OA3MRF24J40MCModular Data Transmitter

© 2011 Microchip Technology Inc.PreliminaryDS00000A MRF24J40MC Data Sheet 2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA External Antenna Connector DS00000A-page iiPreliminary© 2011 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, K EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC 32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: Note the following details of the code protection feature on Microchip devices: •Microchip products meet the specification contained in their particular Microchip Data Sheet. •Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. •There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. •Microchip is willing to work with the customer who is concerned about the integrity of their code. •Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC ® DSCs, KEELOQ ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2011 Microchip Technology Inc.PreliminaryDS00000A-page 1 MRF24J40MC Features: • IEEE Std. 802.15.4™ Compliant RF Transceiver • Supports ZigBee ® , MiWi™ Development Environment Proprietary Wireless Networking Protocols • Small 0.9" x 1.3" (22.9 mm x 33.0 mm), Surface Mountable – Pin Compatible with MRF24J40MB • Integrated Crystal, Internal Voltage Regulator, Matching Circuitry, Power Amplifier, Low Noise Amplifier • External antenna connector: ultra miniature coaxial (U.FL), 50Ω • Easy Integration into Final Product – Minimize Product Development, Quicker Time to Market • Radio Regulation Certified for United States (FCC), Canada (IC), Europe (ETSI) and Australia/New Zealand (C-TICK) • Compatible with Microchip microcontroller families (PIC16F, PIC18F, PIC24F/H, dsPIC33 and PIC32) • Range up to 4000 ft. Operational: • Operating Voltage: 2.7V – 3.6V (3.3V typical) • Temperature Range: –40°C to +85°C Industrial • 4-Wire Serial Peripheral Interface (SPI) • Low-Current Consumption: - 25 mA (typical) in RX mode - 120 mA (typical) in TX mode -5 μA (typical) in Sleep mode RF/Analog Features: • ISM Band 2.405 GHz – 2.475 GHz Operation • Data Rate: 250 kbps • -108 dBm Typical Sensitivity with –23 dBm Maximum Input Level • +19 dBm Typical Output Power with 56 dB TX Power Control Range • Integrated Low Phase Noise VCO, Frequency Synthesizer and PLL Loop Filter • Digital VCO and Filter Calibration • Integrated RSSI ADC and I/Q DACs • Integrated LDO • High Receiver RSSI Dynamic Range MAC/Baseband Features: • Hardware CSMA-CA Mechanism, Automatic ACK Response and FCS Check • Independent Beacon, Transmit and GTS FIFO • Supports all CCA modes and RSS/LQI • Automatic Packet Retransmi…

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MRF24J40MC Transceiver Module – Block Diagram MRF24J40 IEEE 802.15.4 transceiver IC SPI Interface RF generation and reception Baseband packet processing Voltage regulator RF Filter 20 MHZ crystal External data source External Power source Switch Switch LNA (with matching) Power Amp (with matching) Antenna Connector Voltage Regulator

MRF24J40MC Module External Photos Page 1 of 2 Top View MRF24J40MC Module External Photos Page 2 of 2 Bottom View

MRF24J40MC Module Antenna Photos Page 1 of 2 Aristotle Enterprises Inc. P/N RFA-02-5-F7H1-70B-150 2.4 GHz, 5 dBi, Whip, Dipole Antenna MRF24J40MC Module Antenna Photos Page 2 of 2 Aristotle Enterprises Inc. P/N RFA-02-L2H1-70B-150 2.4 GHz, 2 dBi, Whip, Dipole Antenna

MRF24J40MC Module Internal Photos Page 1 of 2 Top View MRF24J40MC Module Internal Photos Page 2 of 2 Bottom View

MRF24J40MC Transceiver Module – Circuit Description The MRF24J40MC module is built around the MRF24J40 RF transceiver IC (U6). This IC contains a standard SPI serial data interface to an external data source. The data source will typically be a microcontroller which may also support the application for the product that uses the module. The IC also includes a voltage regulator which provides regulated power to all of the internal circuits on the IC. Bypass capacitors are provided around the IC as needed. An external crystal at 20.000 MHz generates the clock for all of the digital circuitry on the IC. It also serves as a reference for the frequency synthesizer used to generate the RF carrier. This is the only clock source for the IC. The transmitter function of the IC takes the data from the external data source over the SPI interface, and creates packets per the IEEE 802.15.4 standard in the baseband processor. It has an RF signal source and modulator to create the 2.4 GHz RF output signal. The receiver function of the IC takes a signal into the IC and performs a down conversion to base band where the data is taken out of the incoming packets and passed to the external data unit over the SPI interface. After the MRF24J40 IC, a solid state switch (U4) connects the IC to a power amplifier (PA) (U3) for increasing the transmitter power or to a low noise amplifier (LNA) (U2) to increase the receiver sensitivity. The output of the PA and the input of the LNA go to a second switch (U1) to select which of these is connected to the antenna. The PA has input and output matching circuitry to match the impedance and to reduce harmonics. Bandpass filter FL1 further filters and reduces any transmitted harmonics. The LNA also has impedance matching circuitry. Voltage regulator (U5) to provides regulated power to the PA to provide a consistent power output. At the interface from the second switch to the antenna, an external LC filter is provided to reduce harmonics and to match the impedance to the antenna connector J1.

Qty Designator Value Description Manufacturer Manufacturer Part Number 2 C27, C31 0.5 pF Capacitor, Ceramic, 50V, +/-0.1 pF, UHI Q NP0, SMT 0402 Johanson Technology 500R07S0R5BV4T 1 C25 0.7 pF Capacitor, Ceramic, 50V, +/-0.1 pF, UHI Q NP0, SMT 0402 Johanson Technology 500R07S0R7BV4T 2 C1, C15 1.0 pF Capacitor, Ceramic, 50V, +/-0.25 pF, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H1R0CB01D 1 C9 1.2 pF Capacitor, Ceramic, 50V, +/-0.1 pF, UHI Q NP0, SMT 0402 Johanson Technology 500R07S1R2BV4T 1 C2 1.5 pF Capacitor, Ceramic, 50V, +/-0.25 pF, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H1R5CB01D 1 C18 2.4 pF Capacitor, Ceramic, 50V, +/-0.25 pF, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H2R4CB01D 1 C7 5.6 pF Capacitor, Ceramic, 50V, +/-0.25 pF, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H5R6CB01D 1 C8 6.8 pF Capacitor, Ceramic, 50V, +/-0.25 pF, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H6R8CB01D 2 C3, C6 10 pF Capacitor, Ceramic, 50V, +/-5%, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H100JB01D 1 C11 12 pF Capacitor, Ceramic, 50V, +/- 5%, HI-Q C0G, SMT 0402 Murata Electronics GJM1555C1H120JB01D 2 C38, C41 18 pF Capacitor, Ceramic, 50V, +/-5%, C0G, SMT 0402 Murata Electronics GRM1555C1H180JZ01D 7 C19, C26, C30, C32, C37, C40, C42 47 pF Capacitor, Ceramic, 50V, +/-5%, C0G, SMT 0402 Murata Electronics GRM1555C1H470JZ01D 7 C4, C5, C12, C17, C21, C22, C36 100 pF Capacitor, Ceramic, 50V, +/-5%, C0G, SMT 0402 Murata Electronics GRM1555C1H101JZ01D 5 C10, C13, C14, C16, C29 1000 pF Capacitor, Ceramic, 50V, +/-10%, X7R, SMT 0402 Murata Electronics GRM155R71H102KA01D 3 C24, C34, C43 0.01 uF Capacitor, Ceramic, 25V, +/-10%, X7R, SMT 0402 Murata Electronics GRM155R71E103KA01D 4 C20, C23, C33, C44 0.1 uF Capacitor, Ceramic, 10V, +/-10%, X5R, SMT 0402 Murata Electronics GRM155R61A104KA01D 3 C28, C35, C39 1 uF Capacitor, Ceramic, 6.3V, +/-20%, X5R, SMT 0402 Murata Electronics GRM155R60J105ME19D 1 FL1 Filter, Bandpass, 2.4 GHz Johanson Technology 2450BP15B100E 1 J1 Connector, Receptical, Ultra-mini coax SMD Hirose Electric Co Ltd U.FL-R-SMT(10) 3 L1, L2, L3 2.4 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C2N4SV6T 1 L8 2.7 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C2N7SV6T 1 L10 3.3 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C3N3SV6T 1 L6 3.9 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C3N9SV6T 2 L11, L12 4.7 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C4N7SV6T 2 L7, L9 5.6 nH Inductor, Ceramic, +/-0.3 nH, SMT 0402 Johanson Technology L-07C5N6SV6T 1 L13 7.5 nH Inductor, Ceramic, +/-5%, SMT 0402 Johanson Technology L-07C7N5JV6T 1 L4 18 nH Inductor, Ceramic, +/-5%, SMT 0402 Johanson Technology L-07C18NJV6T 1 R5 2.2 ohm Resistor, 1%, +/-100 ppm/C, SMT 0402 Vishay/Dale CRCW04022R20FKED 1 R2 360 ohms Resistor, 1%, +/-100 ppm/C, SMT 0402 Panasonic - ECG ERJ-2RKF3600X 1 R1 1.60 kohms Resistor, 1%, +/-100 ppm/C, SMT 0402 Panasonic - ECG ERJ-2RKF1601X 1 R3 470 kohms Resistor, 1%, +/-100 ppm/C, SMT 0402 Yageo RC0402FR-07470KL 1 R4 560 kohms Resistor, 1%, +/-100 ppm/C, SMT 0402 Panasonic - ECG ERJ-2RKF5603X 1 U6 MRF24J40 Transceiver, 2.4 GHz, IEEE 802.15.4 QFN Microchip Technology Inc. MRF24J40-I/ML 1 U7 NC7SZ125P5X Buffer, Tri-State, SC-70-5 Fairchild Semiconductor NC7SZ125P5X 1 U5 TC1187VCT713 Regulator, LDO Microchip Technology Inc. TC1187VCT713 2 U1, U4 UPG2179TB Switch, RF, SPDT, 6-SMINI CEL/NEC UPG2179TB-E4-A 1 U2 UPC8233TK Amplifier, Low-noise, 6MINIMOLD CEL/NEC UPC8233TK-A 1 U3 UPG2250T5N Amplifier, RF, 6-TSON CEL/NEC UPG2250T5N-E2-A 1 X1 20.000 MHz Crystal, 20.000 MHz, 3.5x2.5mm SMD Abracon ABM8-156-20.000MHz 1 Shield Sheild, custom Bi Link 24J40MB-SHLD-40166

Certificates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. Maximum Permissible Exposure Statement MRF24J40MC Prepared By: H.B. Compliance Solutions 3292 E. Mead Drive Gilbert, Arizona 85298 ficates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. Maximum Permissible Exposure Statement For the Microchip Technology Inc. MRF24J40MC Transceiver Module January 12, 2011 Prepared for: Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, Arizona 85224 Reviewed By: Hoosamuddin Bandukwala Cert # ATL-0062-E ficates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. Hoosamuddin Bandukwala HBCS MPE Report # EMC_10027 Page 2 of 2 Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 S = PG/4πR2 Where, S = power density (mW/cm2) P = output power at the antenna terminal (mW) G = gain of transmit antenna (numeric) R = distance from transmitting antenna (cm) Maximum peak output power at antenna input terminal = 18.89 (dBm) Maximum peak output power at antenna input terminal = 77.45 (mW) Antenna gain (typical) = 5 (dBi) Maximum antenna gain = 3.16 (numeric) Prediction distance = 200 (cm) Prediction frequency = 2405 (MHz) MPE limit for uncontrolled exposure at prediction frequency = 1.0 (mW/cm^2) Power density at prediction frequency = 0.0486913 (mW/cm^2) To solve for the minimum mounting distance required; R = √ (PG/4πS) R = √ (77.45 x 3.16 / 4π x 0.0486913) = 20 cm (Based on continuous transmission) END OF TEST REPORT

Certificates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. Intentional Radiator IEEE 802.15.4 The FCC Rules contained in Title 47 of the CFR, Part Prepared By: H.B. Compliance Solutions 3292 E. Mead Drive Gilbert, Arizona 85298 Engineering Statement: The measurements shown in this report were made in accordance with the procedure indicated, and the emissions from this equipment were found to be within the limits ap responsibility for the accuracy and completeness of these measurements, and for the qualifications of all persons taking them. It is further stated that upon the basis of the measurement made, the equipment tested is capable of operation in accordance with the requirements of Part maintenance. ficates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. Intentional Radiator Test Report For the Microchip Technology Inc. IEEE 802.15.4 Transceiver Module Tested under Rules contained in Title 47 of the CFR, Part 15.247 for Digitally Transmitting Sequence Prepared for: Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, Arizona 85224 Reviewed By: Hoosamuddin Bandukwala Cert # ATL-0062-E measurements shown in this report were made in accordance with the procedure indicated, and the emissions from this equipment were found to be within the limits applicable. I assume full responsibility for the accuracy and completeness of these measurements, and for the qualifications of all persons taking them. It is further stated that upon the basis of the measurement made, the equipment tested is ation in accordance with the requirements of Part 15 of the FCC Rules under normal use and ficates and reports shall not be reproduced except in full, without the written permission of H.B Compliance Solutions, LLC. for Hoosamuddin Bandukwala measurements shown in this report were made in accordance with the procedure plicable. I assume full responsibility for the accuracy and completeness of these measurements, and for the qualifications of all persons taking them. It is further stated that upon the basis of the measurement made, the equipment tested is of the FCC Rules under normal use and HBCS Report # EMC_10027 Page 2 of 37 Report Status Sheet Revision # Report Date Reason for Revision Ø November 12, 2010 Initial Issue 1 January 21, 2011 Added Section for Unintentional Radiated Emissions and updated Section 7 2 February 01,2011 Updated Section 1 & 2 3 February 04, 2011 Added Duty Cycle Plot and Calculation HBCS Report # EMC_10027 Page 3 of 37 Table of Contents EXECUTIVE SUMMARY ............................................................................................ 4 1. Testing Summary ........................................................................................ 4 EQUIPMENT CONFIGURATION ................................................................................ 5 1. Overview .................................................................................................... 5 2. Test Facility ................................................................................................. 6 3. Description of Test Sample ......................................................................... 6 4. Equipment Configuration ........................................................................... 6 5. Support Equipment .................................................................................... 6 6. Ports and Cabling Information .................................................................... 7 7. Method of Monitoring EUT Operation ........................................................ 7 8. Mode of Operation ..................................................................................... 7 9. Modifications ............................................................................................. 7 10. Disposition of EUT ...................................................................................... 7 Criteria for Un-Intentional Radiators ...................................................................... 8 1. Radiated Emissions ..................................................................................... 8 Emissions Tests Calculations ........................................................................ 9 Criteria for Intentional Radiators .......................................................................... 12 2. Conducted Emissions ................................................................................ 12 3. Occupied Bandwidth ................................................................................ 15 4. RF Power Output ...................................................................................... 19 5. Conducted Spurious Emissions ................................................................. 22 6. Radiated Spurious Emissions .................................................................... 27 7. Emissions at Band Edges and Restricted Band .......................................... 29 8. Power Spectral Density ............................................................................. 34 I. Test Equipment ............................................................................................. 37 HBCS Report # EMC_10027 Page 4 of 37 EXECUTIVE SUMMARY 1. Testing Summary These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with Part 15.247. All tests were conducted using measurement procedure from ANSI C63.4-2003 and FCC Public Notice 558074 DTS Guide March 23, 2005 as appropriate. Test Name Test Method/Standard Result Comments Unintentional Radiated Emissions 15.109 Pass A/C Power Line Conducted Emissions 15.207 Pass Occupied Bandwidth 15.247(a)(2) Pass Peak Output Power 15.247(b) Pass Conducted Spurious Emissions 15.247(d) Pass Radiated Spurious Emissions 15.247(d), 15.209(a), 15.205 Pass Emissions At Band E…

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Test Setup Photo # 1 Test Setup Photo # 2 Test Setup Photo # 3 Test Setup Photo # 4 Test Setup Photo # 5