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O63MH9116Cordless Phone

Lionda Technology Co Ltd
Cordless Phone - FCC ID O63MH9116 - Lionda Technology Co Ltd
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Application Details

Equipment Class
DXX - Part 15 Low Power Communication Device Transmitter
Date of Grant
Aug 30, 2001
Application Purpose
Original Equipment
Date of Application
Jul 11, 2001
Equipment Note
Cordless Phone
Frequency Range
902.12000000 - 927.29000000
Company
Lionda Technology Co Ltd
Country
China

Documents & Files

Select a file to view

Users Manual

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Block Diagram

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Operational Description

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Schematics

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Block Diagram

9116bbd.sch-1 - Tue Jun 12 21:21:16 2001 9116hbd.sch-1 - Tue Jun 12 21:26:35 2001

External Photos

EUT – Handset Top View EUT – Base Top View

ID Label/Location Info

FCC ID Label for Base Unit Rear Side of EUT / Proposed FCC ID Location FCC ID: O63MH9116 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harm- ful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Privacy of Communication may not be ensured when using this phone. 2.1875" 1.0" FCC ID Label Handset Left Side Proposed Label Location If the EUT is too small, the FCC statement could be presented in the user manual. Generally, appendix B contains one copy of user manual. The following is one sample of the FCC Statement: “ This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Privacy of Communication may not be ensured when using the phone.” FCC ID: O63MH9116

Internal Photos

Handset Open Cover View Handset - Main Board Component View Handset –Main Board Solder View Base – Open Cover View Base- Main Board Component View Base –Main Board Solder View RF Module Component View RF Module Solder View RF Module Component View 2 RF Module Solder View 2

Operational Description

Lionda Technology Company Limited Engineering Department 9116Test Mode.doc 6/11/01 Page 1 of 1 Test Mode Procedure for Model 9116 Note: The default test mode channel frequency is CH20 for both the Base Unit (B/U) and the Handset (H/S). Refer to the Frequency Table for proper frequency allocations. Base Basic Test Mode: Insert the 9Vdc plug into the B/U DC jack while pressing the “Page” key. Both RX and TX will be activated and basic testing can be done. Press the “Page” key to scan the channel frequency one at a time. Handset: Insert the battery into the H/S battery socket while pressing the “*7” key. Press “*7” key to scan the channel frequency one at a time. Lionda Technology Company Limited Engineering Department 900MHzFrequency 06/11/01 MH9116 FREQUENCY CHART B A S E H A N D S E T B A S E H A N D S E T CH TX RX TX RX CH TX RX TX RX 1 902.12199 926.11750 926.11750 902.12199 21 902.72226 926.71776 926.71776 902.72226 2 902.15200 926.14751 926.14751 902.15200 22 902.75228 926.74778 926.74778 902.75228 3 902.18202 926.17753 926.17753 902.18202 23 902.78229 926.77779 926.77779 902.78229 4 902.21203 926.20754 926.20754 902.21203 24 902.81230 926.80780 926.80780 902.81230 5 902.24204 926.23755 926.23755 902.24204 25 902.84232 926.83782 926.83782 902.84232 6 902.27205 926.26757 926.26757 902.27205 26 902.87233 926.86783 926.86783 902.87233 7 902.30207 926.29758 926.29758 902.30207 27 902.90235 926.89784 926.89784 902.90235 8 902.33209 926.32759 926.32759 902.33209 28 902.93236 926.92785 926.92785 902.93236 9 902.36210 926.35760 926.35760 902.36210 29 902.96237 926.95787 926.95787 902.96237 10 902.39211 926.38762 926.38762 902.39211 30 902.99239 926.98788 926.98788 902.99239 11 902.42213 926.41763 926.41763 902.42213 31 903.02240 927.01790 927.01790 903.02240 12 902.45214 926.44764 926.44764 902.45214 32 903.05241 927.04791 927.04791 903.05241 13 902.48215 926.47765 926.47765 902.48215 33 903.08243 927.07792 927.07792 903.08243 14 902.51217 926.50767 926.50767 902.51217 34 903.11244 927.10794 927.10794 903.11244 15 902.54218 926.53768 926.53768 902.54218 35 903.14245 927.13795 927.13795 903.14245 16 902.57220 926.56770 926.56770 902.57220 36 903.17247 927.16796 927.16796 903.17247 17 902.60221 926.59771 926.59771 902.60221 37 903.20248 927.19798 927.19798 903.20248 18 902.63222 926.62772 926.62772 902.63222 38 903.23250 927.22799 927.22799 903.23250 19 902.66224 926.65774 926.65774 902.66224 39 903.26251 927.25800 927.25800 903.26251 20 902.69225 926.68775 926.68775 902.69225 40 903.29252 927.28801 927.28801 903.29252

Operational Description

LIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENT MH9116 series Page 1 6/11/01 CIRCUIT DESCRIPTION Model: MH9116 Series Base a. RF Transmitter Section – RF Board Compressed audio signal is frequency modulated through the varactor diode D3. Diode D3, choke coil L2 and the external components formed the voltage controlled oscillator circuit for the transmitter part. This circuit generates the TX VCO frequency. A portion of this signal is fed back to the PLL IC’s pin1 (FIN1) for phase comparison. Once the phase of oscillation stabilized, the PLL circuit generates the error voltage necessary for the VCO to oscillate at the desired transmitter’s RF frequency. The VCO circuit impedance is matched with the succeeding circuit through the transistor Q7 that also acts as the buffer amplifier. RF amplifier Q5 boosts the signal for transmission. This amplified RF signal is trimmed to the desired frequency band by BPF903 so as not to interfere with the receiver circuit. The transmitter RF signal is then propagated through the antenna. b. RF Receiver Section - RF Board The Base Unit antenna receives RF signal. Band Pass Filter BPF927 trims the signal to the desirable frequency band. Transistor Q8 is a low noise amplifier that boosts the RF signal to a specific level for mixing. PLL IC1 (TB31202) is used as a Universal Phase Lock Loop circuit. The frequency from the Voltage Controlled Oscillator (VCO) D1, L1 and Q4, is fed back to the PLL IC through pin 16 (FIN2) for phase comparison. During channel scanning or turning the unit on, once the phase of oscillation stabilized (locked), the PLL circuit generates the first local oscillator frequency for down-converting the received RF signal into the first IF frequency 10.7MHz. This process is accomplished through the IF mixer circuit Q3. Q1 is used for matching the impedance of the mixer circuit with the succeeding circuits. The resulting IF signal is kept constant by the IF Filter FL2 to 10.7MHz which is then mixed with the second local oscillator frequency 11.150MHz (derived from X1 & C47) to produced a much lower IF frequency. This lower IF frequency if further filtered by IF Filter FL4 to produce a more stable signal of 450KHz. Quadrature signal detection is accomplished internally by the Narrow-band Detector IC2 (KA3361) with the IF coil L7. The recovered audio frequency can be taken from IC2 audio output pin9. Double conversion of received signal is utilized to improve the image frequency rejection of the unit. c. Transmitter Audio Section – Main Board Audio Frequency signal from the telephone line is compressed through the compressor part of IC4 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC4 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC4 for expansion thus retrieving the original Audio signal with noise filtered out. Q5 & Q9 are used as buffer circuit. Matching transformer HYB1 isolates the high-voltage telephone line to the rest of the circuit. 1 LIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENT MH9116 series Page 2 6/11/01 HYB1 is also used as a hybrid transformer to create a two-way path for audio transmission to and reception from the telephone line. Handset a. RF Transmitter Section – RF Board Refer to portion 1.a for this section. All circuit performance is exactly the same except that Band Pass Filter BPF903 is changed to BPF927 for the handset transmission. b. RF Receiver Section – RF Board Refer to portion 1.b for this section. All circuit performance is exactly the same except that Band Pass Filter BPF927 is changed to BPF903 for the handset reception. c. Transmitter Audio Section – Main Board Audio Frequency signal from the handset or from the headset microphone is compressed through the compressor part of IC1 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC1 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. Q3 is a switching transistor that controls the power supply for the TX RF part. d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC1 for expansion thus retrieving the original Audio signal with noise filtered out. Q3 act as audio amplifier to sufficiently drive the handset speaker. Q2, Q10 are switching transistors that control the power supply for the RF part, the Compander part and the AF amplifier respectively. An earphone jack is provided for an optional headset unit for handsfree conversation on the handset. OTHERS (Handset): a. Charging and Reset Controls Recharging the handset battery is accomplished by putting the handset on the cradle. Q4 detects this action and sends a command to the CPU for proper exchange of security code. b. Ring Detection When the handset receives the ring command from the base unit, the CPU will send buzzer signal to the ringer amplifier Q5 & Q6 that drives the Buzzer. 2 3 LIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENT MH9116 series Page 3 6/11/01 OTHERS (Base): a. Hook Switching and Dialing Hook switching and pulse dialing is accomplished by the photo-coupler IC3 that is controlled by the CPU. DTMF signal from the ladder circuit internal to the CPU is filtered and amplified by IC2B. b. Over-voltage Protection Fuse F1 and varistor Z1 act as high current and high voltage protectors for the telephone line interface. In case of presence of voltage surge across the telephone line, Z1 decreases its resistance and …

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Schematics

9116BM.SCH-1 - Tue Jun 12 21:29:52 2001 9116HM.SCH-1 - Tue Jun 12 21:33:47 2001

Test Report

Note: This report may not be duplicated without prior written consent of Bay Area Compliance Laboratory Corporation. This report must not be used by the client to claim product endorsement by NVLAP or any agency of the U.S. Government. FCC PART 15 Subpart C EMI MEASUREMENT AND TEST REPORT FOR LIONDA TECHNOLOGY CO., LTD. Block 2 Laodong 2 nd Industrial Area, Xixiang, Baoan, Shenzhen, Guangdong, P.R.China FCC ID: O63MH9116 June 20, 2001 This Report Concerns: Original Report Equipment Type: Cordless Telephone– Household Appliances Test Engineer: Hien Pham Test Date: June 13, 2001 Reviewed By: John Y. Chan – Engineering Manager Prepared By: Bay Area Compliance Laboratory Corporation 230 Commercial Street, Suite 2 Sunnyvale, CA 94085 Tel (408) 732-9162 Fax (408) 732-9164 LIONDA TECHNOLOGY CO., LTD. FCC ID: O63MH9116 Report # TEST REPORT Page 2 of 18 FCC Part 15 Subpart C Test Report TABLE OF CONTENTS 1 - GENERAL INFORMATION.................................................................................................................................................3 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT)........................................................................................3 1.2 OBJECTIVE................................................................................................................................................................................3 1.3 RELATED SUBMITTAL(S)/GRANT(S).....................................................................................................................................3 1.4 TEST METHODOLOGY..............................................................................................................................................................3 1.5 TEST FACILITY.........................................................................................................................................................................3 1.6 TEST EQUIPMENT LIST............................................................................................................................................................4 1.7 EQUIPMENT UNDER TEST (EUT)...........................................................................................................................................4 1.8 LOCAL SUPPORT EQUIPMENT LIST AND DETAILS...............................................................................................................4 1.9 EXTERNAL I/O CABLING LIST AND DETAILS......................................................................................................................5 2 - SYSTEM TEST CONFIGURATION..................................................................................................................................6 2.1 DESCRIPTION OF TEST CONFIGURATION..............................................................................................................................6 2.2 CONFIGURATION OF TEST SYSTEM (BASE).........................................................................................................................7 2.3 TEST SETUP BLOCK DIAGRAM...............................................................................................................................................7 2.4 EQUIPMENT MODIFICATIONS.................................................................................................................................................7 3 - CONDUCTED EMISSIONS TEST DATA........................................................................................................................8 3.1 MEASUREMENT UNCERTAINTY.............................................................................................................................................8 3.2 EUT SETUP...............................................................................................................................................................................8 3.3 SPECTRUM ANALYZER SETUP................................................................................................................................................8 3.4 TEST PROCEDURE....................................................................................................................................................................9 3.5 SUMMARY OF TEST RESULTS.................................................................................................................................................9 3.6 CONDUCTED EMISSIONS TEST DATA....................................................................................................................................9 3.7 PLOT OF CONDUCTED EMISSIONS TEST DATA....................................................................................................................9 4 - RADIATED EMISSION DATA..........................................................................................................................................11 4.1 MEASUREMENT UNCERTAINTY...........................................................................................................................................11 4.2 EUT SETUP.............................................................................................................................................................................11 4.3 SPECTRUM ANALYZER SETUP..............................................................................................................................................11 4.4 TEST PROCEDURE..................................................................................................................................................................12 4.5 CORRECTED AMPLITUDE & MARGIN CALCULATION.......................................................................................................12 4.6 SUMMARY OF TEST RESULTS....................................................................................................................…

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Test Report

Rescan Test Data on August 30, 2001, for Fundamental Frequency, 3 meters INDICATED TABLE ANTENNA CORRECTION FACTOR CORRECTED AMPLITUDE FCC 15 Subpart C Frequency Ampl. Angle Height Polar Antenna Cable Amp. Corr. Ampl. Limit Margin MHz dBμμV/m Comments Degree Meter H/ V dBμμV/m dB dB dBμμV/m dBμμV/m dB 902.1292.9 Base, Low Channel (QP)1801.5V24.83.030.090.794.0-3.3 902.1291.4 Base, Low Channel (QP)2251.3H24.83.030.089.294.0-4.8 902.6992.8 Base , Middle Channel (QP) 1601.5V24.83.030.090.694.0-3.4 902.6991.6 Base , Middle Channel (QP) 2501.4H24.83.030.089.494.0-4.6 903.2992.8 Base , High Channel (QP) 2751.2V24.83.030.090.694.0-3.4 903.2991.2 Base , High Channel (QP) 1801.5H24.83.030.089.094.0-5.0 926.1291.3 Handset, Low Channel(QP) 901.5V24.74.430.090.494.0-3.6 926.1292.3 Handset, Low Channel(QP) 901.3H24.74.430.091.494.0-2.6 926.6990.0 Handset, Middle Channel(QP)01.2V24.74.430.089.194.0-4.9 926.6992.7 Handset, Middle Channel(QP)1801.6H24.74.430.091.894.0-2.2 927.2993.7 Handset, High Channel(QP)01.3V24.74.430.092.894.0-1.2 927.2991.9 Handset, High Channel(QP)1801.4H24.74.430.091.094.0-3.0

Test Setup Photos

EUT Base Conducted Emission Photograph – Front View EUT Base Conducted Emission Photograph – Rear View EUT Base Radiated Emission Photograph – Front View EUT Base Radiated Emission Photograph – Rear View EUT Handset Radiated Emission Photograph – Front View EUT Handset Radiated Emission Photograph – Rear View

Contact Information

Applicant

Dan Coronia(Senior Engineer)
[email protected]86-755-791-7824Fax: 86-755-791-7944

Technical Contact

Bay Area Compliance Laboratory Corp.John Chan
[email protected]408 732 9162

230 Commercial Street · Sunnyvale, California · United States

Non-Technical Contact

Bay Area Compliance Laboratory Corp.Rita Cai
[email protected]408 732 9162

Test Firm

Bay Area Compliance LaboratoryJohn Chan
[email protected]408-732-9162Fax: 408-732-9164

Technical Specifications

#Rule PartsFrequency RangePower Output
115C902.12 MHz - 927.29 MHz-
Grant Notes
Reissued by FCC

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