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MCQ-XBS6XBee Wi-Fi RF Module

Digi International Inc
XBee Wi-Fi RF Module - FCC ID MCQ-XBS6 - Digi International Inc
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Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
Jul 17, 2011
Application Purpose
Original Equipment
Date of Application
Jul 17, 2011
Equipment Note
XBee Wi-Fi RF Module
Frequency Range
2412.00000000 - 2462.00000000
Company
Digi International Inc
Country
United States

Documents & Files

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Users Manual

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Attestation Statements

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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RF Exposure Info

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 1 XBee® Wi-Fi RF Module This manual describes the operation of the XBee® Wi-Fi RF module, which consists of 802.11 bgn firmware loaded onto XBee® hardware. The XBee® Wi-Fi RF Modules are designed to operate within the 802.11 protocol and support the unique needs of low-cost, low-power wireless sensor networks. The modules require minimal power and provide reliable delivery of data between remote devices and wireless 802.11 b, g or n access points and routers. The modules operate within the ISM 2.4 GHz frequency band. Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 877 912-3444 or 952 912-3444 http://www.digi.com © 2011 Digi International, Inc. All rights reserved No part of the contents of this manual may be transmitted or reproduced in any form or by any means without the written permission of Digi International, Inc. XBee® is a registered trademark of Digi International, Inc. Technical Support Phone: (866) 765-9885 toll-free U.S.A. & Canada (801) 765-9885 Worldwide 8:00 am - 5:00 pm [U.S. Mountain Time] Online Support: http://www.digi.com/support/eservice/login.jsp Email: [email protected] XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 2 Contents 1. Overview ............................................................................................................................................. 5 Specifications ...................................................................................................................................... 6 General Specifications .................................................................................................................... 6 RF Specifications ............................................................................................................................. 7 Electrical Specifications ................................................................................................................ 11 Environmental Specifications ....................................................................................................... 11 Serial Communications Specifications .......................................................................................... 12 UART ............................................................................................................................................. 12 SPI ................................................................................................................................................. 12 GPIO Specifications ........................................................................................................................... 13 Agency Approvals ............................................................................................................................. 14 Pin Signals ......................................................................................................................................... 14 Design Notes ..................................................................................................................................... 15 Power Supply ................................................................................................................................ 15 Recommended Pin Connections .................................................................................................. 15 Board Layout ................................................................................................................................ 16 Mounting Considerations ............................................................................................................. 18 2. RF Module Operation ....................................................................................................................... 19 Serial Communications ..................................................................................................................... 19 UART Communications ................................................................................................................. 19 SPI Communications ..................................................................................................................... 20 Serial Buffers .................................................................................................................................... 21 Serial Receive Buffer ..................................................................................................................... 21 Serial Transmit Buffer ................................................................................................................... 21 UART Flow Control ....................................................................................................................... 21 Serial Interface Protocols ................................................................................................................. 22 Transparent Operation ................................................................................................................. 22 API Operation ............................................................................................................................... 23 A Comparison of Transparent and API Operation ........................................................................ 23 Modes of Operation ......................................................................................................................... 24 Idle Mode ..................................................................................................................................... 24 Transmit Mode ............................................................................................................................. 24 Receive Mode ............................................................................................................................... 24 Command …

Text truncated - open the document above for the full version.

Users Manual

XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 1 XBee® Wi-Fi RF Module This manual describes the operation of the XBee® Wi-Fi RF module, which consists of 802.11 bgn firmware loaded onto XBee® hardware. The XBee® Wi-Fi RF Modules are designed to operate within the 802.11 protocol and support the unique needs of low-cost, low-power wireless sensor networks. The modules require minimal power and provide reliable delivery of data between remote devices and wireless 802.11 b, g or n access points and routers. The modules operate within the ISM 2.4 GHz frequency band. Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 877 912-3444 or 952 912-3444 http://www.digi.com © 2011 Digi International, Inc. All rights reserved No part of the contents of this manual may be transmitted or reproduced in any form or by any means without the written permission of Digi International, Inc. XBee® is a registered trademark of Digi International, Inc. Technical Support Phone: (866) 765-9885 toll-free U.S.A. & Canada (801) 765-9885 Worldwide 8:00 am - 5:00 pm [U.S. Mountain Time] Online Support: http://www.digi.com/support/eservice/login.jsp Email: [email protected] XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 2 Contents 1. Overview ............................................................................................................................................. 5 Specifications ...................................................................................................................................... 6 General Specifications .................................................................................................................... 6 RF Specifications ............................................................................................................................. 7 Electrical Specifications ................................................................................................................ 11 Environmental Specifications ....................................................................................................... 11 Serial Communications Specifications .......................................................................................... 12 UART ............................................................................................................................................. 12 SPI ................................................................................................................................................. 12 GPIO Specifications ........................................................................................................................... 13 Agency Approvals ............................................................................................................................. 14 Pin Signals ......................................................................................................................................... 14 Design Notes ..................................................................................................................................... 15 Power Supply ................................................................................................................................ 15 Recommended Pin Connections .................................................................................................. 15 Board Layout ................................................................................................................................ 16 Mounting Considerations ............................................................................................................. 18 2. RF Module Operation ....................................................................................................................... 19 Serial Communications ..................................................................................................................... 19 UART Communications ................................................................................................................. 19 SPI Communications ..................................................................................................................... 20 Serial Buffers .................................................................................................................................... 21 Serial Receive Buffer ..................................................................................................................... 21 Serial Transmit Buffer ................................................................................................................... 21 UART Flow Control ....................................................................................................................... 21 Serial Interface Protocols ................................................................................................................. 22 Transparent Operation ................................................................................................................. 22 API Operation ............................................................................................................................... 23 A Comparison of Transparent and API Operation ........................................................................ 23 Modes of Operation ......................................................................................................................... 24 Idle Mode ..................................................................................................................................... 24 Transmit Mode ............................................................................................................................. 24 Receive Mode ............................................................................................................................... 24 Command …

Text truncated - open the document above for the full version.

Users Manual

XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 1 XBee® Wi-Fi RF Module This manual describes the operation of the XBee® Wi-Fi RF module, which consists of 802.11 bgn firmware loaded onto XBee® hardware. The XBee® Wi-Fi RF Modules are designed to operate within the 802.11 protocol and support the unique needs of low-cost, low-power wireless sensor networks. The modules require minimal power and provide reliable delivery of data between remote devices and wireless 802.11 b, g or n access points and routers. The modules operate within the ISM 2.4 GHz frequency band. Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 877 912-3444 or 952 912-3444 http://www.digi.com © 2011 Digi International, Inc. All rights reserved No part of the contents of this manual may be transmitted or reproduced in any form or by any means without the written permission of Digi International, Inc. XBee® is a registered trademark of Digi International, Inc. Technical Support Phone: (866) 765-9885 toll-free U.S.A. & Canada (801) 765-9885 Worldwide 8:00 am - 5:00 pm [U.S. Mountain Time] Online Support: http://www.digi.com/support/eservice/login.jsp Email: [email protected] XBee® Wi-Fi RF Modules © 2011 Digi International, Inc. Page 2 Contents 1. Overview ............................................................................................................................................. 5 Specifications ...................................................................................................................................... 6 General Specifications .................................................................................................................... 6 RF Specifications ............................................................................................................................. 7 Electrical Specifications ................................................................................................................ 11 Environmental Specifications ....................................................................................................... 11 Serial Communications Specifications .......................................................................................... 12 UART ............................................................................................................................................. 12 SPI ................................................................................................................................................. 12 GPIO Specifications ........................................................................................................................... 13 Agency Approvals ............................................................................................................................. 14 Pin Signals ......................................................................................................................................... 14 Design Notes ..................................................................................................................................... 15 Power Supply ................................................................................................................................ 15 Recommended Pin Connections .................................................................................................. 15 Board Layout ................................................................................................................................ 16 Mounting Considerations ............................................................................................................. 18 2. RF Module Operation ....................................................................................................................... 19 Serial Communications ..................................................................................................................... 19 UART Communications ................................................................................................................. 19 SPI Communications ..................................................................................................................... 20 Serial Buffers .................................................................................................................................... 21 Serial Receive Buffer ..................................................................................................................... 21 Serial Transmit Buffer ................................................................................................................... 21 UART Flow Control ....................................................................................................................... 21 Serial Interface Protocols ................................................................................................................. 22 Transparent Operation ................................................................................................................. 22 API Operation ............................................................................................................................... 23 A Comparison of Transparent and API Operation ........................................................................ 23 Modes of Operation ......................................................................................................................... 24 Idle Mode ..................................................................................................................................... 24 Transmit Mode ............................................................................................................................. 24 Receive Mode ............................................................................................................................... 24 Command …

Text truncated - open the document above for the full version.

Cover Letter(s)

UltraTech Group of Labs FCC TCB & IC CB Ultratech’s Accreditations: 0685 FCC 91038 1309 46390-2049 NvLap Lab Code 200093-0 SL2-IN-E-1119R Korea KCC-RRL CA2049 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 Tel.: (905) 829-1570 Fax.: (905) 829-8050 Website: www.ultratech-labs.com Email: [email protected] July 6, 2011 Ultratech Engineering Labs, Inc. 3000 Bristol Circle Oakville, Ontario L6H 6G4 Subject: Application for Equipment Certification under FCC Part 15, Subpart C, Section 15.247 - Digital Modulation Systems (DTS) Operating in 2400 - 2483.5 MHz Band. Applicant: Digi International Inc. Product: XBee Wi-Fi RF Module Model No.: XBEES6 FCC ID: MCQ-XBS6 Dear Sir/Madam: As appointed agent for Digi International Inc., we submit the application for equipment certification of the above product. Please review all required documents uploaded to your E-Filing Site. NOTE: This application is subject to modular approval; see Applicant’s cover letter requesting for modular approval. If you have any queries, please do not hesitate to contact us. Yours truly, Dan Huynh Dan Huynh Authorized Agent

Cover Letter(s)

~~~- 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax Wednesday, June 10,2010 FEDERAL COMMUNICATIONS COMMISSION 7435 Oakland Mills Road Columbia, MD 21046 U.S.A. Subject: Request signature authority for matters before the Commission. Applicant: Digi International Dear SirlMadam, I authorize Paul Dahl, Engineering Manager, and Frank Artner, Engineering Manager, to sing all documents on behalf ofDigi International for matters befure the Federal Communications Commission. Yours Truly,

Cover Letter(s)

UltraTech Group of Labs FCC TCB & IC CB Ultratech’s Accreditations: 0685 FCC 91038 1309 46390-2049 NvLap Lab Code 200093-0 SL2-IN-E-1119R Korea KCC-RRL CA2049 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 Tel.: (905) 829-1570 Fax.: (905) 829-8050 Website: www.ultratech-labs.com Email: [email protected] July 6, 2011 Ultratech Engineering Labs, Inc. 3000 Bristol Circle Oakville, Ontario L6H 6G4 Subject: Application for Equipment Certification under FCC Part 15, Subpart C, Section 15.247 - Digital Modulation Systems (DTS) Operating in 2400 - 2483.5 MHz Band. Applicant: Digi International Inc. Product: XBee Wi-Fi RF Module Model No.: XBEES6 FCC ID: MCQ-XBS6 Dear Sir/Madam: As appointed agent for Digi International Inc., we submit the application for equipment certification of the above product. Please review all required documents uploaded to your E-Filing Site. NOTE: This application is subject to modular approval; see Applicant’s cover letter requesting for modular approval. If you have any queries, please do not hesitate to contact us. Yours truly, Dan Huynh Dan Huynh Authorized Agent

Cover Letter(s)

~~~- 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax Wednesday, June 10,2010 FEDERAL COMMUNICATIONS COMMISSION 7435 Oakland Mills Road Columbia, MD 21046 U.S.A. Subject: Request signature authority for matters before the Commission. Applicant: Digi International Dear SirlMadam, I authorize Paul Dahl, Engineering Manager, and Frank Artner, Engineering Manager, to sing all documents on behalf ofDigi International for matters befure the Federal Communications Commission. Yours Truly,

Cover Letter(s)

UltraTech Group of Labs FCC TCB & IC CB Ultratech’s Accreditations: 0685 FCC 91038 1309 46390-2049 NvLap Lab Code 200093-0 SL2-IN-E-1119R Korea KCC-RRL CA2049 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 Tel.: (905) 829-1570 Fax.: (905) 829-8050 Website: www.ultratech-labs.com Email: [email protected] July 6, 2011 Ultratech Engineering Labs, Inc. 3000 Bristol Circle Oakville, Ontario L6H 6G4 Subject: Application for Equipment Certification under FCC Part 15, Subpart C, Section 15.247 - Digital Modulation Systems (DTS) Operating in 2400 - 2483.5 MHz Band. Applicant: Digi International Inc. Product: XBee Wi-Fi RF Module Model No.: XBEES6 FCC ID: MCQ-XBS6 Dear Sir/Madam: As appointed agent for Digi International Inc., we submit the application for equipment certification of the above product. Please review all required documents uploaded to your E-Filing Site. NOTE: This application is subject to modular approval; see Applicant’s cover letter requesting for modular approval. If you have any queries, please do not hesitate to contact us. Yours truly, Dan Huynh Dan Huynh Authorized Agent

Cover Letter(s)

~~~- 11001 Bren Road East Minnetonka, MN 55343 952-912-3444 tel 952-912-4991 central fax Wednesday, June 10,2010 FEDERAL COMMUNICATIONS COMMISSION 7435 Oakland Mills Road Columbia, MD 21046 U.S.A. Subject: Request signature authority for matters before the Commission. Applicant: Digi International Dear SirlMadam, I authorize Paul Dahl, Engineering Manager, and Frank Artner, Engineering Manager, to sing all documents on behalf ofDigi International for matters befure the Federal Communications Commission. Yours Truly,

ID Label/Location Info

Module Labels showing FCCID, and Model. Silk Screen on top of module

RF Exposure Info

FCC Part 15, Subpart C, Section 15.247 – DTS Page 199 XBee Wi-Fi RF Module, Model XBEES6 FCC ID: MCQ-XBS6 ULTRATECH GROUP OF LABS File #: DIGI-043Q1F15C247 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 July 6, 2011 Tel. #: 905-829-1570, Fax. #: 905-829-8050, Email: [email protected] , Website: http://www.ultratech-labs.com All test results contained in this engineering test report are traceable to National Institute of Standards and Technology (NIST) 5.11. RF EXPOSURE REQUIRMENTS [§§ 15.247(e)(i), 1.1310 & 2.1091] The criteria listed in the following table shall be used to evaluate the environmental impact of human exposure to radio-frequency (RF) radiation. FCC 47 CFR § 1.1310: 5.11.1. Method of Measurements Refer to Sections 1.1310, 2.1091 In order to demonstrate compliance with MPE requirements (see Section 2.1091), the following information is typically needed: (1) Calculation that estimates the minimum separation distance (20 cm or more) between an antenna and persons required to satisfy power density limits defined for free space. (2) Antenna installation and device operating instructions for installers (professional/unskilled users), and the parties responsible for ensuring compliance with the RF exposure requirement (3) Any caution statements and/or warning labels that are necessary in order to comply with the exposure limits (4) Any other RF exposure related issues that may affect MPE compliance FCC Part 15, Subpart C, Section 15.247 – DTS Page 200 XBee Wi-Fi RF Module, Model XBEES6 FCC ID: MCQ-XBS6 ULTRATECH GROUP OF LABS File #: DIGI-043Q1F15C247 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 July 6, 2011 Tel. #: 905-829-1570, Fax. #: 905-829-8050, Email: [email protected] , Website: http://www.ultratech-labs.com All test results contained in this engineering test report are traceable to National Institute of Standards and Technology (NIST) Calculation Method of RF Safety Distance : 22 44r EIRP r GP S       Where: P: power input to the antenna in mW EIRP: Equivalent (effective) isotropic radiated power S: power density mW/cm 2 G: numeric gain of antenna relative to isotropic radiator r: distance to centre of radiation in cm 5.11.2. RF Evaluation Evaluation of RF Exposure Compliance Requirements RF Exposure Requirements Compliance with FCC Rules Minimum calculated separation distance between antenna and persons required: *14.3 cm Manufacturer’ instruction for separation distance between antenna and persons required: 20 cm. Antenna installation and device operating instructions for installers (professional/unskilled users), and the parties responsible for ensuring compliance with the RF exposure requirement Antenna installation and device operating instructions shall be provided to installers to maintain and ensure compliance with RF exposure requirements. Caution statements and/or warning labels that are necessary in order to comply with the exposure limits Refer to user’s manual for RF exposure Information. Any other RF exposure related issues that may affect MPE compliance None. *The minimum separation distance between the antenna and bodies of users are calculated using the following formula: S EIRP S GP r      44 S = 1.0 mW/cm 2 EIRP = 34.09 dBm = 10 (34.09/10) mW = 2564 mW (Worst Case) (Minimum Safe Distance, r) = cm S EIRP 3.14 )0.1(4 2564 4     

Test Report

XBee Wi-Fi RF Module Model: XBEES6 FCC ID: MCQ-XBS6 Applicant: Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 In Accordance With Federal Communications Commission (FCC) Part 15, Subpart C, Section 15.247 Digital Modulation Systems (DTS) Operating in 2400 – 2483.5 MHz Band UltraTech's File No.: DIGI-043QF15C247 This Test report is Issued under the Authority of Tri M. Luu Vice President of Engineering UltraTech Group of Labs Date: July 6, 2011 Report Prepared by: Dan Huynh Issued Date: July 6, 2011 Tested by: Mr. Hung Trinh Test Dates: May 25 ~ June 24, 2011 The results in this Test Report apply only to the sample(s) tested, and the sample tested is randomly selected. This report must not be used by the client to claim product endorsement by NVLAP or any agency of the US Government. UltraTech 3000 Bristol Circle, Oakville, Ontario, Canada, L6H 6G4 Tel.: (905) 829-1570 Fax.: (905) 829-8050 Website: www.ultratech-labs.com , Email: [email protected], Email: [email protected] FCC Korea KCC-RRL 91038 1309 46390-2049 NvLap Lab Code 200093-0 SL2-IN-E-1119R CA2049 FCC Part 15, Subpart C, Section 15.247 – DTS Contents i XBee Wi-Fi RF Module, Model XBEES6 FCC ID: MCQ-XBS6 ULTRATECH GROUP OF LABS File #: DIGI-043QF15C247 3000 Bristol Circle, Oakville, Ontario, Canada L6H 6G4 July 6, 2011 Tel. #: 905-829-1570, Fax. #: 905-829-8050, Email: [email protected] , Website: http://www.ultratech-labs.com All test results contained in this engineering test report are traceable to National Institute of Standards and Technology (NIST) TABLE OF CONTENTS EXHIBIT 1. INTRODUCTION.............................................................................................................................................. 1 1.1. SCOPE ........................................................................................................................................................................ 1 1.2. RELATED SUBMITTAL(S)/GRANT(S)......................................................................................................................... 1 1.3. NORMATIVE REFERENCES ...................................................................................................................................... 1 EXHIBIT 2. PERFORMANCE ASSESSMENT.................................................................................................................... 2 2.1. CLIENT INFORMATION .............................................................................................................................................. 2 2.2. EQUIPMENT UNDER TEST (EUT) INFORMATION .................................................................................................... 2 2.3. EUT’S TECHNICAL SPECIFICATIONS ....................................................................................................................... 3 2.4. ASSOCIATED ANTENNA DESCRIPTION................................................................................................................... 3 2.5. LIST OF EUT’S PORTS ............................................................................................................................................... 3 2.6. ANCILLARY EQUIPMENT ........................................................................................................................................... 4 EXHIBIT 3. EUT OPERATING CONDITIONS AND CONFIGURATIONS DURING TESTS............................................... 5 3.1. CLIMATE TEST CONDITIONS ..................................................................................................................................…

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Contact Information

Applicant

Erik Reynolds(Director of Engineering)
[email protected]952-912-4248Fax: 952-912-4248

Test Firm

UltraTech Engineering Labs Inc.Tri Luu
[email protected]905-829-1570Fax: 905-829-8050

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.41 GHz - 2.46 GHz117.00 mW
Modular Type
Single Modular Approval
Confidentiality
Long Term
Grant Notes
Single Modular Approval. Power output is conducted and measured at the antenna terminal. This is an OEM transmitter module approved for use in products operating as a mobile transmitting device with respect to 2.1091. MPE compliance was demonstrated with a typical antenna(s) gain as shown in this filing. Final antenna installation and operating configurations of this transmitter including antenna gain and cable loss must not exceed the EIRP of the configuration used for MPE compliance. The antenna(s) used for this transmitter must be installed to provide with the minimum separation distance of 20 cm as described in this filing, and must not be co-located or operating in conjunction with any other antenna or transmitter. Grantee must coordinate with OEM integrators to ensure the end-users of products operating with this module are provided with operating instructions to satisfy RF exposure requirements. Separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations Note: The output power is continuously variable from 0.013 to 0.117 Watts

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