasing a memory Check the type of memory installed in your computer and refer to the memory configura- tion chart before purchasing a memory. Specification: PC2700/3200(184 pin DDR SDRAM DIMM) Speed: 333MHz(166MHz X 2), 400MHz(200MHz X 2) Size: 256MB, 512MB Memory configuration chart Total memory DIMM 1 DIMM 2DIMM 3DIMM 4DUAL/SINGLE SINGLE DUAL DUAL SINGLE DUAL DUAL DUAL DUAL 512MB 256MB256MB 256MB256MB 256MB 1024MB 256MB256MB256MB256MB 512MB 512MB 512MB512MB 2048MB 512MB512MB512MB512MB 512 (1/4) 256 Your computer supports PC2700/3200 DDR memory. Use Unbuffered DDR SDRAM DIMM only to increase the memory. FSB FrequencySupported memory type 533/800 MHzPC2700/3200-DDR SDRAM 333/400 MHz 30System Expansion Replacing the memory The main board configuration, memory socket, and the shape of memory may be dif- ferent depending on the model. 1. Remove the screws on the real of the computer, and open the computer case. 1. Pull the latch on each side of a memory socket. 2. Align the notch at the bottom of the memory with a protrusion in the middle of the socket, and then insert the memory straight down. Note: Push the latch inward so that the memory is securely locked in the socket. 2. Pull the latch on each side of a memory socket to release the memory. Installing a memory Note:Before opening the case, turn off the computer and peripheral devices, and remove the power cords. 31System Expansion Checking the size of the installed memory The computer automatically recognizes the newly installed memory; therefore, you do not need to change the system setup. Follow the instruction below to check the size of the installed memory. 1. Connect the power cord and other devices, and turn on the computer and monitor. 2. Press Delete when the following logo screen appears. In CMOS Setup Utility, select Advanced BIOS Features. Change Full Screen Logo Show Selectable from Enabled to Disabled. Press F10, and Enter to save the new setting. 3. The computer restarts. Press Esc at the logo screen shown above. If the following screen appears, press Pause to stop and check the size of memorynext to Memory Testing. 4. Press Esc to continue the startup. Press DEL to enter …

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FCC ID : BEJDT-CG POWER OF ATTORNEY To whom it may concern: We the undersigned LG Electronics Inc. hereby authorize ESTECH Co., Ltd.(EST) of Korea to act on our behalf in all matters relating to all processes required in the FCC Part 15C approval and any communication needed with the national authority. Any and all acts carried out by EST on our behalf shall have the same effects as acts of our own. If you have any questions regarding the authorization, please don’t hesitate to contact us. Sincerely yours, Sign: Heung-Soo Lee, Team Leader Tel:82-31-610-5335

LG Electronics Inc. 19-1, cheongho-Ri, Jinwuy-Myun, Pyungtak-City, Kyunggi-Do, 451-713, Korea. TEL : +82-31-610-5335 Federal Communications Commission Authorization and Evaluation Division FCC ID : BEJDT-CG Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, the Applicant hereby requests confidential treatment of information accompanying this Application as outlined below: Schematics Block Diagram The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457, disclosure of this Application and all accompanying documentation will not be made before the data of the Grant for this application. Sincerely, Heung-Soo Lee, Team Leader Tel:82-31-610-5335

1. FRONT 2. REAR 3. PORT

INTERNAL PHOTO 1. MAIN 1.1 Front 1.2 Rear 2. POWER 2.1 Front 2.2 Rear 2.3 Label 3. HDD 3.1 Front 3.2 Rear 4.FDD 4.1 Front 4.2 Rear 5. CDRW/DVD-ROM 5.1 Front 5.2 Rear 6. CPU 6.1 Front 6.2 Rear 7. MEMORY 7.1 Front 7.2 Rear

LG Electronics Inc. FCC ID BEJDT-CG -Operational description-

Compliance Test Report for FCC Company name Address Telephone Product name Model No. Serial No. Test date Testing location Standard □ Class A ■ Class B Test resultOK □ Class A ■ Class B Test resultOK Tested by Reviewed by Abbreviation * Note - This test report is not permitted to copy partly without our permission - This test result is dependent on only equipment to be used - This test result based on a single evaluation of one sample of the above mentioned -DG,DM are same product. ONLY Model name is different Report Number : ESTF150410-003 , Web : www. estech. co. kr Page 1 of 14 Report NumberESTF150410-003 Manufacturer Country of origin Applicant Product 2004-10-11 Personal Computer CG,DG,DM NONE LG Electronics Inc. KOREA Date of issue ESTECH. Co., Ltd. 97-1 Hoiuk-Ri Majang-Myon, Icheon-city, KyungKi-Do, Korea Test item ■ Conducted Emission ■ Radiated Emission FCC PART 15 2002 , ANSI C 63.4 2001 2004-10-01~2004-10-11 OK, Pass = Passed, Fail = Failed, N/A = not applicable LG Electronics USA 2000 Millbrook Dr Lincolnshire, IL 60069 United states 847-941-8373 Measurement facility registration number Senior Engineer J.M. Yang Director T.K. Lee 94696 (Signature) (Signature) 3 4 5 6 8 8 8 9 10 10 10 11 12 14 Appendix 1. Spectral diagram Appendix 2. Phorographs of EUT in side PCB Appendix 3. Block diagram of EUT Appendix 4. Circuit Diagram 7. Photogra phs of test setup ........................................................................... 8. Photogra phs of EUT .................................................................................... 6. Measurement of conducted emission ............................................................ 6.1 Measurement e quipment ........................................................................... 6.2 Environmental conditions ........................................................................... 6.3 Test data ................................................................................................ Report Number : ESTF150410-003 , Web : www. estech. co. kr Page 2 of 14 5. Measurement of radiated emission ............................................................... 5.1 Measurement e quipment ........................................................................... Contents 1. Laboratory Information ................................................................................. 2. Description of EUT ....................................................................................... 3. Test Standards ............................................................................................. 4. Measurement condition ................................................................................. 5.2 Environmental conditions ........................................................................ 5.3 Test data ............................................................................................. ... 1. Laboratory Information 1.1 General 1.2 Test Lab. Corporation Name : ESTECH Co. Ltd Head Office : 3 rd Fl., Chungdam Bldg., 119-1 Chungdam-dong Kangnam-gu , Seoul, Korea (Safety & Telecom. Test Lab) EMC Test Lab : 58-1 Osan-Ri, GaNam-Myon, YeoJoo-Gun, KyungKi-Do, Korea 97-1 Hoiuk-Ri Majang-Myon, Icheon-city, KyungKi-Do, Korea 1.3 Official Qualification(s) MIC : Granted Accreditation from Ministry of Information & Communication for EMC, Safety and Telecommunication KOLAS : Accredited Lab By Korea Laboratory Accreditation Schema base on CENELEC requirements FCC : Filed Laboratory at Federal Communications Commission VCCI : Granted Accreditation from Voluntary Control Council for Interference from ITE This EUT (Equipment Under Test) has been shown to be capable of compliance with the applicable technical standards and is tested in accordance with the measurement procedures as indicated in this report. ESTECH Lab attests to accuracy of test data. All measurement reported herein were performed by ESTECH Co., Ltd. ESTECH Lab assume full responsibility for the completeness of these measurements and vouch for the qualifications of all persons taking them. Report Number : ESTF150410-003 , Web : www. estech. co. kr Page 3 of 14 2. Description of EUT 2.1 Summary of Equipment Under Test Product: Model Number : Serial Number : Manufacturer : Country of origin : Rating : Receipt Date : 2.2 General descriptions of EUT I/O Port : PCI : 3, AGP : 1, Parallel : 1, Serial : 1, VGA : 1, PS/2 Keyboard : 1, PS/2 Mouse : 1, 10/100 Base TX :1, USB : 6, Mic : 2, Speaker : 1, Headphone : 1, Line - in : 1 Memory : Min 256MB & Max 2GB CD-RW / DVD-ROM Drive : 42X / 16X / 8X / 4X HDD : 80GB 2.3 Change Item Power Supply:MAX 220WPower Supply:MAX 250W POWER SUPPLY : MAX 250W AC 100V-127Vac (50/60Hz),5A AC 200V-240Vac (50/60Hz),3A OSC FREQ.:14M/25M/24.576M Report Number : ESTF150410-003 , Web : www. estech. co. kr Page 4 of 14 CPU : Pentium 4 3.0Ghz FSB 800Mhz Before changeAfter change HDD:120GBHDD:80GB CPU:P4 3.4GCPU:P4 3.0G KOREA AC120V ,60Hz 2004-10-01 Personal Computer CG,DG,DM NONE LG Electronics Inc. 3. Test Standards Test Standard : FCC PART 15 (2002) Test Method : ANSI C 63.4 (2001) This standard sets forth uniform methods of measurement of radio-frequency (RF) signals and noise emitted from both unintentional and intentional emitters of RF energy in the frequency range 9 kHz to 40 GHz. Methods for the measurement of radiated and AC power-line conducted radio noise are covered and may be applied to any such equipment unless otherwise specified by individual equipment requirements. These methods cover measurement of certain decides that deliberately radiate energy, such as intentional emitters, but does not cover licensed transmitters. This standard is not intended for certification/approval of avionic equipment or for industrial, scientific, and medical (ISM) equipment These method apply to the measurement of individual units or systems comprised of multiple units This Standard sets out the regulations under which an intentional, unintentional, o…

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TEST SETUP PHOTO 1. Conducted Emission setup photo 1.1. Front 1.2. Rear 2. Radiated Emission setup photo 2.1 Front 2.2. Rear 2.3 Front 2.4. Rear