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R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 1 sheet 190-1 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application ANTENNA PRODUCTS Sept., 2008 – V8 R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 2 sheet 190-2 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application Quick Reference Data Centre Frequency 2.38 GHz Bandwidth 2.3 ~ 2.49 GHz VSWR 2.5 (Max.) Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 3.0 dBi Impedance 50 Ω Operating Temperature -25~85 o C Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to soldering heats 260 °C , 10sec. Maximum Power 1W R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 3 sheet 190-3 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 1. Mechanical Data (8 x 1x 1 mm³) CAN4311881XX2453K Bottom-Side View Top-Side View 8.0 mm 1.0 mm 1.0 mm R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 4 sheet 190-4 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 2. Dimension of Footprint - 9.0 mm 1.4 mm 1.4 mm 0.90+- 0.15mm 8.0+- 0.1mm 1.05+- 0.1 mm Bottom Side R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 5 sheet 190-5 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 3. Evaluation Board Dimension and Outlook Unit: mm 50 ohm Line Gound plane in backside R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 6 sheet 190-6 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 4. Measured S-parameter R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 7 sheet 190-7 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 5.The Definition of X-Y-Z Plane X X Y Y Z Z R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 8 sheet 190-8 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 6. The Environment of Antenna Radiation Pattern Anechoic Chamber Dimension=10(m) × ×× × 6(m) × ×× × 6(m) R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 9 sheet 190-9 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 7. Radiation Pattern R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 10 sheet 190- 10 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU 8. Reliability Test IEC 384-10/ CECC 32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 Mounting The antenna can be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive No visible damage 4.5 Visual inspection and dimension check Any applicable method using × ×× × 10 magnification In accordance with specification (chip off 4mm) 4.6.1 Antenna Central Frequency at 20 o C Standard test board in page 4 4.8 Adhesion A force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate No visible damage Bond strength of plating on end face Mounted in accordance with CECC 32 100, paragraph 4.4 No visible damage 4.9 Conditions: bending 0.5 mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length No visible damage 4.10 20(Tb) Resistance to soldering heat 260 ± 5 °C for 10 ± 0.5 s in a static solder bath Satisfy the original electrical specification after soldering. Resistance to leaching 260 ± 5 °C for 30 ± 1 s in a static solder bath Using visual enlargement of × ×× × 10, dissolution of the termination shall not exceed 10% R&D Print date 10/10/07 June, 2008 v6 Aug, 2008 v7 8010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 881 XX 245 3K Sept, 2008 v8 Tommy Chen Page 11 sheet 190- 11 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency BU IEC 384-10/ CECC 32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.11 20(Ta) Solderability Zero hour test, and test after storage (20 to 24 months) in original atmosphere; un-mounted chips completely immersed for 2 ± 0.5 s in 235 ± 5°C. The termination must be well tinned, at least 75% is well tinned at termination 4.12 4(Na) Rapid change of temperature -25 °C (30 minutes) to +85 °C (30 minutes); 100 cycles No visible damage Central Freq. Change ± 6% 4.14 3(Ca) Damp heat 500 ± 12 hours at 60 °C; 90 to 95 % RH No visible damage 2 hours recovery Central Freq. Change ± 6% 4.15 Endurance 500 ± 12 hours at 85 °C; No visible damage 2 hours recovery Central Freq. Change ± 6% ■ ■■ ■ Notice (shipping and storage during transportation) In order to ensure some quality, it is suggested to follow the condition during shipping : • Temperature : -40~70°C °C°C °C • Humidity : 45~75% ■ ■■ ■ Notice (storage condition) In order to ensure the solderability of the termination, it is suggested to follow the condition for storage : • Temperature : 15~30°C °C°C °C • Humidity : 45~75% • Prevent corrosive gas (SO 2 , NO X , NH 3 , Cl 2 , ..etc) • It is better to use products within 6 months. Solderability should be confirmed again if exceed 6 months. R&D Pri…

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Report No.:T100811404-RP1 FCC ID: XV3UD08B Date of Issue: September 13, 2010 Note: This report shall not be reproduced except in full, without the written approval of Compliance Certification Services Inc. This document may be altered or revised by Compliance Certification Services Inc. personnel only, and shall be noted in the revision section of the document. Page 1 Total Page: 38 Rev. 00 FCC 47 CFR PART 15 SUBPART C AND ANSI C63.4: 2003 TEST REPORT For Air Dongle Model : UD08b Brand Name : Test Report Number: T100811404-RP1 Issued for Holy Investment Co., Ltd. 1F., No.2, Lane 25, Yong-an 2nd St., Yongkang City, Tainan County 710, Taiwan Issued by Compliance Certification Services Inc. Tainan Lab. No. 8, Jiu Cheng Ling, Jiaokeng Village,Sinhua Township, Tainan Hsien 712, Taiwan R.O.C. TEL: 886-6-580-2201 FAX: 886-6-580-2202 Issued Date: September 13, 2010 Report No.:T100811404-RP1 FCC ID: XV3UD08B Date of Issue: September 13, 2010 Page 2 Rev. 00 REVISION HISTORY Rev. Issue Date Revisions Effect Page Revised By 00 September 13, 2010 Initial Issue ALL Leah Peng Report No.:T100811404-RP1 FCC ID: XV3UD08B Date of Issue: September 13, 2010 Page 3 Rev. 00 TABLE OF CONTENTS 1. TEST RESULT CERTIFICATION .................................................................................... 4 2. EUT DESCRIPTION .......................................................................................................... 5 3. TEST METHODOLOGY ................................................................................................... 6 3.1 EUT CONFIGURATION................................................................................................. 6 3.2 EUT EXERCISE.............................................................................................................. 6 3.3 GENERAL TEST PROCEDURES.................................................................................... 6 3.4 FCC PART 15.205 RESTRICTED BANDS OF OPERATIONS ...................................... 7 3.5 DESCRIPTION OF TEST MODES................................................................................... 7 4. INSTRUMENT CALIBRATION ....................................................................................... 8 4.1 MEASURING INSTRUMENT CALIBRATION.................................................................... 8 4.2 MEASUREMENT EQUIPMENT USED ...................................................................... 8 5. FACILITIES AND ACCREDITATIONS .......................................................................... 9 5.1 FACILITIES.................................................................................................................... 9 5.2 EQUIPMENT.................................................................................................................. 9 5.3 LABORATORY ACCREDITATIONS LISTINGS ...................................................... 9 5.4 TABLE OF ACCREDITATIONS AND LISTINGS......................................................... 10 6. SETUP OF EQUIPMENT UNDER TEST ....................................................................... 11 6.1 SETUP CONFIGURATION OF EUT.............................................................................. 11 6.2 SUPPORT EQUIPMENT ............................................................................................ 11 7. FCC PART 15.249 REQUIREMENTS ............................................................................ 12 7.1 20 DB BANDWIDTH.................................................................................................. 12 7.2 BAND EDGES MEASUREMENT ............................................................................. 15 7.3 SPURIOUS EMISSION .............................................................................................. 21 7.4 POWERLINE CONDUCTED EMISSIONS ............................................................... 32 8. APPENDIX I PHOTOGRAPHS OF TEST SETUP......................................................... 35 APPENDIX II PHOTOGRAPHS OF E.U.T........................................................A1-1 Report No.:T100811404-RP1 FCC ID: XV3UD08B Date of Issue: September 13, 2010 Page 4 Rev. 00 1. TEST RESULT CERTIFICATION Product: Air Dongle Model: UD08b Brand Name: Applicant: Holy Investment Co., Ltd. 1F., No.2, Lane 25, Yong-an 2nd St., Yongkang City, Tainan County 710, Taiwan Manufacturer: Jow Tong Technology CO., LTD. 46, Lane 337, Chung Cheng Rd., Yung Kang City, Tainan County 710, Taiwan, R.O.C. Tested: September 7, 2010 ~ September 9, 2010 APPLICABLE STANDARDS STANDARD TEST RESULT FCC Part 15 Subpart C : 2008 AND ANSI C63.4 : 2003 No non-compliance noted Jeter Wu Assistant Manager Eric Huang Assistant Section Manager Report No.:T100811404-RP1 FCC ID: XV3UD08B Date of Issue: September 13, 2010 Page 5 Rev. 00 2. EUT DESCRIPTION Product Air Dongle Model Number UD08b Brand Name Frequency Range 2403 ~ 2475MHz Transmit Peak Power 94dBuV (-13dBm) Channel Spacing TX Mode: 1.5MHz Number of Channels 49 Channels 2403 , 2404.5 , 2406 , 2407.5, 2409 , 2410.5 , 2412 , 2413.5 , 2415 , 2416.5 , 2418 , 2419.5 , 2421 , 2422.5 , 2424 , 2425.5 , 2427 , 2428.5 , 2430 , 2431.5 , 2433 , 2434.5 , 2436 , 2437.5 , 2439 , 2440.5 , 2442 , 2443.5 , 2445 , 2446.5 , 2448 , 2449.5 , 2451 , 2452.5 , 2454 , 2455.5 , 2457 , 2458.5 , 2460 , 2461.5 , 2463 , 2464.5 , 2466 , 2467.5 , 2469 ,2470.5 , 2472 , 2473.5 , 2475MHz Transmit Data Rate 100kbps Modulation Technique MSK Frequency Selection By software / firmware Antenna Type Antenna (1)TX&RX: Manufacture: Yageo Taiwan/High Frequency Ceramic Department Model: CAN4311 881 05 245 3K, Type: Chip Antenna, Gain: 3dBi Power Source 5VDC Temperature Range 0 ~ +55°C Remark: 1. The sample selected for test was production product and was provided by manufacturer. 2. This submittal(s) (test report) is intended for FCC ID: XV3UD08B filing to comply with Section 15.107, 15.109, 15.207, 15.209, 15.249 (FCC Part 15, Subpart C Rules.) 3. According …

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