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XVV-ARM725A002.4GHZ 802.15.4 radio module

dresden elektronik ingenieurtechnik gmbh
2.4GHZ 802.15.4 radio module - FCC ID XVV-ARM725A00 - dresden elektronik ingenieurtechnik gmbh
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Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
Dec 26, 2011
Application Purpose
Original Equipment
Date of Application
Dec 26, 2011
Equipment Note
2.4GHZ 802.15.4 radio module
Frequency Range
2405.00000000 - 2480.00000000
Company
dresden elektronik ingenieurtechnik gmbh
Country
Germany

Documents & Files

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Users Manual

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Block Diagram

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Operational Description

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RF Exposure Info

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Schematics

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

User Manual Radio Modules deRFarm7-15A02 / 15C02 deRFarm7-25A00 / 25C00 deRFarm7-25A02 / 25C02 Document Version V1.1 2011-12-22 User Manual Version 01.01 2011-12-22 Radio modules deRFarm7 dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Str. 12 01237 Dresden / Germany Tel.: +49 351 – 31 85 00 Fax: +49 351 – 3 18 50 10 [email protected] www.dresden-elektronik.de Page 2 of 38 Table of contents 1. Overview ......................................................................................................................... 5 2. Application ....................................................................................................................... 5 3. Features .......................................................................................................................... 6 4. Technical data ................................................................................................................. 8 5. Mechanical data ............................................................................................................ 10 5.1. Radio module (pluggable)..................................................................................... 10 5.2. Footprint receptacles ............................................................................................ 10 5.3. Radio module (solderable).................................................................................... 11 5.4. Footprint pads ...................................................................................................... 11 5.5. PCB design .......................................................................................................... 12 6. Soldering profile of deRFarm7 ....................................................................................... 13 7. Pin assignment .............................................................................................................. 14 7.1. External Pins ........................................................................................................ 17 7.2. Internal Connections ............................................................................................. 21 8. Programming ................................................................................................................. 22 8.1. Required hardware ............................................................................................... 22 8.2. Programming example ......................................................................................... 23 8.3. JTAG interface ..................................................................................................... 29 9. Debugging and tracing .................................................................................................. 29 10. RF components ............................................................................................................. 30 10.1. deRFarm7-15A02 / 15C02 .................................................................................... 30 10.2. deRFarm7-25A00 / 25C00 .................................................................................... 30 10.3. deRFarm7-25A02 / 25C02 .................................................................................... 31 11. Radio certification .......................................................................................................... 32 11.1. United States (FCC) ............................................................................................. 32 11.2. European Union (ETSI) ........................................................................................ 33 11.3. Approved antennas .............................................................................................. 34 12. Ordering information ...................................................................................................... 35 13. Revision notes ............................................................................................................... 37 User Manual Version 01.01 2011-12-22 Radio modules deRFarm7 dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Str. 12 01237 Dresden / Germany Tel.: +49 351 – 31 85 00 Fax: +49 351 – 3 18 50 10 [email protected] www.dresden-elektronik.de Page 3 of 38 Document history Date Version Description 2011-02-10 1.0 Initial version 2011-12-22 1.1 Addition of PCB design Addition of transceiver signal description Update certification section Mailing list Firm Division / Name DE APA Author / Check / Release Firm Division / Name Author DE Dev. / APA Check release User Manual Version 01.01 2011-12-22 Radio modules deRFarm7 dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Str. 12 01237 Dresden / Germany Tel.: +49 351 – 31 85 00 Fax: +49 351 – 3 18 50 10 [email protected] www.dresden-elektronik.de Page 4 of 38 Abbreviations Abbreviation Description ADC Analog to Digital Converter BOD Brownout-Detection CE Consumer Electronics DAC Digital to Analog Converter DBGU Debug Unit ETH Ethernet, family of frame-based computer networking technologies for local area networks (LAN). EMAC Ethernet Media Access Controller ETSI European Telecommunications Standards Institute FCC Federal Communications Commission GPIO Generals Purpose Input Output ISM Industrial, Scientific and Medical frequency band JTAG Joint Test Action Group ISP In-System-Programming MAC Medium (Media) Access Control MCU, μC Microcontroller Unit PCB Printed Circuit Board PCBA Printed Circuit Board Assembled PWM Pulse Width Modulation RF Radio Frequency RMII Reduced Media Independent Interface SPI Serial Peripheral Interface TWI Two-Wire Serial Interface U[S]ART Universal [Synchronuous/]Asynchronous Receiver Transmitter USB Universal Serial Bus User Manual Version 01.01 2011-12-22 Radio modules deRFarm7 dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Str. 12 01237 Dresden / Germany Tel.: +49 351 – 31 85 …

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Block Diagram

dresden elektronik Tel.: 0351 – 31 85 00 Seite 1 von 1 ingenieurtechnik gmbh Fax: 0351 – 3 18 50 10 Enno-Heidebroek-Str. 12 [email protected] 01237 Dresden www.dresden-elektronik.de dresden elektronik ingenieurtechnik gmbh FCC ID: XVV-ARM725A00 FCC Part 15 Certification Exhibit: Oscillator block diagram MCU Transceiver device Q1 18.432MHz Q2 16.000 MHz Exhibit: Oscillator block diagram Onboard Q1: Timer/Counter Oscillator Q2: Transceiver Crystal Oscillator

External Photos

dresden elektronik Tel.: 0351 – 31 85 00 Seite 1 von 1 ingenieurtechnik gmbh Fax: 0351 – 3 18 50 10 Enno-Heidebroek-Str. 12 [email protected] 01237 Dresden www.dresden-elektronik.de dresden elektronik ingenieurtechnik gmbh FCC ID: XVV-ARM725A00 FCC Part 15 Certification Exhibit: External Photo

ID Label/Location Info

dresden elektronik Tel.: 0351 – 31 85 00 Seite 1 von 1 ingenieurtechnik gmbh Fax: 0351 – 3 18 50 10 Enno-Heidebroek-Str. 12 [email protected] 01237 Dresden www.dresden-elektronik.de dresden elektronik ingenieurtechnik gmbh FCC ID: XVV-ARM725A00 FCC Part 15 Certification Exhibit: Label Sample Information: ∑ product name ∑ serial number (plain writing and bar code) ∑ MAC adress ∑ FCC-ID ∑ CE sign ∑ manufacturers name (web adress)

Internal Photos

dresden elektronik Tel.: 0351 – 31 85 00 Seite 1 von 2 ingenieurtechnik gmbh Fax: 0351 – 3 18 50 10 Enno-Heidebroek-Str. 12 [email protected] 01237 Dresden www.dresden-elektronik.de dresden elektronik ingenieurtechnik gmbh FCC ID: XVV-ARM725A00 FCC Part 15 Certification Exhibit: Internal Photo Top View: 2011-12-22 Seite 2 von 2 Bottom View:

Operational Description

Radio modules deRFarm7 25A00|25C00 Datasheet dresden elektronik ingenieurtechnik gmbh 07-2011 ß The pluggable radio module deRFarm7-25A00 features an AT91SAM7X512 microcontroller and a 2.4 GHz trans- ceiver AT86RF231. The module complies with IEEE 802.15.4 and can be used for ZigBee / 6LoWPAN / RF4CE or proprietary applications. ß The 25A00 module has two 23 pin male connectors (1.27 mm pitch) which give access to most functions of the AT91SAM7X512. The 25C00 is a solderable variant. ß The chip ceramic antenna provides a transmitting power of +2.5 dBm ERP. Distances of more than 200 m can be reached for line of sight conditions. The integrated trans- ceiver obtains a receiver sensitivity of –101 dBm. A hardware 128-Bit AES encryption engine is part of the transceiver. ß The power supply range is from 3.0 VDC to 3.6 VDC with transmit and receive currents of approx. 45 mA @ 12MHz CPU clock. A current consumption of less then 250 μA can be achieved in sleep mode. ß Special features of the deRFarm7 module family are the integrated Ethernet MAC (EMAC) and the integrated USB device port (UDP) Technical Data Technical Data Dimensions 30 x 22.7 x 8.2 mm (25A00) 30 x 20.4 x 4.1 mm (25C00) Operating temperature -40 to +85°C Control and display elements no Power supply 3.0 – 3.6 VDC Power consumption Active: 45 mA @ 12MHz Sleep: < 250 μA Connections 2 x 23 pins Antenna Chip ceramic Antenna gain +1.3 dBi (Peak), -0.5 dBi (Average) Antenna diversity no Range > 200 m (line of sight) Frequency range 2.4 GHz Transmitting power +2.1 dBm ERP Receiver sensitivity -101 dBm IEEE Standard 802.15.4 Data rate (brutto) 250 kbit/s, 500 kbit/s, 1 Mbit/s, 2 Mbit/s Microcontroller AT91SAM7X512 Transceiver AT86RF231 Interfaces JTAG, DBGU, I2C, SPI, UART, USB, RMII, GPIO, ADC Certification CE, ETSI, FCC dresden elektronik ingenieurtechnik gmbh www.dresden-elektronik.de Contact Enno-Heidebroek-Str. 12 E-Mail: [email protected] 01237 Dresden | Germany Phone: +49 351 – 31 85 0-0 Fax: -10 © 2011 dresden elektronik ingenieurtechnik gmbh . All rights reserved. Other registered trademarks or terms and product names are the property of their respective owners. All information contained herein is subject to change without notice. No liability can be accepted or guarantee made for the information provided being up to date, correct and complete. Pin configuration Connections 1: VCC 13 PA18 24: VCC 36: PB28 2: DGND 14: PA3 25: DGND 37: PB5 3: ADVREF 15: PA17 26: PA27 38: TCK 4: USBDM 16: PB0 27: PA0 39: PB7 5: RSTN 17: PA16 28: PA28 40: TMS 6: PB3 18: PB8 29: PA4 41: PB1 7: PA11 19: PB6 30: PB9 42: TDO 8: PB26 20: PB18 31: PB21 43: JTAGSEL 9: PA10 21: PB15 32: USBDP 44: TDI 10: PA1 22: DGND 33: PB19 45: DGND 11: PB25 23: DGND 34: PB27 46: DGND 12: PB2 35: PA14 Top View deRFarm7-25A00 Top View deRFarm7-25C00 Scope of delivery Order No. Order Information Radio Module deRFarm7-25A00 BN-027264 Radio Module deRFarm7-25C00 coming soon Board variants Variants Radio Module deRFarm7-15A00 coming soon Radio Module deRFarm7-15C00 coming soon Radio Module deRFarm7-25A02 BN-027265 Radio Module deRFarm7-25C02 coming soon Radio Module deRFarm7-15A02 BN-030974 Radio Module deRFarm7-15C02 coming soon More information about the variants are described in detail in the user manual. Order online: http://www.dresden-elektronik.de/shop/cat4.html

Schematics

0.0 5 646 02 00.100.00 deRFarm7-25A00 Rev00 1 1 dresden elektronik ingenieurtechnik GmbHD-01237 Dresden, Enno-Heidebroek-Str. 12 Telefon 0351 / 31850 0Telefax 0351 / 31850 10 Rev: Document File NameARM7_25A00_REV00.SchDoc Sheet of Document Number Time : 07:52:00 14.12.2010 Date : Size A3 Title Nr. Aenderung Datum Name DrawnBy: A.Palm DGND DGND DGND DGND DGND RFN RFP 1 SH1 EMI Shielding DGND DVDD AVDD DGND DGND DGND VCC C141u C151u C161u RFN RFP DGND TCKTMSTDOTDI C122pF DGND PA9/CTS1/SPI0_NPCS3 DGND L3BLM15HG102SN1D EVDD EVDD VCC R16100k R17100k R18100k C271uF PA23/TD/SPI1_MOSI PA24/RD/SPI1_MISO PA8/RTS1/SPI0_NPCS2 DGND DGND PA22/TK/SPI1_SPCK DGND C101nF R21k DGND XINXOUTPLLRC C2822pFC422pF 13 24 Q218,432 MHz DGNDDGNDDGND C810n JTAGSELRSTNPA27/DRXD/PCK3PA28/DTXDPB0/ETXCK/EREFCKPB1/ETXENPB7/ERXERPB8/EMDCPB9/EMDIOPB2/ETX0PB3/ETX1PB5/ERX0PB6/ERX1PB15/ERXDV/ECRSDVPB18/EF100/ADTRGADVREFPB27/TIOA2/PWM0/AD0PB28/TIOB2/PWM1/AD1 USBDPUSBDMPA4/CTS0/SPI1_NPCS3PA0/RXD0PA1/TXD0PA22/TK/SPI1_SPCKPA24/RD/SPI1_MISOPA23/TD/SPI1_MOSIPB19/PWM0/TCLK1PB21/PWM2/PCK1PA14/SPI0_NPCS2/IRQ1PA10/TWDPA11/TWCKPA3/RTS0/SPI1_NPCS2PA17/SPI0_MOSIPA16/SPI0_MISOPA18/SPI0_SPCK R31k DGND DGNDDGND PB26/TIOB1/RI1PB25/TIOA1/DTR1 PA21/TF/SPI1_NPCS0 PA29/FIQ/SPI1_NPCS3 PA29/FIQ/SPI1_NPCS3 RF parts outside the RF Shielding DGND PA9/CTS1/SPI0_NPCS3 C25100n C610u C24100n C23100n C22100n C21100n DGND DGND DGND DGND DGND C17100n C13100n C12100n C11100n DGND DGND DGND DGND C2100n DGND 1P8 VCC C18100n DGND C2010u DGND R44k7 n.b. R54k7 n.b. VCC VCC VCC PA8/RTS1/SPI0_NPCS2PA21/TF/SPI1_NPCS0 AT91SAM7X512Power VDDIN F10 VDDOUT G10 VDDCORE H1 VDDCORE F8 GND J9 VDDIO E9 VDDCORE G7 GND K5 GND J6 VDDIO E7 GND G8 VDDIO D8 VDDCORE K1 GND F9 GND E10 VDDIO A10 VDDCORE K2 VDDFLASH J5 VDDPLL J10 GND E6 IC1AAT91SAM7X512-CU DGND PA27/DRXD/PCK3/PGMD15 G3 PA28/DTXD H2 PA29/FIQ/SPI1_NPCS3 J1 PA30/IRQ0/PCK2 J2 XIN/PGMCK J7 XOUT J8 PLLRC H10 TCK F5 TDI B1 TDO G4 TMS E5 JTAGSEL H3 NRST D3 TST D4 AT91SAM7X512Clock/JTAG/Reset/Debug/Interrupt CLK + PLLICE + JTAGRESETDBGUAIC IC1BAT91SAM7X512-CU PA0/RXD0/PGMEN0 J3 PA1/TXD0/PGMEN1 J4 PA2/SCK0/SPI1_NPCS1 G5 PA3/RTS0/SPI1_NPCS2 H4 PA4/CTS0/SPI1_NPCS3/PGMNCMD H5 PA5/RXD1/PGMRDY G6 PA6/TXD1/PGMNOE F6 PA7/SCK1/SPI0_NPCS1/PGMNVALID H6 PA8/RTS1/SPI0_NPCS2/PGMM0 H8 PA9/CTS1/SPI0_NPCS3/PGMM1 H7 PA10/TWD/PGMM2 D7 PA11/TWCK/PGMM3 D10 PA12/SPI_NPCS0/PGMD0 C9 PA13/SPI0_NPCS1/PCK1/PGMD1 C8 PA14/SPI0_NPCS2/IRQ1/PGMD2 B8 PA15/SPI0_NPCS3/TCLK2/PGMD3 C10 PA16/SPI0_MISO/PGMD4 B9 PA17/SPI0_MOSI/PGMD5 B10 PA18/SPI0_SPCK/PGMD6 A9 PA21/TF/SPI1_NPCS0/PGMD9 A2 PA22/TK/SPI1_SPCK/PGMD10 A1 PA23/TD/SPI1_MOSI/PGMD11 D1 PA24/RD/SPI1_MISO/PGMD12 D2 PA25/RK/SPI1_NPCS1/PGMD13 E1 PA26/RF/SPI1_NPCS2/PGMD14 E2 PB26/TIOB1/RI1 F4 PB25/TIOA1/DTR1 F3 PB24/TIOB0/DSR1 G2 PB23/TIOA0/DCD1 F2 PB22/PWM3/PCK2 G1 PB21/PWM2/PCK1 F1 PB20/PWM1/PCK0 E4 PB19/PWM0/TCLK1 D5 DDM K4 DDP K3 AT91SAM7X512 I/O Interface USBUSART0USART1SSCPWMSPITWITimer IC1CAT91SAM7X512-CU PA19/CANRX/PGMD7 B2 PA20/CANTX/PGMD8 A3 PB0/ETXCK/EREFCK/PCK0 C5 PB30/PCK2/PWM3/AD3 G9 PB29/PCK1/PWM2/AD2 H9 PB28/TIOB2/PWM1/AD1 E8 PB27/TIOA2/PWM0/AD0 D9 PB18/EF100/ADTRG E3 PB17/ERXCK/SPI0_NPCS3 C6 PB16/ECOL/SPI1_NPCS3 C1 PB15/ERXDV/ECRSDV B6 PB14/ERX3/SPI0_NPCS2 B7 PB13/ERX2/SPI0_NPCS1 C7 PB12/ETXER/TCLK0 B5 PB11/ETX3/SPI1_NPCS2 B3 PB10/ETX2/SPI1_NPCS1 C3 PB9/EMDIO A8 PB8/EMDC A7 PB7/ERXER A5 PB6/ERX1 D6 PB5/ERX0 A6 PB4/ECRS C2 PB3/ETX1 C4 PB2/ETX0 B4 PB1/ETXEN A4 ERASE F7 AD4 K9 AD5 K8 AD6 K7 AD7 K6 ADVREF K10 AT91SAM7X512 Flash/CAN/ ETH/ADC CANEthernet MAC 10/100ADCFlash IC1DAT91SAM7X512-CU C710u DGND VCC C910u DIG4 2 AVSS 3 RFP 4 RFN 5 AVSS 6 DVSS 7 RSTN 8 DIG1 9 DIG2 10 SLP_TR 11 DVSS 12 DVDD 13 DVDD 14 DEVDD 15 DVSS 16 CLKM 17 DVSS 18 SCLK 19 MISO 20 DVSS 21 MOSI 22 SEL 23 IRQ 24 XTAL2 25 XTAL1 26 AVSS 27 EVDD 28 AVDD 29 AVSS 30 AVSS 31 AVSS 32 AT86RF231 DIG3 1 DIE 33 IC3AT86RF231-ZU unbalanced 1 DC_GND 2 Balanced P1 3 Balanced P2 4 GND 5 nc 6 B12450FB15L0001E C30,7p Distance between C3 and B1-Pad1 = 0.65mm DGND DGND 1 2 3 X3UFL n.b. DGND C1922pF n.b. R110k n.b. DGND i 50Ohm i 50Ohm L11,0nH i 50Ohm i 50Ohm ANT12450AT43B100 L2 2,2nH PA7/SPI0_NPCS1PA25/SPI1_NPCS1PA26/SPI1_NPCS2 i USB i USB VCC DGNDDGNDDGND DGND VCC DGNDDGND TCKTDOTMSTDIJTAGSELPA27/DRXD/PCK3PA28/DTXDPB9/EMDIOPA4/CTS0/SPI1_NPCS3PB7/ERXERPB21/PWM2/PCK1PB1/ETXENPB19/PWM0/TCLK1PB27/TIOA2/PWM0/AD0PA14/SPI0_NPCS2/IRQ1PB28/TIOB2/PWM1/AD1 PB6/ERX1 PB5/ERX0 PB18/EF100/ADTRG PA0/RXD0 USBDMPB8/EMDC USBDP PA16/SPI0_MISOPB2/ETX0PA17/SPI0_MOSIPA3/RTS0/SPI1_NPCS2PA18/SPI0_SPCKPB3/ETX1PA1/TXD0PA10/TWDPA11/TWCKPB15/ERXDV/ECRSDVRSTNPB0/ETXCK/EREFCKADVREFPB25/TIOA1/DTR1PB26/TIOB1/RI1 1234567891011121314151617181920212223 X1TMS-123-02-L-S 2425262728293031323334353637383940414243444546 X2TMS-123-02-L-S XTAL1 C2610p C2910p 1 3 2 4 Q116MHz / CL=10pF DGND PB23/TIOA0/DCD1 PA7/SPI0_NPCS1PA25/SPI1_NPCS1PA26/SPI1_NPCS2PB23/TIOA0/DCD1 PA15/TCLK2 C510p R6470R DGND PA15/TCLK2 DGND Layout notes:connect only AVSS pins directly to paddle (33) Port Pins needed for RMII:- EREFCK- ETXEN- ETX0 - ETX1- ECRSDV- ERX0- ERX1- ERXER- EMDC- EMDIO- EF100 Hardware Identification: PA7 PA25 PA26 Rev00 1 1 1 Rev01 1 1 0 Rev02 1 0 1 1: open0: GND

Test Report

SLG Prüf- und Zertifizierungs GmbH Burgstädter Straße 20 D – 09232 Hartmannsdorf Test report Radio module deRFarm7-25A00 in combination with development board deRFnode [Funkmodul deRFarm7-25A00 in Kombination mit Entwicklerplatine deRFnode] Test plan of customer FCC rules Partial radio test 1112-11-EE-11-PB001 Testing is a confidential matter Test report no. [Prüfbericht- Nr.]: 1112-11-EE-11-PB001 Date [Datum]: 2011-10-25 Revised by [geprüft]: Tested by [gemessen]: Svadlenka Puder Head of EMC laboratory [Leiter EMV-Labor] EMC laboratory [EMV-Labor] SLG Prüf- und Zertifizierungs GmbH Burgstädter Straße 20 D-09232 Hartmannsdorf EMC laboratory Phone: +49 (0) 37 22 / 73 23 - 760 Fax: +49 (0) 37 22 / 73 23 - 899 e-mail: [email protected] http://www.slg.de.com This report consists of [Dieser Bericht besteht aus]: 80 Pages [Seiten] Customer [Auftraggeber] dresden elektronik ingenieurtechnik GmbH Represented by [vertreten durch] Enno-Heidebroek-Straße 12 Mr. [Herr] Palm, Andreas 01237 Dresden, Germany [Deutschland] Order [Auftrag] Dated [vom]: 2011-02-22 Aim of test [Zweck der Prüfung] Verification of conformity to the requirements according to customer’s test plan [Nachweis der Einhaltung der Anforderungen nach Prüfplan des Auftraggebers] Partial tests of customer’s test plan [Teilprüfungen nach Prüfplan des Auftraggebers] Product [Erzeugnis] Radio module [Funkeinheit] Type [Typ] Radio module deRFarm7-25A00 in combination with development board deRFnode [Funkmodul deRFarm7-25A00 in Kombination mit Entwicklerplatine deRFnode] Manufacturer [Hersteller] dresden elektronik ingenieurtechnik GmbH Enno-Heidebroek-Straße 12 01237 Dresden, Germany [Deutschland] Date of test [Prüfzeitraum] 2011-09-16 – 2011-10-05 Location of test [Prüfungsort] Accredited EMC laboratory of the SLG Prüf- und Zertifizierungs GmbH Hartmannsdorf [akkreditiertes EMV-Labor der SLG Prüf- und Zertifizierungs GmbH Hartmannsdorf] Test according to [Prüfung nach] Customer’s specifications / test plan version: 1.0 dated 2011-03-29 [Lastenheft / Prüfplan des Auftraggebers: Version 1.0 vom 2011-03-29 ] Test base [Prüfgrundlage] CFR 47 Ch. I (10-1-09 Edition) FCC Part 15 Test result [Prüfergebnis] The sample tested fulfills the requirements according to customer’s test plan for the above mentioned partial tests. [Der vorgestellte Prüfling erfüllt die Anforderungen nach Prüfplan des Auftraggebers für die durchgeführten Teilprüfungen.] The test results refer to the tested samples only. Authorisation for the copying of details of this report must be obtained from the SLG Prüf- und Zertifizierungs GmbH. [Die Prüfergebnisse beziehen sich ausschließlich auf die in diesem Bericht genannten Prüfungsgegenstände. Die auszugsweise Ver- vielfältigung dieses Berichtes für Dritte ist nur mit schriftlicher Genehmigung der SLG Prüf- und Zertifizierungs GmbH gestattet.] Test report no. [Prüfbericht-Nr.]: 1112-11-EE-11-PB001 Page [Seite] 3 Details of accreditation / recognition status [Einzelheiten zu Akkreditierungen / Anerkennungen] The SLG EMC laboratory is accredited by the German Accreditation Body (DAkkS) [Das SLG EMV-Labor ist akkreditiert durch die Deutsche Akkreditierungsstelle GmbH (DAkkS)] DAkkS registration number [DAkkS-Registriernummer]: D-PL-15110-01-01 The SLG EMC laboratory is appointed as technical service of category A by the Federal Motor Transport Authority (KBA) [Das SLG EMV-Labor ist benannt als Technischer Dienst der Kategorie A von der Benennungsstelle des Kraftfahrt-Bundesamtes (KBA)] Registration number [Registriernummer]: KBA-P 00030-01 The Notified Body according to EMC directive is recognized by the Federal Network Agency for Electricity, Gas, Telecommunications, Post and Railway [Die Benannte Stelle nach EMV-Richtlinie ist anerkannt durch die Bundesnetzagentur für Elektrizität, Gas, Telekommunikation, Post und Eisenbahn (Bundesnetzagentur)] BNetzA registration number [Registriernummer]: BnetzA-bS EMV-07/61-13 The SLG EMC laboratory is recognized by the Federal Railway Authority (EBA) [Das SLG EMV-Labor ist anerkannt durch das Eisenbahn-Bundesamt (EBA)] Number of identification [Identifikationsnummer]: EBA - 28 / 08 / 05 The SLG EMC laboratory is listed by the Federal Communications Commission (FCC) [Das SLG EMV-Labor ist gelistet bei der Federal Communications Commission (FCC)] Registration number [Registrierungsnummer]: 883849 The SLG EMC laboratory is listed by the Industry Canada Certification and Engineering Bureau [Das SLG EMV-Labor ist gelistet beim Industry Canada Certification and Engineering Bureau] Company number [Firmennummer]: 6114A Test report no. [Prüfbericht-Nr.]: 1112-11-EE-11-PB001 Page [Seite] 4 Contents [Inhalt] 1 General information [Allgemeines] ................................................................................................. 5 1.1 Report chronology [Berichtschronologie] ............................................................................... 5 1.2 Declaration concerning the translation German / English [Erklärung zur Übersetzung Deutsch / Englisch] .................................................................... 5 1.3 General test conditions [Allgemeine Prüfbedingungen] ......................................................... 5 2 Summary of Radio test results [Übersicht über die Funk-Prüfergebnisse] ................................ 7 3 Description of the test sample [Angaben zum Prüfling] ............................................................... 8 4 Emission tests [Störaussendungsprüfungen] ............................................................................. 13 4.1 Measurement of conducted output power [leitungsgeführte Messung der Sendeausgangsleistung] .................................................... 13 4.2 Measurement of power spectral density conducted [leitungsgeführte Messung der spektralen Leistungsdichte] ................................................ 17 4.3 Measurement of the spectrum bandwidth [Messung der Kanalbandbreite] ........................…

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Test Setup Photos

Pictures-1112-11-EE-11-PB001.pdf Page [Seite] 1 View of the EUT [Prüflingsansicht] Figure 1: Test setup with laptop [Prüfaufbau mit Laptop] Figure 2: Plan view [Draufsicht] Figure 3: Top view of test sample [Oberseite des Prüfmusters] Figure 4: Bottom view of test sample [Unterseite des Prüfmusters] Figure 5: disconnect radio module [abgezogenem Funkmodul] Figure 6: Type labels [Typschilder] Pictures-1112-11-EE-11-PB001.pdf Page [Seite] 2 Figure 7: Measurement set-up for conducted measurement acc. to following sections of the report 1112-11-EE-11-PB001: 4.1.1; 4.1.2; 4.2; 4.3; 4.4 and 4.5.5 Figure 8: Measurement set-up for radiated measurement < 30 MHz acc. following sections of the report 1112-11-EE-11-PB001: 4.5.1 Pictures-1112-11-EE-11-PB001.pdf Page [Seite] 3 Figure 9: Measurement set-up for radiated measurement > 30 MHz and < 1 GHz acc. following sections of the report 1112-11-EE-11-PB001: 4.5.2 and 4.6.1 Figure 10: Measurement set-up for radiated measurement > 1 GHz acc. following sections of the report 1112-11-EE-11-PB001: 4.5.3; 4.5.4 and 4.6.2 Pictures-1112-11-EE-11-PB001.pdf Page [Seite] 4 Figure 11: Measurement set-up for conducted measurement of disturbance voltage acc. following section of the report 1112-11-EE-11-PB001: 4.7 and 4.8

Contact Information

Applicant

Andreas Palm
[email protected]+4935131850Fax: +493513185010

Test Firm

SLG Pruef- und Zertifizierungs GmbHRonald Svadlenka
[email protected]49-3722-732360Fax: 49-3722-631376

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.40 GHz - 2.48 GHz2.14 mW
Modular Type
Single Modular Approval
Grant Notes
Power output listed is peak conducted. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. OEM integrators must be provided with antenna installation instructions. OEM integrators and end-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. This device must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. Only antenna(s) documented in this filing may be used with this transmitter.

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