Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
(ShanghaiMXCHIPInformationTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:04-23-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:P53-EMC6266 ShanghaiMXCHIPInformationTechnologyCo.,Ltd.certifiesthattheequipmentforwhichauthorization issoughtisnot“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuantto section2.903oftheFCCrules. ShanghaiMXCHIPInformationTechnologyCo.,Ltd.certifiesthattheequipmentforwhichauthorization issoughtdoesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab, Inc.oranyofitssuccessorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(or anyofitssuccessorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB 986446D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, XuWei/Productdepartmentmanager ShanghaiMXCHIPInformationTechnologyCo.,Ltd. (ShanghaiMXCHIPInformationTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:04-23-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:P53-EMC6266 ShanghaiMXCHIPInformationTechnologyCo.,Ltd.certifiesthat,asofthedateofthefilingofthe application,theapplicantisnotidentifiedontheCoveredList(asaspecificallynamedentityoranyofits subsidiariesoraffiliates)asanentityproducing“covered”equipment. Sincerely, XuWei/Productdepartmentmanager ShanghaiMXCHIPInformationTechnologyCo.,Ltd.
Shanghai MXCHIP Information Technology Co., Ltd. U.S. Agent Designation for Service of Process - Certification Attestation Letter 23/04/2026 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Ref: Attestation Statements Part 2.911(d)(7) Filing FCC ID: P53-EMC6266 Applicant FRN: 0021953211 Shanghai MXCHIP Information Technology Co., Ltd. certifies that, as of the date of the filing of the application, Global Product Services and Consultation LLC is our designated U.S. agent for service of process for the above referenced FCC ID. Shanghai MXCHIP Information Technology Co., Ltd. accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. Global Product Services and Consultation LLC accepts, as of the date of the filing of the application, the obligation of the designated U.S. agent for service of process for the above referenced FCC ID. Designated U.S. Agent Information: Company Name: Global Product Services and Consultation LLC FCC Registration Number (FRN): 0033406703 Physical U.S. Company Address: 328 W Palm Ave. Monrovia, CA91016 Contact Person: Michael Chan Cell Phone : 626-366-4358 Agent Email Address: [email protected] Sincerely, Company: Shanghai MXCHIP Information Technology Co., Ltd. Designated Agent: Global Product Services and Consultation LLC Company Representative: Xu Wei Designated Agent Representative: Michael Chan Title: Product department manager Signature: Title: Technical Director Signature: Date : 04/23/2026 SC : 6040818
(ShanghaiMXCHIPInformationTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision ConfidentialityRequestregardingapplicationforcertificationof FCCID:P53-EMC6266 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestconfidential treatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitTypeFileName Blockdiagram, Schematic, OperationalDescription Blockdiagram.pdf, Schematic.pdf, OperationalDescription.pdf Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthis applicationandallaccompanyingdocumentationwillnotbemadebeforethedateoftheGrant forthisapplication. PursuanttoDA04-1705June15,2004oftheCommission’spublicnotice,wealsorequest temporaryconfidentialtreatmentofinformationaccompanyingthisapplicationasoutlinedbelow: Short-termconfidentialityrequested:180days ExhibitTypeFileName ExternalPhotos, Internalphotos, Testsetupphotos, UserManual ExternalPhotos.pdf, Internalphotos.pdf, Testsetupphotos.pdf, UserManual.pdf Sincerely, XuWei/Productdepartmentmanager2026.04.23 ShanghaiMXCHIPInformationTechnologyCo.,Ltd.
ShanghaiMXCHIPInformationTechnologyCo.,Ltd. MODULARAPPROVALLETTER FCCID:P53-EMC6266 ModularApprovalRequirementYesNo (i)Theradioelementsofthemodulartransmitter musthavetheirownshielding.Thephysicalcrystal andtuningcapacitorsmaybelocatedexternaltothe shieldedradioelements. YES Themodular transmitter haveitsownRF shielding (ii)Themodulartransmittermusthavebuffered modulation/datainputs(ifsuchinputsareprovided) toensurethatthemodulewillcomplywithpart 15requirementsunderconditionsofexcessivedata ratesorover-modulation. YES Themodular accordwithPart 15requirements (iii)Themodulartransmittermusthaveitsownpower supplyregulation. YES ThemodularIt hasitsown powersupply regulation (iv)Themodulartransmittermustcomplywiththe antennaandtransmissionsystemrequirementsof§§ 15.203,15.204(b)and15.204(c).Theantennamust eitherbepermanentlyattachedoremploya‘‘unique’’ antennacoupler(atallconnectionsbetween themoduleandtheantenna,includingthecable).The ‘‘professionalinstallation’’provisionof§15.203isnot applicabletomodulesbutcanapplytolimited modular approvalsunderparagraph(b)ofthissection. YES Themodular accordwiththe antenna requirementsof Section15.203 and 15.204(b)(c) (v)Themodulartransmittermustbetestedina stand-aloneconfiguration YES (vi)Themodulartransmittermustbeequippedwith eitherapermanentlyaffixedlabelormustbecapable ofelectronicallydisplayingitsFCCidentification number. YES Themodular haveone permanently affixedlabel (vii)Themodulartransmittermustcomplywithany specificrulesoroperatingrequirementsthat ordinarilyapplytoacompletetransmitterandthe manufacturermustprovideadequateinstructions alongwiththemoduletoexplainanysuch requirements.Acopyoftheseinstructionsmust beincludedintheapplicationfor equipmentauthorization. YES Themodular transmitter accordwithany specificruleor operating requirements ShanghaiMXCHIPInformationTechnologyCo.,Ltd. (viii)Themodulartransmittermustcomplywithany applicableRFexposurerequirementsinitsfinal configuration. YES Themodular transmitter accordRF exposure requirements Thelettermustbeontheapplicant’sletterheadandsignedbythegranteecode contact. Regards, Signature: XuWei/Productdepartmentmanager ShanghaiMXCHIPInformationTechnologyCo.,Ltd.
(ShanghaiMXCHIPInformationTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Date:April23,2026 SUBJECT:FCCApplicationforFCCID:P53-EMC6266 ToWhomItMayConcern: We,theundersigned,herebyauthorizeTonyWeiatEMTEK(NINGBO)CO.,LTD.onour behalf,toapplytotheFederalCommunicationsCommissiononourequipment.Anyand allactscarriedoutbyEMTEK(NINGBO)CO.,LTD.onourbehalfshallhavethesame effectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,the applicant,arenotsubjecttoadenialoffederalbenefitspursuanttoSection5301ofthe Anti-DrugActof1988,21USC853a,andnopartytotheapplicationissubjecttoadenial offederalbenefitspursuanttothatsection. Regards, XuWei/Productdepartmentmanager ShanghaiMXCHIPInformationTechnologyCo.,Ltd.
FCCID:P53-EMC6266 RFEXPOSUREEVALUATION AccordingtoFCC1.1310:Thecriterialistedinthefollowingtableshallbeusedtoevaluatethe environmentimpactofhumanexposuretoradiofrequency(RF)Radiationasspecifiedin §1.1307(b) LimitsforMaximumPermissibleExposure(MPE) Frequency Range(MHz) ElectricField Strength(V/m) MagneticField Strength(A/m) Power Density(mW/cm 2 ) AverageTime (A)LimitsforOccupational/ControlExposures 300-1500----F/3006 1500-100000----56 (B)LimitsforGeneralPopulation/UncontrolExposures 300-1500----F/15006 1500-100000----130 11.1Friistransmissionformula:Pd=(Pout*G)\(4*pi*R 2 ) Where Pd=PowerdensityinmW/cm 2 Pout=outputpowertoantennainmW G=Numericgainoftheantennarelativetoisotropicantenna Pi=3.1416 R=distancebetweenobservationpointandcenteroftheradiatorincm PdthelimitofMPE,1mW/cm 2 .Ifweknowthemaximumgainoftheantennaandtotalpowerinput totheantenna,throughthecalculation,wewillknowthedistancewheretheMPElimitisreached. mW=10^(dBm/10) 11.2MeasurementResult Antennagain:2dBi; R=20cm BLE OperationFrequency:2402MHz-2480MHz; Channel Freq. (MHz) modulation Measured power (dBm) Tune-up power (dBm) Max tune-up power (dBm) Antenna Gain Numeric Evaluationresult (mW/cm2) Powerdensity Limits (mW/cm2) 2402 GFSK/1Mbps 6.14 6.00±17.0020.0015802621 2440 5.77 5.00±16.0020.0012552471 2480 5.04 5.00±16.0020.0012552471 2402 GFSK/2Mbps 6.20 6.00±17.0020.0015802621 2440 5.88 5.00±16.0020.0012552471 2480 5.80 5.00±16.0020.0012552471 WIFI OperationFrequency:2412MHz-2462MHz; Channel Freq. (MHz) modulation Measured power (dBm) Tune-up power (dBm) Max tune-up power (dBm) Antenna Gain Numeric Evaluationresult (mW/cm2) Powerdensity Limits (mW/cm2) 2412 802.11b 15.3115.00±116.002 0.012552468 1 243715.1315.00±116.002 0.012552468 1 246214.7914.00±115.002 0.009970780 1 2412 802.11g 16.9316.00±117.002 0.015802621 1 243716.7616.00±117.002 0.015802621 1 246216.4916.00±117.002 0.015802621 1 2412 802.11n20 17.8117.00±118.002 0.019894321 1 243717.3117.00±118.002 0.019894321 1 246216.9316.00±117.002 0.015802621 1 2422 802.11n40 17.0917.00±118.002 0.019894321 1 243717.0317.00±118.002 0.019894321 1 245216.8316.00±117.002 0.015802621 1 2412 802.11ax20 16.5216.00±117.002 0.015802621 1 243716.4916.00±117.002 0.015802621 1 246216.2116.00±117.002 0.015802621 1 2422 802.11ax40 15.9215.00±116.002 0.012552468 1 243716.5116.00±117.002 0.015802621 1 245216.2516.00±117.002 0.015802621 1 ***EndofReport***
1 / 3 Antenna RF Report Model Name EMC6266-E HW Solution IOT WLAN (802.11) Module BK7236 FW Version 0000.0000.A001 Report No. MXCHIP-EMC6266-E RF Test_001 Manufacture and Applicant Shanghai MXCHIP Information Technology Co., Ltd. Test Laboratory Address 9th Floor, No.5, Lane2145, Jinsha Jiang Road, Putuo District, Shanghai. MXCHIP RF Testing Laboratory Tester Reviewer Date 2026.03.06. 2 / 3 1.Test Environment Setup 2.Test Equipment Equipment Model Manufacture Vector Network Analyzer E5071C KEYSIGHT Comprehensive Test Instrument RayZone-5000 GTS 3.Antenna Efficient and Gain 3 / 3 5. Antenna Radiation 2450MHz 6. Antenna Type Antenna Type: Copper tube antenna Antenna Frequency: 2.4GHz Antenna Dimension: As shown in following figure Antenna Manufacturer: ZHONGSHAN B&T TECHNOLOGY Co,.Ltd Antenna Manufacturer Address: 3rd Floor, Building A, Eastern Industrial Park, Nanlang Town, Zhongshan City, Guangdong Province, China The applicant agrees that this antenna photo will not be kept confidential.
ReportNo.ENB2603170010W00301RPage1of53Ver.1.0 TESTREPORT ProductName:EmbeddedWi-Fi/BLEModule ModelNumber:EMC6266-E FCCID:P53-EMC6266 Preparedfor:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address:9F,BuildingB,Lane2145,JinshajiangRoad,Putuo District,Shanghai,China(200333) Preparedby:EMTEK(NINGBO)CO.,LTD. Address:No.8,Building8,Lane216,QingyiRoad,Ningbo High-TechZone,Ningbo,Zhejiang,China Tel:+86-574-27907998 Fax:+86-574-27721538 ReportNumber:ENB2603170010W00301R Date(s)ofTests:March17,2026toApril19,2026 Dateofissue:April20,2026 $ 二维码 $ ReportNo.ENB2603170010W00301RPage2of53Ver.1.0 TableofContents 1TESTRESULTCERTIFICATION......................................................................................................................3 2EUTTECHNICALDESCRIPTION....................................................................................................................5 3SUMMARYOFTESTRESULT...........................................................................................................................6 4TESTMETHODOLOGY......................................................................................................................................7 4.1GENERALDESCRIPTIONOFAPPLIEDSTANDARDS.............................................................................7 4.2MEASUREMENTEQUIPMENTUSED.........................................................................................................7 4.3DESCRIPTIONOFTESTMODES.................................................................................................................9 5FACILITIESANDACCREDITATIONS...........................................................................................................10 5.1FACILITIES....................................................................................................................................................10 5.2EQUIPMENT..................................................................................................................................................10 5.3LABORATORYACCREDITATIONSANDLISTINGS...............................................................................10 6TESTSYSTEMUNCERTAINTY......................................................................................................................11 7SETUPOFEQUIPMENTUNDERTEST.........................................................................................................12 7.1RADIOFREQUENCYTESTSETUP1.........................................................................................................12 7.2RADIOFREQUENCYTESTSETUP2.........................................................................................................12 7.3CONDUCTEDEMISSIONTESTSETUP.....................................................................................................15 7.4BLOCKDIAGRAMCONFIGURATIONOFTESTSYSTEM....................................................................16 7.5SUPPORTEQUIPMENT...............................................................................................................................16 8TESTREQUIREMENTS....................................................................................................................................17 8.1DTS6DBBANDWIDTH...............................................................................................................................17 8.2DTS99%BANDWIDTH................................................................................................................................20 8.3MAXIMUMPEAKCONDUCTEDOUTPUTPOWER...............................................................................23 8.4MAXIMUMPOWERSPECTRALDENSITY..............................................................................................26 8.5UNWANTEDEMISSIONSINNON-RESTRICTEDFREQUENCYBANDS............................................29 8.6RADIATEDSPURIOUSEMISSION.............................................................................................................39 8.7CONDUCTEDEMISSIONSTEST...............................................................................................................52 8.8ANTENNAAPPLICATION...........................................................................................................................53 ReportNo.ENB2603170010W00301RPage3of53Ver.1.0 1TESTRESULTCERTIFICATION Applicant:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address: 9F,BuildingB,Lane2145,JinshajiangRoad,PutuoDistrict,Shanghai,China (200333) Manufacturer:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address: 9F,BuildingB,Lane2145,JinshajiangRoad,PutuoDistrict,Shanghai,China (200333) EUT:EmbeddedWi-Fi/BLEModule ModelName:EMC6266-E Trademark: MeasurementProcedureUsed: APPLICABLESTANDARDS STANDARDTESTRESULT FCC47CFRPart2,SubpartJ FCC47CFRPart15,SubpartC PASS ICRSS-GEN,Issue5(04-2018)+A1(03-2019)+A2(02-2021) ICRSS-247Issue4(07-2025) PASS TheaboveequipmentwastestedbyEMTEK(NINGBO)CO.,LTD.Thetestdata,dataevaluation,test procedures,andequipmentconfigurationsshowninthisreportweremadeinaccordancewiththe proceduresgiveninANSIC63.10(2020)andtheenergyemittedbythesampleEUTtestedasdescribed inthisreportisincompliancewiththerequirementsofFCCRulesPart2,Part15.247,ICRSS-247Issue 4andICRSS-GEN,Issue5. Thetestresultsofthisreportrelateonlytothetestedsampleidentifiedinthisreport. DateofTest:March17,2026toApril19,2026 Preparedby: WKLuo/Engineer Reviewer: JuneGao/Supervisor Approved&AuthorizedSigner: TonyWei/Manager ReportNo.ENB2603170010W00301RPage4of53Ver.1.0 ModifiedHistory VersionReportNo.RevisionDateSummary /ENB2603170010W00301R/OriginalReport ReportNo.ENB2603170010W00301RPage5of53Ver.1.0 2EUTTECHNICALDESCRIPTION Characteristics Description Product: EmbeddedWi-Fi/BLEModule ModelNumber: EMC6266-E TestSampleS/N:ENB2603170010W003-1-1 VariantNumber:N/A DeviceType: BluetoothV5.1 DataRate: 1Mbps/2Mbps Modulation:GFSK OperatingFrequencyRange:2402-2480MHz NumberofChannels:40Channels AntennaType: DriverAntenna Antenn…
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ReportNo.ENB2603170010W00302RPage1of90Ver.1.0 TESTREPORT ProductName:EmbeddedWi-Fi/BLEModule ModelNumber:EMC6266-E FCCID:P53-EMC6266 Preparedfor:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address:9F,BuildingB,Lane2145,JinshajiangRoad,Putuo District,Shanghai,China(200333) Preparedby:EMTEK(NINGBO)CO.,LTD. Address:No.8,Building8,Lane216,QingyiRoad,Ningbo High-TechZone,Ningbo,Zhejiang,China Tel:+86-574-27907998 Fax:+86-574-27721538 ReportNumber:ENB2603170010W00302R Date(s)ofTests:March17,2026toApril19,2026 Dateofissue:April20,2026 $二维码$ ReportNo.ENB2603170010W00302RPage2of90Ver.1.0 TABLEOFCONTENTS 1TESTRESULTCERTIFICATION........................................................................................................................3 2EUTTECHNICALDESCRIPTION......................................................................................................................5 3SUMMARYOFTESTRESULT.............................................................................................................................6 4TESTMETHODOLOGY........................................................................................................................................7 4.1GENERALDESCRIPTIONOFAPPLIEDSTANDARDS...............................................................................7 4.2MEASUREMENTEQUIPMENTUSED...........................................................................................................7 4.3DESCRIPTIONOFTESTMODES...................................................................................................................9 5FACILITIESANDACCREDITATIONS.............................................................................................................10 5.1FACILITIES......................................................................................................................................................10 5.2EQUIPMENT...................................................................................................................................................10 5.3LABORATORYACCREDITATIONSANDLISTINGS.................................................................................10 6TESTSYSTEMUNCERTAINTY........................................................................................................................11 7SETUPOFEQUIPMENTUNDERTEST...........................................................................................................12 7.1RADIOFREQUENCYTESTSETUP1...........................................................................................................12 7.2RADIOFREQUENCYTESTSETUP2...........................................................................................................12 7.3CONDUCTEDEMISSIONTESTSETUP......................................................................................................15 7.4BLOCKDIAGRAMCONFIGURATIONOFTESTSYSTEM......................................................................16 7.5SUPPORTEQUIPMENT.................................................................................................................................16 8TESTREQUIREMENTS......................................................................................................................................17 8.1DTS6DBBANDWIDTH.................................................................................................................................17 8.2DTS99%BANDWIDTH..................................................................................................................................25 8.3MAXIMUMPEAKCONDUCTEDOUTPUTPOWER.................................................................................32 8.4MAXIMUMPOWERSPECTRALDENSITY................................................................................................34 8.5UNWANTEDEMISSIONSINNON-RESTRICTEDFREQUENCYBANDS..............................................41 8.6RADIATEDSPURIOUSEMISSION..............................................................................................................66 8.7CONDUCTEDEMISSIONTEST....................................................................................................................89 8.8ANTENNAAPPLICATION.............................................................................................................................90 ReportNo.ENB2603170010W00302RPage3of90Ver.1.0 1TESTRESULTCERTIFICATION Applicant:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address: 9F,BuildingB,Lane2145,JinshajiangRoad,PutuoDistrict,Shanghai,China (200333) Manufacturer:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Address: 9F,BuildingB,Lane2145,JinshajiangRoad,PutuoDistrict,Shanghai,China (200333) EUT:EmbeddedWi-Fi/BLEModule ModelName:EMC6266-E Trademark: MeasurementProcedureUsed: APPLICABLESTANDARDS STANDARDTESTRESULT FCC47CFRPart2,SubpartJ FCC47CFRPart15,SubpartC PASS ICRSS-GEN,Issue5(04-2018)+A1(03-2019)+A2(02-2021) ICRSS-247Issue4(07-2025) PASS TheaboveequipmentwastestedbyEMTEK(NINGBO)CO.,LTD.Thetestdata,dataevaluation,test procedures,andequipmentconfigurationsshowninthisreportweremadeinaccordancewiththe proceduresgiveninANSIC63.10(2020)andtheenergyemittedbythesampleEUTtestedasdescribed inthisreportisincompliancewiththerequirementsofFCCRulesPart2,Part15.247,ICRSS-247Issue 4andICRSS-GEN,Issue5. Thetestresultsofthisreportrelateonlytothetestedsampleidentifiedinthisreport. DateofTest:March17,2026toApril19,2026 Preparedby: WKLuo/Engineer Reviewer: JuneGao/Supervisor Approved&AuthorizedSigner: TonyWei/Manager ReportNo.ENB2603170010W00302RPage4of90Ver.1.0 ModifiedHistory VersionReportNo.RevisionDateSummary /ENB2603170010W00302R/OriginalReport ReportNo.ENB2603170010W00302RPage5of90Ver.1.0 2EUTTECHNICALDESCRIPTION Characteristics Description Product: EmbeddedWi-Fi/BLEModule ModelNumber: EMC6266-E TestSampleS/N:ENB2603170010W003-1-1 VariantNumber:N/A IEEE802.11WLAN ModeSupported: 802.11b 802.11g 802.11n(20MHzchannelbandwidth) 802.11n(40MHzchannelbandwidth) 802…
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328 W Palm Ave · Monrovia, California, 91016 · United States
| # | Rule Parts | Frequency Range | Power Output |
|---|---|---|---|
| 1 | 15C | 2.40 GHz - 2.48 GHz | 6.61 mW |
| 2 | 15C | 2.41 GHz - 2.46 GHz | 280.54 mW |

BLE Module
Equipment Class
DTS - Digital Transmission SystemEmbedded Wi-Fi/BLE Module
Equipment Class
DTS - Digital Transmission SystemEmbedded Wi-Fi/BLE Module
Equipment Class
DTS - Digital Transmission System
Embedded Wi-Fi/BLE Module
Equipment Class
DTS - Digital Transmission System
2.4GHz Wi-Fi/BLE Module
Equipment Class
DTS - Digital Transmission System