XMR202006EC25AUXLTE Module

EC25 Mini PCIe Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 1 / 76 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: [email protected] Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: [email protected] GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 2 / 76 About the Document History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/ Frank WANG Initial 1.1 2017-01-24 Lyndon LIU/ Frank WANG 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in Table 2. 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-AF Mini PCIe, EC25-EU Mini PCIe, EC25-EC Mini PCIe, EC25-EUX Mini PCIe, EC25-MX Mini PCIe and their related information. 2. Updated LTE，UMTS and GSM features, and added storage temperature range in Table 2. 3. Added pin definition and description of pin 3, 5, 44 in Figure 2 and Table 4. 4. Modified the reference circuit of USB interface in Figure 6. 5. Updated the mechanical dimension of EC25 Mini PCIe in Figure 18. 6. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 3 / 76 7. Added COEX UART interface (under development) as UART interface in Chapter 3.6. 8. Modified description of W_DISABLE# signal in Chapter 3.8.3. 9. Modified description of LED_WWAN# signal in Chapter 3.8.5. 10. Updated description of antenna connection in Chapter 5. 11. Added thermal consideration in Chapter 6.7. 12. Added operating frequencies in Table 16. 13. Added GNSS frequency in Table 17. 14. Updated antenna requirements in Table 18. 15. Updated EC25 Mini PCIe conducted RF output power in Table 21. 16. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 22. 17. Added conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 23. 18. Updated conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 24. 19. Updated conducted RF receiving sensitivity of EC25-E Mini PCIe in Table 25. 20. Updated conducted RF receiving sensitivity of EC25-V Mini PCIe in Table 26. 21. Added conducted RF receiving sensitivity of EC25-AF Mini PCIe in Table 27. 22. Added conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 28. 23. Added conducted RF receiving sensitivity of EC25-EC Mini PCIe in Table 29. 24. Added conducted RF receiving sensitivity of EC25-EUX Mini PCIe in Table 30. 25. Added current consumption of EC25-AU Mini PCIe in Table 33. 26. Added current consumption of EC25-J Mini PCIe in Table 34. 27. Added current consumption of EC25-AF Mini PCIe in Table 37. 28. Added current consumption of EC25-EC Mini PCIe in Table 38. 29. Added current consumption of EC25-EUX Mini PCIe in Table 39. LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 4 / 76 2.1 2019-07-05 Fanny CHEN/ Ethan SHAN 1. Added EC25-AFX/-AUX Mini PCIe and related information. 2. Updated supported protocols and USB serial drivers in Table 2. 3. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. 4. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 29. 5. Updated EC25-AF Mini PCIe current consumption in Table 39. 6. Added EC25-AFX Mini PCIe current consumption in Table 42. 7. Added EC25-MX Mini PCIe conducted RF receiving sensitivity in Table 32. 8. Added EC25-MX Mini PCIe current consumption in Table 43. 2.2 2019-08-19 Ward WANG/ Owen WEI 1. Deleted the information of GNSS supported on EC25-EC Mini PCIe in Table 1. 2. Updated conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 24. 3. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 30. 4. Added conducted RF receiving sensitivity of EC25-AUX Mini PCIe in Table 34. 5. Updated current consumption of EC25-J Mini PCIe in Table 38. 6. Added current consumption of EC25-AUX Mini PCIe in Table 45. 7. Added current consumption of EC25-EU Mini PCIe in Table 46. 8. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future…

Text truncated - open the document above for the full version.

Module : EC25-AUX EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC25 Hardware Design EC25_Hardware_Design 1 / 130 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: [email protected] Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: [email protected] GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. LTE Standard Module Series EC25 Hardware Design EC25_Hardware_Design 2 / 130 About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1.1 2016-09-22 Lyndon LIU/ Frank WANG 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1.2 2016-11-04 Lyndon LIU/ Michael ZHANG 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added note about SIMO in Chapter 6.6. 1.3 2017-01-24 Lyndon LIU/ Frank WANG 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. LTE Standard Module Series EC25 Hardware Design EC25_Hardware_Design 3 / 130 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in Table 33. 7. Updated EC25-A conducted RF receiving sensitivity in Table 38. 8. Added EC25-J conducted RF receiving sensitivity in Table 40. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 1. Updated functional diagram in Figure 1. 2. Updated LTE, UMTS and GSM features in Table 2. 3. Updated description of pin 40/136/137/138. 4. Updated PWRKEY pulled down time to 500ms in Chapter 3.7.1 and reference circuit in Figure 10. 5. Updated reference circuit of (U)SIM interface in Figure 17&18. 6. Updated reference circuit of USB interface in Figure 19. 7. Updated PCM mode in Chapter 3.12. 8. Added SD card interface in Chapter 3.13. 9. Updated USB_BOOT reference circuit in Chapter 3.20. 10. Updated module operating frequencies in Table 26. 11. Updated antenna requirements in Table 30. 12. Updated EC25 series module current consumption in Chapter 6.4. 13. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 6.8. 15. Added dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and Chapter 6.3. 17. Updated RF output power in Table 41. 18. Updated GPRS multi-slot classes in Table 53. 19. Updated storage information in Chapter 8.1. 1.5 2018-04-20 Kinsey ZHANG 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in Table 40. 4. Changed GNSS current consumption of EC25 series module into Table 41. 5. Added EC25-AF conducted RF receiving sensitivity in LTE Standard Module Series EC25 Hardware Design EC25_Hardware_Design 4 / 130 Table 50. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 7. Updated general description in Table 1. 8. Updated module operating frequencies in Table 27. 9. Updated GNSS frequency in Table 29. 10. Updated antenna requirements in Table 30. 11. Updated EC25-V current consumption in Table 36. 12. Added EC25…

Text truncated - open the document above for the full version.

Quectel Wireless Solutions Company Limited XMR202006EC25AUX data re‐use cover letter EC25,EC25‐AU MINIPCIE FCC ID: XMR201805EC25AU certifite : 182180550_AA_00_final , date of grant :05/04/2018 We Quectel Wireless Solutions Co., Ltd. declare the following models. Product Name: LTE CAT4 Module Model Number: EC25-AU, EC25-AUX Hardware Version: V3.1 EC25-AU and EC25-AUX share the same HW design, the difference between them is only MMPA and TXM. The vendor is SKYWORKS on EC25-AU, Vanchip on EC25-AUX. Ple a EC25 EC25 for Ban d varia EC2 EC2 dup Rad and EC25 EC25 for Ban d varia SIG O  ase check the 5‐AUX, EC25 5‐AU MINIPC variant. The dwidth, Ban ant in this re 25-AUX, EC 25-AU, EC2 plicated from diated Powe d Radiates S 5‐AUX, EC25 5‐AU MINIPC variant. The dwidth, Ban ant in this re GNATURE: Jean H Original written Typed/pr i e report upda ‐AUX MINIPC CIE (Report N ere is only d Edge Co m port. C25-AUX MI 25-AU MINI m original f er, Occupie Spurious Em ‐AUX MINIPC CIE (Report N ere is only d Edge Co m port. Hu signature of au inted name of a ates below : CIE (Report No.: R1804A0 tested RF p mpliance, Fre NIPCIE (R e IPCIE (Rep for variant. ed Bandwid mission for CIE (Report No.: R1804A0 tested RF p mpliance, Fre uthorized signe authorized sign No.: R2005A 0154‐R1). Te power outp quency Sta b eport No.: R port No.: R There is on th, Band Ed r variant in No.: R2005 A 0154‐R3). Te power outp quency Sta b 05/20 er  Projec ner Ti A0269‐R1) is st values pa ut, Effectiv e bility and Ra R2005A0269 R1804A0154 nly tested R dge Compli this report. A0269‐R3) is st values pa ut, Effectiv e bility and Ra 0/2020 Date (Month, D ct Manager itle of authorize a variant mo rtial duplicat e Radiated P diates Spuri 9-R2) is a va 4-R2). Test RF power o iance, Freq . a variant m o rtial duplicat e Radiated P diates Spuri Day, Year) ed signer odel of EC25 ted from ori Power, Occu ous Emission ariant mod values p a utput, Effec quency Stab odel of EC25 ted from ori Power, Occu ous Emission 5‐AU, ginal upied n for el of artial ctive bility 5‐AU, ginal upied n for

QuectelWirelessSolutionsCompanyLimited DeclarationoftheModularApproval Applicant/Grantee QuectelWirelessSolutionsCompanyLimited FCCID: XMR202006EC25AUX Model: EC25-AUX,EC25-AUXMINIPCIE Thesinglemoduletransmitterhasbeenevaluatedthentestedmeetingthe requirementsunderPart15CSection212asbelow: ModularapprovalrequirementEUTConditionComply (a)Theradioelementsofthemodulartransmittermust havetheirownshielding.Thephysicalcrystaland tuningcapacitorsmaybelocatedexternaltothe shieldedradioelements. Theradioelementsofthe modulartransmitterhave theirownshielding. YES (b)Themodulartransmittermusthave bufferedmodulation/datainputs(ifsuchinputsare provided)toensurethatthemodulewillcomplywith part15requirementsunderconditionsofexcessive dataratesorover-modulation. Themodularhasbuffered datainputs,itisintegratedin chip.Pleasesee schematic.pdf YES (c)Themodulartransmittermusthaveits ownpowersupplyregulation. Allpowerlinesderivedfrom thehostdeviceareregulated beforeenergizingother circuitsinternaltotheEC25- AUX,EC25-AUX MINIPCIE .Pleasesee schematic.pdf YES (d)Themodulartransmittermustcomply withtheantennaandtransmissionsystem requirementsofSections15.203,15.204(b)and 15.204(c).Theantennamusteitherbepermanently attachedoremploya“unique”antennacoupler(atall connectionsbetweenthemoduleandtheantenna, includingthecable).The“professionalinstallation” provisionofSection15.203isnotapplicabletomodules butcanapplytolimitedmodularapprovalsunder paragraph(b)ofthissection. Apermanentlyattached antennaoruniqueantenna connectorisnota requirementforlicensed modules. Not Applicable (e)Themodulartransmittermustbetested inastand-aloneconfiguration,i.e.,themodulemustnot beinsideanotherdeviceduringtestingforcompliance withpart15requirements.Unlessthetransmitter modulewillbebatterypowered,itmustcomplywiththe AClineconductedrequirementsfoundinSection The EC25-AUX,EC25-AUX MINIPCIEwastestedina stand‐aloneconfiguration viaaPCMCIAextender. Pleaseseeconducted set‐upphoto.pdfand YES QuectelWirelessSolutionsCompanyLimited 15.207.ACorDCpowerlinesanddatainput/output linesconnectedtothemodulemustnotcontainferrites, unlesstheywillbemarketedwiththemodule(see Section15.27(a)).Thelengthoftheselinesshallbethe lengthtypicalofactualuseor,ifthatlengthisunknown, atleast10centimeterstoinsurethatthereisno couplingbetweenthecaseofthemoduleand supportingequipment.Anyaccessories,peripherals,or supportequipmentconnectedtothemoduleduring testingshallbeunmodifiedandcommerciallyavailable (seeSection15.31(i))mustnotbeinsideanother deviceduringtesting. spuriousset‐up (f)Themodulartransmittermustbe equippedwitheitherapermanentlyaffixedlabelor mustbecapableofelectronicallydisplayingitsFCC identificationnumber. ThelabelpositionofEC25- AUX,EC25-AUXMINIPCIE isclearlyindicated.Ifthe FCCIDofthemodulecannot beseenwhenitisinstalled, thenthehostlabelmust includethetext:Contains FCCID: XMR202006EC25AUX. Pleaseseethelabel.pdf YES (g)Themodulartransmittermustcomply withanyspecificrulesoroperatingrequirementsthat ordinarilyapplytoacompletetransmitterandthe manufacturermustprovideadequateinstructionsalong withthemoduletoexplainanysuchrequirements.A copyoftheseinstructionsmustbeincludedinthe applicationfor equipmentauthorizationrequirements,whicharebasedon theintendeduse/configurations. TheEC25-AUX,EC25-AUX MINIPCIEiscompliantwith allapplicableFCCrules. Detailinstructionsaregiven intheUserManual. YES (h)Themodulartransmittermustcomply withanyapplicableRFexposurerequirementsinits finalconfiguration. TheEC25-AUX,EC25-AUX MINIPCIEisapprovedto complywiththeapplicable RFexposurerequirement, pleaseseetheMPE evaluationwith20cmasthe distancerestriction. YES QuectelWirelessSolutionsCompanyLimited Dated 2020/6/8 By: JeanHu SignaturePrinted Title:CertificationSectionManager Onbehalfof:(QuectelWirelessSolutions CompanyLimited) Telephone: +86-2150086326-800

QuectelWirelessSolutionsCompanyLimited POWEROFATTORNEY DATE:June8,2020 To: FederalCommunicationsCommission, Authorization&EvaluationDivision, 7435OaklandMillsRoad, Columbia,MD21046 We,theundersigned,herebyauthorizeTATechnology(Shanghai)Co.,Ltd./ Hanjinnanonourbehalf,toapplytoFCConourequipmentforFCCID: XMR202006EC25AUX.AnyandallactscarriedoutbyTATechnology (Shanghai)Co.,Ltd./Hanjinnanonourbehalfshallhavethesameeffectas actsofourown. Sincerely, Signature: Printname:JeanHu Company:QuectelWirelessSolutionsCompanyLimited

QuectelWirelessSolutionsCompanyLimited RequestforConfidentiality Date:_2020/6/8_ Subject:ConfidentialityRequestfor:_____FCCID:XMR202006EC25AUX______ PursuanttoFCC47CRF0.457(d)and0.459andICRSP-100,Section10,theapplicantrequeststhatapartofthe subjectFCCapplicationbeheldconfidential. TypeofConfidentialityRequestedExhibit ShortTermPermanentBlockDiagrams ShortTermExternalPhotos ShortTermPermanent* 1 InternalPhotos ShortTermPermanentOperationDescription/TheoryofOperation ShortTermPermanentPartsList&Placement/BOM ShortTermPermanentTune-UpProcedure ShortTermPermanentSchematics ShortTermTestSetupPhotos ShortTermPermanent*User’sManual *Note:______(InsertExplanationasNecessary)______ ______FCCID:XMR202006EC25AUX_____hasspentsubstantialeffortindevelopingthisproductandit isoneofthefirstofitskindinindustry.Havingthesubjectinformationeasilyavailableto"competition"would negatetheadvantagetheyhaveachievedbydevelopingthisproduct.Notprotectingthedetailsofthedesignwill resultinfinancialhardship. PermanentConfidentiality: Theapplicantrequeststheexhibitslistedaboveaspermanentlyconfidentialbepermanentlywithheldfrompublic reviewduetomaterialsthatcontaintradesecretsandproprietaryinformationnotcustomarilyreleasedtothepublic. Short-TermConfidentiality: Theapplicantrequeststheexhibitsselectedaboveasshorttermconfidentialbewithheldfrompublicviewfora periodof______daysfromthedateoftheGrantofEquipmentAuthorizationandpriortomarketing.Thisisto avoidprematurereleaseofsensitiveinformationpriortomarketingorreleaseoftheproducttothepublic.Applicant isalsoawarethattheyareresponsibletonotifyTCBintheeventinformationregardingtheproductortheproductis madeavailabletothepublic.TCBwillthenreleasethedocumentslistedaboveforpublicdisclosurepursuantto FCCPublicNoticeDA04-1705. NOTEforIndustryCanadaApplications: TheapplicantunderstandsthatuntilsuchtimethatICdistinguishesbetweenShortTermandPermanent Confidentiality,eithertypeofmarkedexhibitabovewillsimplybemarkedConfidentialwhensubmittedtoIC. Sincerely, By:JeanHu (Signature/Title 2 )(Printname)

E TA Techno This report sh EUT Ap EUT Appearanc ology (Shang hall not be repr ppearanc ce ghai) Co., L roduced except ce td. tin full, without Picture 1: t the written ap a: EUT : Constituen pproval of TA Te ts of EUT Re echnology (Shan eport No.: R200 Pa nghai) Co., Ltd. 05A0269 age 1 of 1

MPE TEST REPORT Applicant Quectel Wireless Solutions Co., Ltd FCC ID XMR202006EC25AUX Product LTE Module Brand Quectel Model EC25-AUX, EC25-AUX MINIPCIE Report No. R2005A0269-M1V1 Issue Date June 22, 2020 TA Technology (Shanghai) Co., Ltd. tested the above equipment in accordance with the requirements in FCC 47 CFR Part 1 1.1310. The test results show that the equipment tested is capable of demonstrating compliance with the requirements as documented in this report. Performed by: Yu Wang Approved by: Guangchang Fan TA Technology (Shanghai) Co., Ltd. No.145, Jintang Rd, Tangzhen Industry Park, Pudong Shanghai, China TEL: +86-021-50791141/2/3 FAX: +86-021-50791141/2/3-8000 MPE Test Report Report No: R2005A0269-M1V1 TA Technology (Shanghai) Co., Ltd. Page 2 of 10 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. Table of Contents 1 Test Laboratory ............................................................................................................................... 3 1.1 Notes of the Test Report ......................................................................................................... 3 1.2 Test facility .............................................................................................................................. 3 1.3 Testing Location ...................................................................................................................... 4 1.4 Laboratory Environment .......................................................................................................... 4 2 Description of Equipment under Test .............................................................................................. 5 3 Maximum conducted output power (measured) and antenna Gain ................................................ 6 4 Test Result ..................................................................................................................................... 7 MPE Test Report Report No: R2005A0269-M1V1 TA Technology (Shanghai) Co., Ltd. Page 3 of 10 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. 1 Test Laboratory 1.1 Notes of the Test Report This report shall not be reproduced in full or partial, without the written approval of TA technology (shanghai) co., Ltd.The results documented in this report apply only to the tested sample, under the conditions and modes of operation as described herein .Measurement Uncertainties were not taken into account and are published for informational purposes only. This report is written to support regulatory compliance of the applicable standards stated above. 1.2 Test facility FCC (Designation number: CN1179, Test Firm Registration Number: 446626) TA Technology (Shanghai) Co., Ltd. has been listed on the US Federal Communications Commission list of test facilities recognized to perform electromagnetic emissions measurements. MPE Test Report Report No: R2005A0269-M1V1 TA Technology (Shanghai) Co., Ltd. Page 4 of 10 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. 1.3 Testing Location Company: TA Technology (Shanghai) Co., Ltd. Address: No.145, Jintang Rd, Tangzhen Industry Park, Pudong Shanghai, China City: Shanghai Post code: 201201 Country: P. R. China Contact: Fan Guangchang Telephone: +86-021-50791141/2/3 Fax: +86-021-50791141/2/3-8000 Website: http://www.ta-shanghai.com E-mail: [email protected] 1.4 Laboratory Environment Temperature Min. = 18C, Max. = 25 C Relative humidity Min. = 30%, Max. = 70% Ground system resistance < 0.5  Ambient noise is checked and found very low and in compliance with requirement of standards. Reflection of surrounding objects is minimized and in compliance with requirement of standards. MPE Test Report Report No: R2005A0269-M1V1 TA Technology (Shanghai) Co., Ltd. Page 5 of 10 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. 2 Description of Equipment under Test Client Information Applicant Quectel Wireless Solutions Co., Ltd Applicant address Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Manufacturer Quectel Wireless Solutions Co., Ltd Manufacturer address Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 General Technologies Model EC25-AUX, EC25-AUX MINIPCIE IMEI 862708040005709 Hardware Version R1.0 Software Version EC25AUXGAR08A02M1G Date of Testing: May 12, 2020 ~ May 13, 2020 The series model number is: EC25-AUX MINIPCIE. The difference of these models are have different marketing requirement. Note: This revised report (Report No.: R2005A0269-M1V1) supersedes and replaces the previously issued report (Report No.: R2005A0269-M1). Please discard or destroy the previously issued report and dispose of it accordingly. EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2005A0269-M1V1) is a variant model of EC25-AU, EC25-AU MINIPCIE (Report No.: R1804A0154-M1). All test items tested for variant in this report. The detailed product change description please refers to Statement letter_EC25-AU&amp; EC25-AUX. MPE Test Report Report No: R2005A0269-M1V1 TA Technology (Shanghai) Co., Ltd. Page 6 of 10 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. 3 Maximum conducted output power (measured) and antenna Gain the numeric gain (G) of the antenna with a gain specified in dB is determined by Numeric gain (G)=10^(antenna gain/10) Band Burst Turn up Power(dBm) Division Factors (dB) Time-Averaged Tune up Power (dBm) GSM 850 GSM 35.000 -9.03 25.97 GSM 1900 GSM 32.000 -9.03 22.97 Note: Division Factors To average the power, the division factor is as follows: 1Txslot = 1 transmit time slot out of 8 t…

Text truncated - open the document above for the full version.

RF TEST REPORT Applicant Quectel Wireless Solutions Co., Ltd FCC ID XMR202006EC25AUX Product LTE Module Brand Quectel Model EC25-AUX, EC25-AUX MINIPCIE Report No. R2005A0269-R1 Issue Date May 28, 2020 TA Technology (Shanghai) Co., Ltd. tested the above equipment in accordance with the requirements in FCC CFR47 Part 2 (2019)/ FCC CFR 47 Part 22H (2019). The test results show that the equipment tested is capable of demonstrating compliance with the requirements as documented in this report. Performed by: Peng Tao Approved by: Kai Xu TA Technology (Shanghai) Co., Ltd. No.145, Jintang Rd, Tangzhen Industry Park, Pudong Shanghai, China TEL: +86‐021‐50791141/2/3 FAX: +86‐021‐50791141/2/3‐8000 RF Test Report Report No.: R2005A0269-R1 TA Technology (Shanghai) Co., Ltd. TA-MB-05-001R Page 2 of 58 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. TABLE OF CONTENT 1. Test Laboratory ...................................................................................................................................... 4 1.1. Notes of the Test Report ............................................................................................................... 4 1.2. Test facility ..................................................................................................................................... 4 1.3. Testing Location ............................................................................................................................ 4 2. General Description of Equipment under Test ....................................................................................... 5 2.3. Applicant and Manufacturer Information ....................................................................................... 5 2.4. General Information ....................................................................................................................... 5 3. Applied Standards .................................................................................................................................. 7 4. Test Configuration .................................................................................................................................. 8 5. Test Case Results ................................................................................................................................ 10 5.1. RF Power Output and Effective Radiated Power ........................................................................ 10 5.2. Occupied Bandwidth ................................................................................................................... 18 5.3. Band Edge Compliance ............................................................................................................... 27 5.4. Peak-to-Average Power Ratio (PAPR) ....................................................................................... 35 5.5. Frequency Stability ...................................................................................................................... 38 5.6. Spurious Emissions at Antenna Terminals ................................................................................. 44 5.7. Radiates Spurious Em…

Text truncated - open the document above for the full version.