P53-EMW3076Embedded WiFi Module

Copyright of Shanghai MXCHIP Information Technology Co., Ltd. Abstract ⚫ Input Voltage：2.7V~3.6V ⚫ Processor：ARM Cortex-M4 Processor Core ▪ Cortex-M4F core，up to 160MHz ▪ 26MHz clock input ▪ SWD/JTAG simulation debugger interface ⚫ Memory ▪ 256K bytes SRAM ▪ 24K bytes Boot ROM ▪ 512 bytes OTP memory area ▪ 2M bytes XIP flash ⚫ Wi-Fi ▪ IEEE 802.11 b/g/n 1T1R 2.4GHz Single Frequency ▪ Built-in power amplifier(PA) with self- calibration ▪ Support 802.11e QoS enhancement (WMM) ▪ Support WPA/WPA2 PSK，Open/WEP/ TKIP/CCMP ▪ Support IEEE Power Save mode ⚫ Rich Peripherals ▪ 16 x GPIO ▪ 3 x SPI、2 x I2C、8 x PWM、8 x Timer ▪ 3 x UART，Support hardware flow control ▪ Up to 8 10-bit ADC channels ▪ RTC ⚫ Operating Temperature：-40°C to +125°C ⚫ Antenna：On-Board PCB Antenna，or IPEX Connector ⚫ Application Functions ▪ Support AliOS and MXOS operating system ▪ Provide major cloud platforms access SDK ▪ Mass production firmware for typical applications such as smart appliances, lighting, and sockets ⚫ Interface and Dimension ▪ EMW3076: 17.8mm x 20mm, stamp hole or pin ✓ Support external antenna ✓ Typical applications: smart home appliances, IoT data terminals Datasheet EMW3076 Wi-Fi Module Built-in ARM Cortex-M4F Wi-Fi MCU 2.4G Hz IEEE 802.11 b/g/n, ultra-high integration, rich peripherals Version：1.0 Date：2020-01-08 Number：DS0157EN Copyright of Shanghai MXCHIP Information Technology Co., Ltd. Order Code For example, EMW 3 07 0 -P I 6 Product Series EMW=IoT Wi-Fi Module Product Type 3=Welding type wireless module Typical target applications and features 07=IOT Application 7 Series Dimensions, enhancements 0=18mm x 33mm, 2 x 6pin 2.0 Spacing double row stamp hole + 9 pin 2.0 Spacing stamp hole or pin 1=13.8mm x 15mm, 5pin + 6 pin 2.0 Spacing golden finger 2=16mm x 24mm, 2 x 8 pin 2.0 Spacing double row stamp hole 3=15mm x 17.3mm, 7 pin + 7 pin 2.0 Spacing stamp hole or golden finger 5=8.5mm x 13.5mm, 2 pin + 3 pin 2.0 Spacing golden finger 6=18mm x 20.2mm, 5 pin + 6 pin 2.0 Spacing golden finger RF Interface P=2.4GHz On-Board PCB Antenna E=2.4GHz External Antenna IPEX Connector Flash Capacity I=2M bytes Flash Memory J=4M bytes Flash Memory Operating Temperature 6=Industrial Temperature Range, -40°C~85°C 7= Industrial Temperature Range，-40°C~105°C 8= Industrial Temperature Range，-40°C~12°C Optional Model Order Code Description EMW3076-PI6 18mm x 20.2mm, Golden finger interface, on-board PCB, 2M bytes flash memory , -40°C~85°C EMW3076 Series Wireless Module Data Manual Copyright of Shanghai MXCHIP Information Technology Co., Ltd. Parts Version Update Instructions Date Version Update Contents 2020-01-08 1.0 Initial Document Copyright Notice Without permission, it is prohibited to use or copy all or any part of this manual, especially for trademarks, model naming, part numbers and drawings. Order Code Description MXKIT-Base Development board for all EMW3076 modules MXKIT-Core-3076 The development board core board for the EMW3076, including the EMW3076-PI6 module. Used with MXKIT-Base FX-3076 EMW3076 production fixture with accompanying test board：MXKIT-Base, MXKIT- Core-3076 MXFlasher Offline writer for burning chips such as MOC108, MOC108A, MX1270 EMW3076 Series Wireless Module Data Manual Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 1 Catalog Abstract ............................................................................................................................................................................... 1 Introduction ............................................................................................................................................................... 3 Pin Definition ............................................................................................................................................................. 4 Pin Arrangement .........................................................................................................................................................................4 2.1.1. EMW3076 ................................................................................................................................................................................4 Pin Definition ................................................................................................................................................................................1 Memory Space Allocation ....................................................................................................................................... 1 Work Mode Selection ............................................................................................................................................... 2 Hardware Working Mode Selection .....................................................................................................................................2 Firmware Working Mode Selection ......................................................................................................................................2 Electrical Parameter .................................................................................................................................................. 4 Absolute Maximum Parameters ............................................................................................................................................4 Operating Voltage and Current .............................................................................................................................................4 Typical Application Power Consumption ............................................................................................................................4 Temperature ..................................................................................................................................................................................5 RF Parameter .................................................…

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Rev 11/20/07 Shanghai MXCHIP Information Technology Co.,Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: P53-EMW3076 Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, we hereby request confidential treatment of information accompanying this application as outlined below: Exhibit Type File Name Block Diagram, Schematics, Operational Description, Block Diagram Operation Description schematic diagram The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. Sincerely, Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

MODULAR APPROVAL LETTER FCC ID: P53-EMW3076 Modular Approval Requirement Yes No (i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. YES The modular transmitter have its own RF shielding (ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. YES The modular accord with Part 15 requirements (iii) The modular transmitter must have its own power supply regulation. YES The modular It has its own power supply regulation (iv) The modular transmitter must comply with the antenna and transmission system requirements of §§ 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a ‘‘unique’’ antenna coupler (at all connections between the module and the antenna, including the cable). The ‘‘professional installation’’ provision of § 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. YES The modular accord with the antenna requirements of Section 15.203 and 15.204(b)(c) (v) The modular transmitter must be tested in a stand-alone configuration YES (vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. YES The modular have one permanently affixed label (vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. YES The modular transmitter accord with any specific rule or operating requirements (viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES The modular transmitter accord RF exposure requirements The letter must be on the applicant’s letterhead and signed by the grantee code contact. Signature: Date: ___2020-04-03 Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

Shanghai MXCHIP Information Technology Co.,Ltd. Federal Communications Commission Authorization and Evaluation Division 1435 Oakland Mills Road Columbia, MD 21046 Date: 2020-03-30 SUBJECT: FCC Application for FCC ID: P53-EMW3076 To Whom It May Concern: We, the undersigned, hereby authorize Lisa Wang at EMTEK (SHENZHEN) CO., LTD. on our behalf, to apply to the Federal Communications Commission on our equipment. Any and all acts carried out by EMTEK (SHENZHEN) CO., LTD. on our behalf shall have the same effect as acts of our own. This is to advise that we are in full compliance with the Anti- Drug Abuse Act. We, the applicant, are not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 USC853a, and no party to the application is subject to a denial of federal benefits pursuant to that section. Regards, Xu Wei/ Product department manager Shanghai MXCHIP Information Technology Co.,Ltd.

EUT EXTERNAL PHOTOGRAPHS EUT View 1 EUT View 2 ----------------The end----------------

Label and label location

EUT INTERNAL PHOTOGRAPHS Solder Board-Component View 1 ----------------The end---------------- WIFI Ant

FCC ID : P53-EMW3076 RF EXPOSURE EVALUATION According to FCC 1.1310: The criteria listed in the following table shall be used to evaluate the environment impact of human exposure to radio frequency (RF) Radiation as specified in §1.1307(b) Limits for Maximum Permissible Exposure (MPE) Frequency Range(MHz) Electric Field Strength(V/m) Magnetic Field Strength(A/m) Power Density(mW/cm 2 ) Average Time (A) Limits for Occupational/Control Exposures 300-1500 -- -- F/300 6 1500-100000 -- -- 5 6 (B) Limits for General Population/Uncontrol Exposures 300-1500 -- -- F/1500 6 1500-100000 -- -- 1 30 11.1 Friis transmission formula: Pd= (Pout*G)\ (4*pi*R 2 ) Where Pd= Power density in mW/cm 2 Pout=output power to antenna in mW G= Numeric gain of the antenna relative to isotropic antenna Pi=3.1416 R= distance between observation point and center of the radiator in cm Pd the limit of MPE, 1mW/cm 2 ,If we know the maximum gain of the nd total power input to the antenna, through the calculation, we will know the distance where the MPE limit is reached. 11.2 Measurement Result Antenna gain: 2.0 dBi modulation Channel Freq. (MHz) Measured power (dBm) Tune-up power (dBm) Max tune-up power (dBm) Antenna Gain Numeric Evaluation result (mW/cm2 ) Power density Limits (mW/cm2 ) 11b 2412 15.59 14 to 16 16 1.58 0.0125 1 2437 16.51 15 to 17 17 1.58 0.0158 1 2462 14.58 13 to 15 15 1.58 0.0099 1 11g 2412 13.78 12 to 14 14 1.58 0.0079 1 2437 12.81 11 to 13 13 1.58 0.0063 1 2462 13.94 12 to 14 14 1.58 0.0079 1 11n HT20 2412 11.29 10 to 12 12 1.58 0.0050 1 2437 12.73 11 to 13 13 1.58 0.0063 1 2462 13.76 12 to 14 14 1.58 0.0079 1

Report No.ES190923023W Page 1 of 46 Ver.1.0 TEST REPORT Product Name ： Embedded WiFi module Model Number ： EMW3076 FCC ID ： P53-EMW3076 Prepared for : Shanghai MXCHIP Information Technology Co., Ltd. Address : 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) Prepared by : EMTEK (SHENZHEN) CO., LTD. Address : Bldg 69, Majialong Industry Zone, Nanshan District, Shenzhen, Guangdong, China Tel: (0755) 26954280 Fax: (0755) 26954282 Report Number : ES190923023W Date(s) of Tests : March 03, 2020 to March 29, 2020 Date of issue : March 30, 2020 $二维码$ Report No.ES190923023W Page 2 of 46 Ver.1.0 TABLE OF CONTENTS 1 TEST RESULT CERTIFICATION ...................................................................................................................... 3 2 EUT TECHNICAL DESCRIPTION .................................................................................................................... 4 3 SUMMARY OF TEST RESULT ........................................................................................................................... 5 4 TEST METHODOLOGY ...................................................................................................................................... 6 4.1 GENERAL DESCRIPTION OF APPLIED STANDARDS ............................................................................ 6 4.2 MEASUREMENT EQUIPMENT USED ....................................................................................................... 6 4.3 DESCRIPTION OF TEST MODES ................................................................................................................ 7 5 FACILITIES AND ACCREDITATIONS ............................................................................................................. 8 5.1 FACILITIES.................................................................................................................................................... 8 5.2 LABORATORY ACCREDITATIONS AND LISTINGS ................................................................................ 8 6 TEST SYSTEM UNCERTAINTY ........................................................................................................................ 9 7 SETUP OF EQUIPMENT UNDER TEST ......................................................................................................... 10 7.1 RADIO FREQUENCY TEST SETUP 1 ........................................................................................................ 10 7.2 RADIO FREQUENCY TEST SETUP 2 ........................................................................................................ 10 7.3 CONDUCTED EMISSION TEST SETUP .................................................................................................... 11 7.4 BLOCK DIAGRAM CONFIGURATION OF TEST SYSTEM .................................................................... 12 7.5 SUPPORT EQUIPMENT.............................................................................................................................. 12 8 TEST REQUIREMENTS .................................................................................................................................... 13 8.1 DTS (6DB) BANDWIDTH ........................................................................................................................... 13 8.2 MAXIMUM PEAK CONDUCTED OUTPUT POWER .............................................................................. 19 8.3 MAXIMUM POWER SPECTRAL DENSITY ............................................................................................. 21 8.4 UNWANTED EMISSIONS IN NON-RESTRICTED FREQUENCY BANDS ............................................ 27 8.5 RADIATED SPURIOUS EMISSION ........................................................................................................... 32 8.6 CONDUCTED EMISSIONS TEST .............................................................................................................. 44 8.7 ANTENNA APPLICATION ......................................................................................................................... 45 Report No.ES190923023W Page 3 of 46 Ver.1.0 1 TEST RESULT CERTIFICATION Applicant : Shanghai MXCHIP Information Technology Co., Ltd. Address : 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) Manufacturer : Shanghai MXCHIP Information Technology Co., Ltd. Address : 9th Floor,No.5,Lane2145 JinshaJiang Road,Putuo District, ShangHai,China (200333) EUT : Embedded WiFi module Model Name : EMW3076 Trademark : Measurement Procedure Used: APPLICABLE STANDARDS STANDARD TEST RESULT FCC 47 CFR Part 2 , Subpart J FCC 47 CFR Part 15 , Subpart C PASS The above equipment was tested by EMTEK (SHENZHEN) CO., LTD. The test data, data evaluation, test procedures, and equipment configurations shown in this report were made in accordance with the procedures given in ANSI C63.10 (2013) and the energy emitted by the sample EUT tested as described in this report is in compliance with the requirements of FCC Rules Part 2 and Part 15.247 The test results of this report relate only to the tested sample identified in this report. Date of Test : March 03, 2020 to March 29, 2020 Prepared by : Sewen Guo /Editor Reviewer : Joe Xia/Editor Approve & Authorized Signer : Lisa Wang/Manager Report No.ES190923023W Page 4 of 46 Ver.1.0 2 EUT TECHNICAL DESCRIPTION Note: for more details, please refer to the User’s manual of the EUT. Characteristics Description Product Embedded WiFi module Model Number EMW3076 IEEE 802.11 WLAN Mode Supported 802.11b 802.11g 802.11n(20MHz channel bandwidth) 802.11n(40MHz channel bandwidth) Data Rate 802.11 b:1,2,5.5,11Mbps; 802.11 g:6,9,12,18,24,36,48,54Mbps; 802.11n(HT20): up to 65Mbps; Modulation DSSS with DBPSK/DQPSK/CCK for 802.11b; OFDM with BPSK/QPSK/16QAM/64QAM for 802.11g/n; Operating Frequency Range 2412-2462MHz for 802.11b/g/n(HT20); 2422-2452MHz for 802.11n(HT40); Numb…

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TRF NO. FCC15/A Page 1 of 1 Report No.: ES190923023W Ver.1.0 TEST SETUP PHOTOGRAPHS 1.1. Photos of Radiation Emission Measurement Spurious Emission Test Setup (Below 1GHz) Spurious Emission Test Setup (Above 1GHz) ----------------The end----------------