2ACSV-HF-Z100Zigbee Module

HF-Z100 ZigBee Module User Manual Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com)-1- HF-Z100 ZigBee Module User Manual V1.2 TABLE OF CONTENTS LIST OF FIGURES ................................................................................................................................................. 2 LIST OF TABLES ................................................................................................................................................... 2 HISTORY ................................................................................................................................................................. 2 1. PRODUCT OVERVIEW ............................................................................................................................ 3 1.1. General Description ............................................................................................................................... 3 1.2. Device Features ...................................................................................................................................... 3 1.3. Device Paremeters ................................................................................................................................. 4 1.4. Key Application ....................................................................................................................................... 4 2. HARDWARE INTRODUCTION .............................................................................................................. 5 2.1. Pins Definition ......................................................................................................................................... 5 2.2. Electrical Characteristics ....................................................................................................................... 6 2.3. Mechanical Size ...................................................................................................................................... 6 2.4. Antenna .................................................................................................................................................... 7 2.5. Evaluation Kit .......................................................................................................................................... 9 2.6. Order Information ................................................................................................................................. 10 2.7. Typical Application ............................................................................................................................... 10 3. PACKAGE INFORMATION ................................................................................................................... 11 3.1. Recommended Reflow Profile ............................................................................................................ 11 3.2. Device Handling Instruction (Module IC SMT Preparation) .......................................................... 11 3.3. Shipping Information ............................................................................................................................ 11 APPENDIX A: HW REFERENCE DESIGN ............................................................................................... 13 APPENDIX B: CONTACT INFORMATION ................................................................................................ 14 HF-Z100 ZigBee Module User Manual Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com)-2- LIST OF FIGURES Figure 1. HF-Z100 Overview ............................................................................................................................. 5 Figure 2. HF-Z100 Pins Map ............................................................................................................................. 5 Figure 3. HF-Z100 Mechanical Dimension ...................................................................................................... 7 Figure 4. HF-Z100 Suggested Wire Antenna Position .................................................................................. 8 Figure 5. HF-Z100 through hole PAD Position ............................................................................................... 8 Figure 6. HF-Z100 with Chip Antenna Suggested Placement ..................................................................... 8 Figure 7. HF-Z100 Evaluation Kit ..................................................................................................................... 9 Figure 8. HF-Z100 Order Information ............................................................................................................ 10 Figure 9. HF-Z100 Hardware Typical Application ........................................................................................ 10 Figure 10. Reflow Soldering Profile .............................................................................................................. 11 Figure 11. Shipping Information .................................................................................................................... 12 LIST OF TABLES Table 1. HF-Z100 Module Technical Specifications ........................................................................................ 4 Table 2. HF-Z100 Pins Definition ........................................................................................................................ 5 Table 3. Operation Parameters ........................................................................................................................... 6 Table 4. RF Parameters ....................................................................................................................................... 6 Table 5 HF-Z100 Evaluation Kit Interface Description ..............................................................................…

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FCC INFORMATION (Additional) OEM INTEGRATION INSTRUCTIONS (Continued): This module has no shielding, ans therefore the host equipment shall add a shielding function, and the host with module installed, has to be tested for spurious emissions on this point. Additional equipment authorization shall be achieved on the host equipment that has the module installed.

Figure 1 The EUT-Overall View (In the Host) Figure 2 The EUT-Front View (In the Host) The EUT is placed in the host. The EUT is placed in the host. Figure 3 The EUT-Back View (In the Host) The EUT is placed in the host.

Label Location On EUT

FCC ID: 2ACSV-HF-Z100

Figure 4 The EUT-Inside View Figure 5 The PCB-Front View (on the Evaluation Kit) The module is placed on the Evaluation Kit. Figure 6 The PCB-Back View (on the Evaluation Kit) Figure 7 The EUT-Front View Figure 8 The EUT-Back View

MPE Calculation FCC ID: 2ACSV-HF-Z100 Remark: Average ≤ Peak, which means that calculating the power density applying Peak power is worst case. The worst case operation mode generating the highest power in each frequency range is taken for calculation. Frequency range:2405-2480MHzTypical use distance: d ≥20cm Power density limit for mobile devices at 2.4 GHz: S ≤1mW/cm 2 Maximum measured conducted power (Peak): Pconducted =11.98dBm =15.78mW Antenna Gain: G = 0dBi =1on the linear scale Calculation: P radiated = P conducted + G linear =11.98dBm +0dBi =11.98dBm =15.78mW Power density S = (P radiated ) / (4π x d 2 ) =15.78/5026 =0.0031mW/cm 2 <1=> below limit

Shenzhen Anbotek Compliance Laboratory Limited FCC ID: 2ACSV-HF-Z100 Page 1 of 37 Report No.: R011406345E Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com FCC TEST REPORT for High-Flying Electronics Technology Co., Ltd. Zigbee Module Model No.: HF-Z100 Report Number : R011406345E Date of Test : Jun. 16~ 30, 2014 Date of Report : Jul. 12, 2014 Prepared for : High-Flying Electronics Technology Co., Ltd. Address : Room 1002, Building 1, No.3000, Longdong Avenue, Pudong New Area, Shanghai, China, 201203 Prepared By : Shenzhen Anbotek Compliance Laboratory Limited Address : 1/F., Building 1, SEC Industrial Park, No.0409 Qianhai Road, Nanshan District, Shenzhen, Guangdong, China Tel: (86) 755-26066544 Fax: (86) 755-26014772 Shenzhen Anbotek Compliance Laboratory Limited FCC ID: 2ACSV-HF-Z100 Page 2 of 37 Report No.: R011406345E Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com TABLE OF CONTENT Description Page Test Report 1. GENERAL INFORMATION ................................................................................................................ 4 1.1. Description of Device (EUT) ...................................................................................................................... 4 1.2. Auxiliary Equipment Used during Test ........................................................................................................ 5 1.3. Description of Test Facility ......................................................................................................................... 5 1.4. Measurement Uncertainty ........................................................................................................................... 5 2. TEST METHODOLOGY ..................................................................................................................... 6 2.1. Summary of Test Results ............................................................................................................................ 6 2.2. Description of Test Modes .......................................................................................................................... 6 3. CONDUCTED EMISSION TEST ......................................................................................................... 7 3.1. Block Diagram of Test Setup ...................................................................................................................... 7 3.2. Power Line Conducted Emission Measurement Limits (15.207) .................................................................. 7 3.3. Configuration of EUT on Measurement ...................................................................................................... 7 3.4. Operating Condition of EUT ....................................................................................................................... 7 3.5. Test Procedure ............................................................................................................................................ 8 3.6. Test equipment ........................................................................................................................................... 8 3.7. Power Line Conducted Emission Measurement Results .............................................................................. 8 4. FCC PART 15.247 REQUIREMENTS FOR DSSS & OFDM MODULATION ...................................... 11 4.1 Test Setup .................................................................................................................................................. 11 4.2 6dB Bandwidth ......................................................................................................................................... 11 4.3. Maximum Peak output power test ............................................................................................................. 14 4.4. Band Edges Measurement ......................................................................................................................... 17 4.5. Peak Power Spectral Density .................................................................................................................... 20 4.6. Radiated Emissions .................................................................................................................................. 23 5. PHOTOGRAPH ................................................................................................................................. 31 5.1. Photo of Conducted Emission Measurement ............................................................................................. 31 5.2. Photo of Radiation Emission Test ............................................................................................................. 31 APPENDIX I (EXTERNAL PHOTOS) ................................................................................................... 33 APPENDIX II(INTERNAL PHOTOS) ................................................................................................... 35 Shenzhen Anbotek Compliance Laboratory Limited FCC ID: 2ACSV-HF-Z100 Page 3 of 37 Report No.: R011406345E Shenzhen Anbotek Compliance Laboratory Limited Tel:(86)755-26066544 Fax:(86)755-26014772 www.anbotek.com TEST REPORT Applicant : High-Flying Electronics Technology Co., Ltd. Manufacturer : High-Flying Electronics Technology Co., Ltd. EUT : Zigbee Module Model No. : HF-Z100 Serial No. : N.A. Trade Mark : High-Flying Rating : DC 3.3V5%, 170mA-300mA Measurement Procedure Used: FCC Part15 Subpart C, Paragraph 15.247 The device described above is tested by Shenzhen Anbotek Compliance Laboratory Limited to determine the maximum emission levels emanating from the device and the severe levels of the device can endure and its performance criterion. The measurement results are contained in this test report and Shenzhen Anb…

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1. Photo of Conducted Emission Measurement 2. Photo of Radiation Emission Test