VO8A6BLUETOOTH HEADSET (CLASS 2)

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FRONT VIEW OF SAMPLE BOTTOM VIEW OF EUT LEFT VIEW OF SAMPLE RIGHT VIEW OF SAMPLE TOP VIEW OF SAMPLE BOTTOM VIEW OF SAMPLE

FCC ID Label Location FCC ID: VO8A6

FCC ID Label Location FCC ID: VO8A6

INTERNAL VIEW OF SAMPLE – 1 INTERNAL VIEW OF SAMPLE – 2

Preliminary Datasheet Released date: 02/20/2008 © 2000~2008 Integrated Systems Solution Corporation Revision1.0 Page 10 創傑科技股份有限公司 Integrated System Solution Corp. www.issc.com.tw Bluetooth Single Chip v2.0 w/ EDR IS1610N 5 Functional Description 5.1 Overall Architecture The ISSC IS1610N integrates an enhanced EDR Bluetooth RF & BB core, HCI controller, Audio controller and an ENHANCED 8051 processor with an internal mask ROM for program memory and SRAM for data memory. An innovative interconnection structure called the Common-Memory Architecture (CMA) is designed to provide a fast and flexible data movement scheme between the embedded processor, Bluetooth core, and peripheral hardware within this SRAM data memory space. For audio and power management, IS1610N provide embedded audio code and some power management to reduce the external components. Figure 1 – Block diagram for IS1610N Common SRAM (24KB) EDR Modem A- law/u- law /CVSD encoder/ decoder RF FSM controller & Registers Embedded Processor - ROM HCI Control logic Common Memory CPU Interface & Interrupt controller Memory mapped Register Bank Misc. Logic Clock Timer Hopping Sequence Controller Task Controller UART GPIO Voice Codec PLL 1.8V LDO . SAR ADC EDR RF Preliminary Datasheet Released date: 02/20/2008 © 2000~2008 Integrated Systems Solution Corporation Revision1.0 Page 11 創傑科技股份有限公司 Integrated System Solution Corp. www.issc.com.tw Bluetooth Single Chip v2.0 w/ EDR IS1610N 5.2 Radio Frequency (RF) 5.2.1 Transmitter The internal PA has a maximum output power of +4dBm with level control 8dB from amplitude control. This is applied into Class2/3 radios without external RF PA. If you want a larger output power for Class1 application, the external PA can be used. The transmitter features IQ direct conversion to minimize the frequency drift. And it can excess 30dB power range with temperature compensation machine. 5.2.2 Receiver The LNA can be operated into two type modes. One type is TR-combined mode for single port application. The other type is TR-separated mode for dual port application that used an external PA/LNA application. The image rejection filter is to reject image frequency for low-IF architecture. This filter for low-IF architecture is implied to reduce external BPF component for super heterodyne architecture. The ADC is utilized to sample input analogue wave to convert into digital for de- modulator analysis. Before the ADC, a channel filter has been integrated into receiver channel that can reduce the external component count and increase the anti-interference capacity. For avoiding temperature variation issues, a temperature sensor with temperature calibration is utilized into bias current and gain control of LNA, Mixers, and RF AMP. 5.2.3 Synthesizer The internal loop filter is used to reduce external RC components. This can reduce cost and variations for components. This internal LC tank for VCO is utilized to reduce variation for components. The cost is down at the same time. A fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter. Preliminary Datasheet Released date: 02/20/2008 © 2000~2008 Integrated Systems Solution Corporation Revision1.0 Page 12 創傑科技股份有限公司 Integrated System Solution Corp. www.issc.com.tw Bluetooth Single Chip v2.0 w/ EDR IS1610N 5.3 SAR ADC Voltage Converter The 10-bit Successive-Approximation analog to digital converter (SAR ADC) features 1 dedicated channel for battery power detection and 1 channel for external peripheral temperature sensing. This ADC has 10 bits resolution that provides a high accurate monitoring for battery voltage. The operating current is very low and almost consumes no power when disabled. Preliminary Datasheet Released date: 02/20/2008 © 2000~2008 Integrated Systems Solution Corporation Revision1.0 Page 13 創傑科技股份有限公司 Integrated System Solution Corp. www.issc.com.tw Bluetooth Single Chip v2.0 w/ EDR IS1610N 5.4 MODEM There are three different modulations for Bluetooth v2.0 w/ EDR. In figure 2, we summarized these modulations and data rate. Figure 2 – Modulation type for Bluetooth v2.0 w/ EDR Data Rate Modulation Bits/Symbol BDR: 1 Mbps GFSK 1 EDR: 2 Mbps π/4 DQPSK 2 EDR: 3 Mbps 8DPSK 3 5.4.1 Basic Data Rate MODEM (BDR) On the Bluetooth v1.2 specification and below, 1 Mbps was the standard data rate based on Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets BDR requirements of Bluetooth v2.0+EDR specification. Figure 3 – Data format for BDR Access Code Header Payload 5.4.2 Enhanced Data Rate MODEM (EDR) On the Bluetooth v2.0+EDR specification, Enhanced Data Rate (EDR) has been introduced to provide 2 and 3 Mbps data rates as well as 1 Mbps. This enhanced data rate modem meets EDR requirements of Bluetooth v2.0+EDR specification. For the viewpoint of baseband, both BDR and EDR utilize the same 1MHz symbol rate and 1.6 KHz slot rate. For BDR, 1 symbol represents 1 bit. However each symbol in the payload part of EDR packets represents 2 or 3 bits. This is achieved by using two different modulations, π/4 DQPSK and 8DPSK. Preliminary Datasheet Released date: 02/20/2008 © 2000~2008 Integrated Systems Solution Corporation Revision1.0 Page 14 創傑科技股份有限公司 Integrated System Solution Corp. www.issc.com.tw Bluetooth Single Chip v2.0 w/ EDR IS1610N Figure 4 –Data format for EDR Access Code Header GuardSyncPayload Trailer For this modulation, each symbol carries 2 bits of information. For its constellation diagram, although there are 8 possible phase states, the encoding scheme guarantees the trajectory of the modulation between symbols is restricted to 4 states. For a given starting point, every phase change between symbols is restricted to +45°, +135°, -45°, and -135°. Figure 5 –Phase shift & bit pattern for 2 MHz data rate Phase Shift Bit Pattern +45° (+π/4) 00 +135° (+3π/4) 01 -135°(-3π/4) 11 -45°(-π/4) 10 For this modulation, each symbol carries 3 bits of information. For its cons…

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序号 商 品 编 号 名 称 型 号 规 格 数 量 元 件 位 号 备 注 更 改 1 成品板 A6-20 1 自制；材料如下 1.1 贴片电容 1uF±20% 6.3V 7 C13、C14、C17、C18、C19、C24、 C30、 0402 1.2 贴片电容 1OuF±20% 16V 1 C23 0805 1.3 贴片电容 330nF±20% 16V 2 C20、C21 0402 1.4 贴片电容 0.1uF±20% 16V 2 C11、C16 0402 1.5 贴片电容 4.7uF±20% 10V 2 C2、C22 0603 1.6 贴片电容 15pF±5% 50V 2 C12、C15 0402 1.7 贴片电容 0.5pF±5% 50V 3 C7、C8、C10 0402 1.8 贴片电容 1pF±20% 50V 1 C9 0402 1.9 贴片电阻 4.7K±5% 1 R11 0402 1.10 贴片电阻 47K±5% 1 R10 0402 1.11 贴片电阻 10K±5% 2 R31、R5 0402 1.12 贴片电阻 2.4K±5% 1 R13 0402 1.13 贴片电阻 1K±5% 6 R1、R4、R14、R15、R16、R17 0402 1.14 贴片电阻 3.3K±5% 2 R7、R12 0402 1.15 贴片电阻 330Ω±5% 1 R9 0402 1.16 贴片电感 3.9nH±5% S 1 L1 0402 1.17 贴片电感 2.7nH±5% S 1 L2 0402 1.18 贴片三极管 MMBT3904 1 Q1 SOT23 1.19 贴片IC XC6204B282MR 1 U2 SOT23-5 1.20 贴片IC IS1610N-002 1 U3 QFN56 1.21 EEPROM AT24C08 1 U4 TSSOP-8 1.22 侧按开关 SS305GS16（A6） 1 SW1 侧按键 1.23 贴片发光管 蓝色(束光) 1 LED1 0603 1.24 贴片二极管 CDSH3-222N 1 D2 SOT-523 1.25 贴片晶振 16MHz±10PPM 12PF 1 X1 5032 1.26 天 线 A6 1 ANT1 定 制 1.27 印制板 A6-20 1 2 软板 A6 1 3 咪 头 -42dBm（A6） 1 4015 4 聚合物电芯 441220 1 5 喇 叭 Φ13*32Ω 1 长25mm 6 上 壳 A6蓝牙耳机 1 7 下 壳 A6蓝牙耳机 1 8 侧按键 A6蓝牙耳机 1 9 电源指示 A6蓝牙耳机 1 10 电源座 A6蓝牙耳机 1 0 0 版本号 修改状态 数 量 更改单号 签 名 日 期 修改标记 数量 更改单号 签 名 日 期 拟 制 审 核 LH041WL 等级 标记 第 1张 共 2 张 批 准 A6蓝牙耳机 物 料 清 单 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn 序号 商 品 编 号 名 称 型 号 规 格 数 量 元 件 位 号 备 注 更 改 11 电源触片 A6蓝牙耳机 2 12 螺 丝 M1.2*4CA 3 13 耳 挂 A6 1 14 听 筒 A6 1 15 听筒盖 A6 1 16 咪头胶套 A6 1 17 充电座 P430 自制；材料如下 17.1 贴片电容 1OuF±20% 16V 1 C1 0805 17.2 贴片电容 4.7uF±20% 10V 1 C18 0603 17.3 贴片IC SE9016 1 U1 SOT23-5 17.4 贴片电阻 15K±5% 1 R1 0805 17.5 贴片电阻 4.7K±5% 1 R3 0805 17.6 贴片电阻 1.5K±5% 1 R2 0805 17.7 贴片电阻 150K±5% 2 R4、R11 0805 17.8 贴片三极管 MMBT3904 1 Q1 SOT23 17.9 双色发光二极管 φ3白发红绿（共阳） 1 D1 DIP 17.10 DC插座 3脚L10×W5×H3mm 1 A6 17.11 PCB A6充电板 1 17.12 接触母座 A6 1 17.13 接触盖板 A6 1 17.14 充电座指示 A6 1 17.15 充电座前盖 A6 1 17.16 充电座后盖 A6 1 17.17 充电座下盖 A6 1 17.18 座充五金 878 2 17.19 小弹簧 F508 2 17.20 红色导线 28#长45mm 1 17.21 黑色导线 28#长45mm 1 17.22 螺 丝 M2*4KB 2 18 包装盒 A6 1 19 吸 塑 A系列 1 20 说明书 A系列 1 21 充电器 1 根据订单 LH041WL 0 0 等 级 标 记 第 2 张 共 2 张 版本号 修改状态 数 量 更改单号 签 名 日 期 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn

RF EXPOSURE EVALUATION - FCC ID: VO8A6 Limit According to §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. According to §1.1310 and §2.1091 RF exposure is calculated. Limits for Maximum Permissible Exposure (MPE) Frequency Range (MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density (mW/cm 2 ) Averaging Time (Minute) Limits for Occupational / Controlled Exposure 0.3 – 3.0 614 1.63 (100)* 6 3.0 – 30 1842/f 4.89/f (900/f)* 6 30 – 300 61.4 0.163 1.0 6 300 – 1500 / / f/300 6 1500 – 100 000 / / 5 6 Frequency Range (MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density (mW/cm 2 ) Averaging Time (Minute) Limits for General population / Uncontrolled Exposure 0.3 – 3.0 614 1.63 (100)* 30 3.0 – 30 842/f 2.19/f (180/f)* 30 30 – 300 27.5 0.073 0.2 30 300 – 1500 / / f/1500 30 1500 – 100 000 / / 1.0 30 F = Frequency in MHz * = Plane-wave equivalent power density Test Data Predication of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 S=PG/4πR² Where: S=power density P=power input to antenna G=power gain of the antenna in the direction of interest relative to an isotropic radiator R=distance to the center of radiation of the antenna Maximum peak output power: -6.87(dBm) Maximum peak output power: 0.206(mW) Prediction distance: 1 (cm) Predication frequency: 2.480(GHz) Duty Cycle: 0.332 Power density at predication frequency at 1 cm: 0.049 (mW/cm²) MPE limit for controlled exposure at prediction frequency: 5.0 (mW/cm²) MPE limit for uncontrolled exposure at prediction frequency: 1.0 (mW/cm²) Test Result: Pass

123456 A B C D 654321 D C B A Title NumberRevisionSize Orcad C Date:21-Mar-2008Sheet of File:D:\Bluetooth-CSR-ISSC-Broadcom 总体资料\蓝牙耳机的资料\卢工 ISSC 单芯片 Bluetooth\A6-20单声道\ISSC A6- 20Drawn By: P W R _ e n 1 2 R41K C11 0.1uF 12 B LED1 1 ANT1 C1515pF 12 R16 1K C131uF 12 R9 330 SW1 1 2 R73K3 RF 12 R1 1K 12 R14 1K TXD MIC- 1 2 R5 10K 1 2 R11 4K7 1 2 L1 3.9nH 3 21 Q1 MMBT3904 C2 4.7uF 12 R15 1K C16 0.1uF 3 2 1 D1 CDSH3-222N 1 2 R13 2K4 C141uF C10 0.5pF C2310uF 12 R12 3K3 C17 1uF IS1610N QFN56 VOLup 1 PWRen 2 VDD_IO 3 MFB 4 VOLdown 5 GND 6 HCI_RXD 7 HCI_TXD 8 NC 9 SCL 10 SDA 11 VDD_core 12 NC 13 BAT_in 14 A V D D _ S A R 1 5 A V D D _ A D C 1 6 A G N D _ A D C 1 7 L i n e _ i n + 1 8 L i n e _ i n - 1 9 B G _ R 2 0 B G _ R E F 2 1 L i n e _ o u t + 2 2 L i n e _ o u t - 2 3 A G N D _ D A C 2 4 A V D D _ D A C 2 5 L D O _ o u t 2 6 L D O _ e n 2 7 L D O _ i n 2 8 SCO 29 VDD_core 30 TEST 31 PWM 32 GND 33 VDD_IO 34 PWR 35 DC_in 36 EAN 37 VCC_dig 38 DIG18 39 XO_P 40 XO_N 41 PLL_18 42 V C C _ R F 4 3 R F _ T P 4 4 R F _ T P 4 5 R X 4 6 R T X 4 7 N C 4 8 N C 4 9 N C 5 0 N C 5 1 N C 5 2 N C 5 3 L E D 1 5 4 L E D 0 5 5 C H G s t a t e 5 6 G N D 5 7 U3 IS1610N-QFN56 SPK- C9 1pF VIN 1 EN 3 BP 4 VOUT 5 GND 2 U2 XC6204B282BR SPK+ A0 1 A1 2 A2 3 GND 4 SDA 5 SCL 6 WP 7 VCC 8 U4 HT24LC08 12 R17 1K C5 NC MIC+ C18 1uF C8 0.5pF C20 330nF RXD C19 1uF 41 32 X1 16M/12PF 12 R10 47K C7 0.5pF C22 4.7uF C1215pF 12 L2 2.7nH C21 330nF 1V8 2V8 1V8 GND 1V8 GND 2V8 1V8 GND GND 1V8 2V8 2V8 2V8 2V8 VBAT 2V7 1V8 VBAT GND 2V8 GND VBAT 2V8 眯头 喇叭 EEPROM BATTERY BAT+ BAT- Text 52 P2 ISSC 单芯片的蓝牙耳机 A6 原理图 C30 1uF 12 R31 10K TP3 C241uF 12 R35 NC C40 4.7uF R4 150K C1 10u/16V R1 15K R3 4.7K R2 1.5K 5V Q1 3904 C2 ?? 6 6 1 1 2 2 3 3 4 4 5 5 U1 SE9016 1 2 3 J1 CON3 D1 R11 150k C18 4.7uF R13 NC P430的充电电路 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn

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FCC Part 15 TEST REPORT For Bluetooth Headset (Class 2) Model Name: A6 FCC ID: VO8A6 Report No.: GZAGC132080302E6 Date of Issue: Mar.31, 2008 Prepared For GuangZhou LIWEI Electronics Co., Ltd. No.33, Zhenzhongbei Road, Shenshan Industrial Park, Baiyun District, Guangzhou 510460, P.R. China Tel: 86-020 8606 2626 Fax: 86-020 8606 2626 Prepared By Shenzhen Attestation of Global Compliance Science & Technology Co., Ltd. Suite B11/B12, 4F, Huafeng Mall, Chuangye 2 nd Road, 25 District, Bao’an, Shenzhen Tel: 86-755-2974 2358 Fax: 86-755-2600 8484 Report No.:GZAGC132080302E6 Page 1 of 38 VERIFICATION OF COMPLIANCE Applicant: GuangZhou LIWEI Electronics Co., Ltd. Manufacturer GuangZhou LIWEI Electronics Co., Ltd. Product Description: Bluetooth Headset (Class 2) Brand Name: Bluedio Model Number: A6 FCC ID VO8A6 Report Number: GZAGC132080302E6 Date of Test: Mar.25, 2008-Mar.31, 2008 WE HEREBY CERTIFY THAT: The above equipment was tested by Shenzhen Attestation of Global Compliance Science & Technology Co., Ltd. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.4 (2003) and the energy emitted by the sample EUT tested as described in this report is in compliance with radiated emission limits of FCC Rules Part 15.247. Tested By: Tony Tian Mar.31, 2008 Checked By: Randy He Mar.31, 2008 Authorized By King Zhang Mar.31, 2008 Report No.:GZAGC132080302E6 Page 2 of 38 TABLE OF CONTENTS 1. GENERAL INFORMATION ...................................................................................................................... 4 1.1 PRODUCT DESCRIPTION............................................................................................................ 4 1.2 RELATED SUBMITTAL(S) / GRANT (S) ....................................................................................... 4 1.3 TEST METHODOLOGY ................................................................................................................ 4 1.4 TEST FACILITY ............................................................................................................................. 4 1.5 SPECIAL ACCESSORIES............................................................................................................. 4 1.6 EQUIPMENT MODIFICATIONS ....................................................................................................4 2. SYSTEM TEST CONFIGURATION ......................................................................................................... 5 2.1 CONFIGURATION OF TESTED SYSTEM .................................................................................... 5 2.2 EQUIPMENT USED IN TESTED SYSTEM ................................................................................... 5 3. SUMMARY OF TEST RESULTS ............................................................................................................. 6 4. DESCRIPTION OF TEST MODES........................................................................................................... 6 5. CONDUCTION EMISSIONS .................................................................................................................... 7 5.1 MEASUREMENT PROCEDURE: .................................................................................................. 7 5.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ......................................................... 7 5.3 MEASUREMENT EQUIPMENT USED:......................................................................................... 7 5.4 LIMITS AND MEASUREMENT RESULT:...................................................................................... 8 6. MAXIMUM OUTPUT POWER.................................................................................................................. 9 6.1 MEASUREMENT PROCEDURE: .................................................................................................. 9 6.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ......................................................... 9 6.3 MEASUREMENT EQUIPMENT USED:....................................................................................... 11 6.4 LIMITS AND MEASUREMENT RESULT:.................................................................................... 12 7. 20 DB BANDWIDTH .............................................................................................................................. 14 7.1 MEASUREMENT PROCEDURE .................................................................................................14 7.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .......................................................14 7.3 MEASUREMENT EQUIPMENT USED:....................................................................................... 14 7.4 LIMITS AND MEASUREMENT RESULTS: ................................................................................. 14 8. MAXIMUM CONDUCTED OUTPUT POWER SPECTRAL DENSITY ................................................... 16 8.1 MEASUREMENT PROCEDURE: ................................................................................................ 16 8.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .......................................................16 8.3 MEASUREMENT EQUIPMENT USED:....................................................................................... 16 8.4 LIMITS AND MEASUREMENT RESULT:.................................................................................... 16 9. OUT OF BAND EMISSION .................................................................................................................... 19 9.1 MEASUREMENT PROCEDURE: ................................................................................................ 19 9.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .......................................................19 9.3 MEASUREMENT EQUIPMENT USED:........................…

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RADIATED EMISSION TEST SETUP - TRANSMITTING RADIATED EMISSION TEST SETUP – CHARGING CONDUCTED EMISSION TEST – CHARGING