ZT9-TZ207011V2915 MHz RF Module

connected freedom Toumaz UK Limited Building 3, 115 Milton Park, Abingdon, OX14 4RZ, UK Tel: +44 1235 438 950 Email: info@ www.toumaz.com Web: www.toumaz.com Toumaz Asia 11F No. 285, Sec 2, Tiding Blvd. Neihu District, Taipei Tel: +886 2 2799 8108 Telran TDK Kit User Guide Telran TDK TZ2070-IFU_v2.02 Sep 2011 connected freedom TZ2070-IFU ver 2.02 Sep 2011 Page 2 of 58 Copyright    2011 Toumaz UK Limited This document contains and refers to proprietary information, which is protected by copyright. Reproduction of any part of this document is prohibited without the prior written permission of Toumaz UK Limited. Notices Information contained in this publication regarding the Telran TZ1053 and the Telran TDK is provide as-is and may be superseded by updates. It is the Users responsibility to see that his/hers applications meets their own specifications. TOUMAZ MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Toumaz disclaims all liability arising from this information and its use. Use of Toumaz’s products as critical components in life support systems is not authorized except with express written approval by Toumaz. No licenses are conveyed, implicitly or otherwise, under any Toumaz intellectual property rights. All information in this document is subject to change without notice. The products supplied may differ in appearance from that shown. Trademarks The Toumaz™ name and logo, and Telran™ are registered trademarks of Toumaz UK Limited. The Microchip name and logo, KEELOQ, MPLAB, PIC, are the registered trademarks of Microchip Technology Incorporated. UMI and the UMI logo are trademarks of Cambridge Consultants Ltd. All other trademarks mentioned herein are the property of their respective companies Document Revision History Issue Description Author Date 1.00 First Version for Telran TDK AM 20-Jan-2011 2.00 Updated for Version 2 TDKs AM 06-Jul-2011 2.01 Updated for Version 2 TDKs AM 10-Aug-2011 2.02 Safety Information Updated AM 22-Sep-2011 connected freedom TZ2070-IFU ver 2.02 Sep 2011 Page 3 of 58 Contents Copyright  2011 Toumaz UK Limited ............................................................................... 2 Notices ................................................................................................................................ 2 Trademarks ......................................................................................................................... 2 Document Revision History ................................................................................................ 2 Contents ............................................................................................................................. 3 Figures ................................................................................................................................ 5 1. Introduction ......................................................................................................................... 6 1.1 Document Layout................................................................................................................ 6 1.2 Screen Displays .................................................................................................................. 7 1.3 Conventions Used in this Guide ......................................................................................... 7 1.4 Recommended Reading ..................................................................................................... 7 1.5 The Toumaz Web Site ........................................................................................................ 7 1.6 Abbreviations ...................................................................................................................... 8 1.7 Customer Support............................................................................................................... 8 2. Regulatory Approval ........................................................................................................... 9 2.1 USA .................................................................................................................................... 9 2.2 Canada ............................................................................................................................. 10 2.2.1 Radio Frequency Module ................................................................................................. 10 2.2.2 USB Dongle ...................................................................................................................... 10 2.2.3 Sensor Development Board ............................................................................................. 10 2.3 Europe .............................................................................................................................. 11 2.3.1 Helpful Web Sites: ............................................................................................................ 12 3. Telran TDK Kit Contents ................................................................................................... 13 3.1 Deliverables ...................................................................................................................... 13 3.2 Electrostatic Warning ........................................................................................................ 14 3.3 Safety Notice .................................................................................................................... 14 3.4 Waste Electrical and Electronic Equipment (WEEE)........................................................ 14 3.5 Telran TDK Hardware Features ....................................................................................... 15 3.5.1 Telran TDK R…

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1. RF Module Block Diagram The functional block diagram of RF Module TZ20701x is shown below. Digital RF Antenna Matching Telran 1053 VBatt/Vchip VDDIO GPIOs Connector Reset 2. USB Block Diagram. The functional block diagram of the USB Dongle unit TZ20702x is shown below. USBConnector, J3 PIC SPI Memory 5 x LEDs Serial Routing Circuitry ISP Port, J5 SPI Bus & Control PIC Reset, SW2 USB Serial Data Telran TZ1053 Antenna Matching USB Interface J2 Telran TDK External Connector 3. SDB Block Diagram The functional block diagram for the Sensor Development board TZ207030 is shown below. Sensor Board To RF Module Connector, J7 Sensor Board Break Out Connector, J6 PIC 32k768Hz Oscillator SPI Memory SPI Accelerometer 5 x LEDs SPI Bus Steering Circuitry ISP Port, J5 UART Port, J13 User Pushbutton, SW2 Battery and Voltage Boost Circuitry Chip Select Chip Select

FCC ID: ZT9-TZ207011V2 IC ID:9809A-TZ207011V2 Toumaz UK Ltd TZ207011 – Telran RF Module 2011 Not to be reproduced, except in its entirety, Page 1 of 1 without the Permission of TÜV SÜD Product Service Ltd Reference: 75914477 PHOTOGRAPHS OF EQUIPMENT RF Module – Top View RF Module – Bottom View

ToumazUK Limited 115 MiltonPark Abingdon,Oxfordshire.OX144RZ Tel: +44 (0)1235438950 web: www.toumaz.com Title Size Drawing No. Rev. A4 Date Filename Scale Dimensions Drn Check Appro. Notice The informationand data containedherin is consideredthe Copyrightof ToumazUK Limited This documentshall not be copied,reproduced or disclosedwithoutthe expresswrittenconsent of ToumazUK Limited.Possessionof this document does not constitutea grant to manufactureany items. © 2011Toumaz UK Limited Sheet Rev. Description ECN Date Appro. 001 If In Doubt Ask ! Telran TDK TZ207011 Product Label mm ±0.25 19.00 19.00 1.50 4.00 R1.50 TZ207011 FCC ID: ZT9-TZ207011V2 IC: 9809A-TZ207011V2 0D:DD:9A:BC:DE:F0 S/N: www.toumaz.com FCC Label for RF Module Fixed to RF Can 2.0 ATM 06 Oct 2011 1:1 TZ207011-LB01_02.tcw 1 of 1 2x Full Size Shaded Area on Label to be Transparent TZ207011-LB01 TZ207011 FCC ID: ZT9-TZ207011V2 IC: 9809A-TZ207011V2 0D:DD:9A:BC:DE:F0 S/N: www.toumaz.com

FCC ID: ZT9-TZ207011V2 IC ID:9809A-TZ207011V2 Toumaz UK Ltd TZ207011 – Telran RF Module 2011 Not to be reproduced, except in its entirety, Page 1 of 1 without the Permission of TÜV SÜD Product Service Ltd Reference: 75914477 PHOTOGRAPHS OF EQUIPMENT RF Module – Top View RF Module – Bottom View

FCC ID: ZT9-TZ207011V2 IC ID:9809A-TZ207011V2 Toumaz UK Ltd TZ207011 – Telran RF Module 2011 Not to be reproduced, except in its entirety, Page 1 of 1 without the Permission of TÜV SÜD Product Service Ltd Reference: 75914477 PHOTOGRAPHS OF EQUIPMENT RF Module – View 1 RF Module – View 2

Data sheet of Dielectric Chip Antenna Part No. : AMAM903012ST05 (434, 868, 915MHz) Revision Contents Date 0 New 2008.12.03 December 3, 2008 AMOTECH Co., LTD. Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. AMOTECH - 2 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 1. SPECIFICATIONS 1.1 Electrical Specifications No ITEM SPEC. Matching Value 1 Frequency Range 434MHz 433 ~ 435 MHz Series1 : 100nH, Series2 : 68nH, Shunt : 5.1pF 868MHz 867 ~ 869 MHz Series1 : 27nH, Series2 : 6.8nH, Shunt : 4.7pF 915MHz 902 ~ 928 MHz Series1 : 22nH, Series2 : 8.2nH, Shunt : 4.7pF 2 VSWR 2.0 : 1 max. 3 Gain 434MHz Avg. -8 dBi min. 868MHz Avg. -7 dBi min. 915MHz Avg. -4 dBi min. 4 Polarization Linear 5 Azimuth Beam Pattern Omni-directional 6 Impedance Nominal 50 Ω ※ These values are measured on the matched reference test board. 1.2 Mechanical Specifications No ITEM Spec. Remark 1 Electrode Ag Pb-free 2 Dimensions (L * W * H) 9.0 * 3.0 * 1.2 mm 3 Unit Weight 0.12 ± 0.05 g 4 Operating Temperature -35 ~ +85 °C 1.3 Appearance and Dimensions L(Length) 9.0 W(Width) 3.0 H(Height) 1.2 No Name Function Material 1 Electrode Radiation Element Ag 2 Ceramic Body - Ceramic ② ① AMOTECH - 3 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 2. MEASUREMENT 2.1 Reference Test Board for Measurement [ Test board size is 100.0 X 50.0 X 1.0 ] 2.2 Diagram for VSWR measurement Network Analyzer Styrofoam AUT GND Chip Antenna RF Cable Matching AMOTECH - 4 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 2.3 Diagram for radiation gain and pattern measurements iMac A. Anechoic chamber spec. Parameters Condition Unit Chamber size 8x4x4 m Temperature 21.5 °C Humidity 55 % RH Measurement S21 (8753ES) System software Midas (Orbit/FR) B. Measurement coordinates Measurement Plane Symbol Rotating direction Azimuth Azimuth x → y Elevation1 E1 z → x Elevation2 E2 z →-y Azimuth E2 E1 AMOTECH - 5 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3. MEASUREMENT RESULT 3.1.1 VSWR (434MHz) A. Matching Value (recommend for reference Testboard only) Matching network Series L1 100 nH Series L2 68 nH Shunt C 5.1 pF B. Measured data [VSWR: AMAN903012ST05@434MHz on the testboard] AMOTECH - 6 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3.1.2 Radiation Gain and Pattern [Measured data table] H-plane E1-plane E2-plane Avg. Gain Polarization H-pol V-pol H-pol V-pol H-pol V-pol H+V pol Gain (dBi) -5.83 -16.52 -14.33 -10.01 -22.57 -9.23 -7.41 [ Radiation pattern of AMAN903012ST05: Azimuth@434MHz ] [ Radiation pattern of AMAN903012ST05: Elevation@434MHz ] AMOTECH - 7 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3.2.1 VSWR & Smithchart (868MHz) A. Matching Value (recommend for reference Testboard only) Matching network Series L1 27 nH Series L2 6.8 nH Shunt C 4.7 pF B. Measured data [VSWR: AMAN903012ST05@868MHz on the testboard] AMOTECH - 8 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3.2.2 Radiation Gain and Pattern [Measured data table] H-plane E1-plane E2-plane Avg. Gain Polarization H-pol V-pol H-pol V-pol H-pol V-pol H+V pol Gain (dBi) -4.62 -19.32 -16.10 -8.59 -26.83 -8.64 -6.59 [ Radiation pattern of AMAN903012ST05: Azimuth@868MHz ] [ Radiation pattern of AMAN903012ST05: Elevation@868MHz ] AMOTECH - 9 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3.3.1 VSWR & Smithchart (915MHz) A. Matching Value (recommend for reference Testboard only) Matching network Series L1 22 nH Series L2 8.2 nH Shunt C 4.7 pF B. Measured data [VSWR: AMAN903012ST05@915MHz on the testboard] AMOTECH - 10 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 3.3.2 Radiation Gain and Pattern [Measured data table] H-plane E1-plane E2-plane Avg. Gain Polarization H-pol V-pol H-pol V-pol H-pol V-pol H+V pol Gain (dBi) -2.20 -13.62 -11.29 -6.20 -22.16 -5.98 -3.91 [ Radiation pattern of AMAN903012ST05: Azimuth@915MHz ] [ Radiation pattern of AMAN903012ST05: Elevation@915MHz ] AMOTECH - 11 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 4. RELIABILITY TEST No ITEM TEST CONDITION TEST REQUIREMENTS 1 Adhesive Strength of Termination 1. Applied force on SMD chip till detached point from PCB. 1. No mechanical damage by forces applied on the right. 2. Strength (F) > 5 kgf 2 Thermal Shock (Temperature Cycle) 1. 1 cycle / step 1: -40 ± 3°C, 30 min step 2: +125 ± 3°C, 30 min 2. Number of cycle: 30 3. Measure after left for 48 hrs min. at room temperature 1. No visual damage 2. Within electric spec (VSWR) 3 High Temperature Resistance 1. Temperature: +125 ± 5°C 2. Time: 1000 ± 24 hrs 3. Measure f C after left for 24 hrs min. at room temperature 1. No visual damage 2. Within electric spec (VSWR) 4 Low Temperature Resistance 1. Temperature: -40 ± 5°C 2. Time: 1000 ± 24 hrs 3. Measure f C after left for 48 hrs min. at room temperature 1. No visual damage 2. Within electric spec (VSWR) 5 Humidity (Steady Condition) 1. Humidity: 85 % RH 1. Temperature: +85 ± 3°C 2. Time: 1000 ± 24 hrs 3. Measure f C after left for 48 hrs min. at room temperature 1. No visual damage 2. Within electric spec (VSWR) AMOTECH - 12 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 5. SOLDERING RECOMMENDATIOS 5.1 Reflow Soldering Profile [ Soldering Reflow Profile for Pb-free ] 5.2 Soldering Land Pattern [Unit : mm] Item Dimension [mm] Item Function A 9.0 ① or ② Feeding B 3.0 - - C 3.0 - - D 1.0 AMOTECH - 13 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 6. PACKING 6.1 Tape Dimension (unit: mm) A0 3.20 +0.00/-0.10 P0 4.00±0.10 E 1.75±0.10 B0 9.20 +0.00/-0.01 P1 8.00±0.10 F 7.50±0.10 K0 1.65±0.10 P2 2.00±0.10 W 16.00±0.30 D0 1.55±0.05 t 0.30±0.05 6.2 Taping Style 6.3 Surface resistance 1) Carrier tape: Max. 10 11 Ω 2) Cover tape: Min. 10 11 Ω 3) Reel: Max. 10 11 Ω AMOTECH - 14 - Dielectric CHIP ANTENNA November 2008 (Rev0.0) 7. Free Space Size [ Board Top Pattern ] [ Board Bottom Pattern ]

connected freedom TELRAN Technical Description Page 1 of 10 This copy printed on 9-Sep-11 1 Introduction This document specifies the tests and assessments that are required on the Telran TDK and it’s component parts that will allow regulatory approval in Canada, US and EU. This will allow:- Regulatory bodies to assess if the test and assessment regime as satisfactory to allow regulatory approval before testing. 3rd Part test laboratories to provide competitive costs for the testing involved. Toumaz to provide sufficient number and quality of test samples for the testing. 2 Product Overview The products that require approval are:- A USB Dongle. A Radio Transceiver Module. A Sensor Development Board. A TDK (consisting of the USB Dongle and both boards). The TDK is intended for use within an electronic engineering R&D environment. Usual laboratory ESD precautions are expected. connected freedom TELRAN Technical Description Page 2 of 10 This copy printed on 9-Sep-11 The RF Module is designed to be used and sold as a component of customer designed larger systems to provide low power wireless communications. It is not intended to be used as stand-alone equipment. The Sensor Development Board is designed as a development aid for engineers. It is expected to be used and sold solely for this reason and not as stand-alone equipment. The USB Dongle is designed for use with other Toumaz systems as well as the Telran TDK. There are 2 versions of these products, one for the North American market and one for the European Market. Description Europe North America TDK consisting of:- TZ1053TDK868 (Marketing) TZ1053TDK915 (Marketing) USB Dongle TZ207020-ASY TZ207021-ASY RF Module TZ1053RFM868 (Marketing) TZ207010-PCBA (Engineering) TZ1053RFM915 (Marketing) TZ207011-PCBA (Engineering) Sensor Development Board TZ207030-PCBA connected freedom TELRAN Technical Description Page 3 of 10 This copy printed on 9-Sep-11 3 Product Description 3.1 USB Dongle – TZ20702x The USB Dongle consists of a PIC micro processor, a RF transceiver, a FTDI USB transceiver and SPI RAM on a single PCB housed in a New Age Enclosure, P1A-260906U housing. This is shown in Figure 1. Figure 1 USB Dongle Functional Block Diagram 3.1.1 Digital A PIC 18LF25K22 microcontroller acts as a local host controller. It has an ISP connector to allow the PIC to be programmed. The PIC uses its internal 16 MHz oscillator. Two PIC USART connections are used to allow either the Telran, TZ1053 to communications directly with a PC via a USB interface, or the Telran to communicate via the PIC with a PC. NC7SZ157 gates are used to switch the data paths. A 256K SPI Bus Low-Power Serial SRAM (23A256) is used to allow greater storage and manipulation of data. The USB interface uses a FTDI FT232RQ. The USB port is protected by a TPD4E001 ESD diode array. LEDs show the states of the Telran status pins. These are for R&D use only and are not visible to the end user. 3.1.2 Radio The radio circuit is the same as the RF Module described in § 0. However the PCB layout is different. 3.1.3 Power Power is derived from the USB bus and regulated down to 3.3V by the FTDI IC for the PIC and further to 1.25 V by a MAX8863 LDO. PIC SPI Memory 5 x LEDs Serial Routing Circuitry USB Serial Data Telran TZ1053 Antenna Matching SPI Bus & Control USB Interface IC USB Connector, J3 PIC Reset, SW2 PIC Programming Port, J5 connected freedom TELRAN Technical Description Page 4 of 10 This copy printed on 9-Sep-11 3.1.4 USB Dongle information Item Value Comments Power supply sources USB 5.0 V nominal (4.4 V to 5.25 V.) Dimensions 65 x 23 x 15 mm (w x h x d) including USB Connector Temperature Range 0 to + 70 °C Connection Ports USB A connected freedom TELRAN Technical Description Page 5 of 10 This copy printed on 9-Sep-11 3.2 Radio Transceiver Module – TZ20701x The RTM consists of a single bare PCB with a Telran RF transceiver IC and integrated antenna. The North American version is houses the active RF circuits under a screening can. The unit is powered by a LR44 Alkaline cell, but an external power source can be used on the EU version. 3.2.1 RF Module Summary Item Value Comments Power supply sources Alkaline Cell LR44 nominal 1.5 V Operational Supply Range 1.08 to 1.50V Dimensions 43 x 23 x 7 mm (w x h x d) without battery holder. 43 x 23 x 14 mm (w x h x d) with battery holder. Temperature Range 0 to + 70 °C Connection Ports Digital Interface 20 Way 2 x 10 0.05” Samtec RF Test U-FL Hirose 3.2.2 Operational Frequencies The transceiver is designed to operate in the 866 MHz SRD band in Europe and the 915 MHz ISM band in the USA. Details of the frequency ranges are in Table 1. Table 1 Frequency Bands Frequency Bands From To Europe 863 870.0 US 902 928 3.2.3 Transceiver Description The radio is operates in a TDMA (Time Division Multiple Access) system using the same uplink and downlink frequency. The full RF system is contained in the Toumaz Telran TZ1053 IC along with a few additional components. The transceiver system consists of a separate Single Super-heterodyne transmit and receive chains with a common Local Oscillator System. The channel spacing is 200 kHz. This is shown in Figure 2 and described in greater detail in the following sections. 3.2.4 Transmitter The transmit section of the Telran transceiver comprises I Q modulation from baseband up to an IF of approximately 100 MHz followed by a final up conversion by 800 MHz to a final transmit frequency of around 900 MHz. The PA stage is designed to deliver up to -3dBm into a matched antenna load. The PA output stage is open drain and requires an external inductor as a load and a series capacitor match to a 50ohm SAW filter. The transceiver uses an on-chip switch to connect to a common SAW filter and antenna path. The PA circuitry incorporates a control loop which holds connected freedom TELRAN Technical Description Page 6 of 10 This copy printed on 9-Sep-11 the output power at the correct level. Control of the PA output power is in appr…

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44 33 22 11 D D C C B B A A 50ohm track 50ohm track Place xtal close to chip Place components close to chip Place R4 and R20 close to U1 Band SelectEUUSJPN/CHNNo SAW/All Bands Mode Pins 1 2 1 0 0 1 1 1 0 0 Set Resistors R2 R5 R3 R6 100K No Fit No Fit 100K No Fit 100K 100K No Fit 100K No Fit 100K No Fit No Fit100K No Fit 100K Target SelectDefaultPeriodic(20% Duty Cycle) Mode Pin 0 0 1 Set Resistors R1 R4 No Fit 100K 100K No Fit 869MHz ReservedReserved ReservedReserved Place R1 & R4 outside of RF Can VDDSYN MOSI_TELGPIO1 VDDDIG VDDRF SPI_CS_N VDDDIG MISO_TEL F0 F0 GPIO2GPIO3GPIO4 VDDIO VXO VXOVXO TEL_RESET GPIO1GPIO3GPIO4 TEL_RESET SLPTMRVDDIOMODE0 GPIO0SPI_CS_NMOSI_TELSPI_CLKVchipMISO_TEL SPI_CLK GPIO2 VDDRF VDDSYN Vchip VBOARD VBOARD GPIO0 VDDDIG VDDIO VDDDIG VDDIO VDDRF VDDSYN TitleSize Document Number Rev Date: Sheet of TZ207010-SCH 2.0 Telran TDK RF Board Toumaz UK Ltd.115 Milton Park,Abingdon,Oxfordshire,OX14 4RZ. A3 1 1 Wednesday, April 20, 2011 TitleSize Document Number Rev Date: Sheet of TZ207010-SCH 2.0 Telran TDK RF Board Toumaz UK Ltd.115 Milton Park,Abingdon,Oxfordshire,OX14 4RZ. A3 1 1 Wednesday, April 20, 2011 TitleSize Document Number Rev Date: Sheet of TZ207010-SCH 2.0 Telran TDK RF Board Toumaz UK Ltd.115 Milton Park,Abingdon,Oxfordshire,OX14 4RZ. A3 1 1 Wednesday, April 20, 2011 C1610nC1610n L18n2L18n2 L3 56n L3 56n C151n0C151n0 J2 FSH-110-04-F-RA-SL J2 FSH-110-04-F-RA-SL 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 12 13 13 14 14 15 15 16 16 17 17 18 18 19 19 20 20 FIX1 21 FIX2 22 U1B TZ1053 U1B TZ1053 TRSTN/GPIO0 3 TCK/GPIO1 4 TMS/GPIO2 5 TDI/GPIO3 6 TDO/GPIO4 7 VDDIO 8 SCS_N 9 SDO 10 SDI 11 SCLK 12 HWRESET_N 13 VDDDIG 14 OSCSLPTMR 15 CHIP GROUND 33 C232u2C232u2 C922nHC922nH C20100nC20100n SW1B3U-1000PSW1B3U-1000P A 1 B 2 C7100nC7100n R10 0RR10 0R TP24TP24 1 GND GND X1 16 MHz GND GND X1 16 MHz 1 2 3 4 C14No FitC14No Fit C610nC610n TP25TP25 1 L427nL427n C111p0C111p0 R1310MR1310M C18100nC18100n R15100kR15100k R19100kR19100k R3No FitR3No Fit R6100kR6100k R1No FitR1No FitR4100kR4100k R2100kR2100k C21100nC21100n R5No FitR5No Fit J1U_FLJ1U_FL 1 2 3 PCB1 TZ207010_PCB-ISS_2 PCB1 TZ207010_PCB-ISS_2 CAN1 SA-4SFL_2020_CAN CAN1 SA-4SFL_2020_CAN GND0 1 GND1 2 GND2 3 GND3 4 GND4 5 GND5 6 GND6 7 GND7 8 U3S1312C11-A4T1U3U3S1312C11-A4T1U3 Vin 4 Vout 1 ON/OFF 3 VSS 2 Thermal 5 C8100pC8100p R18No FitR18No Fit R1710RR1710R R7100kR7100k L224nL224n R1610RR1610R F1B39871B3715U410F1B39871B3715U410 5 2 1 3 4 6 Amotech ANT1868MHz Amotech ANT1868MHz 1 2 3 C172u2C172u2 R8100kR8100k C5100nC5100n C132n2C132n2 R9120kR9120k TP1TP1 1 C10100nC10100n U1A TZ1053 U1A TZ1053 VDDSYN 1 DVCOREG 2 VDDXO 16 R_EXT 24 MODE3 23 MODE2 22 MODE1 21 MODE0 20 XO_TUNE 19 XO_N 18 XO_P 17 CPOUT 32 DVDDPA 31 RFOUT 30 ANTTX 29 ANT 28 ANTRX 27 RFIN 26 VDDRF 25 C2210u0C2210u0 B1 HU357 Battery Holder B1 HU357 Battery Holder 1 3 2 C12100pC12100p TP2TP2 1 R20No FitR20No Fit C19100pC19100p

Document 75914477 Report 03 Issue 1 August 2011 Report On Limited FCC and Industry Canada Testing of the Toumaz UK Ltd Telran TDK In accordance with FCC CFR 47 Part 15C and Industry Canada RSS-210 COMMERCIAL-IN-CONFIDENCE FCC IDs: RF Module: ZT9-TZ207011V2 , USB Dongle: ZT9-TZ207021V2 IC IDs: RF Module: 9809A-TZ207011V2 , USB Dongle: 9809A-TZ207021V2 TÜV SÜD Product Service Ltd, Octagon House, Concorde Way, Segensworth North, Fareham, Hampshire, United Kingdom, PO15 5RL Tel: +44 (0) 1489 558100. Website: www.tuvps.co.uk COMMERCIAL-IN-CONFIDENCE Document 75914477 Report 03 Issue 1 Page 1 of 45 COMMERCIAL-IN-CONFIDENCE REPORT ON Limited FCC and Industry Canada Testing of the Toumaz UK Ltd Telran TDK In accordance with FCC CFR 47 Part 15C and Industry Canada RSS-210 Document 75914477 Report 03 Issue 1 August 2011 PREPARED FOR Toumaz UK Ltd Building 3 115 Milton Park Abingdon Oxfordshire OX14 4RZ PREPARED BY Natalie Bennett Senior Administrator APPROVED BY Mark Jenkins Authorised Signatory DATED 22 September 2011 ENGINEERING STATEMENT The measurements shown in this report were made in accordance with the procedures described on test pages. All reported testing was carried out on a sample equipment to demonstrate limited compliance with FCC CFR 47 Part 15C and Industry Canada RSS-210. The sample tested was found to comply with the requirements defined in the applied rules. Test Engineer(s); R Henley G Lawler B Airs Document 75914477 Report 03 Issue 1 Page 2 of 45 COMMERCIAL-IN-CONFIDENCE COMMERCIAL-IN-CONFIDENCE CONTENTS Section Page No 1 REPORT SUMMARY ................................................................................................................... 3 1.1 Introduction ................................................................................................................................... 4 1.2 Brief Summary of Results ............................................................................................................. 5 1.3 Application Form ........................................................................................................................... 6 1.4 Product Information ...................................................................................................................... 8 1.5 Test Conditions ............................................................................................................................. 8 1.6 Deviations from the Standard ....................................................................................................... 8 1.7 Modification Record ...................................................................................................................... 8 2 TEST DETAILS ............................................................................................................................ 9 2.1 Field Strength of Fundamental ................................................................................................... 10 2.2 Field Strength of Spurious Emissions ......................................................................................... 17 2.3 Occupied Bandwidth Testing ...................................................................................................... 36 3 TEST EQUIPMENT USED ......................................................................................................... 41 3.1 Test Equipment Used ................................................................................................................. 42 3.2 Measurement Uncertainty .......................................................................................................... 43 4 ACCREDITATION, DISCLAIMERS AND COPYRIGHT ............................................................ 44 4.1 Accreditation, Disclaimers and Copyright ................................................................................... 45 Document 75914477 Report 03 Issue 1 Page 3 of 45 COMMERCIAL-IN-CONFIDENCE COMMERCIAL-IN-CONFIDENCE SECTION 1 REPORT SUMMARY Limited FCC and Industry Canada Testing of the Toumaz UK Ltd Telran TDK In accordance with FCC CFR 47 Part 15C and Industry Canada RSS-210 Document 75914477 Report 03 Issue 1 Page 4 of 45 COMMERCIAL-IN-CONFIDENCE COMMERCIAL-IN-CONFIDENCE 1.1 INTRODUCTION The information contained in this report is intended to show verification of the Limited FCC and Industry Canada Testing of the Toumaz UK Ltd Telran TDK to the requirements of FCC CFR 47 Part 15C and Industry Canada RSS-210. Objective To perform Limited FCC and Industry Canada Testing to determine the Equipment Under Test's (EUT’s) compliance with the Test Specification, for the series of tests carried out. Manufacturer Toumaz UK Ltd Model Number(s) Telran RF Module: TZ207011 Telran USB Dongle: TZ207021 Serial Number(s) DD 21 30 14 84 915 DD 21 90 A4 B4 915 Number of Samples Tested 2 Test Specification/Issue/Date FCC CFR 47 Part 15C: 2010 Industry Canada RSS-210: 2010 Incoming Release Date Application Form 17 July 2011 Disposal Reference Number Date Held Pending Disposal Not Applicable Not Applicable Order Number Date 4408 24 June 2011 Start of Test 31 July 2011 Finish of Test 24 August 2011 Name of Engineer(s) R Henley G Lawler B Airs Related Document(s) ANSI C63.10: 2009 Document 75914477 Report 03 Issue 1 Page 5 of 45 COMMERCIAL-IN-CONFIDENCE COMMERCIAL-IN-CONFIDENCE 1.2 BRIEF SUMMARY OF RESULTS A brief summary of the tests carried out in accordance with FCC CFR 47 Part 15C and Industry Canada RSS-210 is shown below. Section Spec Clause Test Description Result Comments/Base Standard USB Dongle 2.1 15.249 (a) and A2.9 Field Strength of Fundamental Pass 2.2 15.249 (a)(d), 15.209 and A2.9 Field Strength of Spurious Emissions Pass 2.3 ANSI C63.10, 6.9.1 Occupied Bandwidth Testing Pass Radio Transceiver Module 2.1 15.249 (a) and A2.9 Field Strength of Fundamental Pass 2.2 15.249 (a)(d), 15.209 and A2.9 Field Strength of Spurious Emissions Pass 2.3 ANSI C63.10, 6.9.1 Occupied Bandwidth T…

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FCC ID: ZT9-TZ207011V2 IC ID:9809A-TZ207011V2 Toumaz UK Ltd TZ207011 – Telran RF Module 2011 Not to be reproduced, except in its entirety, Page 1 of 1 without the Permission of TÜV SÜD Product Service Ltd Reference: 75914477 PHOTOGRAPHS OF TEST SET UP 30MHz-1GHz Radiated Emissions 1GHz-10GHz – Radiated Emissions