2AD56HLK-M20WIFI module

ShenzhenHi-LinkElectronicCo.,Ltd. HLK-M20specifications Version：V1.0Revisedate：2020-4-13Allrightsreserved@ShenzhenHi-linkElectronicco.,ltd CONTENTS 1.PRODUCTBRIEF..........................................................................................................................................................1 1.1.HLK-M20SERIES..............................................................................................................................................1 1.2.WLANFEATURES.............................................................................................................................................2 1.3.MCUFEATURES................................................................................................................................................2 2.FUNCTIONALBLOCKDIAGRAM.....................................................................................................................3 3.SPECIFICATIONS...................................................................................................................................................3 3.1.SYSTEMMEMORY............................................................................................................................................3 3.2.INTERFACE........................................................................................................................................................4 3.3.POWERSUPPLY................................................................................................................................................4 4.MODULEPINDEFINITION.................................................................................................................................5 4.1.PINDEFINITIONDIAGRAM...........................................................................................................................5 4.2.PINDESCRIPTION............................................................................................................................................6 5.MODULEDIMENSIONDRAWING.....................................................................................................................7 6.TYPICALAPPLICATIONCIRCUIT....................................................................................................................7 7.RECOMMENDEDREFLOWTEMPERATURE.................................................................................................8 8.REVISITION............................................................................................................................................................9 Specification HLK-M20 1 1.ProductBrief Applications:IOT,IPTV,TV,surveillance,etc. Integration:singlechipintegratingBB/PMIC/RF/PA/Memory/LNA/Balun Advantages:lowerpowerconsumption,betterperformance,largermemory Specifications: 802.11b/g/n150Mbps 2.4GHz IntegratedMCU,160MHz Interface(I2C,I2S,3*UART,2*SPI,SDIO,6*hardPWM,4*ADC,14*GPIO) SupportFreeRTOS 1.1.HLK-M20moduletype Themodulehardwaretypeisshownbelow ： Pic1PinandSMDmodelsfront Specification HLK-M20 2 Pic2PinandSMDmodelsontheback 1.2.WLANfeatures SinglechipintegrationMAC/PHY/DMAC Support2.4GHzIEEE802.11b/g/n 20/40MHzbandwidth,maximum150Mbps Support(WPA)/WPA2/WPA2-Enterprise/Wi-Fi SupportsoftAP SupportA-MPDU,A-MSDU 1.3.MCUfeatures 32-bit,thehighestclockfrequencyis160MHz Built-in8Mbitflash Programmablefunctionpinposition GPIOthatcanbeinterruptedorawakenedbyexternalrising/fallingedges Specification HLK-M20 3 2.Functionalblockdiagram Pic3Modulefunctionalblockdiagram 3.Specifications 3.1.Systemmemory ProjectParameter Memory system Built-inRAM UserSRAM 128KBytes Built-inFlashBuilt-in8Mbitflash Form1Systemmemory Specification HLK-M20 4 3.2.Interface ProjectParameter Serialport performance Supportupto3serialports,baudratecanbeconfiguredfrom 1200bps-500000bps I2Sinterface performance Support1channelI2Sinterface;BCLKofI2Shostsupport8/32/44.1/48/ 88.2/96KHz;support16/32bitperchannel,dataformatcanbeconfiguredas 8/16/20/24/32bit I2Cinterface performance SupportanI2Cstandardinterface.Supportmasterorslaveoperation PWMinterface performance Supportupto6PWMinterfaces;PWMperiodanddutycycleareprogrammable SPIinterfaceAsSPImaster,supportupto2SPIslaves SDIOSupport1SDIOinterface Form2Systeminterfaceintroduction 3.3.Powersupply symbolfunction Minimumvoltage （V） Typical voltage（V） Maximum voltage（V） Current （mA） VBATSupplyvoltagerange3.03.33.6≥380mA I/OI/OInputvoltagerange1.83.33.5≤10mA Form3Introductionofpowersupply Specification HLK-M20 5 4.Modulepindefinition 4.1.Pindefinitiondiagram Pic4Pindefinitiondiagram Notes： 1，Thepictureisdefinedbydefault,themultiplexingfunctionisnotlisted。 2，Pleaseleavetheunusedfunctions.donotpullupanddownatwill,soasnottocausethemoduletostart abnormally Specification HLK-M20 6 4.2.Pindescription Pin number Pinname TypeDirection 1RSTIRESETsignalofthechip 2GNDI/Obuckground 3GPIO14I/OGeneralpurposeinput/output 4GPIO15I/OGeneralpurposeinput/output 5GPIO20I/OGeneralpurposeinput/output 6GPIO17I/OGeneralpurposeinput/output 7GPIO21I/OGeneralpurposeinput/output 83.3VPWRpowersupply 9NCI/O 10NCI/O 11NCI/O 12NCI/O 13GPIO0I/OGeneralpurposeinput/output 14GPIO1I/OGeneralpurposeinput/output 15GNDGNDbuckground 16GPIO2I/OGeneralpurposeinput/output 17GPIO3I/OGeneralpurposeinput/output 18GPIO4I/OGeneralpurposeinput/output 19GPIO13I/OGeneralpurposeinput/output 20GPIO22I/OGeneralpurposeinput/output 21RXI/OUART_RX 22TXI/OUART_TX Form4Pindescription Pintypedefinition： I/O→Digitalinput/output；  A,I/O→Analoginput/output PWR→Power  GND→Ground Specification HLK-M20 7 5.Moduledimensiondrawing unit：mm Pic5Dimensionaldrawingofthemodule 6.Typicalapplicationcircuit Pic6Testboardschematic Specification HLK-M20 8 Note:ThisisaschematicdiagramoftheM20developmenttestsuite.Pleaseobtaintheschematicdiagram andPCBsourcefilesfromthesales. 7.Recommendedreflowtemperature Whenthemodulepassesthefurnaceforthesecondtime,pleasestrictlyfollowthistemperaturecurve.Ifthe temperat…

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1. MAXIMUM PERMISSIBLE EXPOSURE (MPE) Client Information Applicant: ShenZhen HaiLingKe Electronic co.,Ltd Address of applicant: 3F Caiyue Mansion,No.24 Liuxian blvd,LongHua District, Shenzhen, Guangdong, China Manufacturer: ShenZhen HaiLingKe Electronic co.,Ltd Address of manufacturer: 3F Caiyue Mansion,No.24 Liuxian blvd,LongHua District, Shenzhen, Guangdong, China General Description of EUT Product Name: WIFI module Trade Name: HI-LINK Model No.: HLK-M20 FCC ID: 2AD56HLK-M20 Rated Voltage: DC 5V Equipment Type: Mobile or Fixed Technical Characteristics of EUT Support Standards: 802.11b, 802.11g, 802.11n Frequency Range: 2412-2462MHz for 802.11b/g/n-HT20 2422-2452MHz for 802.11n-HT40 RF Output Power: 16.13dBm (Conducted) Type of Modulation: DBPSK,BPSK,DQPSK,QPSK,16QAM,64QAM Data Rate: 1-11Mbps, 6-54Mbps, up to 150Mbps Quantity of Channels: 11 for 802.11b/g/n-HT20 7 for 802.11n-HT40 Channel Separation: 5MHz Type of Antenna: PCB Antenna Antenna Gain: 1.0dBi 1.2 Standard Applicable According to §1.1307(b)(1) and KDB 447498 D01 General RF Exposure Guidance v06, system operating under the provisions of this section shall be operating in a manner that the public is not exposed to radio frequency energy level in excess limit for maximum permissible exposure. (a) Limits for Occupational / Controlled Exposure Frequency range (MHz) Electric Field Strength (E) (V/m) Magnetic Field Strength (H) (A/m) Power Density (S) (mW/cm 2 ) Averaging Times | E | 2 , | H | 2 or S (minutes) 0.3-3.0 614 1.63 (100)* 6 3.0-30 1842/f 4.89/f (900/f)* 6 30-300 61.4 0.163 1.0 6 300-1500 / / F/300 6 1500-100000 / / 5 6 (b) Limits for General Population / Uncontrolled Exposure Frequency range (MHz) Electric Field Strength (E) (V/m) Magnetic Field Strength (H) (A/m) Power Density (S) (mW/cm 2 ) Averaging Times | E | 2 , | H | 2 or S (minutes) 0.3-1.34 614 1.63 (100)* 30 1.34-30 824/f 2.19/f (180/f)* 30 30-300 27.5 0.073 0.2 30 300-1500 / / F/1500 30 1500-100000 / / 1 30 Note: f = frequency in MHz: * = Plane-wave equivalents power density 1.3 MPE Calculation Method S = (30*P*G) / (377*R 2 ) S = power density (in appropriate units, e.g., mw/cm 2 ) P = power input to the antenna (in appropriate units, e.g., mw) G = power gain of the antenna in the direction of interest relative to an isotropic radiator, the power gain factor is normally numeric gain. R = distance to the center of radiation of the antenna (in appropriate units, e.g., cm) 1.4 MPE Calculation Result Wi-Fi: Maximum Tune-Up output power: 17 (dBm) Maximum peak output power at antenna input terminal: 50.12(mW) Prediction distance: >20(cm) Prediction frequency: 2412(MHz) Antenna gain: 1.0(dBi) Directional gain (numeric gain): 1.26 The worst case is power density at prediction frequency at 20cm: 0.0126 (mw/cm 2 ) MPE limit for general population exposure at prediction frequency: 1 (mw/cm 2 ) Result: Pass

Waltek Testing Group (Shenzhen) Co., Ltd. http://www.semtest.com.cn Page 1 of 65 TEST REPORT Reference No. .................... : WTX20X06038198W FCC ID ................................ : 2AD56HLK-M20 Applicant ........................... : ShenZhen HaiLingKe Electronic co.,Ltd Address ............................. : 3F Caiyue Mansion,No.24 Liuxian blvd,LongHua District, Shenzhen, Guangdong, China Product Name ................... : WIFI module Test Model. ........................ : HLK-M20 Standards .......................... : FCC Part 15.247 Date of Receipt sample .... : Jun.18, 2020 Date of Test........................ : Jun.18, 2020 to Jun.31, 2020 Date of Issue ..................... : Jun.31, 2020 Test Result ......................... : Pass Remarks: The results shown in this test report refer only to the sample(s) tested, this test report cannot be reproduced, except in full, without prior written permission of the company. The report would be invalid without specific stamp of test institute and the signatures of compiler and approver. Prepared By: Waltek Testing Group (Shenzhen) Co., Ltd. Address: 1/F., Room 101, Building 1, Hongwei Industrial Park, Liuxian 2nd Road, Block 70 Bao'an District, Shenzhen, Guangdong, China Tel.: +86-755-33663308 Fax.: +86-755-33663309 Tested by: Reviewed By: Approved & Authorized By: Jack Huang / Project Engineer Lion Cai / RF Manager Silin Chen / Manager Reference No.: WTX20X06038198W Page 2 of 65 Waltek Testing Group (Shenzhen) Co., Ltd. http://www.semtest.com.cn TABLE OF CONTENTS 1. GENERAL INFORMATION ................................................................................................................................... 4 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ............................................................................... 4 1.2 TEST STANDARDS ................................................................................................................................................... 5 1.3 TEST METHODOLOGY ............................................................................................................................................. 5 1.4 TEST FACILITY ....................................................................................................................................................... 5 1.5 EUT SETUP AND TEST MODE ................................................................................................................................. 6 1.6 MEASUREMENT UNCERTAINTY .............................................................................................................................. 7 1.7 TEST EQUIPMENT LIST AND DETAILS ..................................................................................................................... 8 2. SUMMARY OF TEST RESULTS ......................................................................................................................... 10 3. RF EXPOSURE ....................................................................................................................................................... 11 3.1 STANDARD APPLICABLE ....................................................................................................................................... 11 3.2 TEST RESULT........................................................................................................................................................ 11 4. ANTENNA REQUIREMENT ................................................................................................................................ 12 4.1 STANDARD APPLICABLE ....................................................................................................................................... 12 4.2 EVALUATION INFORMATION ................................................................................................................................ 12 5. POWER SPECTRAL DENSITY ........................................................................................................................... 13 5.1 STANDARD APPLICABLE ....................................................................................................................................... 13 5.2 TEST SETUP BLOCK DIAGRAM ............................................................................................................................. 13 5.3 TEST PROCEDURE ................................................................................................................................................. 13 5.4 SUMMARY OF TEST RESULTS/PLOTS .................................................................................................................... 13 6. DTS BANDWIDTH ................................................................................................................................................. 19 6.1 STANDARD APPLICABLE ....................................................................................................................................... 19 6.2 TEST SETUP BLOCK DIAGRAM ............................................................................................................................. 19 6.3 TEST PROCEDURE ................................................................................................................................................. 19 6.4 SUMMARY OF TEST RESULTS/PLOTS .................................................................................................................... 19 7. RF OUTPUT POWER ............................................................................................................................................ 25 7.1 STANDARD APPLICABLE ....................................................................................................................................... 25 7.2 TEST SETUP BLOCK DIAGRAM .........................................................................................…

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