XZF-CM701DIGITAL WIRELESS CAMERA

FCC STATEMENT Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. RF warning statement: The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

        

     
      
  
 
       
   
     !"# !
$%#"#&"! '!$()*  59( 

SCS-F18: Project and Product Certification Representative Authorization Letter Page 1 of 2 Rev 2.0 2206 Ringwood Avenue San Jose, CA 95131 Tel: 408-526-1188 Fax: 408-526-1088 Email: [email protected] Project and Product Certification Representative Authorization Letter Revision History Reason for Amendment (current / obsolete) From To Approved Date Initial Release (current) 1.0 1.0 Nov-14-2006 Revised wording (current) 1.0 2.0 Sept–25-2007 SCS-F18: Project and Product Certification Representative Authorization Letter Page 2 of 2 Rev 2.0 SHENZHEN LYD TECHNOLOGY CO., LTD. Date:2011-04-01 To: SIEMIC, INC. 2206 Ringwood Avenue, San Jose, CA 95131 USA Dear Sir/Madam, Re: Project and Product Certification Representative Authorization Letter We, SHENZHEN LYD TECHNOLOGY CO., LTD. hereby authorize SIEMIC, INC. to act as a Certification Body for certifying for the following project(s): Product: DIGITAL WIRELESS CAMERA (M/N: CM701) We affirm that between SIEMIC and SHENZHEN LYD TECHNOLOGY CO., LTD., any difference in understanding, including test plan, measurement methods, applicable standards and relevant procedures and processes have been resolved prior to commencement of testing activities. Signature Mingsheng Deng Manager SHENZHEN LYD TECHNOLOGY CO., LTD. Building A, Cunnan Industrial Estate, Shuidou Laowei, Longhua Town, Bao’an District, Shenzhen, China.

General Appearance of the EUT

FCC ID Lable Location On EUT

Antenna

CM701 camera images are sent to the MCU signal processing--------- Through the RF wireless part of the launch to the receiver RC202U-------- RF receiver receives the signal sent to the receiver's MCU processing-------- Then sent to the computer monitor USB port for image restore. CM701 microphone collected audio signals encoded ALC5623 audio codec------ Sent to the MCU address-------- Through the RF wireless part of the launch to the receiver RC202U--------- RF receiver receives the signal sent to the receiver's MCU processing------Then sent to the computer through USB port audio amplifier to restore a computer voice. Frequency range: 2402~2480MHz Module : GFSK Antenna: Whip Antenna Power supply: AC100-240V/50-60Hz COME FORM ADAPTER

12345678 A B C D 87654321 D C B A RST NEA MODE USB_DN USB_DET USB_DP S_SDA S_SCL X27M_OUT X27M_IN MODE DGNDDGNDDGNDDGNDDGND X27M_INX27M_OUTVCC_3VDGNDVCC_3VDGNDVCC_3VDGNDVCC_3VDGND VCC_3V DGND VCC_3V DGND VCC_3V DGND VCC_3V NEA VCC_3V VCC_2V5 SWD RST VCC_2V5 VCC_2V5VCC_2V5 L01_SCLK VCC_2V5 I2S_DAC L01_EN I2S_ADC VCC_2V5 VCC_2V5 I2S_BCLK I2S_MCLK VCC_2V5VCC_2V5 USB_DET DGND USB_DNUSB_DP DGND I2S_LRC L01_NSS L01_CS L01_IRQ S_SCL S_SDA S_IMG3 S_IMG2 S_PCLK S_HSYNC S_VSYNC S_MCLK S_IMG9S_IMG8S_IMG7S_IMG6S_IMG5S_IMG4 RXD0 TXD0 PAIR_LED TESTSWD TEST DGND DGND VCC_3V VCC_2V5 L01_MOSI L01_EN L01_SCLK L01_MISO L01_MOSI L01_MISO R310K C310pF R10 330 R12 NC R1947K CB17 0.1uF R820K R17 300K CB11 0.1uF C2 0.1uF D1 POWER R9 47K CB15 0.1uF MR8981C MARS IMG3 2 IMG2 3 PCLK 4 HSYNC 5 VSYNC 6 MCLK 7 SCL 8 SDA 9 NROMCE 10 ROMA15 11 ROMA14 12 VCC2V5 13 ROMA13 14 ROMA12 15 ROMA11 16 ROMA10 17 ROMA9 18 VCC3V3 19 ROMA8 20 ROMA7 21 ROMA6 22 GPIO8_7 23 GPIO8_6 24 GPIO8_5 25 GPIO8_4 26 GPIO8_3 27 V2V5 28 VCC3V3 29 GND 30 GND 31 I2S_ACLK 32 I2S_DCLK 33 NC 34 NC 35 NC 36 NC 37 NC 38 VCC3V3 39 VCC3V3 40 GND 41 VCC2V5 42 NC 43 NC 44 NC 45 NC 46 NC 47 NC 48 VCC2V5 49 GND 50 X27MIN 51 X27MOUT 52 VCC2V5 53 VCC3V3RTC 54 PWR_KEEP 55 RST 56 GND 57 VCC2V5RTC 58 X32KIN 59 X32KOUT 60 GND 61 DN 62 DP 63 VCC3V3 64 GND 1 IMG4 128 IMG5 127 IMG6 126 IMG7 125 IMG8 124 IMG9 123 GPIO7_0 122 GPIO7_1 121 GPIO7_2 120 GPIO7_3 119 GPIO7_4 118 GND 117 NC 116 VCC3V3 115 NROMRD 114 NROMWR 113 VCC2V5 112 GND 111 NC 110 NC 109 ROMA16 97 VCC3V3 98 VCC2V5 99 VCC2V5 100 ROMD1 101 ROMD0 102 GND 103 VCC3V3 104 GND 105 GND 106 GND 107 GND 108 USB_DET 65 GPIO0_2 66 GPIO0_1 67 GPIO0_0 68 SPI_NCS 69 SPI_CLK 70 SPI_SDO 71 SPI_SDI 72 ROMD7 73 ROMD6 74 ROMD5 75 ROMD4 76 GND 77 GND 78 ROMD3 79 ROMD2 80 TEST 81 VCC3V3 82 VCC2V5 83 ROMA5 84 ROMA4 85 ROMA3 86 ROMA2 87 ROMA1 88 ROMA0 89 I2S_BCLK 90 I2S_SDI 91 I2S_SDO 92 POWER_KEY 93 USB_MODE 94 SWD 95 NEA 96 U1 MR8981C C5 22uFR20 47K R18 NC R610K Q1 3904 C410pF CB5 0.1uF C10.01uF R210K R11 47K CB8 0.1uF R16 0R CB14 0.1uF K1 MODE R7100K CB16 0.1uF CB3 0.1uF CB4 0.1uF R1 1.5K C6 22uF CB6 0.1uF CS# 1 WP# 3 CLK 6 DO 2 DI 5 VSS 4 HOLD# 7 VCC 8 U2 EN25B80/EN25F16 R15 0R CB10 0.1uF R427R CB2 0.1uF R14 0R CB7 0.1uF R13 NC CB9 0.1uF X1 27MHz R527R S_SCL PAIR_LED S_SDA I2S_MCLK I2S_BCLK L01_EN L01_SCLK L01_CS L01_IRQ L01_NSS I2S_ADC I2S_DAC I2S_LRC TXD0 RXD0 L01_EN L01_SCLK L01_MOSI L01_MISO L01_MISO L01_MOSI VCC_3V DGND DGND DGND VCC_3V DGND VCC_3V VCC_2V5 DGND 5V DGND VCC_3V VCC_3V VUSBVUSB DGND DGND VCC_3V DGND VCC_3V DGND VCC_3V DGND VCC_3V Decoupling capacitor for U1 Decoupling capacitor for U1 1.27mmX13PIN Connector 1 2 3 4 5 6 7 8 9 10 11 12 13 J5 CON13 S_IMG8 S_IMG9 S_IMG2 S_IMG3 S_IMG4 S_IMG5 S_IMG6 S_SCL S_SDA S_MCLK S_IMG7 1 2 3 4 5 6 J10 CON6 S_PCLK S_HSYNC S_VSYNC GPIO3(SRESET) AUDIO OUT C93 100NF C78 100PF 5V VBUS 1 D- 2 D+ 3 NC 4 GND 5 J1 USB SOCKET D+ D- VCC_3V C7 22UF C10 0.1uF C9 0.1uF 1 23 IN OUT VSS U3 FS8854-33PL D+ D- L01_IRQ ANT VCC 1 GND 2 IRQ 8 MISO 7 MOSI 6 SCK 5 CNS 4 CE 3 GND 9 ANT 10 GND 11 U13 NORDIC_L01 2 2 1 1 3 3 ANT1 ANT L01_MOSI L01_MISO L01_SCLK L01_NSS L01_CS DGND RF_3V DGNDDGND DGND DGND C20 330pF C21 2200pF C19 0.1uF 5V DGND RF_3V DGNDDGND C17 22uF C18 22uF C16 0.1uF 1 23 IN OUT VSS U8 FS8854-33PL 1 2 3 4 J4 HEADER 4 RXD0 TXD0 VCC_3V DGND RS232 debug port Supply circuitTransmit module Main Control circuit R21 27KC11 0.1uF DGND 5V D7 6.2V D8 1234 A B C D 4321 D C B A C11 104 C18 4.7uF GPIO3(SRESET) S_VSYNC S_HSYNC S_SDA S_SCL S_MCLK S_IMG2 S_IMG3 S_IMG4 S_IMG5 S_IMG6 S_IMG7 S_IMG8 3.3V S_PCLK S_IMG9 C21 4.7uF DATA7 E3 DATA6 E4 DATA0 E5 PCLK E6 DATA5 F2 DGND F3 DVDD F4 DATA4 F5 AVDD A1 NC A2 VREFH A3 PWDN A4 NC A5 AVDD A6 AGND B1 VREFN B2 RESET_B B5 AGND B6 DOVDD C1 SFIN C2 HREF C3 SIOC C4 SIOD C5 DOVDD C6 VSYNC D1 DATA8 D2 DATA3 D3 DATA2 D4 XVCLK1 D5 DOGND D6 DATA9 E1 DATA1 E2 U2 OV7740 C17 104 C22 104 C15 104 C14 104 C12 104 R22 10K 1.27mm * 13Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 J12 CON13 S_IMG8 S_IMG9 S_IMG2 S_IMG3 S_IMG4 S_IMG5 S_IMG6 S_SCL S_SDA S_MCLK S_IMG7 VGIN 1 2 3 4 5 6 J11 CON6 S_PCLK S_HSYNC S_VSYNC GPIO3(SRESET) C69 100PF 1.27mm * 6 Pin 1 2 IN 3 U8 XC6206P332MR VGIN 3.3V + C42 22UF C64 0.1uF + C66 22UF C76 0.1UF C24 104 R17 4K7 R18 4K7 3.3V R19 100K 3.3V LED3 LED4 LED5 LED6 LED7 LED8 LED9 LED10 Q10 8050 Q11 D882 Q12 8050 VGIN R38 300K R39 1K R40 10K R41 10R R42 5.6R VGIN Q1 3906 Q3 3906 Q4 3906 Q2 8050 Q5 8050 Q6 8050Q7 8050 Q8 8050 R1 100K R2 75RR3 10K R4 4.7K R5 4.7K R7 4.7K R8 4.7K R9 4.7K R10 4.7K R11 4.7K R12 4.7K R13 0R 1 2 3 45 6 7 8 U3 F108AAMJ P50 P51 P55 P70 P67 VDD VSS RESET C5 0.1UF Q9 8050 12 J1 R6 39K VGIN R43 0R CDS HT0949Z01 C13 104 GB+ LED-

DONGGUAN EMTEK CO., LTD. REPORT NO.: KAD101229041E FCC ID: XZF-CM701 DATE: 04/01/2011 Page 1 of 29 ELECTROMAGNETIC EMISSIONS COMPLIANCE REPORT INTENTIONAL RADIATOR CERTIFICATION TO FCC PART 15 SUBPART B &C REQUIREMENT OF DIGITAL WIRELESS CAMERA MODEL No.: CM701 BRAND NAME: LYD FCC ID: XZF-CM701 REPORT NO: KAD101229041E ISSUE DATE: April 01, 2011 Prepared for SHENZHEN LYD TECHNOLOGY CO., LTD. Building A, Cunnan Industrial Estate, Shuidou Laowei, Longhua Town, Bao’an District, Shenzhen, China. Prepared by DONGGUAN EMTEK CO., LTD. No.281, Guantai Road, Nancheng District, Dongguan, Guangdong, China TEL: 86-769-22807078 FAX: 86-769-22807079 DONGGUAN EMTEK CO., LTD. REPORT NO.: KAD101229041E FCC ID: XZF-CM701 DATE: 04/01/2011 Page 2 of 29 VERIFICATION OF COMPLIANCE Applicant: SHENZHEN LYD TECHNOLOGY CO., LTD. Building A, Cunnan Industrial Estate, Shuidou Laowei, Longhua Town, Bao’an District, Shenzhen, China. Product Description: DIGITAL WIRELESS CAMERA Brand Name: LYD Model Number: CM701 File Number: KAD101229041E Date of Test: December 30, 2010 to April 01, 2011 We hereby certify that: The above equipment was tested by DONGGUAN EMTEK CO., LTD. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.4 (2009) and the energy emitted by the sample EUT tested as described in this report is in compliance with conducted and radiated emission limits of FCC Rules Part 15.249. The test results of this report relate only to the tested sample identified in this report. Approved By Sam Lv / Q.A. Manager DONGGUAN EMTEK CO., LTD. DONGGUAN EMTEK CO., LTD. REPORT NO.: KAD101229041E FCC ID: XZF-CM701 DATE: 04/01/2011 Page 3 of 29 Ta b l e o f C o n t e n t s 1. GENERAL INFORMATION ........................................................................................................... 4 1.1 PRODUCT DESCRIPTION........................................................................................................................... 4 1.2 RELATED SUBMITTAL(S) / GRANT (S) ..................................................................................................... 5 1.3 TEST METHODOLOGY.............................................................................................................................. 5 1.4 SPECIAL ACCESSORIES............................................................................................................................ 5 1.5 EQUIPMENT MODIFICATIONS.................................................................................................................. 5 1.6 TEST FACILITY........................................................................................................................................ 6 2. SYSTEM TEST CONFIGURATION .............................................................................................. 7 2.1 EUT CONFIGURATION............................................................................................................................. 7 2.2 EUT EXERCISE........................................................................................................................................ 7 2.3 TEST PROCEDURE.................................................................................................................................... 7 2.4 LIMITATION............................................................................................................................................. 7 2.5 CONFIGURATION OF TESTED SYSTEM..................................................................................................... 9 3. SUMMARY OF TEST RESULTS ................................................................................................. 10 4. DESCRIPTION OF TEST MODES............................................................................................... 10 5. CONDUCTED EMISSIONS TEST ............................................................................................... 11 5.1 MEASUREMENT PROCEDURE:................................................................................................................ 11 5.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ....................................................................... 11 5.3 MEASUREMENT EQUIPMENT USED: ...................................................................................................... 11 5.4 MEASUREMENT RESULT:....................................................................................................................... 11 5.5 CONDUCTED MEASUREMENT PHOTOS: ................................................................................................ 14 6. RADIATED EMISSION TEST ......................................................................................................15 6.1 MEASUREMENT PROCEDURE................................................................................................................. 15 6.2 TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) ....................................................................... 16 6.3 MEASUREMENT EQUIPMENT USED: ...................................................................................................... 17 6.4 OUT OF BAND RADIATED MEASUREMENT RESULT.............................................................................. 17 6.5 RADIATED MEASUREMENT PHOTOS:.................................................................................................... 21 7. BAND EDGE .................................................................................................................................... 22 8. ANTENNA APPLICATION ........................................................................................................... 24 8.1 ANTENNA REQUIREMENT...................................................................................................................... 24 DONGGUAN EMTEK CO., LTD. REPORT NO.: KA…

Text truncated - open the document above for the full version.

Conducted Emission Setup Photos Radiated Emission Setup Photos