
Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
Shanghai MXCHIP Information Technology Co., Ltd. All rights reserved. Abstract ⚫ Input: 3.0V~3.6V ⚫ Operating temperature:-40°C to +105°C ⚫ Dual Processor(Arm Cortex-M55 and RISC-V) ▪ 32-bit processor ▪ Main frequency up to 240MHz. ▪ UART supporting download and debugging. ⚫ Memory ▪ 512KB SRAM ▪ 64KB ROM ▪ 8MB XIP Flash ▪ 8MB external Flash ⚫ Wi-Fi ▪ IEEE 802.11 b/g/n/ax 1T1R . ▪ Support 20/40MHz Channel bandwidth, 2.4GHz single frequency. ▪ Transmitting power up to+18dBm, receiving sensitivity - 99dBm. ▪ Support working mode:STA、AP、Direct, Concurrency AP+STA. ▪ Support WPA/WPA2/WPA3. ▪ Integrated BT/WLAN coexistence(PTA). ⚫ Bluetooth ▪ Support BLE 5.2 Standard. ▪ Support Bluetooth scattering network ▪ Support SIG Mesh network communication mode that supports flooding and scattering methods. ▪ Support AOA and AOD technology ▪ Wi-Fi and BLE share the same PA and antenna, time-sharing multiplexing. ▪ Support Bluetooth slave mode, which can be used for Bluetooth distribution network. ⚫ Rich Peripherals ▪ 21 x GPIO ▪ 1 x SPI ▪ 3 x UART ⚫ Interface and Size ▪ External antenna with IPEX connector. ▪ 18mm x 19.2mm x 3.2mm, stamp hole ⚫ Rich Supporting Software ▪ Support MXOS operating systems. ▪ Provide access SDK and AT instructions for major cloud platforms. ▪ Provide mass-produced firmware for various typical applications. ⚫ Typical Application ▪ Smart appliances ▪ Intelligent electrician ▪ Industrial automation ⚫ Order code Code Direction EMC6083-EZJ6 External Antenna with IPEX connector -40°C~105°C Datasheet EMC6083 Wi-Fi/BLE IoT Module Built-in Wi-Fi 6 Combo SoC 2.4G Hz IEEE 802.11 b/g/n/ax, BLE 5.2, ultra-high integration, rich peripherals Version:0.5 Date:2025-05-23 Number:DS0232EN EMC6083 Series Wi-Fi/BLE IoT Module Datasheet Shanghai MXCHIP Information Technology Co., Ltd. All rights reserved. Order Code Example EMC 6 08 3 -E Z L 7 -xxx Product Series EMC = Wi-Fi/BLE Module Product Type 6 = Wi-Fi 6 Typical Targe Application and Function 08 = IOT Application 8 series Shape size, enhancement function 3 = 18mm x 19.2mm x 3.2mm RF Interface P = 2.4GHz On-Board PCB Antenna E = 2.4GHz External Antenna IPEX Connector PSRAM Capacity(optional) Z=Without PSRAM J=4Mbyte PSRAM Flash Capacity L= 16M byte Flash Temperature Range 7 = Industrial Temperature Range, -40°C~105°C Optional TR = Reel packaging (pallet is used by default) For a list of all relevant features (such as packaging, minimum order quantity, etc.) and other information, please contact the nearest MXCHIP sales point and agent. Parts Order Code Direction MXKIT-Base Development board motherboard, applicable to all EMC6083 modules. MXKIT-Core-6083 The development board core board for EMC6083, including the EMC6083-P module. Used with MXKIT-Base. FX-6083 EMC6083 production fixture, including accompanying plate: MXKIT-Base, MXKIT-Core- 6083. EMC6083 Series Wi-Fi/BLE IoT Module Datasheet Shanghai MXCHIP Information Technology Co., Ltd. All rights reserved. Version Update Date Version Update 2024-01-15 0.1 Initial Version 2024-01-30 0.2 Adjust processor content 2024-04-15 0.3 Add reuse function of some IO pins Update RF parameters Update the final assembly dimension drawing 2024-04-24 0.4 Adjust the final assembly dimension drawing 2024-05-23 0.5 Optimize the annotation data of the final assembly dimension drawing Copyright Notice Without permission, it is prohibited to use or copy all or any part of this manual, especially for trademarks, model naming, part numbers and drawings. Datasheet lower than 1.0 are for reference only and may be modified before mass production. EMC6083 Series Wi-Fi/BLE IoT Module Datasheet Shanghai MXCHIP Information Technology Co., Ltd. All rights reserved. 1 Catalog Introduction ............................................................................................................................................................................................ 3 Pin Definition .......................................................................................................................................................................................... 4 Pin Arrangement .................................................................................................................................................................................................................. 4 Pin Definition ......................................................................................................................................................................................................................... 4 Electrical Parameters............................................................................................................................................................................ 7 Operation Voltage and Current ...................................................................................................................................................................................... 7 General I/O Interface .......................................................................................................................................................................................................... 8 Typical Application Power ................................................................................................................................................................................................. 8 Temperature ........................................................................................................................................................................................................................... 8 Electrostatic discharge ....................................................................................................................................................................................................... 9 RF Parameter ....................................................................................…
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Rev1/26/2023 ShanghaiMXCHIPInformationTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:07-23-2024 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:P53-EMC6083 [ShanghaiMXCHIPInformationTechnologyCo.,Ltd.](“theapplicant”)certifiesthattheequipmentfor whichauthorizationissoughtisnot“covered”equipmentprohibitedfromreceivinganequipment authorizationpursuanttosection2.903oftheFCCrules. Sincerely, Signature Name:WeiXu Title:Manager Company:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Addressandcontactinformation:9thFloor,No.5,Lane2145JinshaJiangRoad,PutuoDistrict,ShangHai, China Rev1/26/2023 ShanghaiMXCHIPInformationTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:07-23-2024 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:P53-EMC6083 [ShanghaiMXCHIPInformationTechnologyCo.,Ltd.](“theapplicant”)certifiesthat,asofthedateof thefilingoftheapplication,theapplicantisnotidentifiedontheCoveredList(asaspecificallynamed entityoranyofitssubsidiariesoraffiliates)asanentityproducing“covered” equipment. Sincerely, Signature Name:WeiXu Title:Manager Company:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Addressandcontactinformation:9thFloor,No.5,Lane2145JinshaJiangRoad,PutuoDistrict,ShangHai, China
Rev11/20/07 ShanghaiMXCHIPInformationTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision ConfidentialityRequestregardingapplicationforcertificationofFCCID:FCCID:P53- EMC6083 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestconfidential treatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitTypeFileName BlockBlock Schematicssch OperationalDescription BOM OperationDescription BOM Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthis applicationandallaccompanyingdocumentationwillnotbemadebeforethedateoftheGrant forthisapplication. Sincerely, Signature Name:WeiXu Title:Manager Company:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Addressandcontactinformation:9thFloor,BuildingB,Lane2145,JinshaJiangRoad,Putuo District,Shanghai,China
ShanghaiMXCHIPInformationTechnologyCo.,Ltd OperatingProceduresForm–FCCModularPage1of1 MODULARAPPROVALLETTER 2024/07/23 (Productname)FCCID:P53-EMC6083,isseekingFCCAuthorizationasa SingleModulartransmitter/SingleLimitedModularApproval(Pleasecheckone) TheEUTmeetstherequirementsfor SingleModularapproval/SingleLimitedModularApproval(pleasecheckone) asdetailedinKDB996369.Compliancetoeachoftherequirementsisdescribedbelow: Requirementper15.212andKDB996369D01ExplanationfromGrantee (donotwriteyes/no,butexplainwhyproduct complies/howitisachieved) Theradioelementsmusthavetheradiofrequencycircuitry shielded.Physicalcomponentsandtuningcapacitor(s)maybe locatedexternaltotheshield,butmustbeonthemodule assembly. Thismodulehasacompletemetalshield coveringtheentirecircuit,exceptforthe antenna. Themodulemusthavebufferedmodulation/datainputstoensure thatthedevicewillcomplywithPart15requirementswithanytype ofinputsignal. IthaslargeFlashandram,andacomplete modemtoensurethatthedevicewillcomply withPart15requirementswithanytypeof inputsignal. Themodulemustcontainpowersupplyregulationonthemodule. ItintegratedDCDC(BUCK)andseveral LDOsinternally. Themodulemustcontainapermanentlyattachedantenna,or containauniqueantennaconnector,andbemarketedand operatedonlywithspecificantenna(s),per§§15.203,15.204(b), 15.204(c),15.212(a),2.929(b). ThemodulecontainsainvertedPCBantenna ontheboard. Themodulemustdemonstratecomplianceinastand-alone configuration. ItcontainsRFPA/LNAandtransceiver,and ARMCortexM0MCUinside;Itcanrealize functionsstandalone. ThemodulemustbelabeledwithitspermanentlyaffixedFCCID label,oruseanelectronicdisplay(seeKDBPublication784748). Alabelwillbeattachedtothemetalshieldof themodule. Themodulemustcomplywithallspecificrulesapplicabletothe transmitter,includingalltheconditionsprovidedintheintegration instructionsbythegrantee. Thismodulehasgooddesignanduniform quality,itcanmeettestrequirements. ThemodulemustcomplywithRFexposurerequirements ItcomplieswiththeBluetoothLowEnergyand 802.11b/g/n/axspecification,andithasbeen testedandverified. Client’ssignature: Client’sname&title: WeiXu/ ManagerContactinformation/address:9thFloor,No.5,Lane2145 JinshaJiangRoad,PutuoDistrict,ShangHai,China
ShanghaiMXCHIPInformation TechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Date:2024.07.23 FCCID:P53-EMC6083 ToWhomItMayConcern: We,theundersigned,herebyauthorizeWiminXieatGRGMetrology&TestGroup Co.,Ltd.onourbehalf,toapplytotheFederalCommunicationsCommissiononour equipment.AnyandallactscarriedoutbyGRGMetrology&TestGroupCo.,Ltd.onour behalfshallhavethesameeffectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,the applicant,arenotsubjecttoadenialoffederalbenefitspursuanttoSection5301ofthe Anti-DrugActof1988,21USC853a,andnopartytotheapplicationissubjecttoadenial offederalbenefitspursuanttothatsection. Regards, Signature Name:WeiXu Title:Manager Company:ShanghaiMXCHIPInformationTechnologyCo.,Ltd. Addressandcontactinformation:9thFloor,No.5,Lane2145JinshaJiangRoad, PutuoDistrict,ShangHai,China(200333)Shanghai,China
Report No.: S20240603102301-A1 Page Number: 1 of 3 Attachment 1:External Photo of EUT Photo 1: The whole product view Photo 2: The whole product view Report No.: S20240603102301-A1 Page Number: 2 of 3 Photo 3: The whole product view Photo 4: The whole product view Report No.: S20240603102301-A1 Page Number: 3 of 3 Photo 5: The whole product view Photo 6: The whole product view