P53-EMB1082Embedded BLE module

Abstract Features ⚫ Based on an ultra-low power BLE SOC ▪ ARM Cortex-M4F Core 20MHz ▪ 160KB RAM ▪ 512KB Flash in chip, and support external flash up to 8Mbyte ▪ 32K RCOSC in chip, and support external 32K clock ⚫ Operating Voltage: 2.7V～3.3V ⚫ Support up to 16 IOs pin mux. ⚫ Bluetooth Features ▪ Support Bluetooth 5.0 (BLE single mode) ▪ Max RF date rate 1Mbps ▪ Max TX power: 7dBm ▪ Min RX sensitivity: -96dBm@1Mbps ▪ Support BLE Master/ Slave mode ▪ Support broadcasting, data encryption, and adaptive frequency hopping ▪ Support LE L2CAP ▪ Support LE date length expension ⚫ Operating Temperature：-40°C to +105°C ⚫ Antenna: PCB antenna or IPEX connector (Optional) Application ⚫ Intelligent lighting ⚫ Smart Home Application ⚫ Wearables ⚫ Smart healthcare ⚫ Portable devices Module Type Type Note EMB1082-P PCB antenna EMB1082-E IPEX connector Hardware Block Copyright Notice Mxchip copyrights this specification. No part of this specification may be reproduced in any form or means, without the prior written consent of Mxchip. Datasheet EMB1082 BLE module Vision：1.2 Date：2020-03-18 Number: DS0135EN Datasheet [Page 1] EMB1082 Version history Date Vision Details 2018-10-23 1.0 Initial release 2019-03-25 1.1 Update power consumpiton 2020-03-18 1.2 Update product image Datasheet [Page 2] EMB1082 Content Abstract ............................................................................................................................................................................... 1 Version history .................................................................................................................................................................... 1 1. Product Introduction .................................................................................................................................................. 4 2. Pins and dimension ..................................................................................................................................................... 5 PIN ARRANGEMENT .......................................................................................................................................... 5 PIN DEFINITION ................................................................................................................................................ 7 3. Electrical Parameters ............................................................................................................................................... 10 OPERATING CONDITIONS ................................................................................................................................ 10 POWER CONSUMPTION ................................................................................................................................... 10 WORKING ENVIRONMENT ............................................................................................................................... 11 ELECTROSTATIC DISCHARGE .......................................................................................................................... 11 4. RF parameters ........................................................................................................................................................... 12 BASIC RF PARAMETERS .................................................................................................................................. 12 GFSK PARAMETERS ....................................................................................................................................... 12 5. Antenna Information ................................................................................................................................................ 14 ANTENNA TYPE .............................................................................................................................................. 14 PCB ANTENNA CLEARANCE ZONE ................................................................................................................. 14 EXTERNAL ANTENNA CONNECTOR ................................................................................................................. 15 6. Assembly Information and Production Guidance ................................................................................................. 16 ASSEMBLY SIZE .............................................................................................................................................. 16 PRODUCTION GUIDANCE（IMPORTANT） ...................................................................................................... 16 CONSIDERATIONS............................................................................................................................................ 18 STORAGE CONDITION ..................................................................................................................................... 19 TEMPERATURE CURVE OF SECONDARY REFLOW ............................................................................................. 20 7. Reference Circuit ...................................................................................................................................................... 21 8. FCC and IC Information ......................................................................................................................................... 23 FCC WARNING ............................................................................................................................................... 23 IC WARNING.................................................................................................................................................... 23 9. Module MOQ and Package Information ................................................................................................................ 25 10. Sales Information and Technical Support ................…

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Rev 11/20/07 Shanghai MXCHIP Information Technology Co.,Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: P53-EMB1082 Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, we hereby request confidential treatment of information accompanying this application as outlined below: Exhibit Type File Name Block Diagram, Schematics, Operational Description, Block Diagram Operation Description schematic diagram The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. Sincerely, 2020-7- 15 Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

MODULAR APPROVAL LETTER FCC ID: P53-EMB1082 Modular Approval Requirement Yes No (i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. YES The modular transmitter have its own RF shielding (ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. YES The modular accord with Part 15 requirements (iii) The modular transmitter must have its own power supply regulation. YES The modular It has its own power supply regulation (iv) The modular transmitter must comply with the antenna and transmission system requirements of §§ 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a ‘‘unique’’ antenna coupler (at all connections between the module and the antenna, including the cable). The ‘‘professional installation’’ provision of § 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. YES The modular accord with the antenna requirements of Section 15.203 and 15.204(b)(c) (v) The modular transmitter must be tested in a stand-alone confi guration YES (vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. YES The modular have one permanently affixed label (vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. YES The modular transmitter accord with any specific rule or operating requirements (viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES The modular transmitter accord RF exposure requirements The letter must be on the applicant’s letterhead and signed by the grantee code contact. Signature: Date: ___2020-05-17 Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

Shanghai MXCHIP Information Technology Co.,Ltd. Federal Communications Commission Authorization and Evaluation Division 1435 Oakland Mills Road Columbia, MD 21046 Date: 2020-07-15 SUBJECT: FCC Application for FCC ID: P53-EMB1082 To Whom It May Concern: We, the undersigned, hereby authorize Lisa Wang at EMTEK (SHENZHEN) CO., LTD. on our behalf, to apply to the Federal Communications Commission on our equipment. Any and all acts carried out by EMTEK (SHENZHEN) CO., LTD. on our behalf shall have the same effect as acts of our own. This is to advise that we are in full compliance with the Anti- Drug Abuse Act. We, the applicant, are not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 USC853a, and no party to the application is subject to a denial of federal benefits pursuant to that section. Regards, Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

Shanghai MXCHIP Information Technology Co., Ltd. Family models declaration letter. 2020-7-15 We Shanghai MXCHIP Information Technology Co., Ltd. Of 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) Product: Embedded BLE module FCC ID: P53-EMB1082 Model Name: EMB1082-E, EMB1082-P Two models are identical in circuitry and electrical, mechanical and physical construction; the only difference is EMB1082-P model with PCB antenna; EMB1082-E model with IPEX antenna connector Thanks Sincerely, 2020-7-15 Xu Wei/ Product department manager

External Photo Model: EMB1082‐E Model: EMB1082‐P

Label and Label location

Internal Photo Model: EMB1082‐E Antenna port Model: EMB1082‐P Antenna

FCC ID : P53-EMB1082 RF EXPOSURE EVALUATION According to FCC 1.1310: The criteria listed in the following table shall be used to evaluate the environment impact of human exposure to radio frequency (RF) Radiation as specified in §1.1307(b) Limits for Maximum Permissible Exposure (MPE) Frequency Range(MHz) Electric Field Strength(V/m) Magnetic Field Strength(A/m) Power Density(mW/cm 2 ) Average Time (A) Limits for Occupational/Control Exposures 300-1500 -- -- F/300 6 1500-100000 -- -- 5 6 (B) Limits for General Population/Uncontrol Exposures 300-1500 -- -- F/1500 6 1500-100000 -- -- 1 30 11.1 Friis transmission formula: Pd= (Pout*G)\ (4*pi*R 2 ) Where Pd= Power density in mW/cm 2 Pout=output power to antenna in mW G= Numeric gain of the antenna relative to isotropic antenna Pi=3.1416 R= distance between observation point and center of the radiator in cm Pd the limit of MPE, 1mW/cm 2 ,If we know the maximum gain of the nd total power input to the antenna, through the calculation, we will know the distance where the MPE limit is reached. 11.2 Measurement Result Max support antenna gain: 2.0 dBi Mode Channel Freq. (MHz) Measured power (dBm) Tune-up power (dBm) Max tune-up power (dBm) Antenna Gain Numeric Evaluation result (mW/cm2 ) Power density Limits (mW/cm2 ) BLE 2402 5.91 5.5-7.5 7.5 1.58 0.0018 1 2440 7.17 5.5-7.5 7.5 1.58 0.0018 1 2480 6.18 5.5-7.5 7.5 1.58 0.0018 1

Report No. ES200521036W Page 1 of 46 Ver.1.0 TEST REPORT Product Name ： Embedded BLE module Model Number ： EMB1082-E, EMB1082-P FCC ID ： P53-EMB1082 Prepared for : Shanghai MXCHIP Information Technology Co., Ltd. Address : 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) Prepared by : EMTEK (SHENZHEN) CO., LTD. Address : Bldg 69, Majialong Industry Zone, Nanshan District, Shenzhen, Guangdong, China Tel: (0755) 26954280 Fax: (0755) 26954282 Report Number : ES200521036W Date(s) of Tests : May 25, 2020 to June 24, 2020 Date of issue : June 24, 2020 $二维码$ Report No. ES200521036W Page 2 of 46 Ver.1.0 Table of Contents 1 TEST RESULT CERTIFICATION ..................................................................................................................................... 3 2 EUT TECHNICAL DESCRIPTION ................................................................................................................................... 5 3 SUMMARY OF TEST RESULT ......................................................................................................................................... 6 4 TEST METHODOLOGY .................................................................................................................................................... 7 4.1 GENERAL DESCRIPTION OF APPLIED STANDARDS .......................................................................... 7 4.2 MEASUREMENT EQUIPMENT USED ..................................................................................................... 7 4.3 DESCRIPTION OF TEST MODES ............................................................................................................. 8 5 FACILITIES AND ACCREDITATIONS ............................................................................................................................ 9 5.1 FACILITIES ................................................................................................................................................. 9 5.2 LABORATORY ACCREDITATIONS AND LISTINGS .............................................................................. 9 6 TEST SYSTEM UNCERTAINTY ..................................................................................................................................... 10 7 SETUP OF EQUIPMENT UNDER TEST ........................................................................................................................ 11 7.1 RADIO FREQUENCY TEST SETUP 1 ..................................................................................................... 11 7.2 RADIO FREQUENCY TEST SETUP 2 ..................................................................................................... 11 7.3 CONDUCTED EMISSION TEST SETUP ................................................................................................. 12 7.4 SUPPORT EQUIPMENT ........................................................................................................................... 13 8 TEST REQUIREMENTS .................................................................................................................................................. 14 8.1 DTS 6DB BANDWIDTH ........................................................................................................................... 14 8.2 MAXIMUM PEAK CONDUCTED OUTPUT POWER ............................................................................ 17 8.3 MAXIMUM POWER SPECTRAL DENSITY .......................................................................................... 20 8.4 UNWANTED EMISSIONS IN NON-RESTRICTED FREQUENCY BANDS ......................................... 23 8.5 RADIATED SPURIOUS EMISSION ......................................................................................................... 28 8.6 CONDUCTED EMISSIONS TEST ........................................................................................................... 44 8.7 ANTENNA APPLICATION ....................................................................................................................... 45 Report No. ES200521036W Page 3 of 46 Ver.1.0 1 TEST RESULT CERTIFICATION Applicant : Shanghai MXCHIP Information Technology Co., Ltd. Address： 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) Manufacturer : Shanghai MXCHIP Information Technology Co., Ltd. Address： 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) EUT : Embedded BLE module Model Name : EMB1082-E, EMB1082-P Trademark : MXCHIP Measurement Procedure Used: APPLICABLE STANDARDS STANDARD TEST RESULT FCC 47 CFR Part 2 , Subpart J FCC 47 CFR Part 15, Subpart C PASS The above equipment was tested by EMTEK(SHENZHEN) CO., LTD. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.10 (2013) and the energy emitted by the sample EUT tested as described in this report is in compliance with the requirements of FCC Rules Part 2 and Part 15.247 The test results of this report relate only to the tested sample identified in this report Date of Test : May 25, 2020 to June 24, 2020 Prepared by : Sevin Li/Editor Reviewer : Joe Xia/Supervisor Approve & Authorized Signer : Lisa Wang/Manager Report No. ES200521036W Page 4 of 46 Ver.1.0 Modified History Version Report No. Revision Date Summary Ver.1.0 ES200521036W / Original Report Report No. ES200521036W Page 5 of 46 Ver.1.0 2 EUT TECHNICAL DESCRIPTION Product Embedded BLE module Model Number EMB1082-E, EMB1082-P Two models are identical in circuitry and electrical, mechanical and physical construction; the only difference is EMB1082-P model with PCB antenna; EMB1082-E model with IPEX antenna connector Device Type Bluetooth 5.0 (BLE single mode) Modulation: GFSK Operating Frequency Range: 2402-2480MHz Number of Channels: 40 Channels for Bluetooth DTS Transmit Power Max: 7.17dB…

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Test Setup Radiation Emission