U8ONB811BLUETOOTH AND WIFI MODULE

Revision C January 2011 C C E E - - 5 5 0 0 0 0 M M o o b b i i l l e e D D a a t t a a T T e e r r m m i i n n a a l l H H a a r r d d w w a a r r e e G G u u i i d d e e Important Notice Micronet Ltd. All rights reserved. Micronet Ltd. reserves the right to alter the equipment specifications and descriptions in this publication without prior notice. No part of this publication shall be deemed to be part of any contract or warranty unless specifically incorporated by reference into such contract or warranty. The information contained herein is merely descriptive in nature, and does not constitute a binding offer for the sale of the product described herein. All usage of the Micronet Ltd. logotype or trademarks is forbidden without prior written approval from Micronet Ltd. Information in this manual is subjected to change without notice. Micronet shall have neither liability nor responsibility to any person or entity with respect to any loss or damages arising from the information contained in this book. Other company and brand products and service names are trademarks or registered trademarks of their respective holders, for example: ARM Cortex™, Microsoft™, and Microsoft™ products (Windows Embedded CE™, Compact Framework™, Microsoft Active Sync™, and Visual Studio™). For further information, contact Micronet, as follows: Micronet web site: http://www.micronet.co.il Contact us: http://www.micronet.co.il/Contact_Micronet.html Additional CE-500 information: http://www.micronet.co.il/Ce500main.html Table of Contents GDUTUG500/01 CE-500 MDT Hardware Guide 3 / 97 T T a a b b l l e e o o f f C C o o n n t t e e n n t t s s Table of Contents........................................................................................................................ 3 Preface ...................................................................................................................... 7 Revision History .......................................................................................................................... 7 Safety Precautions ...................................................................................................................... 8 Usage Precautions .................................................................................................................... 8 Power Supply ........................................................................................................................... 9 Introduction ............................................................................................................ 10 CE-500 Platform Overview .......................................................................................................... 10 CE-504 and CE-507 Models ......................................................................................................... 10 Displays ................................................................................................................................. 11 Physical Interfaces ................................................................................................................... 11 Optional Wireless Modules ........................................................................................................ 11 Fixed Mount and Portable Configuration ...................................................................................... 11 Development Tool Kit ................................................................................................................. 12 Hardware ............................................................................................................................... 12 Software ................................................................................................................................ 12 Documentation ........................................................................................................................ 12 CE-500 Platform Key Feature Specifications .................................................................................. 13 CE-500 Platform Optional Modules ............................................................................................... 15 CE-500 Platform Accessories ....................................................................................................... 16 CE-50X Device Components ........................................................................................................ 17 CE-504 Front Panel components ................................................................................................ 17 CE-507 Front Panel Components ............................................................................................... 18 CE-50X Model, Bottom Panel components ................................................................................... 19 CE-50X Model, Right Side Panel ................................................................................................. 20 CE-50X Model, Left Side Panel Component .................................................................................. 21 CE-50X Model, Rear Panel Components ...................................................................................... 21 Technical and Functional Details ............................................................................. 23 Platform Core ............................................................................................................................ 23 Operating System .................................................................................................................... 23 Application Development Environment ....................................................................................... 23 Processor ............................................................................................................................... 24 RAM ......................................................................…

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Page 1 of 1 Date: 02/02/2011 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: U8ONB811 Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, we hereby request permanent confidential treatment of information accompanying this application as outlined below: CONF APPENDIX NBOARD811 BlkDia.pdf CONF APPENDIX NBOARD811 PartsLst.pdf CONF APPENDIX NBOARD811 Schem.pdf The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, Thank you, Signatu re: ____________________ Printed Name: Natan Shvarts Position: Quality & Standardization Manager

Page 1 of 1 Date: 02/02/2011 To: Timco Engineering Inc. To Whom It May Concern We hereby authorize Mr. Shaike Raz of I.T.L. (Product Testing) Ltd (ITL) to sign FORM 731 on our behalf for the following application: FCC ID: U8ONB811 Thank you, Signature: ____________________ Printed Name: Natan Shvarts Position: Quality & Standardization Manager

Page 1 of 1 Date: 02/02/2011 To Whom It May Concern We hereby authorize I.T.L. (Product Testing) Ltd (ITL) to act on our behalf regarding the FCC ID Certification Process for the following application: FCC ID: U8ONB811 Thank you, Signatu re: ____________________ Printed Name: Natan Shvarts Position: Quality & Standardization Manager

To: Federal Communications Commission From: Shaike Raz Att: Reviewing Engineer Reference No: L102170.00 Date: 01 March 2011 Subject: FCC Certification for Micronet Ltd, Bluetooth and WiFi Module, M/N: NBOARD811, FCC ID: U8OBN811 To Whom it may Concern, 1. We are submitting an application for Limited Modular approval on behalf of Micronet Ltd. for the above subject device placed in the hosts whose details are submitted with this application. 2. Exploratory radiated emission test was performed on the host configurations (CE-504; CE-507) in order to determine the “worst case” host. Full testing was performed on the “worst case” host (CE-507). 3. Exhibits concerning all hosts under this application are being submitted. 4. The Bluetooth and WiFi Module operates only in the hosts listed above and therefore does not have its own manual. A hardware guide/user manual is being submitted for the CE-500 products. 5. Please let me know if you need any additional information. I.T.L (PRODUCT TESTING) Ltd. PRODUCT SAFETY, EMC & TELECOMS LAB. Bat-Sheva St., POB 87 LOD 71100 ISRAEL Tel. 972-8-9186100 Fax. 972-8-9153101 Email: [email protected], Web Site: http://www.itl.co.il Regards Shaike Raz EMC Laboratory Manager EMC Laboratory ITL (Product Testing) Ltd. Kfar Bin Nun/Lod Israel Tel: +972-8-918-6117 Fax: +972-8-915-3101 Email: [email protected] http://www.itl.co.il

Page 1 of 3 Date: 22/02/2011 Ref: LMA Compliance Letter To: Federal Communications Commission Subject: LMA compliance letter This letter introduces Micronet Ltd request to approve it's BT + WiFi module according to FCC Limited Modular Approval procedure, and to demonstrate the means to control the module as required by the LMA procedure. Description of the module: This is a small board PCB which provide W-LAN (WiFi) + Bluetooth (hereinafter: BT) feature. This feature provided by embedded module IC which manufacture by "Azurewave" in Taiwan and consists of wireless LAN connection feature according to IEEE802.11 b/g and bluetooth 2.1+EDR connection protocol (two protocols in one IC). This model is not sold separately, and is not installed in any units other than Micronet Ltd’s 's products, and currently it is used in the following hosts: CE-504 and CE-507. In any case where the NBOARD811 will be added to other hosts in the future, Micronet Ltd. will expand the LMA to include the new hosts. Since the module incorporates an integral antenna its EIRP does not change between the hosts other than changes created by the host units shape influence. Due to all the above mentioned, Micronet Ltd feels that the testing conducted by ITL to the various hosts, with the fact that Micronet Ltd. have full control on the sales and installation of the module, assure complete compliance with FCC LMA procedure. Page 2 of 3 As per § 15.212 Modular transmitters: Single modular transmitters must meet the following requirements to obtain a modular transmitter approval. Requirement Not Maintained Maintained (1) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. Not maintained (2) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. YES (3) The modular transmitter must have its own power supply regulation. YES (4) The modular transmitter must comply with the antenna and transmission system requirements of §§15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). The “professional installation” provision of §15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. YES (Internal Antenna) (5) The modular transmitter must be tested in a stand-alone configuration, i.e. , the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in §15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see §15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimetres to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see §15.31(i)). Not Maintained (The module was tested inside the terminal) (6) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. YES Page 3 of 3 Thank you, Signatu re: ____________________ Printed Name: Natan Shvarts Position: Quality & Standardization Manager

Page 1 of 1 Radio module NBOARD811 (FCC-ID:U8ONB811) & CE-500 Device family labels location Description Label view Label location (see the red mark) Remakes Radio module On lower side of the board PCB See below label explanations Device (full configuration (WiFi+BT+GSM) On right dent of the device rear cover This rear cover is identical in CE-504 & CE-507 NBOARD811 - Identification label include FCC-ID explanations: Serial No. of the board "RoHS" mark according to EU directive FCCID Testing status Micronet's Batch no. P/N ("X" stands for configuration) Model no. that bear the FCCID X

Wireless LAN and Bluetooth Class2 Overview The CE‐500 platform provides an optional combined Wireless Local Area Network (IEEE 802.11) and Bluetooth (Class2) communication module. The Wireless LAN communication is especially suited to high‐speed data transfer over the air, when the Wireless LAN hotspot infrastructure is provided. For applications that require huge data transactions, Wireless LAN is the most economical way to implement the solution. Bluetooth communication is used for the Bluetooth‐ enabled connections with peripherals, such as mobile phone, audio headset, and printer. The CE‐500 Wireless LAN and Bluetooth Class2 module adopts Marvell’s latest highly‐integrated WLAN and Bluetooth SoC ‐ 88W8688 Wireless LAN Operation The module is compliant with the IEEE 802.11b/g standard and uses DSSS (Direct Sequence Spread Spectrum), OFDM (Orthogonal Frequency Division Multiplexing), DBPSK, DQPSK, CCK, and QAM baseband modulation technologies. In addition to the support of WPA / WPA2, WEP 64‐bit, and 128‐bit encryption, the module supports the IEEE 802.11i security standard. The module supports this standard through the implementation of AES (Advanced Encryption Standard), CCMP (Counter Mode CBC‐MAC Protocol), and WEP with TKIP security mechanisms. The module also supports IPSec with DES / 3DES / ASE encryption and MD5 / SHA‐1 authentication. For the Chinese market, the module supports WAPI specifications. For video, voice, and multimedia applications, the AW‐GH381 supports 802.11e QoS (Quality of Service). Bluetooth Operation The module is Bluetooth 2.1+EDR (Enhanced Data Rate) compliant. The CE-500 system supports the following Bluetooth communication profiles: SPP [Service (Serial) Port Profile] LAP (LAN Access Profile, applicable in professional license only) PAN (Personal Area Networking) Profile GAP (Generic Access Profile) TBD GOEP (Generic Object Exchange Profile) TBD HCRP (Hardcopy Cable Replacement Profile) TBD DUN (Dial-Up Network) Profile TBD FTP (File Transfer Profile) TBD HID (Human Interface Device) Profile TBD HFP (Hands-Free Profile) TBD HSP (Headset Profile) TBD OPP (Object Push Profile) TBD

Page 1 of 1 Date: 02/02/2011 To Whom It May Concern I hereby declare that there is no tune-up procedure for: FCC ID: U8ONB811 Sincerely, Thank you, Signatu re: ____________________ Printed Name: Natan Shvarts Position: Quality & Standardization Manager

DATE: 23 January 2011 I.T.L. (PRODUCT TESTING) LTD. FCC Radio Test Report for Micronet Ltd. Equipment under test: Bluetooth and WiFi Module (WiFi Radio) NBOARD811 Written by: _____________________________ D. Shidlowsky, Documentation Approved by: _____________________________ A. Sharabi, Test Engineer Approved by: ____________________________ I. Raz, EMC Laboratory Manager This report must not be reproduced, except in full, without the written permission of I.T.L. (Product Testing) Ltd. This report relates only to items tested. Test Report E102173.00 Micronet Ltd. Page 1 of 131 FCC ACC M Ver 1.1 05Mayl 2000 Test Report E102173.00 Micronet Ltd. Page 2 of 131 FCC ACC M Ver 1.1 05Mayl 2000 Measurement/Technical Report for Micronet Ltd. Bluetooth and WiFi Module (WiFi Radio) NBOARD811 FCC ID: U8ONB811 This report concerns: Original Grant: x Class I change: Class II change: Equipment type: Part 15 Digital Transmission System 47CFR15 Section 15.247 Measurement procedure used is ANSI C63.4-2003. prepared by: (different from "prepared by") Ishaishou Raz Natan Shvarts ITL (Product Testing) Ltd. Micronet Ltd. Kfar Bin Nun P.O.B. 11524, 27 Hametsuda St. D.N. Shimshon 99780 Azor 58001 Israel Israel e-mail [email protected] Tel: +972- 3 - 588 - 4884 Fax: +972- 3 - 558 - 4885 e-mail: [email protected] TABLE OF CONTENTS 1. GENERAL INFORMATION ------------------------------------------------------------------------------- 5 1.1 Administrative Information ................................................................................. 5 1.2 List of Accreditations ......................................................................................... 6 1.3 Product Description ........................................................................................... 7 1.4 Test Methodology .............................................................................................. 7 1.5 Test Facility ....................................................................................................... 7 1.6 Measurement Uncertainty ................................................................................. 7 2. SYSTEM TEST CONFIGURATION --------------------------------------------------------------------- 8 2.1 Justification ........................................................................................................ 8 2.2 EUT Exercise Software ..................................................................................... 9 2.3 Special Accessories .......................................................................................... 9 2.4 Equipment Modifications ................................................................................... 9 2.5 Configuration of Tested System ...................................................................... 10 3. TEST SET-UP PHOTOS ----------------------------------------------------------------------------------11 4. 26 DB MINIMUM BANDWIDTH ------------------------------------------------------------------------13 4.1 Test procedure ................................................................................................ 13 4.2 Results............................................................................................................. 20 4.1 Test Equipment Used. ..................................................................................... 21 5. 6 DB MINIMUM BANDWIDTH --------------------------------------------------------------------------22 5.1 Test procedure ................................................................................................ 22 5.2 Results............................................................................................................. 29 5.3 Test Equipment Used. ..................................................................................... 30 6. MAXIMUM TRANSMITTED PEAK POWER OUTPUT -------------------------------------------31 6.1 Test procedure ................................................................................................ 31 6.2 Results............................................................................................................. 38 6.3 Test Equipment Used. ..................................................................................... 39 7. PEAK POWER OUTPUT OUT OF 2400-2483.5 MHZ BAND ----------------------------------40 7.1 Test procedure ................................................................................................ 40 7.2 Results............................................................................................................. 89 7.3 Test Equipment Used. ..................................................................................... 90 8. BAND EDGE SPECTRUM -------------------------------------------------------------------------------91 8.1 Test procedure ................................................................................................ 91 8.2 Results............................................................................................................. 96 8.3 Test Equipment Used. ..................................................................................... 97 9. RADIATED EMISSION, 9 KHZ – 30 MHZ -----------------------------------------------------------98 9.1 Test Specification ............................................................................................ 98 9.2 Test Procedure ................................................................................................ 98 9.3 Test Data ......................................................................................................... 98 9.4 Test Instrumentation Used, Radiated Measurements .................................... 99 9.5 Field Strength Calculation ............................................................................... 99 10. SPURIOUS RADIATED EMISSION 30 MHZ – 25 GHZ ---------------------------------------- 100 10.1 Radiated Emission Above 1 GHz .............…

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