2AXYP-OTW-323SP-LTrue Wireless Earbuds

ORAIMOTECHNOLOGYLIMITED FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:22August2025 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing&AttestationStatementsPart 2.911(d)(5)(ii)Filing FCCID:2AXYP-OTW-323SP-L ORAIMOTECHNOLOGYLIMITEDcertifiesthattheequipmentforwhichauthorizationis soughtisnotequipmentprohibitedfromreceivinganequipmentauthorizationpursuantto section2.903oftheFCCrules. ORAIMOTECHNOLOGYLIMITED(“theapplicant”)certifiesthattheequipmentforwhich authorizationissoughtdoesnotincludecybersecurityoranti-virussoftwareproducedor providedbyKasperskyLab,Inc.oranyofitssuccessorsandassignees,includingequipment withintegratedKasperskyLab,Inc.(oranyofitssuccessorsandassignees)cybersecurityor anti-virussoftwarepursuanttoDA-24-886andKDB986446D01CoveredEquipment GuidancesectionB(2a) ORAIMOTECHNOLOGYLIMITEDcertifiesthat,asofthedateofthefilingoftheapplication, theapplicantisnotidentifiedontheCoveredList(asspecificallynamedentityoranyofits subsidiariesoraffiliates)asanentityproducing”coveredequipment. Sincerely, Printedname:GreenyXian Title:PM CompanyName:ORAIMOTECHNOLOGYLIMITED Signed:

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DeclarationofAuthorization We NameofCompany:ORAIMOTECHNOLOGYLIMITED Address: FLATN16/FBLOCKBUNIVERSALINDUSTRIALCENTRE 19-25SHANMEISTREETFOTANNTHONGKONG City:HONGKONG Country:CHINA Declarethat: NameRepresentative ofagent:WuXuewen AgentCompany name:ShenzhenBalunTechnologyCo.,Ltd. Address: BlockB,1stFL,BaishaScienceandTechnologyPark,ShaheXi Road,NanshanDistrict City:Shenzhen,Guangdong Country:China isauthorizedtoapplyforCertificationofthefollowingproduct(s): Productdescription:Open-EarTrueWirelessEarbuds Typedesignation(s):OTW-323SP Trademark:oraimo onourbehalf. Date:August22,2025 Name:YitingLuo Title:PM Signature:

ORAIMOTECHNOLOGYLIMITED Date:22August2025 To:FederalCommunicationsCommission, Authorization&EvaluationDivision, 7435OaklandMillsRoad, Columbia,MD21046 ToWhomItMayConcern: TheORAIMOTECHNOLOGYLIMITED,theundersigned,herebyauthorizesMr.WuXuewenfrom ShenzhenBALUNTechnologyCo.,Ltd.,toactonthebehalfoftheORAIMOTECHNOLOGY LIMITEDsolelyinmattersrelatingtotheapplicationforanFCCequipmentauthorizationfor FCCID:2AXYP-OTW-323SP-Lincludingthesigningofdocumentsinconnectionwiththis Application.NecessaryactscarriedoutbyShenzhenBALUNTechnologyCo.,Ltd.inconnection withtheApplicationshallhavethesameeffectasactsoftheFYInnovationsTechnologyCo., Ltd. TheORAIMOTECHNOLOGYLIMITEDalsoherebycertifythatnopartytothisapplicationis subjecttoadenialofbenefits,includingFCCbenefits,pursuanttoSection5301oftheAnti-Drug AbuseActof1988,21U.S.C.Section862. YoursSincerely, __________ GreenyXian

ORAIMOTECHNOLOGYLIMITED Date:22August2025 To:FederalCommunicationsCommission, Authorization&EvaluationDivision, 7435OaklandMillsRoad, Columbia,MD21046 Re:ORAIMOTECHNOLOGYLIMITED FCCID:2AXYP-OTW-323SP-L FCCCertificationConfidentialityRequest Gentlemen: Thisletteristocomplywith47CFR0.457and0.459pertainingtoconfidentiality material.ORAIMOTECHNOLOGYLIMITEDrequeststhatthefollowing documentsregardingthissubmissionforFCCID:2AXYP-OTW-323SP-Lbekept Long-Termconfidential: ExhibitTypeFileName BlockDiagramBlockDiagram.pdf SchematicsSchematics.pdf OperationalDescriptionOperationalDescription.pdf Andbelowexhibitkeptshort-termconfidential(180days): ExternalphotosExternalphotos.pdf Testsetupphotostestphoto.pdf InternalphotosInternalphotos.pdf UsermanualUsermanual.pdf Thosedocumentscontaindetailedsystemandequipmentdescriptionandrelated informationabouttheproductwhichORAIMOTECHNOLOGYLIMITEDconsiders tobeconfidentialproprietary,acustomdesignand,otherwise,notreleasableto thegeneralpublic.Sincethisdesignisabasisformwhichfuturetechnological productswillevolve,ORAIMOTECHNOLOGYLIMITEDconsidersthis informationwouldbeofbenefittoitscompetitors,andthatthedisclosureofthe informationinthesedocumentswouldgivecompetitorsanunfairadvantageinthe market. YoursSincerely, GreenyXian

Report No.: BL-SZ2571679-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 1 / 10 Web: www.titcgroup.com Template No.: TRP-FCC-Portable-2 (2023-10-07) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China TEST REPORT Applicant: ORAIMO TECHNOLOGY LIMITED Address: FLAT N 16/F BLOCK B UNIVERSAL INDUSTRIAL CENTRE 19-25 SHAN MEI STREET FOTAN NT HONGKONG Equipment Type: True Wireless Earbuds Model Name: OTW-323SP Brand Name: oraimo FCC ID: 2AXYP-OTW-323SP-L Test Standard: 47 CFR Part 2.1093 KDB 447498 D04 v01 Sample Arrival Date: Jul. 24, 2025 Test Date: Aug. 10, 2025 Date of Issue: Sep. 22, 2025 ISSUED BY: Shenzhen BALUN Technology Co., Ltd. Tested by: Xiong Lining Checked by: Xu Rui Approved by: Tolan Tu (Testing Director) _______________ _______________ _______________ Report No.: BL-SZ2571679-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 2 / 10 Web: www.titcgroup.com Template No.: TRP-FCC-Portable-2 (2023-10-07) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China Revision History Version Issue Date Revisions Content Rev. 01 Aug. 26, 2025 Initial Issue Rev. 02 Sep. 22, 2025 Modified the frequency of section 5.3 TABLE OF CONTENTS 1 GENERAL INFORMATION ........................................................................................................ 3 1.1 Test Laboratory ............................................................................................................ 3 1.2 Test Location ................................................................................................................ 3 2 PRODUCT INFORMATION ....................................................................................................... 4 2.1 Applicant Information .................................................................................................... 4 2.2 Manufacturer Information .............................................................................................. 4 2.3 General Description for Equipment under Test (EUT) ................................................... 4 2.4 Technical Information ................................................................................................... 5 3 SUMMARY OF TEST RESULT ................................................................................................. 6 3.1 Test Standards ............................................................................................................. 6 4 DEVICE CATEGORY AND LEVELS LIMITS ............................................................................. 7 5 ASSESSMENT RESULT ........................................................................................................... 9 5.1 Output Power ............................................................................................................... 9 5.2 Tune-up power ............................................................................................................. 9 5.3 RF Exposure Evaluation Result .................................................................................... 9 5.4 Conclusion .................................................................................................................... 9 Report No.: BL-SZ2571679-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 3 / 10 Web: www.titcgroup.com Template No.: TRP-FCC-Portable-2 (2023-10-07) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China 1 GENERAL INFORMATION 1.1 Test Laboratory Name Shenzhen BALUN Technology Co., Ltd. Address Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China Phone Number +86 755 6685 0100 1.2 Test Location Name Shenzhen BALUN Technology Co., Ltd. Location Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China 1/F, Building B, Ganghongji High-tech Intelligent Industrial Park, No. 1008, Songbai Road, Yangguang Community, Xili Sub-district, Nanshan District, Shenzhen, Guangdong Province, P. R. China Accreditation Certificate The laboratory is a testing organization accredited by FCC as a accredited testing laboratory. The designation number is CN1196. Report No.: BL-SZ2571679-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 4 / 10 Web: www.titcgroup.com Template No.: TRP-FCC-Portable-2 (2023-10-07) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China 2 PRODUCT INFORMATION 2.1 Applicant Information Applicant ORAIMO TECHNOLOGY LIMITED Address FLAT N 16/F BLOCK B UNIVERSAL INDUSTRIAL CENTRE 19-25 SHAN MEI STREET FOTAN NT HONGKONG 2.2 Manufacturer Information Manufacturer ORAIMO TECHNOLOGY LIMITED Address FLAT N 16/F BLOCK B UNIVERSAL INDUSTRIAL CENTRE 19-25 SHAN MEI STREET FOTAN NT HONGKONG 2.3 General Description for Equipment under Test (EUT) EUT Name True Wireless Earbuds Model Name Under Test OTW-323SP Series Model Name N/A Description of Model name differentiation N/A Hardware Version V2.0 Software Version V1.0 Dimensions (Approx.) N/A Weight (Approx.) N/A Report No.: BL-SZ2571679-701 Tel: +86-755-66850100 E-mail: [email protected] Page No. 5 / 10 Web: www.titcgroup.com Template No.: TRP-FCC-Portable-2 (2023-10-07) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China 2.4 Technical Information Network and Wireless connectivity Bluetooth (BR+EDR+BLE) The requirement for the following technical information of the EUT was tested in this report: Operating Mode Bluetooth Frequency Range Bluetooth 2402 ~ 2480 MHz Antenna Type Bluetooth Ceramic Antenna Exposure Category General Population/Uncontrolled Exposure Product Type Portable Device Re…

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承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： KBAN3216G245H01 規格 DESCRIPTION ： Chip Ceramic Antenna 3216L Ant 2.45G Type H01 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/11 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ziv Alex Jerry 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. For Bluetooth / WLAN A 3216Chip Ceramic antenna pplications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: KBAN3216G245H01 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information KBAN 3216 G 245 H 01 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 01 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number KBAN3216G245H01 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.73 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 78.66 % 1.64 dBi 2.68 dBi 2450MHz 81.58 % 1.73 dBi 2.61 dBi 2500MHz 79.88 % 1.68 dBi 2.65 dBi Chamber Coordinate System Z Y X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended…

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Report No.: BL-SZ2571679-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 1 / 61 Web: www.titcgroup.com Template No.: TRP-FCC Part.15 247 (2022-01-12) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China TEST REPORT Applicant: Address: Equipment Type: Model Name: Brand Name: FCC ID: Test Standard: Sample Arrival Date: Test Date: Date of Issue: ORAIMO TECHNOLOGY LIMITED FLAT N 16/F BLOCK B UNIVERSAL INDUSTRIAL CENTRE 19-25 SHAN MEI STREET FOTAN NT HONGKONG True Wireless Earbuds OTW-323SP oraimo 2AXYP-OTW-323SP-L 47 CFR Part 15 Subpart C (refer to section 3.1) Jul. 24 , 2025 Jul. 31, 2025 - Aug. 05, 2025 Aug. 26, 2025 ISSUED BY: Shenzhen BALUN Technology Co., Ltd. Tested by: Julie Zhu Checked by: Ye Hongji Approved by: Sunny Zou (Technical Director) _______________ _______________ _______________ Report No.: BL-SZ2571679-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 2 / 61 Web: www.titcgroup.com Template No.: TRP-FCC Part.15 247 (2022-01-12) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China Revision History Version Issue Date Revisions Rev. 01 Aug. 26, 2025 Initial Issue TABLE OF CONTENTS 1 GENERAL INFORMATION ......................................................................................................... 4 1.1 Test Laboratory .............................................................................................................. 4 1.2 Test Location .................................................................................................................. 4 2 PRODUCT INFORMATION ......................................................................................................... 5 2.1 Applicant Information ...................................................................................................... 5 2.2 Manufacturer Information ............................................................................................... 5 2.3 General Description for Equipment under Test (EUT) ................................................... 5 2.4 Technical Information ..................................................................................................... 6 3 SUMMARY OF TEST RESULTS ................................................................................................. 8 3.1 Test Standards ............................................................................................................... 8 3.2 Test Verdict .................................................................................................................... 8 4 GENERAL TEST CONFIGURATIONS ........................................................................................ 9 4.1 Test Environments ......................................................................................................... 9 4.2 Test Equipment List ........................................................................................................ 9 4.3 Test Software List ........................................................................................................... 9 4.4 Measurement Uncertainty ............................................................................................ 10 4.5 Description of Test Setup ............................................................................................. 10 4.6 Measurement Results Explanation Example ................................................................ 13 5 TEST ITEMS .............................................................................................................................. 14 5.1 Antenna Requirements ................................................................................................. 14 5.2 Output Power ............................................................................................................... 15 5.3 Occupied Bandwidth .................................................................................................... 17 5.4 Conducted Spurious Emission ..................................................................................... 18 5.5 Band Edge (Authorized-band band-edge) .................................................................... 20 Report No.: BL-SZ2571679-602 Tel: +86-755-66850100 E-mail: [email protected] Page No. 3 / 61 Web: www.titcgroup.com Template No.: TRP-FCC Part.15 247 (2022-01-12) Add: Block B, 1/F, Baisha Science and Technology Park, Shahe Xi Road, Nanshan District, Shenzhen, Guangdong Province, P. R. China 5.6 Conducted Emission .................................................................................................... 22 5.7 Radiated Spurious Emission ........................................................................................ 23 5.8 Band Edge (Restricted-band band-edge) ..................................................................... 28 5.9 Power Spectral density (PSD) ...................................................................................... 29 ANNEX A TEST RESULT ............................................................................................................. 30 A.1Output Power ............................................................................................................... 30 A.2Occupied Bandwidth .................................................................................................... 33 A.3Conducted Spurious Emissions ................................................................................... 38 A.4Band Edge (Authorized-band band-edge) .................................................................... 43 A.5Conducted Emissions ................................................................................................... 46 A.6Radiated Spurious Emission ........................................................................................ 48 A.7Ban…

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