HBW1573BCRemote Control Transmitter

THEORY OF OPERATION AND CIRCUIT DESCRIPTION MODEL 81-315LM SINGLE FUNCTION, REMOTE CONTROL TRANSMITTER (Please refer to enclosed schematic drawing: 195D1573) The 81-315LM transmitter consists of a low power RF oscillator (Q1 and associated components), a digital encoder (U1 and related components), and on/off switches. The RF oscillator, Q1, is of the grounded base type. C3, C5, C2, L2, and the copper loop set the center frequency of the oscillator at 315MHz. C4 and C7, with the internal capacitance of Q2, establish feedback levels and harmonic suppression. R3, R4 and R5 establish dc operating conditions on Q2 and help improve temperature stability. U1 and related components generate a digital code. This code is used in the companion receiver to identify a particular transmitter or functions. The 3.0 volt battery circuit is equipped with an automatically releasing (normally off) push-button switch. S4 supplies voltage to U1. The digital signal at U1 (pin 4) is randomly programmed at our factory location.

REF DESPART NUMBERDESCRIPTIONQTY CAPACITORS C130B0477CAP LYTIC 4.7UF 16V1 C230B0431CAP VARIABLE 1.8-5.0PF1 C330D76800000CAP SMD805 6.8PF NPO1 C430D72003000CAP SMD805 2.0PF NPO1 C530D76800000CAP SMD805 6.8PF NPO1 C8,C9,C730D71020000CAP SMD805 100PF NPO6 C10,C11,C12 C630D710422R0CAP SMD805 0.01UF1 DIODES D152B0065DIODE SOT231 INDUCTORS L140B0092INDUCTOR LEADED 470UH1 JUMPERS JU1217A0147JUMPER LEADED 0.5"1 JU2311C0001JUMPER SMD 0 OHMS1 JU3217A0147JUMPER LEADED 0.25"1 TRANSISTORS Q1207C0073XTOR SMD NPN SW1 Q2207C0074XTOR SMD NPN RF1 RESISTORS R1311C1015RES SMD805 1001 R2311C4325RES SMD805 1 R3311C2205RES SMD805 221 R4311C6225RES SMD805 6.2K1 R5311C1525RES SMD805 1.5K1 R6311C1035RES SMD805 10K1 SWITCHES S1 - S4SEE NOTE 5SW MOMENTARY SPST IC U1NOTE 5SOIC, ATMEL ENCODER1 BATTERY CONNECTORS E232D0134BATTERY CONTACT NEG1 E132C0133BATTERY CONTACT POS1 B110A0020BATTERY LITHUM 2032 3V1 ITEM 114D0481PCB 1/3 CH TX1 190A0460PRODUCT SPECIFICATION 190A0461FINAL TEST SPEC NOTES: 1. ALL LEADED COMPONENTS TO BE INSERTED TO WITHIN 0.020" OF BODY OR PREFORM LIMITS UNLESS OTHERWISE SPECIFIED. 2. LEAD CLIPPING SPEC: 0.050" MIN, 0.095 MAX. 3. CLEANING OF ASSEMBLY WITH A CLEANING SOLVENT AFTER SOLDERING IS NOT PERMITTED. 4. TEST SPECIFICATION: 190A0460 5. COMPONENT USAGE CHART: 001A5536-1001A5536-3001A5536-4 1ch RC 315MHz3ch RC 315MHz1CH BC 315 S1, S2, S3NOT USED180B0120-2NOT USED S4180B0120-2NOT USED180B0120-2 U1125C0218125C0218125C0224 100PF 100PF 100PF 0.01UF 6.8PF 100 100PF 100PF 100PF