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MCQ-50M1746WLAN Module

Digi International Inc
WLAN Module - FCC ID MCQ-50M1746 - Digi International Inc
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Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
Mar 17, 2010
Application Purpose
Original Equipment
Date of Application
Mar 17, 2010
Equipment Note
WLAN Module
Frequency Range
2412.00000000 - 2462.00000000
Company
Digi International Inc
Country
United States

Documents & Files

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Users Manual

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Attestation Statements

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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RF Exposure Info

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

Part number/version: 90000797_B Release date: March 2010 www.digiembedded.com Digi Connect ™ Wi-Wave 802.11 b/g Hardware Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digi International, Inc. 11001 Bren Road East Minnetonka, MN 55343 U.S.A. United States: +1 877 912-3444 Other locations: +1 952 912-3444 www.digiembedded.com ©2010 Digi International Inc. Printed in the United States of America. All rights reserved. Digi, Digi International, the Digi logo, a Digi International Company, Jump Start Kit, ConnectCore, NET+, NET+OS and NET+Works are trademarks or registered trademarks of Digi International, Inc. in the United States and other countries worldwide. All other trademarks are the property of their respective owners. Information in this document is subject to change without notice and does not represent a committment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, either expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. This product could include technical inaccuracies or typographical errors. Changes are made periodically to the information herein; these changes may be incorporated in new editions of the publication. 3 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chapter 1:About the Module..................................................................7 Features 7 What’s on the module? 8 Digi Connect Wi-Wave 802.11 b/g module edge connector 8 Digi Connect Wi-Wave 802.11 b/g module edge connector: Pinout 9 U.FL connectors 9 USB peripheral controller 10 802.11b/g modes and channels 10 Channel allocations 10 Voltage regulators 11 Voltage monitor — Reset generator 11 LEDS 11 Power 11 DISABLE signal 11 Power Requirements 12 Chapter 2: About the Development Board ...........................................13 What’s on the development board 13 Features 13 The development board 14 Unpopulated components 14 Digi Connect Wi-Wave802.11 b/g module connector, J52 15 LEDs 17 LED DS1 17 LED DS2 17 Debug (signal) breakout header LEDs 17 Switches and reset functionality 18 Voltage monitor 18 Alternative methods to trigger RESET# 18 Power supply 19 Input power jack, J3 19 Input power supply 19 USB peripheral interface, J4 20 USB peripheral jack, J4 20 Debug breakout header, P21 21 4Digi Connect Wi-Wave 802.11b/g Hardware Reference, Rev. B, 2/2010 Debug breakout header signal map 21 W_DISABLE# signal 22 U.FL and RP-SMA connectors 23 U.FL connectors 23 U.FL cables 23 RP-SMA connectors 24 For more information 24 Chapter 3: Using the Antenna ............................................................ 25 Necessary Conditions for Integration 25 Connect Wi-Wave 802.11 b/g antenna configurations 26 General information 26 Antenna switch 26 Cable Specification: U.FL/W.FL to RP-SMA 26 Attributes 26 Antenna specifications: 802.11 a/b/g antenna 27 Attributes 27 Dimensions 28 End User Manual: RF Exposure Statements 28 Appendix A:Specifications.................................................................. 29 Environmental specifications 29 WLAN interface 29 Mechanical dimensions 30 Power requirements 31 RF exposure statement 31 Safety statements 31 Module and development board dimensions 32 Module dimensions 32 Development board dimensions 33 Appendix B: Certifications.................................34 FCC Part 15 Class B 34 5 Using this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . This guide provides information about the Digi Connect Wi-Wave 802.11 b/g embedded core module. Conventions used in this guide This table describes the typographic conventions used in this guide: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digi information Related documentation For additional documentation, see the Documentation folder in the Start menu. Documentation updates Digi occasionally provides documentation updates on the Web site (www.digiembedded.com/support). Be aware that if you see differences between the documentation you received in your package and the documentation on the Web site, the Web site content is the latest version. This conventionIs used for italic typeEmphasis, new terms, variables, and document titles. monospaced type Filenames, pathnames, and code examples. 6Digi Connect Wi-Wave 802.11 b/g Hardware Reference, Rev. B 2/2010 Contact information For more information about your Digi products, or for customer service and technical support, contact Digi International. To contact Digi International byUse MailDigi International, Inc. 11001 Bren Road East Minnetonka, MN 55343 U.S.A World Wide Webwww.digiembedded.com Eservice Supportwww.digi.com/support/eservice/login.jsp Telephone (U.S.)(952) 912-3444 or (877) 912-3444 Telephone (other locations)+1 (952) 912-3444 or +1 (877) 912-3444 7 Chapter 1:About the Module The Digi Connect Wi-Wave module is an 802.11b/g WLAN communications module for use in embedded applications. The module is a single circuit card packaged in a PCI Express Mini Card form factor, and supports all the RF, analog, and digital circuitry necessary to implement WLAN functionality. Using Digi’s baseband processor technology, this module is the ideal choice for embedded applications requiring long-term product availability in conjunction with reliability and easy design integration. The primary interface to the module is through a standards-compliant PCI Express Mini Card edge connector, using a USB 2.0 full speed/…

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Attestation Statements

Digi International 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 03/10/2010 RE: FCC ID: MCQ-50M1746 / IC: 1846A-50M1746 submittal as modular device 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC Part 15 and Industry Canada limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The Digi Connect Wi-Wave 802.11 b/g module is designed such that all RF components and circuitry are placed on the top surface of the PCB. No RF related circuitry is present on the bottom surface of the PCB. A formed metal shield is soldered onto the top of the PCB and covers all RF components and circuitry. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 and Industry Canada requirements under conditions of excessive data rates or over-modulation. All of the user data that is to be transmitted over the modular transmitter is buffered by the Digi Connect Wi-Wave 802.11 b/g baseband controller. The user’s data is packetized and transmitted at data rates that are completely controlled by the baseband controller and its software. The user has no access to either the baseband controller or its software. 3. The modular transmitter must have its own power supply regulation. This is intended to ensure that the module will comply with Part 15 and Industry Canada requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. All critical RF circuitry runs on a locally regulated power supply which allows the module to function within specification with worst case input voltages ranging from 3.1V (module will enter a non-operative state if the Vin drops to <3V ) to 3.6V (Vin >3.6V will cause a catastrophic failure of the processor and the unit will cease to function). The optimal Vin voltage range is 3.3V +/-9%. Digi International 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax 4. The modular transmitter must comply with the antenna requirements of FCC Sections 15.203 and 15.204(c) and Industry Canada requirements. The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). Any antenna used with the module must be approved with the module, either at the time of initial authorization or through a Class II permissive change. The “professional installation” provision of FCC Section 15.203 may not be applied to modules. The Digi Connect Wi-Wave 802.11 b/g module has one antenna configuration: usage of two U.FL antenna connectors. Transmission is made only on one antenna – the second one is foreseen for receive diversity. The antennas specified for the Digi Connect Wi-Wave 802.11 b/g module is: • ANT-DB1-RAF-RPS 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with FCC Part 15 and Industry Canada emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in FCC Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see FCC Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see FCC Section 15.31(i)). The Digi Connect Wi-Wave 802.11 b/g module is designed to be compliant with all relevant FCC requirements without any additional shielding or filtering of any sort. As tested, the Digi Connect Wi- Wave 802.11 b/g module was mounted on top of a carrier board which provided the +3.3VDC to power the module and an USB line transceiver to allow serial data traffic. The carrier board drives the +3.3V from an on-card DC to DC converter which is in turn powered by an external +12VDC power supply which is mains powered. There are no additional filters associated with the module/carrier board. Nor is there any additional shielding associated with this setup – beyond the shield that is soldered to the module. Digi International 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax 6. The modular transmitter must be labeled with its own FCC ID / IC number, and, if the FCC ID / IC number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: XYZMODEL1 / IC: XXX-YYYY” or “Contains FCC ID: XYZMODEL1 / IC: XXX-YYYY.” Any similar wording that expresses the same meaning may be used. The Applicant may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions…

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External Photos

CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 61 of 65 Photo 5: WLAN RF module Photo 6: WLAN RF module & application / development board CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 62 of 65 Photo 7: WLAN RF module & application / development board Photo 8: WLAN RF module & application / development board + 2 rod. antennas (TX & RX) CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 63 of 65 Photo 9: WLAN RF module & application / development board bottom side Photo 10: WLAN RF module & application / development board bottom side CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 64 of 65 Photo 11: application / development board bottom side Photo 12: AC / DC power supply CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 65 of 65 Photo 13: AC / DC power supply Photo 14: AC / DC power supply

Internal Photos

CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 60 of 65 8 Photographs of the EUT Photo documentation Photo 4: WLAN RF module CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 61 of 65 Photo 5: WLAN RF module Photo 6: WLAN RF module & application / development board

RF Exposure Info

CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 28 of 65 MPE calculation These equations are generally accurate in the far field of an antenna but will over predict power density in the near field, where they could be used for making a “worst case” prediction. S = PG/4R 2 where S = power density ( in appropriate units, e.g. mW/cm 2 ) P = power input to the antenna (in appropriate units e.g. mW) G = power gain of the antenna in the direction of interest relative to the isotropic radiator R = distance to the centre of radiation of the antenna (appropriate units e.g. cm) Or S = EIRP/4R 2 where EIRP = equivalent isotropically radiated power Calculation: (Calculated for max. EIRP) EIRP: 24.98 dBm (314.8 mW) calculated at distance of 20 cm: power density = 314.8 /420 2 = 0.06266 mW/ cm 2 Limit: 1mW/ cm 2 is the reference level for general public exposure according to the OET Bulletin 65, Edition 97-01 Table 1.

Test Report

CETECOM ICT Services GmbH Untertürkheimer Straße 6-10 . D-66117 Saarbrücken Phone: +49 (0) 681-598-0 Fax: -9075 RSC-Laboratory 2010-03-11 Page 1 of 65 Accredited testing-laboratory DAR registration number: DGA-PL-176/94-D1 Federal Motor Transport Authority (KBA) DAR registration number: KBA-P 00070-97 Recognized by the Federal Communications Commission Anechoic chamber registration no.: 90462 (FCC) Anechoic chamber registration no.: 3462C-1 (IC) Certification ID: DE 0001 Accreditation ID: DE 0002 Accredited Bluetooth ® Test Facility (BQTF) The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Cetecom ICT is under license Test report no. : 1-1350-01-08/09 Type identification : Digi Connect Wi-Wave 802.11 b/g P/N (50001746-XX) Applicant : Digi International GmbH FCC ID : MCQ-50M1746 IC Certification No : 1846A-50M1746 Test standards : 47 CFR Part 15 RSS - 210 Issue 7 CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 2 of 65 Table of contents 1 General information.................................................................................................. 3 1.1 Notes ...................................................................................................................................................................3 1.2 Testing laboratory ...............................................................................................................................................4 1.3 Details of applicant .............................................................................................................................................4 1.4 Application details ..............................................................................................................................................4 2 Test standard/s ......................................................................................................... 5 3 Technical tests.......................................................................................................... 6 3.1 Details of manufacturer.......................................................................................................................................6 3.1.1 Test item......................................................................................................................................................6 3.1.2 Additional EUT information For IC Canada (appendix 2)..........................................................................7 3.1.3 RF Technical Brief Cover Sheet acc. To RSS-102 .....................................................................................8 3.1.4 EUT operating modes..................................................................................................................................9 3.1.5 Extreme conditions testing values ...............................................................................................................9 4 Summary of Measurement Results and list of all performed test cases ....................... 10 5 RF measurement testing .......................................................................................... 11 5.1 Description of test set-up ..................................................................................................................................11 5.1.1 Radiated measurements.............................................................................................................................11 5.1.2 Conducted measurements..........................................................................................................................11 5.2 Referenced Documents .....................................................................................................................................12 5.3 Additional comments ........................................................................................................................................13 5.4 Peak Power Spectral density (digitally modulated systems) §15.247(e)...........................................................14 5.5 Spectrum Bandwidth of a DSSS System / 6 dB Bandwidth §15.247(a)(2).......................................................15 5.6 Spectrum Bandwidth of a DSSS System / 20 dB Bandwidth............................................................................19 5.7 Maximum output power (conducted) §15.247 (b)(3)........................................................................................23 5.8 Max. peak output power (radiated) §15.247 (b)(3) ...........................................................................................27 5.9 Band-edge compliance of conducted emissions §15.247 (d) ............................................................................29 5.10 Band-edge compliance of radiated emissions §15.205 .................................................................................32 5.11 Spurious Emissions - conducted (Transmitter) §15.247 (c) ..........................................................................34 5.12 Spurious Emissions - radiated (Transmitter) §15.209 ...................................................................................44 5.13 Spurious Emissions - radiated (Receiver) §15.109 / 209 ..............................................................................50 5.14 Spurious Emissions - radiated <30 MHz §15.209.........................................................................................53 5.15 Conducted Emissions <30 MHz §15.107/207...............................................................................................54 6 Test equipment and ancillaries used for tests ........................................................... 56 7 Photographs of the Test Set-up ................................................................................ 58 8 Photographs of the EUT ....................................................................…

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Test Setup Photos

CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 58 of 65 7 Ph otog ra ph s of th e Test S et-up Photo documentation Photo 1: Radiated Spurious Emissions CETECOM ICT Services GmbH Test report no.: 1-1350-01-08/09 2010-03-11 Page 59 of 65 Photo 2: Radiated Spurious Emissions Photo 3: AC/DC Adaptor: TR10R120-AUE-01A02 (USB connected)

Contact Information

Applicant

Erik Reynolds(Director of Engineering)
[email protected]952-912-4248Fax: 952-912-4248

Test Firm

cetecom advanced GmbHGerald Schmidt
[email protected]49-681-598-0Fax: 49-681-598-8775

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.41 GHz - 2.46 GHz185.00 mW
Modular Type
Single Modular Approval
Confidentiality
Long Term
Grant Notes
Output power listed is conducted. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

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