XHG-M600W4G Module

Mobile Broadband module M600W User Manual Sprint Smart View M600W Mobile Broadband Module 2 CONTENTS 1. BEFORE USING M600W .....................................................................................4 Introduction...................................................................................................5 System Requirement.......................................................................................5 2. DEVICE ACTIVATION.........................................................................................6 Device Activation Overview ..............................................................................7 Activation Wizard Tutorial ................................................................................8 3. The Sprint Smart View Interface....................................................................... 11 The Main Window ......................................................................................... 12 The Mobile Control Panel ............................................................................... 12 The Wi-Fi Control Panel: In Detail ................................................................... 13 Automatic vs. Manual Connection.................................................................... 13 The File Menu .............................................................................................. 14 The Tools Menu ............................................................................................ 14 The Help Menu ............................................................................................. 16 4. ESTABLISHING MOBILE................................................................................... 17 BROADBADN CONNECTIONS ............................................................................... 17 Manually Connecting to the Sprint Mobile Broadband Network............................. 19 Automatic Connection Upon Device Attachment ................................................ 19 Multiple Broadband Devices ........................................................................... 21 Locking and Unlocking Your Sprint Mobile Broadband Device............................... 21 3G Bearer Types........................................................................................... 22 Mobile Info Window ...................................................................................... 23 5. THE APPLICATION LAUNCHER .......................................................................... 24 The Application Launch Menu: In Detail ........................................................... 25 Configuring Launched Applications .................................................................. 25 Automatically Launching Applications .............................................................. 27 Monitoring Launched Applications ................................................................... 29 6. SPRINT SMARTVIEW SETTINGS ........................................................................ 31 M600W Mobile Broadband Module 3 Accessing the Settings Window....................................................................... 32 Settings: Acceleration ................................................................................... 32 Settings: App Launcher ................................................................................. 33 Settings: Client ............................................................................................ 33 Settings: Hardware....................................................................................... 34 Settings: Location/GPS.................................................................................. 36 Settings: Sounds.......................................................................................... 38 Settings: Updates......................................................................................... 39 Settings: VPN .............................................................................................. 40 7. SUPPORT ...................................................................................................... 42 Trouble Shooting .......................................................................................... 43 WARRANTY.................................................................................................. 44 SAFETY INFORMATION .................................................................................. 45 M600W Mobile Broadband Module 4 Section 1, 1. BEFORE USING M600W  Introduction  System Requirement M600W Mobile Broadband Module 5 Introduction Welcome to the help pages of the Sprint Smart View software. The Help system is designed to answer users' questions on how to perform specific tasks and to explain the Sprint Smart View's functions. The menu system to the left allows users to browse help topics while the Index and Search tabs provide other mechanisms to access available help topics. System Requirement The system requirements for basic installation and operation of the Sprint Smart View software are shown in the table below. Windows XP Windows Vista Windows 7 Processor 300MHz 800MHz (1GHz recommended) 1GHz RAM 256MB 1GB (2GB recommended) 1GB (2GB recommended) Hard Drive Space 70MB 70MB 70MB Internet Explorer IE 5.5 IE 7 IE 8 OS Service Pack Service Pack 3 Service Pack 2 Additional Requirements:  Windows Vista and Windows 7 operation requires a DirectX 9.0 (or better) graphics accelerator  Internet Connection (if downloading the installer from the Internet)  CD-ROM (if installing from CD) M600W Mobile Broadband Module 6 Section 2, 2. DEVICE ACTIVATION  Device Activation Overview  Activation Wizard Tutorial M600W Mobile Broadband Module 7 Device Activation Overview Some Sprint Mobile Broadband devices may require activation (programming) prior to use. If your device needs such an action, Sprint Smart View will inform you and start the ac…

Text truncated - open the document above for the full version.

Applicant/Grantee Franklin Technology Inc. FCC ID: XHG-M600W Section 15.212 Modular Transmitters Request for Modular Approval Request for Limited Modular Approval Requirements EUT Conditions Comply (Y/N) Single Modular Approval Requirements 1 The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. Refer to external photos. Shield is over the radio circuit module. Y 2 The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. All inputs to the modules are buffered through logic or microprocessor inputs. Y 3 The modular transmitter must have its own power supply regulation. Internal power regulator. Y 4 The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). The “professional installation” provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. Module contatins a hirose connector. The module will go inside final product where the antenna(s) will be integral to the end product, which can be considered permanently attached. Y 5 The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with Part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting Module was tested outside. Refer to test setup photos in test report Y equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i)). 6 The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. (A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: XYZMODEL1” or “Contains FCC ID: XYZMODEL1.” Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. (B) If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC certified transmitter module(s).” Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. Refer to label provided. Y 7 The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. Refer to manual. Y 8 The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Refer to MPE calculation in the Test report. Y A limited modular approval may be granted for single or split modular transmitters that do not comply with all of the above requirements, e.g., shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation, if the manufacturer can demonstrate by alternative means in the application for equipment authorization that the modular transmitter meets all the applicable Part 15 requirements under the operating conditions in which the transmitter will be used. Limited modular approval also may be granted in those instances where compliance with RF exposure rules is demonstrated only for particular product configurations. The applicant for certification must state how control of the end product into which the module will be installed will be maintained such that full compliance of the end product is always ensured.

Request for Confidentiality Compliance Certification Services Date: 2010. 10. 19 47173 Benicia St. Fremont, CA 94538 RE: Certification Application FCC ID: XHG-M600W Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commission’s Rule, the applicant hereby requests confidential treatment of information accompanying this application as outlined below: CONFIDENTIAL AND SHORT-TERM CONFIDENTIAL LIST Exhibit Description 1 Block Diagram 2 Parts Lists 3 Schematics CONFIDENTIAL 4 Operational Description 5 External Photos 6 Internal Photos 7 Test-Setup Photos SHORT-TERM CONFIDENTIAL 8 User’s Manual The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to rule 0.457 & 0.459, disclosure od this application and all accompanying documentation will not be made before the date of the GRANT for this application ́. Thank you for your attention in this matter. Applicant’s Company : Franklin Technology Inc. address : 1505 Digital Tower Aston, 505-15 Gasan-dong,Gumcheon-gu, Seoul Korea Signature : ____________________________ Job Title and Dept. :Senior Manager

FCC ID : XHG-M600W HCT CO., LTD. SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr Report 1/2 FCC ID : XHG-M600W HCT CO., LTD. SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr Report 2/2

XHG-M600W

FCC ID : XHG-M600 HCT CO., LTD. SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr 1/2 FCC ID : XHG-M600 HCT CO., LTD. SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr 2/2

Rev. 03 (2010.08.27)1. Main Part. 1 USD 1100 123456 4 1 BLM15AG601SN1 BEAD-INDUCTOR 600R, 1005 L502-503 2 MURATA 4 2 BLM18AG601SN1 BEAD-INDUCTOR 600R, 1608 L602 1 MURATA 4 3 GMD033R60J104KE11D CHIP-CAPACITOR 0.1uF, X5R, K, 0603 C502-503 C508-509 C512 C534-535 C539 C545 C553-555 C558-559 C56 1 C564 C572 C603 C622 19 MURATA 4 4 GRM0335C1ER70BZ01D CHIP-CAPACITOR 0.7pF, C0G, B, 0603 C513 C520 C524 3 MURATA 4 5 GRM0335C1E1R3CD01D CHIP-CAPACITOR 1.3pF, C0G, C, 0603 C514 1 MURATA 4 6 GRM0335C1E101JD01D CHIP-CAPACITOR 100pF, C0G, J, 0603 C516 C526-527 C530 C571 5 MURATA 4 7 GRM033R71A103KA01D CHIP-CAPACITOR 10nF, X7R, K, 0603 C552 1 MURATA 4 8 GRM0335C1E100JD01D CHIP-CAPACITOR 10pF, C0G, J, 0603 C501 C528-529 C537 C540 C547 C550-551 C56 6-567 10 MURATA 4 9 GRM188R60J106ME47D CHIP-CAPACITOR 10uF, X5R, M, 1608 C575-576 C608 C610 4 MURATA 4 10 GRM033R71E121KA01D CHIP-CAPACITOR 120pF, X7R, K, 0603 C541 1 MURATA 4 11 GRM033R71E151KA01D CHIP-CAPACITOR 150pF, X7R, K, 0603 C542 1 MURATA 4 12 GRM033R71E102KA01D CHIP-CAPACITOR 1nF, X7R, K, 0603 C565 C568 2 MURATA 4 13 GRM155R61A105KE15D CHIP-CAPACITOR 1uF, X5R, K, 1005 C510-511 C533 C548-549 5 MURATA 4 14 GRM188R60J105KE19D CHIP-CAPACITOR 1uF, X5R, M, 1608 C506-507 2 MURATA 4 15 GRM033R61A222MA01D CHIP-CAPACITOR 2.2nF, X5R, M, 0603 C543 1 MURATA 4 16 JMK105BJ225MV-F CHIP-CAPACITOR 2.2uF, X5R, M, 1005 C544 C556-557 C560 C562-563 C569-570 C57 4 9 Taiyo yuden 4 17 GRM033R71C221KA01D CHIP-CAPACITOR 220pF, X7R, K, 0603 C536 C546 2 MURATA 4 18 GRM033R60J223ME01D CHIP-CAPACITOR 22nF, X5R, M, 0603 C538 1 MURATA 4 19 GRM0335C1E220JD01D CHIP-CAPACITOR 22pF, C0G, J, 0603 C611 1 MURATA 4 20 GRM219R60G226ME66D CHIP-CAPACITOR 22uF, X5R, M, 2012, 0 .85T C573 C601-602 C618 C621 5 MURATA 4 21 GRM0335C1E330JD01D CHIP-CAPACITOR 33pF, C0G, J, 0603 C519 C522 2 MURATA 4 22 GRM0335C1E4R3CD01D CHIP-CAPACITOR 4.3pF, C0G, C, 0603 C523 C525 2 MURATA 4 23 AMK105BJ475MV-F CHIP-CAPACITOR 4.7uF, X5R, M, 1005 C604 C607 2 Taiyo yuden 4 24 GRM0335C1E6R0CD01D CHIP-CAPACITOR 6pF, C0G, C, 0603 C515 C521 2 MURATA 4 25 GRM0335C1E9R0CD01D CHIP-CAPACITOR 9pF, C0G, C, 0603 C531-532 2 MURATA 4 26 TCM0806G-900-2P-T CHIP-COIL, USB 2.0 Common Mode Filte r, 0.85x0.65x0.4 F602 1 TDK 4 27 HKQ0603S1N2S-T CHIP-INDUCTOR 1.2nH, S, 0603 L505-506 2 Taiyo Yuden 4 28 WR02X000 JTL CHIP-RESISTOR 0R, J, 0603 R503 R507 R511 R527 R534 R537-538 R542 R546-548 R552 R555 R559- 561 R601 R605-606 R610 R612 R631 R633 R647-648 L501 L504 27 Walsin 4 29 WR04X1022 FTL CHIP-RESISTOR 10.2K, F, 1005 R621 1 Walsin 4 30 WR02X101 JTL CHIP-RESISTOR 100R, J, 0603 R508-509 R535 R607 R609 R611 6 Walsin 4 31 WR02X103 JTL CHIP-RESISTOR 10K, J, 0603 R505 R514 R539 R544 R549-551 R554 8 Walsin 4 32 WR04X1542 FTL CHIP-RESISTOR 15.4K, F, 1005 R620 1 Walsin 4 33 WR02X102 JTL CHIP-RESISTOR 1K, J, 0603 R512 R515-517 R519 R525-526 R529 8 Walsin 4 34 WR02X222 JTL CHIP-RESISTOR 2.2K, J, 0603 R536 1 Walsin 4 35 WR02X203 JTL CHIP-RESISTOR 20K, J, 0603 R553 R625 R638 3 Walsin 4 36 WR04X2263 FTL CHIP-RESISTOR 226K, F, 1005 R636 1 Walsin 4 37 WR02X202 JTL CHIP-RESISTOR 2K, J, 0603 R655 1 Walsin 4 38 WR04X304 FTL CHIP-RESISTOR 300K, F, 1005 R613 1 Walsin 4 39 WR02X331 JTL CHIP-RESISTOR 330R, J, 0603 R510 R518 R651 R654 4 Walsin 4 40 WR02X37R4 FTL CHIP-RESISTOR 37.4R, F, 0603 R501 1 Walsin 4 41 WR02X472 JTL CHIP-RESISTOR 4.7K, J, 0603 R639 R641 2 Walsin 4 42 WR04X4220 FTL CHIP-RESISTOR 422R, F, 1005 R623 1 Walsin 4 43 WR02X473 JTL CHIP-RESISTOR 47K, J, 0603 R523 R634 2 Walsin 4 44 WR04X5603 FTL CHIP-RESISTOR 560K, F, 1005 R608 1 Walsin 4 45 WR02X561 JTL CHIP-RESISTOR 560R, J, 0603 R653 1 Walsin 4 46 WR02X6041 FTL CHIP-RESISTOR 6.04K, F, 0603 R506 1 Walsin 4 47 WR02X7321 FTL CHIP-RESISTOR 7.32K, F, 0603 R528 1 Walsin 4 48 WR04X8453 FTL CHIP-RESISTOR 845K, F, 1005 R635 1 Walsin 4 49 U.FL-R-SMT CONNECTOR, Coaxial Connector SW501-502 2 HIROSE 4 50 FC-135 32.768KHz CRYSTAL, 32.768kHz/CL : 9pF X501 1 EPSON 4 51 DSX221G 40MHz CRYSTAL, 40MHz, 2.5X2MM X502 1 KDS 4 52 NRH3012T2R2M Coil-POWER INDUCTOR, 2.2uH L603 1 Taiyo yuden 4 53 NRH3012T3R3M Coil-POWER INDUCTOR, 3.3uH L605 1 Taiyo yuden 4 54 NFM18PC105R0J3 EMI Filter F601 1 Murata 4 55 RZL035P01 FET, 1.5V Drive P-Channel MOSFET Q605 1 ROHM 4 56 NTE4153NT1G FET, 915 mA, 20V N-Channel, NTE4153N T1G Q601 1 ON Semiconductor 4 57 NTE4151PT1G FET, P-CHAN, 20V, SC-89, NTE4151PT1G Q501 1 ON Semiconductor 4 58 MAX8815AETB IC, 1A,Step-Up Converter U601 1 Maxim 4 59 RT8058PQW IC, 1MHz 1A Step-Down DC/DC Converte r U602 1 Richtek 4 60 LSHX-65BHB-BT3 IC, 2.6GHz WiMAX Front End Module U502 1 HITACHI METALS 4 61 MP2005DD-LF-Z IC, 800mA, HIGH PSRR,ULDO LINEAR REG ULATOR U606 1 MPS 4 62 KIC7SZ14FU IC, CMOS DIGITAL INTEGRATED U505 1 KEC 4 63 AT25256B-XHL-T IC, EEPROM, 2nd/3rd Source Add (Rem ark) U504 1 ATMEL - M95256-RDW6TP (STM)- 25AA256 ( Mocrochi p) 4 64 SM6610BH IC, Temp Sensor U501 1 SEIKO NPC 4 65 BCSM250-BB IC, WiMAX Baseband/RF Modem, 2Rx, 2T x U503 1 BECEEM 4 66 KIC7SZ32FU IC-2 input OR Gate U605 1 KEC 4 67 BR C2016T1R0M Power INDUCTOR 1uH, M, 2016 L607 1 MURATA 4 68 KRC404V TR, NPN Q602 Q604 2 KEC 4 69 KRA304V TR, PNP With Built-in Bias Resistor 47K Q607-608 2 KEC 4 70 PCB PCB 1 4 71 Shield Frame(TOP) 1 4 72 Shield Frame(Bottom) 1 4 73 DNI PAD, 52pin mini PCI Express PAD CON601 1 4 74 DNI CHIP-CAPACITOR DNI, 0603 C504-505 C517-518 4 Unit Cost($) Cost($)*qty Layer Vender Currency Unit Price Remark ◈ M600 WIMAX BOM list SEQ Level No Part Type Part Number Part Description Location Number Q'ty 4 75 DNI CHIP-RESISTOR DNI, 0603 R504 R513 R520-522 R524 R530-533 R540-541 R543 R545 R556-558 R6 02- 604 R614-618 R650 26 3 76 Shield Cover(TOP) 1 3 77 Shield Cover(Bottom) 1

Tune-up Procedure over Power Range M600W Adjustment and Test Procedure 1. Overview With ordinary use in clean, dry environments, no periodical alignment should be necessary for M600W. 2. Test equipment & Accessory The equipments and accessories listed below requires in order to proper test in the shield room. ■ Equipment ■WIMAX No. Equipment Name Company Part Number 1 Spectrum Analyzer Agilent N9020A 2 Signal Generator Agilent N5183A 3 Power Supply Agilent E3648A ■ Accessory WIMAX RF Cable, USB A type receptacle Cable, Power Splitter, Coupler, etc.. 3. Test Configuration The configuration for adjustment and test is shown in below WIMAX Figure1 Figure 1. Configuration for Adjustment and Test of WIMAX mode 4. Test Procedure A. Calibration equipment N9020A, N5183A and the M600W are connected through GPIB. B. Target power (required power level according to the specification which should be set by calibration Program) is set to equipment as power level (ex : WIMAX max power is 23dBm). C. Active M600W in Test mode. D. N9020A, N5183A equipment measures transmitted power through RF test cable from the M600W and reports measured level to calibration program. E. The program compares measured power with the target power. F. The calibration program decides power code which is defined in advance in the program and writes the code to the flash memory in the M600W. 5. Range of operating power levels The operating power levels is divided into step WIMAX mode TX PA Driver steps 1-20 (0dB<step<1.5dB) TX PA Driver step 21 (9dB<step<12dB) All TX PGA steps (1.5dB<step<2.5dB) 6. Range of operating power levels The TX PA Driver(TX PADRV) has22 steps that range from index 0 to 21. For indices 0 though 21, the step values from one TX PA Driver attenuation index to the next are stored in the TX1 PA Drv attn Steps table in the EEPROM. The difference in attenuation between index 0 and index 1 is stored in the pa Drv Attn step index 1 field, while the difference in attenuation between index 1 and index 2 is stored in the PA Drv Attn step index 1 field, and so on. The approximate step size for steps 1 through 20 is 1 dB. The Difference in attenuation between index 20 and index 21 is approximately 10dB and is stored in the TX PA Drv Index 21 field in the EEPROM. The Tx1 PA Drv index 0 should never be modified.

FCC ID:XHG-M600W HCT CO., LTD SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL : + 82 31 639 8565 FAX : + 82 31 639 8525 www.hct.co.kr 1 of 3 RF Exposure Statement 1. LIMITS According to §1.1310 and §2.1091 RF exposure is calculated. (B) Limits for General Population/Uncontrolled Exposures Frequency range (MHz) Electric field Strength (V/m) Magnetic field Strength (A/m) Power density (mW/cm²) Averaging time (minutes) 0.3 - 1.34....................................... 1.34 - 30....................................... 30 - 300....................................... 300 - 1500.................................... 1500 - 100.000................................. 614 824/f 27.5 ............... ............... 1.63 2.19/f 0.073 ............... ............... *(100) *(180/ f²) 0.2 f/1500 1.0 30 30 30 30 30 F = frequency in MHz * = Plane-wave equivalent power density 2. MAXIMUM PERMISSIBLE EXPOSURE Prediction Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 S = PG/4πR² S = Power density P = power input to antenna G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna FCC ID:XHG-M600W HCT CO., LTD SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL : + 82 31 639 8565 FAX : + 82 31 639 8525 www.hct.co.kr 2 of 3 2-1. 5MHz Bandwidth Max Peak output Power at antenna input terminal (dBm) 23.410 Max Peak output Power at antenna input terminal (mW) 219.280 Prediction distance (cm) 20.000 Prediction frequency (MHz) 2687.5 Antenna Gain(typical) (dBi) 0.000 Antenna Gain(numeric) 1.0000 Power density at prediction frequency (mW/cm²) 0.04362 MPE limit for uncontrolled exposure at prediction frequency (mW/cm²) 1.00000 2-2. PCS Bandwidth Max Peak output Power at antenna input terminal (dBm) 23.11 Max Peak output Power at antenna input terminal (mW) 204.644 Prediction distance (cm) 20.000 Prediction frequency (MHz) 2685.00 Antenna Gain(typical) (dBi) 0.0000 Antenna Gain(numeric) 1.0000 Power density at prediction frequency (mW/cm²) 0.04071 MPE limit for uncontrolled exposure at prediction frequency (mW/cm²) 1.00000 FCC ID:XHG-M600W HCT CO., LTD SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA TEL : + 82 31 639 8565 FAX : + 82 31 639 8525 www.hct.co.kr 3 of 3 3. RESULTS The power density level at 20 cm is 0.04362 mW/cm², which is below the uncontrolled exposure limit of 1.00000 mW/cm² at 2687.500 MHz for 5 MHz band. The power density level at 20 cm is 0.04071 mW/cm², which is below the uncontrolled exposure limit of 1.00000 mW/cm² at 2685.0 MHz for 10MHz band.

CHECK QC APPR. DRAW of REV VER SHEET DATE FILENAME TITLE PROJECT SECRET FRANKLIN TECHNOLOGY INC. FRANKLIN TECHNOLOGY INC. Confidential and Proprietary FWM600MOD SCHEMATIC MAIN FWM600MOD_Main_Rev03 Copyright ̈Ï 2010 FRANKLIN TECHNOLOGY INC. All right reserved FRANKLIN TECHNOLOGY INC. CONFIDENTIAL AND PROPRIETARY M600 2010.09.01 1 6 Thomas <QC By> <Checked By> <Drawn By> 1.TITLE_MAIN P3 03 of DRAW CHECK CHECK APPR. REV VER SHEET DATE FILENAME TITLE PROJECT SECRET FRANKLIN TECHNOLOGY INC. Confidential and Proprietary FRANKLIN TECHNOLOGY INC. Revision History Version Remark Operator Description Date Revision Version Remark Operator Description Date Revision Revision History Version Remark Operator Description Date Revision Version Remark Operator Description Date Revision Copyright ̈Ï 2010 FRANKLIN TECHNOLOGY INC. All right reserved FRANKLIN TECHNOLOGY INC. CONFIDENTIAL AND PROPRIETARY 2010.07.14 01 P2 Kyle Choi 1. DPX402 (ACMD7403 => MFD880960W03) Part Change 2. FL409 (B9034 => LW31A) Part/Size Change 3. X601/X701 (C3F12.000-30HZ30125 => DSX221G-12MHz) Part Change 4. C182 (0603 => 1005) Size Change 5. U406 (KIC7S02FU => KIC7SZ02FU) Part Change 6. Q605/Q701 (Si2343DS => Si2343CDS) Part Change 7. F602/F701 (ICMEF212P121M => BS-CM-900HAS-T) Part Change 8. U703 (RP103N261B-TR-FE => MIC5255-2.6V) Part Change 9. C716 0.1uF(1005) Part Add 10. LED701/LED702 (SSC-FR104-II1 => HT-191UR) Part Change 11. LED703 (SSC-YG101-IC1 => HT-191YG) Part Change P1 01 Initial 2010.07.20 1. U602 (RT8020 => RT8010/A) Part Change 2. U606 (MIC47050YML) Part Add 3. R627, R628, R632, R633, L604, C608 Part Remove 4. C604, R620, R621, R623, R701, D706 Part Add 5. F602, F701 PCB Decal Change 6. Q701 Part Remove 7. D702 (RSX501LA-20 => RSX051VA-30) Part Change 8. L701 (NRH3012T4R7M => NRS5020T 4R7M) Part Change 9. R741, R743, R744, R747, R748, L708, C729, C730, C731, C733, CT704 Part Remove 10. R750, R752, R754, R755, R756, R757, L709, CT705, C736, C737, C738, C739, C740 Part Remove 11. U705 (MAX15041ETE => MIC37100-3.3WS) Part Change 12. U706 (MAX15041ETE => MIC37100-1.5WS) Part Change 13. R749, R751 (DNI => 0R(1005)) Value Change 14. C727, C734 (10uF/50V(3225) => 10uF/10V(2012)) Part Change 15. C728, C735 (47uF/6.3V(3225) => 10uF/10V(2012)) Part Change 16. R706 (0R(1005) => DNI) Value Change 17. U701 (MM60-EZH059-B5 => 48099-5701) Part Change 18. CON704 (MM60-52B1-E1 => 67910-5701) Part Change P2 02 Kyle Choi 1. C302 (15pF) Part Add 3. C304 C313 C334 C340 C341 C343 C360 C378 C379 C384 C387 Value Change Part Change 2. U401 (CP0402A0836BNTR => CP0402A0836DNTR) 4. C330 C361 C362 C367 C369 C370 C381 C390 C403 C602 Value Change 6. L430 Q606 R656 D601 Part Remove 5. L401 L402 L403 L410 L412 L419 L420 L424 L436 Value Change 7. Q605 (Si2343CDS => RZL035P01) Part Change 9. LED Control Net Change 2010.07.23 P2 03 Kyle Choi 8. Q607 Q608 (KRC404V => KRA304V) Part Change 1. CT702 CT703 PCB Decal Change 2010.07.26 P2 04 Kyle Choi 2. UART Control Net Change 3. R125 Value Change(HW Revision) 4. U104 R136 R137 R138 C201 CON713 CON714 Part Add 5. Wimax Net Change Part Change 6. Q602 Q603 Q604 (DTC124EM => KRC404V) 7. D706 (DNI => RSX501LA-20) Value Change 8. R712 R713 R723 R724 C573 C574 C606 C608 Part Add Part Change 9. Q702 Q703 Q704 (DTC124EM => KRA304V) Net Add Value Change 10. mini PCIe 1.5V 11. R707 R727 R728 12. L102 (MIPSZ2012D4R7 => DNI) Value Change 13. X601/X701 (DSX221G-12MHz => E2SB12.0000F10E33-12MHz) Part Change 14. C615 C616 C725 C726 Value Change 15. X502 (DSX221S-40MHz => DSX221G-40MHz) Part Change 1. R125, R126 Value Change(HW Revision) 2. R139 Part Add (Seperate M600/M600S) Part Change 3. U104 (MIC47050 => MP2005) Value Change 4. R137 R138 Part Change 5. X101 (FC-135 => FC-13F) Value Change 6. L421 7. C575, C576, R601 Part Add Part Change 8. U505 (NC7S14L6X => KIC7SZ14FU) 9. R502 Part Remove Part Change 10. U602 (RT8010A => RT8058PQW) Value Change 11. L605 Part Change 12. U606 (MIC47050 => MP2005) Value Change 13. R602, R619, R620, R621, R637, R645, R646 Part Add 14. TP601~TP613, TP701 2010.08.24 P3 01 Kyle Choi Part Change 15. U603 (FE4.1 => USB2412) Part Change 16. L606 (1608 Pwr Inductor => BEAD600R) Part Change 17. F602 (BS-CM-900HAS-T => TCM0806G-900-2P-T) Part Add 18. R605, R606, R626, R627, R628, R629, R630, R632, R633, R648, R656, R657, R658 Part Add 19. C613, C614, C617, C619, C620, C623, L706, D707 Value Change 20. R710, L702, L703, L704, L705, C708, C709, C710, C712, C713, C714 Part Add 21. CT704, R714, R715, R725, R726, R741, L706, C717, C729 Part Add 22. TP701~TP704 23. R751, L707 Part/Size Change 1. CON710, U707, L708, C736, C737, R752 Part Add 2010.08.27 P3 02 Kyle Choi 1. DPX402 (MFD880960W03 => ACMD-7403) Part Change 2010.08.30 P3 03 Kyle Choi 16. SW401, SW403, SW501, SW502, SW702, SW703, SW704, SW705 Part Change (MM9329-2700 => U.FL-R-SMT) 2. X102 (KT3225P19200DCV28KN0 => T0H19200PH4CND) Part Change 1. L438 Value Change 2010.08.31 P3 04 Kyle Choi 6 2 2010.09.01 of M600 2010.09.01 Thomas <QC By> <Checked By> <Drawn By> 2.REV_HISTORY P3 03 DRAW CHECK CHECK APPR. REV VER SHEET DATE FILENAME TITLE PROJECT SECRET FRANKLIN TECHNOLOGY INC. Confidential and Proprietary FRANKLIN TECHNOLOGY INC. Open Open Open Open Pull_DN Pull_DN Pull_DN Pull_DN Pull_DN Pull_DN Pull_DN Pull_DN MP2 MP1 Pull_DN Pull_DN Open Pull_DN Open Open Open Open Open Open PP2 PP1 P4 GPIO_0 P2 P3 P1 Open GPIO_13 GPIO_14 Pull_DN HW Revision Copyright ̈Ï 2010 FRANKLIN TECHNOLOGY INC. All right reserved FRANKLIN TECHNOLOGY INC. CONFIDENTIAL AND PROPRIETARY PM Bypass VCO_TUN VC-TCXO MCP (NAND 1G * DDR 256M) D-CDMA P-CDMA P-PCS GPS Div-PCS 1.3V GPIO_0 GPIO_13 GPIO_14 M600(DNI)/M600S(Pull_DN) of M600 2010.09.01 3 6 Thomas <QC By> <Checked By> <Drawn By> 3.EVDO_LOGIC P3 03 L101 MIPSZ2012D4R7 C…

Text truncated - open the document above for the full version.