E2XSWL-2700MMini PCI Card

TEST SETUP PHOTO 1. Conducted Emission setup photo 1.1. Front 1.2. Rear 1.3. setup 2. Radiated Emission setup photo 2.1. Front 2.2. Rear 2.3. setup

MagicLAN5 Utility SWL-2700M/5300M User’s Guide SAMSUNG 2.4/5GHz Wireless LAN Networking Soultions Introduction The MagicLan5 Utility is a user-mode utility designed to edit and add profiles for, as well as display and diagnostics pertaining to a selected SWL-2700M/5300M minipci card (wireless adapter). See also: • System Requirements • Scan Available Networks • Profile Management • TCP/IP Configuration System Requirements • Laptop/ PC containing: • 32-bit CardBus slot (or Desktop PC with PC Card-PCI adapter) • Mini PCI • 32 MB memory or greater • 300 MHz processor or higher • Microsoft Windows 2000, Windows Millennium Edition, Windows 98 Second Edition, Windows XP Scan Available Networks Click the Refresh button on the Wireless Networks tab to scan for available infrastructure and ad hoc networks. Connecting to a different network • Highlight a network name and click the Configure button to connect an available netwo rk. If no configuration profile exists for that network, the Profile Management windo w opens to the General tab. Fill in the profile name and click OK to create the configuration profile for that network. Profile Management Configure the wireless network adapter (wireless card) from the Wireless Networks tab of the MagicLan5 Utility. • Add a profile • Edit a profile • Switch to a different profile • Remove a profile The wireless network adapter works in either infrastructure mode (which uses an access point) or ad hoc mode (a group of stations participating in the wireless LAN). Create or Modify a Configuration Profile To add a new configuration profile, click New on the Wireless Networks tab. To modify a configuration profile, select the configuration from the Profile list and click the Modify button. Profile Management: • Edit the General tab. • Edit the Security tab . • Edit the Advanced tab . To configure a profile for ad hoc or access point (infrastructure) mode, edit the Network Type field on the Advanced tab . Remove a Configuration Profile 1. Go to the Wireless Networks tab. 2. Select the profile to remove from the list of configuration profiles. 3. Click the Remove button. Switching to a different configuration profile 1. To switch to a different profile, go to the Wireless Networks tab. 2. Click on the profile name in the Profile List. 3. Click the Activate button. See also Scan Available Networks . General Tab In the MagicLan5 Utility, access the General tab by clicking Configure, New or Modify on the Wireless Networks tab. Edit the fields in the General tab to configure the configuration profile. Make sure to also edit the Security and Advanced tabs. Profile Name Identifies the configuration profile. This name must be unique. Profile names are not case sensitive. Network Names (SSID) The IEEE 802.11 wireless network name. This field has a maximum limit of 32 characters. Configure a SSID See also: • Configure a Profile for Ad Hoc Mode • Configure a Profile for Access Point (Infrastructure) Mode Ad Hoc Mode Profile Configuration To configure a profile in ad hoc mode, change the Network Type in Advanced tab. For ad hoc mode, modify the settings: • Network Name (on General Tab) • Transmit Power Level • 802.11b Preamble (if using 802.11b) • Wireless Mode When Starting an Ad Hoc Network Make sure to also edit the General and Security tabs. Infrastructure (Access Point) Mode Profile Configuration To configure a profile in infrastructure (access point) mode, change the Network Type in the Advanced tab . For access point mode, modify the settings: • Transmit Power Level • Power Save Mode • 802.11b Preamble (if using 802.11b) • Wireless Mode Make sure to also edit the General and Security tabs. Security Tab In the MagicLan5 Utility, access the Security tab by clicking New or Modify on the Wireless Networks tab. Click the Security tab in the Profile Management window. Edit the fields in the Security tab of Wireless Networks to configure the profile. To define the security mode, select the radio button of the desired security mode. Make sure to also edit the General and Advanced tabs. WPA Enables the use of Wi-Fi Protected Access (WPA). Choosing WPA opens the WPA-EAP drop-down menu. The options include: • TLS • TTLS • PEAP (EAP-MSCHAP V2) WPA-PSK Enables WPA – PSK security. Click on the Configure button and fill in the WPA–PSK . 802.1x Enables 802.1x security. This option requires IT administration. Choosing 802.1x opens the 802.1x EAP type drop-down menu. The options include: • TLS • TTLS • PEAP (EAP-MSCHAP V2) • LEAP WEP Key (Static WEP) Enables the use of WEP keys that are defined on both the access point and the station. To define pre-shared encryption keys, choose the WEP Key radio button and click the Configure button to fill in the Define Pre-Shared Keys window. None No security (not recommended). Using TLS Security To use EAP-TLS security In the MagicLan5 Utility, access the Security tab in the Profile Management window. 1. On the Security tab, choose the WPA radio button. OR: On the Security tab, choose the 802.1x radio button. 2. Choose TLS from the drop-down menu. Enabling TLS security: To use EAP-TLS security, the machine must already have the EAP-TLS certificates downloaded onto it. Check with the IT manager. 1. If EAP-TLS is supported, choose TLS from the drop-down menu on the right, then click the Configure button. 2. Select the appropriate certificate authority from the list. The server/domain name and the login name are filled in automatically from the certificate information. Click OK. 3. Click OK. 4. Activate the profile. Using TTLS Security To use EAP-TTLS security In the MagicLan5 Utility, access the Security tab in the Profile Management window. 1. On the Security tab, choose the WPA radio button. OR: On the Security tab, choose the 802.1x radio button. 2. Choose TTLS from the drop-down menu. Enabling TTLS security: To use EAP-TTLS security, the machine must already have the EAP-TTLS certificates downloaded onto it. Check with the IT manager. 1. If EAP…

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POWER OF ATTORNEY To whom it may concern: We the undersigned SAMSUNG ELECTRO-MECHANICS hereby authorize ESTECH Co., Ltd.(EST) of Korea to act on our behalf in all matters relating to all processes required in the FCC Part 15C approval and any communication needed with the national authority. Any and all acts carried out by EST on our behalf shall have the same effects as acts of our own. If you have any questions regarding the authorization, please don ’t hesitate to contact us. Sincerely yours, Young-Sik Jeon / Senior Engineer SAMSUNG ELECTRO-MECHANICS Tel: +82-31-210-6270 Fax: +82-31-210-5529

Samsung Electro Mechanics 314, Maetan 3-Dong Pal Dal-Ku Suwon City, Kyungki-Do, 442-743 Korea TEL : +82-31-210-6270 FAX : 82-31-210-5529 Federal Communications Commission Authorization and Evaluation Division FCC ID : E2XSWL-2700M Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, the Applicant hereby requests confidential treatment of information accompanying this Application as outlined below: Schematics Block Diagram The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457, disclosure of this Application and all accompanying documentation will not be made before the data of the Grant for this application. Sincerely, YOUNG-SIK JEON / Senior Engineer Samsung Electro Mechanics Tel : 82-31-210-6270 Fax : 82-31-210-5529

American Telecommunications Certification Body Inc. 6731 Whittier Ave, McLean, VA 22101 May 19, 2004 RE: Samsung Electro Mechanics FCC ID: E2XSWL-2700M I have a few comments on this Application. Depending on your responses, kindly understand there may be additional comments. 1.) No Operational Description was uploaded for this device. Please supply an Operational Description. 2.) The Block Diagram does not meet the requirements of 2.1033. Please show any oscillators and their frequency paths in the Block Diagram. 3.) Please segregate the photographs into two Exhibits. The FCC requires an External Photograph and a Internal Photograph exhibit. May I suggest that the photographs with the RF shielding removed be placed in the Internal Photographs exhibit? In addition, the supplied photos are too small. Please provide larger photos for both these exhibits. 4.) The Regulatory Information in the Manual is insufficient. Please provide installation information to the OEM integrator to be certain that 20cm is maintained between the end user and all radiating structures. 5.) Please provide a Confidentiality Request letter for both the Block Diagram and the Schematics 6.) Please be sure to provide the Test Setup Photographs as a separate Exhibit. 7.) Will product that is setup only for Channels 1-11 be shipped to the USA? Equipment that is capable of being used on Channels 12 and 13 is not appropriate for US market, and not Certifiable. 8.) Will this device be classified as a “Module”? If so, then the eight points of DA 00-1407 must be addressed in a separate letter. Please provide if Modular Approval is requested. 9.) The Form 731 does not show any peak RF conducted power. Please specify the peak power found in the band for Form 731. 10.) Please provide an MPE estimation at 20cm for the RF Exposure exhibit. William H. Graff President and Director of Engineering mailto: [email protected] The items indicated above must be submitted before processing can continue on the above referenced application. Failure to provide the requested information may result in application termination. Correspondence should be considered part of the permanent submission and may be viewed from the Internet after a Grant of Equipment Authorization is issued. Please do not respond to this correspondence using the email reply button. In order for your response to be processed expeditiously, you must submit your documents through the AmericanTCB.com website. Also, please note that partial responses increase processing time and should not be submitted. Any questions about the content of this correspondence should be directed to the sender.

FCC ID: E2XSWL-2700M Operational Description This device is a Mini- PCI CARD which operates in the 2.4GHz band, the maximum data rate could be up to 54Mbps which OFDM technique will be applied. If the signal to noise radio is too poor which could not support 54Mbps, the 11Mbps data rate with CCK technique will be applied. This project is seeking the authorization of limited module approval specific to the mobile device such as access point. The transmitter of the EUT is powered by host equipment via a mini-PCI interface. The antenna type used in this product is Printed dipole antenna with UFL antenna connector. The other instruction, please have a look at the users manual.

FCC ID: E2XSWL-2700M Operational Description This device is a Mini- PCI CARD which operates in the 2.4GHz band, the maximum data rate could be up to 54Mbps which OFDM technique will be applied. If the signal to noise radio is too poor which could not support 54Mbps, the 11Mbps data rate with CCK technique will be applied. This project is seeking the authorization of limited module approval specific to the mobile device such as access point. The transmitter of the EUT is powered by host equipment via a mini-PCI interface. The antenna type used in this product is Printed dipole antenna with UFL antenna connector. The other instruction, please have a look at the users manual.

REPORT NO. : ESTRF0405-001 MODEL NO. : SWL-2700M ACCORDING : FCC Guidelines for Human Exposure IEEE C95.1 APPLICANT : SAMSUNG ELECTRO MECHANICS ADDRESS : 314, Maetan 3-Dong Pal Dal-Ku Suwon City, Kyungki-Do, 442-743 Korea ISSUED BY : ESTECH CO., LTD. LAB ADDRESS : 3F, Chungdam Bldg., 119-1 Chungdam-dong, Kangnam-ku, Seoul, Korea. http://www.estech.co.kr Tel : 82-2-549-0485 Fax : 82-2-549-0487 RF EXPOSURE REPORT ESTECH Co., Ltd. RF Exposure Measurement (Mobile Device) 1. Introduction 2. Classification 3. RF Exposure Limit Magnetic Field Strength(A/m) Power Density (mW/cm 2 ) Average Time (minutes) 0.1631.06 F/3006 56 Magnetic Field Strength(A/m) Power Density (mW/cm 2 ) Average Time (minutes) 0.0730.230 F/150030 1.030 F = Frequency in MHz 2.4GHz frequency band is regarded specially as a dangerous band for its heating harmfulness to the human body. That's why microwave oven is operating in this frequency band. The manufacturer whose product is working in this frequency band is obligatory to prove the harmfulness of his product. In this document, we try to prove the safety of radiation harmfulness to the human body for our product. The limit for Maximum Permissible Exposure (MPE) specified in FCC 1.1310 is followed. The Gain of the antenna used in this product is measured in a Fully Anechoic Chamber (FAC), and the maximum total power input to the antenna is measured. Through the Friis transmission formula Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 2 of 4 The antenna of the product, under normal use condition, is at least 20cm away from the body of the user. Warning statement for keeping 20cm separation distance and the prohibition of operating next to a person has been printed on the user's manual. So, this product is classified as the Mobile Device. According to FCC 1.1310: The criteria listed in the following table shall be used to evaluate the environmental impact of human exposure to radio-frequency(RF) radiation as specified in 1.1307(b). LIMITS FOR MAXIMUM PERMISSIBLE EXPOSURE (MPE) - Class A Frequency Range (MHz) Electric Field Strength (V/m) 30 - 300 300 - 1500 1500 - 100,000 61.4 LIMITS FOR MAXIMUM PERMISSIBLE EXPOSURE (MPE) - Class B Frequency Range (MHz) Electric Field Strength (V/m) 30 - 300 300 - 1500 1500 - 100,000 27.5 4. Friis Formula Friis transmission formula : P d = (P out *G) / (4*π*r 2 ) P d = power density in mW/cm 2 P out = output power to antenna in mW G = gain of antenna in linear scale Pi = 3.1416 R = distance between observation point and center of the radiator in cm 5. EUT Operating condition Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 3 of 4 The software provided by Manufacturer enabled the EUT to transmit and receive data at lowest, middle and highest channel individually. Pd is the limit of MPE, 1mW/cm 2 . If we know the maximum Gain of the antenna and the total power input to the antenna, through the calculation, we will know the distance r where the MPE limit is reached. 6. Test Results 6.1 Antenna Gain The maximum Gain measured in Fully Anechoic Chamber is 2.94dBi or 1.968 (numeric). 6.2 Output Power into Antenna & RF Exposure value at distance 20cm: MODE: CCK (802.11b) Channel Channel Frequency (MHz) Output Power to Antenna (mW) Power Density (mW/cm 2 ) Limit of Power Density (mW/cm 2 ) 1241277.9830.0311.0 6243777.0900.0301.0 11246286.2980.0341.0 MODE: OFDM (802.11g) Channel Channel Frequency (MHz) Output Power to Antenna (mW) Power Density (mW/cm 2 ) Limit of Power Density (mW/cm 2 ) 1241274.4730.0291.0 6243782.2240.0321.0 11246277.8040.0301.0 Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 4 of 4 The minimum allowable distance is very close to the enclosure of the antenna and is very far away from the human beign under normal use condition.

Tie ground planes together SWL-2700M C 15Wednesday, April 21, 2004 Title SizeDocument NumberRev Date:Sheet of Samsung Electro Mechanics CO.,LTD 314, Maetan-3Dong, Paldal-Gu,Suwon, Kyunggi-Do, KOREA, 442-743 TEL: 82-31-210-3341 FAX: 82-31-210-5529 SLEEP2 3.3V VCC_ADC 3.3V3.3V_VCO VCC_CORE 3.3V_A 3.3V 2.5V_A VCC_DAC 2.5V_D VCC_CORE 2.5V_D 2.5V_D3.3VVCC_DAC 2.5V_DVCC_CORE SH1 1 0.1uF 10V C127 2.2uF6.3V C126 SH2 1 SH3 1 1uF 6.3 V C128 220pF C130 SH4 1 SH5 1 SH6 1 L16 BK2125LM252 12 C131 22uF C132 22uF R63 30K 1 20.1uF 10V C123 L13 BK2125LM252 12 2.2uF6.3V C124 VR1 LTC3406ES 1 2 34 5 RUN GND SWVIN VFB 2.2uF6.3V C138 L14 BK2125LM252 12 1000pF 25V C133 L15 BK2125LM252 12 Q8 KST3906 1 23 R90100K 1% 12 2.2uF6.3V C129 1uF 6.3V C122 R4 R 12 1000pF 25V C121 100 R92 SH8 1 2.2uH L17 SH7 1 0.1uF 10V C26 AME8805MEFT VR2 23 1 INOUT GND 10K 1% R94 1000pF 25V C139 R113 0 2012 12 2.2uF6.3V C125 0.1uF 10V C27 R65 R 12 W : 8 (0.20mm) L : 170 (4.32mm) L=180 S=5 W=20 W : 8 (0.20mm) L : 320 (8.13mm) W10 L70 Only stuff R125 and R123 with 1.1k 1%, Q13 with CMKT3906, and R124 with 100k for direct RF_Kill feature W : 7 (0.18mm) L : 100 (2.54mm) W : 8 (0.20mm) L : 150 (3.81mm) W : 5 (0.13mm) L : 120 (3.05mm) W : 17 (0.43mm) L : 140 (3.56mm) W : 10 (0.25mm) L : 70 (1.78mm) W : 10 (0.25mm) L : 120 (3.05mm) W : 55 (1.40mm) L : 220 (5.59mm) T : 1.0mm W : 1.0mm L : 1.1mm W : 5 (0.13mm) L : 160 (4.06mm) W : 5 (0.13mm) L : 320 (8.13mm) SWL-2700M C 15Wednesday, April 21, 2004 Title SizeDocument NumberRev Date:Sheet of Samsung Electro Mechanics CO.,LTD 314, Maetan-3Dong, Paldal-Gu,Suwon, Kyunggi-Do, KOREA, 442-743 TEL: 82-31-210-3341 FAX: 82-31-210-5529 ANTA2 ATTEN22 ANTB2 AR5112_2G_TX_OUT3 TX22 AR5112_2G_RX_IN3 AR5112_5G_RX_IN3 RX52 AR5112_5G_TX_OUT3 TX52 PDETECT3 RF_DISABLE2 XBIAS22 XBIAS52 3.3V_A 3.3V_A 3.3V_A 3.3V_A 2.5V_A 3.3V_A 3.3V_A 3.3V_A R511 R 1 2 R52 10K 1 2 C95 C U4 U 1 46 2 37 5 8 9 10111213 GND VPC1VPC2 RF IN GNDRFOUT GND RF OUT RFOUT VCC VCC2VCC1 GND 10pF C99 R28 R 12 Q3 Q 1 2 3 C78 C C517 C C114 1.8pF C80 C 1uF6.3V C144 C118 10pF Q4 Q 2 1 4 3 C86 C R R125 F4 F 1 23 4 L48 2.7nH 12 47 R50 R93 10K 12 C102 C C101 C 1 2 Q6 SGA-8343 1 3 24 1uF 6.3 V C108 R49 1.1K 1 2 F5 12 R517 R 1 2 R505 R 1 2 R32 R 12 C115 120pF R126 R 1 2 STUB1 1 2 IN G 330pF C119 C358 1pF C120 1pF J7 U.FL-R-SMT R89 150 12 R16 R 12 C79 C R512R 12 10pF C134 L1 L 12 C515 C 12 C82 10pF 1 2 C63 C R46 3.57K 1 2 C514 C 12 C518 C 12 R27 R 12 F3 F 42 31 42 31 C93 C 12 J6 U.FL-R-SMT C516 C 12 10pF C104 R518 R 12 R29 R 1 2 R31 R 12 R519 R 12 8.2nH L27 200 1% R51 R R123 L44 3.9nH 1 2 C113 1.8pF R48 47 12 L25 3.3nH 12 Q2 Q 1 32 C350 C 15 uH 10% L43 F8 LFB2H2G4SG7A204 12 34 INOUT GNDGND R122 R 12 8.2nH L28 2.2nH L22 3.3pF C110 L31 18nH 1 2 C C28 18nHL12 1 2 Q14 Q 1 2 3 GND IN OUT R26 R 12 F9 F 1 2 3 4 5 6 HF GNDLFGND COM GND R R39 Q5 KST3906 1 2 3 10pF C21 Q7 KST3904 1 3 2 R34 R 1 2 C100 1.8pF C96 C STUB2 1 2 IN G C87 C C109 330pF MASWSS0094 S1 12 34 5 67 89 10 11 12 13 GNDGND V1ANT1 GND ANT2V2 GNDGND RX GND TX GND C116 10pF C91 C LX5510 U5 1 2 3 45 6 7 8 16 10 11 913 1214 15 17 NC RF IN RF IN NCNC VB1 VB2 NC VCC RF OUT RF OUT NCNC VC2VC1 NC GND 10pF C106 R43 15 12 C112 10pF R520 0 1 2 Q13 1 2 3 4 5 6 47 R38 C64 C C97 C L30 6.8nH 1 2 R121 R 12 C111 10pF 12 SMS7621-005 D1 1 3 2 C88 10pF 1 2 R521 0 1 2 R R124 C117 10pF C81 C Q10 Q 3 4 2 1 E1 E2 C1 C2 C359 C F7 LCB32B2450A3 12 34 INOUT GNDGND 10pF C98 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Place C39 close to pin 45 Place matching caps close to pin 44 Place C45 close to pin 43 SWL-2700M C 15Wednesday, April 21, 2004 Title SizeDocument NumberRev Date:Sheetof Samsung Electro Mechanics CO.,LTD 314, Maetan-3Dong, Paldal-Gu,Suwon, Kyunggi-Do, KOREA, 442-743 TEL: 82-31-210-3341 FAX: 82-31-210-5529 ADCP_I DACN_I ADCP_Q RFRESET_L RFLOAD RFSHIFT RFDATAOUT0 RFDATAOUT1 RFDATAOUT2 RFDATAOUT3 RFDATAIN PDETECT5 PDETECT AR5112_CLK40_OUT AR5112_5G_RX_IN ADCN_Q ADCN_I DACP_I DACP_Q DACN_Q PDETECT2 AR5112_5G_TX_OUT AR5112_2G_TX_OUT RFRESET_L2 RFSHIFT2 RFDATAOUT02 RFDATAOUT12 RFDATAOUT22 RFDATAOUT32 ADCN_Q2 ADCP_Q2 ADCP_I2 ADCN_I2 DACP_Q2 DACN_Q2 DACP_I2 DACN_I2 AR5112_2G_RX_IN4 AR5112_5G_RX_IN4 RFDATAIN2 RFLOAD2 PDETECT4 AR5112_CLK40_OUT2 AR5112_5G_TX_OUT4 XBIAS24 AR5112_2G_TX_OUT4 XBIAS54 2.5V_A 2.5V_A 2.5V_A 2.5V_A 2.5V_A 3.3V_A 2.5V_A 3.3V_A 3.3V_VCO 2.5V_D 2.5V_A 2.5V_A 3.3V_A 2.2pF C45 R R21 6.19K 1% R25 C C70 C43 10pF 1 2 F1 F 1 2 3 4 56 10pF C22 C34 C 1 2 C38 10pF 1 2 10pF C24 0.01uF 25V C25 RR23 0.1uF 10V C51 R1200 12 R116 47 12 0.1uF 10V C52 0.1uF 10V C77 3.3nH L33 1M R22 1pF C74 1 2 10pF C55 C40 10pF 1 2 0 R20 AR2112 DUAL BAND U3 1 2 3 4 5 6 7 8 9 12 11 13 15 14 10 16 2827262524232229303132 33 34 37 36 21 35 191718 38 20 39 43 44 45 47 48 46 495052535455565758595160626364 42 40 41 61 65 Gnd2a RESET_L Serial_load Serial_clk Serial_in0 Serial_in1 Serial_in2 Serial_in3 Vdd2d Clk40 DataOut Gnd3d Vdd2a Vdd3d Gnd2d Xtal_i Aoutp_dcRF5out_pRF5out_nAoutn_dcAresVdd3paGnd2aGnd2aVdd3paGnd2aVdd2a Pdetect5 Pdetect2 Boutp_dc Bres Vdd2a Vdd2pa xbias5Xtal_oxbias2 RF2out_p Biasref RF2out_p Vdd2pa RF5in_n RF5in_p RF2in_n Gnd2a RF2in_p Vdd2a Ftest_p Gnd2a RXout_Qn RXout_QP RXout_IpRXout_In Gnd2a TXin_QpTXin_Qn Ftest_n TXin_In Gnd2aVdd3aVdd2a Boutn_dc RF2out_n RF2out_n TXin_Ip MTG L45 3.9nH 1 2 L49 1.5nH 1 2 10pF C73 1pF C75 1 2 10pF C20 3.09K 1% R13 10pF C58 1uF6.3V C49 10pF C36 C C39 18pF 2%C59 10pF C29 0.01uF 25V C48 10pF C46 L50 4.7nH 12 330pF C23 40.0000MHZ Y2 13 C33 C 1 2 C37 C 12 1pF C68 1 2 C C69 1uF 6.3V C76 3.3nH L34 C41 C 1 2 10pF C47 18pF 2%C60 68 R15 L3 L 12 C44 1pF 12 L4 L 12 DO NOT STUFF SWL-2700M C 15Wednesday, April 21, 2004 Title SizeDocument NumberRev Date:Sheet of Samsung Electro Mechanics CO.,LTD 314, Maetan-3Dong, Paldal-Gu,Suwon, Kyunggi-Do, KOREA, 442-743 TEL: 82-31-210-3341 FAX: 82-31-210-5529 PCI_TRDY_L PCI_INT_L AD4 AD6 AD22 PCI_REQ_L PCI_IRDY_L AD14 PCI_PAR PCI_IDSEL_L AD13 AD9 AD10 AD3 PCI_CBE1_L AD5 AD7 PCI_CBE2_L PCI_RST_L MPCI_11MPCI_12 AD18 AD26 AD2 PCI_FRAME_L AD15 AD27 AD8 PCI_STOP_L AD1 AD19 AD21 PCI_DEVSEL_L AD…

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Compliance Test Report for FCC Company name Address Telephone Product name Model No. Serial No. Test date2004-05-14~ Testing location Standard □Class A■Class BTest resultOK □Class A■Class BTest resultOK Tested by Reviewed by Abbreviation * Note - This test report is not permitted to copy partly without our permission - This test result is dependent on only equipment to be used - This test result based on a single evaluation of one sample of the above mentioned Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 1 of 37 Report NumberESTF150405-002 Manufacturer Country of origin Applicant Product 2004-05-20 Mini PCI Card SWL-2700M NONE Samsung Electro Mechanics KOREA Date of issue2004-05-19 ESTECH. Co., Ltd. 97-1 Hoiuk-Ri Majang-Myon, Icheon-city, KyungKi-Do, Korea Test item ■ Conducted Emission ■ Radiated Emission FCC PART 15.247 2002 , ANSI C 63.4 2001 OK, Pass = Passed, Fail = Failed, N/A = not applicable Samsung Electro Mechanics 314, Maetan 3-Dong Pal Dal-Ku Suwon City, Kyungki-Do, 442- 743 Korea 82-31-210-6270 Measurement facility registration number Senior Engineer J.M. Yang Director T.K. Lee 94696 (Signature) (Signature) 4 5 6 7 9 9 9 9 11 13 13 13 14 14 14 14 16 18 18 18 18 20 5. 6dB Bandwidth Measurement ........................................................................ ... 8. Band-Edge and Out of Band Emissions ............................................................ 5.1 Test procedure .......................................................................................... 5.2 Test instruments and measurement setup ...................................................... 5.3 Measurement results .................................................................................... 6.1 Test procedure .......................................................................................... 6.2 Measurement results .................................................................................... 7.1 Test procedure .......................................................................................... 7.2 Test instruments and measurement setup ...................................................... 7.3 Measurement results .................................................................................... 4. Measurement condition .................................................................................... Contents 1. Laboratory Information .................................................................................... 2. Description of EUT .......................................................................................... 3. Test Standards ................................................................................................ Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 2 of 37 5.4 Trace data ................................................................................................ 8.1 Test procedure .......................................................................................... 8.2 Test instruments and measurement setup ...................................................... 8.3 Measurement results .................................................................................... 8.4 Trace data of band-edge & out of emissioin ................................................... 6. Maximum Peak Output Power ........................................................................... 7.4 Trace data ................................................................................................ 7. Transmitter Power S pectral Density ..................................................................... 22 22 22 23 26 27 27 27 28 29 30 30 31 37 37 37 Appendix 1. Spectral diagram Appendix 2. Phorographs of EUT in side PCB Appendix 3. Block diagram of EUT Appendix 4. Circuit Diagram 9.4 Photo graphs of test setup ........................................................................... 10.4 Photo graphs of test setup ........................................................................... 10. Measurement of radiated emission (30MHz - 1GHz) .......................................... 10.1 Measurement equipment ........................................................................... 11.2 Test data ................................................................................................... 10.2 Environmental conditions ........................................................................... 10.3 Test data ................................................................................................ 11. Measurement of radiated emission (1GHz - 25GHz) ....................................... ... 11.1 Measurement equipment ........................................................................... 9. Measurement of conducted emission ............................................................... 9.1 Measurement e quipment .............................................................................. 9.2 Environmental conditions .............................................................................. 9.3 Test data ................................................................................................... 12.1 Standard Applicable ................................................................................. 12.2 Anetenna connected construction ............................................................... Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 3 of 37 12. Antenna Requirement ....................................................................................... 1. Laboratory Information Corporation Name : ESTECH Co. Ltd Head Office : 3 rd Fl., Chungdam Bldg., 119-1 Chungdam-dong Kangnam-gu , Seoul, Korea (Safety & Telecom. Test Lab) EMC Test Lab : 58-1 Osan-Ri, GaNam-Myon, YeoJoo-Gun, KyungKi-Do, Korea 97-1 Hoiuk-Ri Majang-Myon, Icheon-city, KyungKi-Do, Korea Report Number : ESTF150405-002 , Web : www. estech. co. kr Page 4 of 37 2. Description of E…

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TEST SETUP PHOTO 1. Conducted Emission setup photo 1.1. Front 1.2. Rear 1.3. setup 2. Radiated Emission setup photo 2.1. Front 2.2. Rear 2.3. setup