XMR202012EC25TLTE Module

EC25 MINIPCIE Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.4 Date: 2019-12-18 Status: Released www.quectel.com LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 1 / 80 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: [email protected] Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: [email protected] GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 2 / 80 About the Document Revision History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/ Frank WANG Initial 1.1 2017-01-24 Lyndon LIU/ Frank WANG 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in Table 2. 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-AF Mini PCIe, EC25-EU Mini PCIe, EC25-EC Mini PCIe, EC25-EUX Mini PCIe, EC25-MX Mini PCIe and their related information. 2. Updated LTE，UMTS and GSM features, and added storage temperature range in Table 2. 3. Added pin definition and description of pin 3, 5, 44 in Figure 2 and Table 4. 4. Modified the reference circuit of USB interface in Figure 6. 5. Updated the mechanical dimension of EC25 Mini PCIe in Figure 18. 6. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. 7. Added COEX UART interface (under LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 3 / 80 development) as UART interface in Chapter 3.6. 8. Modified description of W_DISABLE# signal in Chapter 3.8.3. 9. Modified description of LED_WWAN# signal in Chapter 3.8.5. 10. Updated description of antenna connection in Chapter 5. 11. Added thermal consideration in Chapter 6.7. 12. Added operating frequencies in Table 16. 13. Added GNSS frequency in Table 17. 14. Updated antenna requirements in Table 18. 15. Updated EC25 Mini PCIe conducted RF output power in Table 21. 16. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 22. 17. Added conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 23. 18. Updated conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 24. 19. Updated conducted RF receiving sensitivity of EC25-E Mini PCIe in Table 25. 20. Updated conducted RF receiving sensitivity of EC25-V Mini PCIe in Table 26. 21. Added conducted RF receiving sensitivity of EC25-AF Mini PCIe in Table 27. 22. Added conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 28. 23. Added conducted RF receiving sensitivity of EC25-EC Mini PCIe in Table 29. 24. Added conducted RF receiving sensitivity of EC25-EUX Mini PCIe in Table 30. 25. Added current consumption of EC25-AU Mini PCIe in Table 33. 26. Added current consumption of EC25-J Mini PCIe in Table 34. 27. Added current consumption of EC25-AF Mini PCIe in Table 37. 28. Added current consumption of EC25-EC Mini PCIe in Table 38. 29. Added current consumption of EC25-EUX Mini PCIe in Table 39. 2.1 2019-07-05 Fanny CHEN/ Ethan SHAN 1. Added EC25-AFX/-AUX Mini PCIe and related information. LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design 4 / 80 2. Updated supported protocols and USB serial drivers in Table 2. 3. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. 4. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 29. 5. Updated EC25-AF Mini PCIe current consumption in Table 39. 6. Added EC25-AFX Mini PCIe current consumption in Table 42. 7. Added EC25-MX Mini PCIe conducted RF receiving sensitivity in Table 32. 8. Added EC25-MX Mini PCIe current consumption in Table 43. 2.2 2019-08-19 Ward WANG/ Owen WEI 1. Deleted the information of GNSS supported on EC25-EC Mini PCIe in Table 1. 2. Updated conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 24. 3. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 30. 4. Added conducted RF receiving sensitivity of EC25-AUX Mini PCIe in Table 34. 5. Updated current consumption of EC25-J Mini PCIe in Table 38. 6. Added current consumption of EC25-AUX Mini PCIe in Table 45. 7. Added current consumption of EC25-EU Mini PCIe in Table 46. 8. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in th…

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EC25 Series Hardware Design LTE Standard Module Series Rev. EC25_Series_Hardware_Design_V2.4 Date: 2020-12-21 Status: Released www.quectel.com LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 1 / 126 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: [email protected] Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: [email protected] GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 1 / 126 About the Document Revision History Version Date Author Description 1.0 2016-04-01 Woody WU Initial 1.1 2016-09-22 Lyndon LIU/ Frank WANG 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1.2 2016-11-04 Lyndon LIU/ Michael ZHANG 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added note about SIMO in Chapter 6.6. LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 2 / 126 1.3 2017-01-24 Lyndon LIU/ Frank WANG 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in Table 33. 7. Updated EC25-A conducted RF receiving sensitivity in Table 38. 8. Added EC25-J conducted RF receiving sensitivity in Table 40. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 1. Updated functional diagram in Figure 1. 2. Updated LTE, UMTS and GSM features in Table 2. 3. Updated description of pin 40/136/137/138. 4. Updated PWRKEY pulled down time to 500 ms in Chapter 3.7.1 and reference circuit in Figure 10. 5. Updated reference circuit of (U)SIM interface in Figure 17 & 18. 6. Updated reference circuit of USB interface in Figure 19. 7. Updated PCM mode in Chapter 3.12. 8. Added SD card interface in Chapter 3.13. 9. Updated USB_BOOT reference circuit in Chapter 3.20. 10. Updated module operating frequencies in Table 26. 11. Updated antenna requirements in Table 30. 12. Updated EC25 series module current consumption in Chapter 6.4. 13. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 6.8. 15. Added dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and Chapter 6.3. 17. Updated RF output power in Table 41. 18. Updated GPRS multi-slot classes in Table 53. 19. Updated storage information in Chapter 8.1. 1.5 2018-04-20 Kinsey ZHANG 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in Table 40. 4. Changed GNSS current consumption of EC25 series LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 3 / 126 module into Table 41. 5. Added EC25-AF conducted RF receiving sensitivity in Table 50. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 7. Updated general description in Table 1. 8. Updated module operating frequencies in Table 27. 9. Updated GNSS frequency in Table 29. 10. Updated antenna requirements in Table 30. 11.…

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EC25-AF FCC ID :XMR2018EC25AF ，date of Grant ；08/03/2018 Module Category Supported Band EC25--AF CAT4 WCDMA: B2/B4/B5 LTE:B2/B4/B5/B12/B13/B14/B66/B71 EC25-T CAT4 LTE:B2/B4/B5/B12/B13/B66/B71 EC25-AF&EC25-AF MINIPCIE and EC25-T&EC25-T MINIPCIE share the same HW design, EC25-T&EC25-T MINIPCIE reduce B13and B14 and GPSIC on the basis of EC25-AF&EC25-AF MINIPCIE. The details are shown as following pictures and table. The detailed product change description please refers to Statement letter_EC25-AF&EC25-T file. The test contents of all EC25-T&EC25-T MINIPCIE reports are as follows: EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R1) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R1V1). There is only tested RF Power Output and Effective Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R1V1). EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R2) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R2V1). There is only tested RF Power Output and Effective Isotropic Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R2V1). EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R3) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R3V1). There is only tested RF Power Output and Effective Isotropic Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R3V1). Signature: Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/12/16_ Subject: Confidentiality Request for: _____ FCC ID: XMR202012EC25T ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Exhibit Short Term Permanent Block Diagrams Short Term External Photos Short Term Permanent* 1 Internal Photos Short Term Permanent Operation Description/Theory of Operation Short Term Permanent Parts List & Placement/BOM Short Term Permanent Tune-Up Procedure Short Term Permanent Schematics Short Term Test Setup Photos Short Term Permanent* User’s Manual *Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202012EC25T _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality: The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality: The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications: The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By: Jean Hu (Signature/Title 2 ) (Print name)

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee Quectel Wireless Solutions Co., Ltd FCC ID: XMR202012EC25T Model: EC25-T, EC25-T MINIPCIE The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below: Modular approval requirement EUT Condition Comply (a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. YES (b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES (c)The modular transmitter must have its own power supply regulation. All power lines derived from the host device are regulated before energizing other circuits internal to EC25-T, EC25-T MINIPCIE. Please see schematic.pdf YES (d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). The “professional installation” provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. Device uses a micro-strip trace on the host’s printed circuit board to an antenna connector on the host circuit board. YES (e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC EC25-T, EC25-T MINIPCIE was tested in a stand‐alone configuration via a PCMCIA extender. Please see spurious set‐up YES Quectel Wireless Solutions Company Limited power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i)) must not be in side another device during testing. (f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. The label position of EC25-T, EC25-T MINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID: XMR202012EC25T. Please see the label.pdf YES (g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebas edon theintendeduse/configurations. EC25-T, EC25-T MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES (h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. EC25-T, EC25-T MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES Quectel Wireless Solutions Company Limited Dated 2020/12/16 By: Jean Hu Signature Printed Title: Project Manager On behalf of : Quectel Wireless Solutions Company Limited Telephone: +86-21-51086236 ext 6511

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE:December 16, 2020 To: Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd. /Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID: XMR202012EC25T. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature: Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

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RF TEST REPORT Applicant Quectel Wireless Solutions Co., Ltd. FCC ID XMR202012EC25T Product LTE Module Brand Quectel Model EC25-T, EC25-T MINIPCIE Marketing Quectel EC25-T, Quectel EC25-T MINIPCIE Report No. R2011A0762-R1 Issue Date December 11, 2020 TA Technology (Shanghai) Co., Ltd. tested the above equipment in accordance with the requirements in FCC CFR47 Part 2 (2019)/ FCC CFR 47 Part 22H (2019). The test results show that the equipment tested is capable of demonstrating compliance with the requirements as documented in this report. Prepared by: Peng Tao Approved by: Kai Xu TA Technology (Shanghai) Co., Ltd. No.145, Jintang Rd, Tangzhen Industry Park, Pudong Shanghai, China TEL: +86‐021‐50791141/2/3 FAX: +86‐021‐50791141/2/3‐8000 RF Test Report Report No.: R2011A0762-R1 TA Technology (Shanghai) Co., Ltd. TA-MB-05-001R Page 2 of 42 This report shall not be reproduced except in full, without the written approval of TA Technology (Shanghai) Co., Ltd. TABLE OF CONTENT 1. Test Laboratory ...................................................................................................................................... 4 1.1. Notes of the Test Report ............................................................................................................... 4 1.2. Test facility ..................................................................................................................................... 4 1.3. Testing Location ............................................................................................................................ 4 2. General Description of Equipment under Test ....................................................................................... 5 2.3. Applicant and Manufacturer Information ....................................................................................... 5 2.4. General Information ....................................................................................................................... 5 3. Applied Standards .................................................................................................................................. 7 4. T…

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