P53-EMW3162Embedded WiFi module

1 Warning statement FCC STATEMENT 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. The EMW3162 module is designed to comply with the FCC statement. FCC ID is P53-EMW3162. The host system using EMW3162, should have label indicated FCC ID P53-EMW3162. 2 User Manual Embedded M2M Module with 802.11b/g/n 1T1R WiFi (Project Name) Embedded M2M Module with Broadcom 802.11bgn(1x1) WiFi single chip (Foxconn Part No.) T77H497.00 (Customer Part No.) EMW3162 3 Content 1. INTRODUCTION ........................................................................... 4 1.1 RF MODULE OVERVIEW ..................................................................... 4 1.2 SPECIFICATION REFERENCE .................................................................. 4 1.3 SYSTEM FUNCTIONS ........................................................................ 5 2. MECHANICAL SPECIFICATION ............................................................. 6 2.1 MECHANICAL DRAWING ...................................................................... 6 2.2 44PIN QFN PIN DEFINITION .................................................................. 7 3. ELECTRICAL SPECIFICATION .............................................................. 8 3.1 802.11B MODE ............................................................................ 8 3.2 802.11G MODE ............................................................................ 9 3.3 802.11N HT20 MODE ...................................................................... 10 4 1. Introduction Project Name: Embedded M2M Module with Broadcom 802.11bgn (1x1) WiFi. Project Number: T77H497.00. This documentation describes the engineering requirements specification of WiFi module with T77H497.00. It is a confidential document of Foxconn. 1.1 RF module Overview This M2M (Machine to Machine) module integrates 32 bit MCU and Broadcom WiFi. It provides wireless modem functionality utilizing direct sequence spread spectrum and OFDM/CCK technology. It operates in 2.4GHz ISM band, compatible with the IEEE 802.11b/g/n standard. It can implement the wireless network function on the embedded devices easily and improve the product’s competitiveness. It supports TCP/IP protocol and all of the Wi-Fi security. This module has implemented some efficient mechanisms in its software and hardware to maximize the performance. The functional block diagram is shown in Figure .1. Figure 1 Module Block Diagram 1.2 Specification reference This specification is based on additional references listed below.  IEEE Std. 802.11b  IEEE Std. 802.11g  IEEE Std. 802.11n 5 1.3 System Functions Table1: General Specification as below: Main Chipset 32 bit MCU and Broadcom WiFi single chip Operating Frequency 2412MHz~2462MHz WiFi Standard 802.11b/g/n(1x1) Modulation 11b: DBPSK, DQPSK, CCK and DSSS 11g: BPSK, QPSK, 16QAM, 64QAM and OFDM 11n: MCS0~7 OFDM PHY Data rates 11b: 1, 2, 5.5 and 11Mbps 11g: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps 11n(HT20): MCS0~7, up to 150Mbps Form factor 44pin QFN design Host Interface SDIO 2.0 PCB Stack 4-layers single side design PCBA Dimension Typical, 38.60mm(W)*23.62mm(L)*3.30mm(T) Antenna Type  One printed antenna on board  One U.F.L connector for external antenna Operation Temperature -30°C to +80°C Storage Temperature -40°C to +85°C Sample picture is as below. BOTTOM TOP 6 2. Mechanical Specification 2.1 Mechanical Drawing Typical Dimension (W x L x T ): 38.60x23.62x3.30 mm . TOP VIEW BOTTOM VIEW SIDE VIEW Unit: mm 31 39 1 1540 44 1630 7 2.2 44pin QFN Pin definition The pin definition is as below, and its pin number refers to item 2.1. Pin # Name Pin # Name 1 I2C_SCL 21 nCTS_DM 2 I2C_SDA 22 TXD 3 JTMSSWDIO 23 RXD 4 I2S_MCK 24 VCC3V3 5 PA3_RX2-TCP 26 32K_SLPCLK_OUT 6 SPI-NSS_I2S-WS 27 BOOT0 7 JTDO_SPI-CLK_I2S-CK 28 JTCKSWCLK 8 NJTRST_SPI-MISO_I2Sext_SD 29 WAKE_UP 9 SPI-MOSI_I2S-SD 30 status 10 SPI_INT 31 GPIO_PA5 11 Readyness 32 GPIO_PA6 12 GPIO_PC2 33 GPIO_PA7 13 GPIO_PB14 34 GPIO_PB15 14 GPIO_PC6 35 GPIO_PC3 16 nRF_LED 36 GPIO_PC4 17 nRESET 37 GPIO_PC0 18 JTDI_DSR 38 PA2_TX2 19 DATA_RDY 15,25,39~44 GND 20 nRTS_DP 8 3. Electrical Specification 3.1 802.11b Mode Items Contents Standard IEEE802.11b Modulation Type DSSS / CCK Frequency range 2412MHz~2462MHz Channel CH1 to CH11 Data rate 1, 2, 5.5, 11Mbps TX Characteristics Min.Typ. Max.…

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MXCHIP ______________________________________________________ Statement We MXCHIP Of Room 811,Tongpu Building, No.1220 Tongpu Road,Shanghai,200333 hereby state that Product :WiFi module Model Number :EMW3162 The EMW3162 Serial included two Models（EMW3162-E and EMW3162-P）. All models have the same constructions, circuit diagram and PCB layout. EMW3162-E used external antenna,EMW3162-P used PCB antenna,like all the other. Sincerely, Signature: E-mail:[email protected] Phone:+86 18964818248 Fax:+86 21 52655025-817 Address:Room 811,Tongpu Building, No.1220 Tongpu Road,Shanghai,China,200333

SCS-F18: Project and Product Certification Representative Authorization Letter Page 1 of 2 Rev 3.0 775 Montague Expressway Milpitas, CA 95035 Tel: 408-526-1188 Fax: 408-526-1088 Email: [email protected] Project and Product Certification Representative Authorization Letter SCS-F18: Project and Product Certification Representative Authorization Letter Page 2 of 2 Rev 3.0 MXCHIP ______________________________________________________ 2013.10.25 To: SIEMIC, INC. 775 Montague Expressway, Milpitas, CA 95035 USA Dear Sir/Madam, Re: Project and Product Certification Representative Authorization Letter We, ____Shanghai MXCHIP Information Technology Co.,Ltd.____hereby authorize SIEMIC, INC. to act as a Certification Body for certifying for the following project(s): Product Name: Embedded WiFi module Model name: EMW3162, EMW3162-E,EMW3162-P FCC ID: P53-EMW3162 We affirm that between SIEMIC and ____ Shanghai MXCHIP Information Technology Co.,Ltd.____, any difference in understanding, including test plan, measurement methods, applicable standards and relevant procedures and processes have been resolved prior to commencement of testing activities. Sincerely, Client’s signature Client’s name / title : YangLi/ Hardware Engineer Contact information / address ：Shanghai MXCHIP Information Technology Co.,Ltd. Room 811,Tongpu Building, No.1220 Tongpu Road,Shanghai,China

SCS-F19: Confidentiality Request Letter Page 1 of 2 Rev 3.0 775 Montague Expressway Milpitas, CA 95035 Tel: 408-526-1188 Fax: 408-526-1088 Email: [email protected] Confidentiality Request Letter Reason for Amendment (current / obsolete) Revision History Approved Date From To Initial Release (obsolete) 1.0 1.0 Nov-14-2006 Adding CFR 2.459 (obsolete) 1.0 2.0 August – 11 - 2008 Updated company template & Added text box (current) 2.0 3.0 Jan-31-2012 SCS-F19: Confidentiality Request Letter Page 2 of 2 Rev 3.0 MXCHIP ______________________________________________________ 2013.10.25 To: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD Subject: Permanent Confidentiality Request for FCC ID: P53-EMW3162 We hereby request confidential treatment of information accompanying this application as outlined below: - Block Diagram - Schematics - Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 & 0.459 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, Client’s signature Client’s name / title : YangLi/ Hardware Engineer Contact information / address ：Shanghai MXCHIP Information Technology Co.,Ltd. Room 811,Tongpu Building, No.1220 Tongpu Road,Shanghai,China

Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1 Issue Date: October 21, 2013 Page: 65 of 75 www.siemic.com.cn Annex B. EUT AND TEST SETUP PHOTOGRAPHS Annex B.i. Photograph 1: EUT External Photo EUT - Front View EUT - Rear View PCB Antenn a

13/08/21 13/11/05 Delete Japan Logo and Update CE Logo 1 Taim Taim Taim Sunny v MAC ID label XF581 T77H497.00 500.01467.035 Notes: A:CE 2200 CE 2200 ---- Fixed B:FCC ID:P53-EMW3162 D:MXCHIP E:MO-VVSS MO:工單號 VV:為工程版本（參考製造文件封面Foxconn Label Rev.欄位） SS:為文件版本（參考製造文件封面Doc Rev之主版本） F:XXXXXXXXXXXX-EMW3162-XXX XXXXXXXXXXXX:12digital,MAC ID :Customer provide MAC ID range,confirm with PM. (one MAC per product) EMW3162:7digital,Customer PN XXX:Date Code(refer to the attachment) All font:TRIUMVIRATE COND， height 0.8mm Scannable: C:XXXXXXXXXXXX-EMW3162-XXX 2D barcode DATAMATRIX, 5 dots Columns&Rows 20*20 A B C D F E 500.01467.035 15*15mm XXXXXXXXXXXX -EMW3162 -XXX MO-VVSS Vendor provide Label stick position: 11 11 15 15 FCC ID:P53-EMW3162 MXCHIP FCC ID:P53-EMW3162MXCHIP Tray ID label Foxconn PN: 503.00090.005, size: 45*8mm 45 8 TFYWWSSSS H uman readable: TFYWWSSSS Font: TRIUMVIRATE COND.height6pt Scannable: 1. Barcode type: code128 2. Barcode height: 2.96mm 3. Barcode content: TFYWWSSSS T---Tray F--- Y--- WW--- SSSS---36reset0001 tray Panel label 503.00039.015 (19.05*5mm) P:PCB label F:Foxconn YMD:Year,month,day SSSSS:00000-zzzzz Barcode:128 code, 2.54mm height, Font:Verdana,Bold,2pt label PFYMDSSSSS 19.05 5 panel label 100mm 50mm M/O: XXXXXXXX Qty : XXX Hon Hai P/N: T77H497.00REV: VVSS Carton ID: CIPPYWWXXXX Remark: A B C D A.XXXXXXXX: the Foxconn MO(工單號) B.Qty : XXX XXX:the quantity of product in carton(carton內裝的產品數量) Barcode content:the quantity of product in carton(carton內裝的產品數量) C.REV:VVSS VV:the engineering version(refer to Foxconn label Rev column in the cover of the MFG document) VV為工程版本（參見製造文件封面Foxconn Label Rev.欄位） SS:the version of A300/A400 product(refer to Doc Rev.in the cover of MFG document) SS為A300/A400產品之版本（參見製造文件封面Doc Rev.之主版本） D.CIPPYWWXXXX C+ production location + production line + production year + production week + Serial Number(Base on 36) C: carton I: production location(refer to attachment of the last page) PP:Production line YWW: Production year & production week. XXXX:Serial number(Base on 36,every two week reset to 0001) Carton label & Antistatic label:P/N:503.00098.005 P/N:T77H497.00 PIPPYWWXXXX REV:VVSS Follow Foxconn standard PIPPYWWXXXX: P+ production location + production line + production year + production week + Serial Number(Base on 36) P: Pallet I: Production location(refer to attachment of the last page) PP: production line Y: the last digital of production year WW: production week XXXX: Serial number(Base on 36,every two week reset to 0001) VVSS: VV: the engineering version (refer to Foxconn label Rev column in the cover of the MFG document) SS: the version of A300/A400 product (refer to Doc Rev.in the cover of MFG document) Pallet label:P/N:503.00089.005 110mm 36mm carton label Antistatic label heat seal M/O: XXXXXXXX Qty : XXX Hon Hai P/N: T77H374.00REV: VVSS Carton ID: CIPPYWWXXXX Remark: 1 st CharacterYearCodes Year 2006200720082009201020112012Soon Code 6789012 2 nd CharacterMonthcodes Month JanuaryFebruaryMarchAprilMayJuneJulyAugustSeptemberOctoberNovemberDecember Code 123456789ABC 3 rd CharacterDayCodes Day 1 st 2 nd 3 rd 4 th 5 th 6 th 7 th 8 th 9 th 10 th 11 th 12 th 13 th 14 th 15 th 16 th 17 th 18 th 19 th Code 123456789ABCDEFGHIJ Day 20 th 21 st 22 nd 23 rd 24 th 25 th 26 th 27 th 28 th 29 th 30 th 31 st Code KLMNOPQRSTUV 1.Date code define 2013 2014 2015 3 4 5 LOCATIONLOCATIONNAME 0新竹 1中山 2褔田 3土城 4泰詠 5精陽 6廣川 7台表 8宏鉅 9新進 A香港 B國璉 C重慶CBT DFOR DUMMY E上海 F龍華E5 G龍華E5A資料庫 H I保留 J K南寧 L環電 MEASTAR N O保留 P龍華CPEI RMA Q重慶CPEI R上海RMA SCPEII T煙台（Sony機種） U越南桂武CMB V煙台（任天堂機種） Y越南黃田 Z越南桂武CPEII 產地編碼明細 保留

Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 66 of 75 www.siemic.com.cn Annex B.ii. Photograph 2: EUT Internal Photo Uncover Without Shielding - Front View Uncover Without Shielding - Rear View PCB Antenn a Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 67 of 75 www.siemic.com.cn Note: the external antenna for EMW3162-E IPEX Antenna

Shanghai MXCHIP Information Technology Co.,Ltd Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P November 28, 2013 Report No.: 13020741-FCC-H1-V1 (This report supersedes NONE) Modifications made to the product : None This Test Report is Issued Under the Authority of: William Long Compliance Engineer Alex Liu Technical Manager This test report may be reproduced in full only. Test result presented in this test report is applicable to the representative sample only. Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 2 of 8 www.siemic.com Laboratory Introduction SIEMIC, headquartered in the heart of Silicon Valley, with superior facilities in US and Asia, is one of the leading independent testing and certification facilities providing customers with one-stop shop services for Compliance Testing and Global Certifications. In addition to testing and certification, SIEMIC provides initial design reviews and compliance management through out a project. Our extensive experience with China, Asia Pacific, North America, European, and international compliance requirements, assures the fastest, most cost effective way to attain regulatory compliance for the global markets. Accreditations for Conformity Assessment Country/Region Accreditation Body Scope USA FCC, A2LA EMC , RF/Wireless , Telecom Canada IC, A2LA, NIST EMC, RF/Wireless , Telecom Taiwan BSMI , NCC , NIST EMC, RF, Telecom , Safety Hong Kong OFTA , NIST RF/Wireless ,Telecom Australia NATA, NIST EMC, RF, Telecom , Safety Korea KCC/RRA, NIST EMI, EMS, RF , Telecom, Safety Japan VCCI, JATE, TELEC, RFTEMI, RF/Wireless, Telecom Mexico NOM, COFETEL, Caniety Safety, EMC , RF/Wireless, Telecom Europe A2LA, NIST EMC, RF, Telecom , Safety Accreditations for Product Certifications Country/Region Accreditation Body Scope USA FCC TCB, NIST EMC , RF , Telecom Canada IC FCB , NIST EMC , RF , Telecom Singapore iDA, NIST EMC , RF , Telecom EU NB EMC & R&TTE Directive Japan MIC, (RCB 208) RF , Telecom Hong Kong OFTA (US002) RF , Telecom Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 3 of 8 www.siemic.com This page has been left blank intentionally. Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 4 of 8 www.siemic.com CONTENTS 1. EXECUTIVE SUMMARY & EUT INFORMATION ........................................................................................... 5 2. TECHNICAL DETAILS .......................................................................................................................................... 6 3. MAXIMUM PERMISSIBLE EXPOSURE (MPE) .................................................................................................. 7 FCC §2.1091 - MAXIMUM PERMISSIBLE EXPOSURE (MPE) ................................................................................... 7 Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 5 of 8 www.siemic.com 1. EXECUTIVE SUMMARY & EUT INFORMATION The purpose of this test programme was to demonstrate compliance of the Shanghai MXCHIP Information Technology Co.,Ltd, Embedded WiFi module and model: EMW3162against the current Stipulated Standards. The Embedded WiFi module has demonstrated compliance with the FCC 2.1091: 2013. EUT Information EUT Description : Embedded WiFi module Main Model : EMW3162 Serial Model EMW3162-E,EMW3162-P Antenna Gain : PCB Antenna: 2dBi IPEX antenna: 2dBi Input Power : Voltage Range: 3.0 ~ 3.6V DC Maximum Conducted Peak Power to Antenna : 802.11b:15.35dBm 802.11g:12.37dBm 802.11n:11.52 dBm Classification Per Stipulated Test Standard : FCC 2.1091: 2013 Note: the EMW3162 Serial included two Models（EMW3162-E and EMW3162-P. All models have the same constructions, circuit diagram and PCB layout.EMW3162-E used external antenna, EMW3162-P used PCB antenna, like all the other. Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 6 of 8 www.siemic.com 2. TECHNICAL DETAILS Purpose Compliance testing of Embedded WiFi module with stipulated standard Applicant / Client Shanghai MXCHIP Information Technology Co.,Ltd Room811,Tongpu Building,No.1220,Tongpu Road,Shanghai,China Manufacturer Shanghai MXCHIP Information Technology Co.,Ltd Room811,Tongpu Building,No.1220,Tongpu Road,Shanghai,China Laboratory performing the tests SIEMIC (Nanjing-China) Laboratories NO.2-1,Longcang Dadao, Yuhua Economic Development Zone, Nanjing, China Tel: +86(25)86730128/86730129 Fax: +86(25)86730127 Email: [email protected] Test report reference number 13020741-FCC-H1-V1 Date EUT received September 11, 2013 Standard applied FCC 2.1091: 2013 Dates of test October 08 to November 06, 2013 No of Units #1 Equipment Category DTS Trade Name MXCHIP RF Operating Frequency (ies) WIFI: 802.11b/g/n: 2412-2462 MHz Number of Channels 802.11b/g /n: 11CH Modulation CCK/OFDM FCC ID P53-EMW3162 Title: RF Exposure Evaluation Report for Embedded WiFi module Main Model: EMW3162 Serial Model: See P5 To: FCC 2.1091: 2013 Report No: 13020741-FCC-H1-V1 Issue Date: November 28, 2013 Page: 7 of 8 www.siemic.com 3. MAXIMUM PERMISSIBLE EXPOSURE (MPE) FCC §2.1091 - MAXIMUM PERMISSIBLE EXPOSURE (MPE) Applicable Standard According to §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guide…

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Shanghai MXCHIP Information Technology Co.,Ltd Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P Nobember 28, 2013 Report No.: 13020741-FCC-R1-V1 (This report supersedes none) Modifications made to the product : None This Test Report is Issued Under the Authority of: William Long Compliance Engineer Alex Liu Technical Manager This test report may be reproduced in full only. Test result presented in this test report is applicable to the representative sample only. Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 2 of 75 www.siemic.com.cn Laboratory Introduction SIEMIC, headquartered in the heart of Silicon Valley, with superior facilities in US and Asia, is one of the leading independent testing and certification facilities providing customers with one-stop shop services for Compliance Testing and Global Certifications. In addition to testing and certification, SIEMIC provides initial design reviews and compliance management through out a project. Our extensive experience with China, Asia Pacific, North America, European, and international compliance requirements, assures the fastest, most cost effective way to attain regulatory compliance for the global markets. Accreditations for Conformity Assessment Country/Region Accreditation Body Scope USA FCC, A2LA EMC , RF/Wireless , Telecom Canada IC, A2LA, NIST EMC, RF/Wireless , Telecom Taiwan BSMI , NCC , NIST EMC, RF, Telecom , Safety Hong Kong OFTA , NIST RF/Wireless ,Telecom Australia NATA, NIST EMC, RF, Telecom , Safety Korea KCC/RRA, NIST EMI, EMS, RF , Telecom, Safety Japan VCCI, JATE, TELEC, RFTEMI, RF/Wireless, Telecom Mexico NOM, COFETEL, Caniety Safety, EMC , RF/Wireless, Telecom Europe A2LA, NIST EMC, RF, Telecom , Safety Accreditations for Product Certifications Country/Region Accreditation Body Scope USA FCC TCB, NIST EMC , RF , Telecom Canada IC FCB , NIST EMC , RF , Telecom Singapore iDA, NIST EMC , RF , Telecom EU NB EMC & R&TTE Directive Japan MIC, (RCB 208) RF , Telecom Hong Kong OFTA (US002) RF , Telecom Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 3 of 75 www.siemic.com.cn This page has been left blank intentionally. Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 4 of 75 www.siemic.com.cn CONTENTS 1 EXECUTIVE SUMMARY & EUT INFORMATION .......................................................................................... 5 2 TECHNICAL DETAILS ......................................................................................................................................... 6 3 MODIFICATION ..................................................................................................................................................... 7 4 TEST SUMMARY .................................................................................................................................................... 8 5 MEASUREMENTS, EXAMINATION AND DERIVED RESULTS .................................................................. 9 ANNEX A. TEST INSTRUMENT & METHOD ........................................................................................................ 60 ANNEX B. EUT AND TEST SETUP PHOTOGRAPHS ........................................................................................... 65 ANNEX C. TEST SETUP AND SUPPORTING EQUIPMENT ................................................................................ 70 ANNEX D. USER MANUAL / BLOCK DIAGRAM / SCHEMATICS / PART LIST ............................................ 74 ANNEX E. DECLARATION OF SIMILARITY ........................................................................................................ 75 Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 5 of 75 www.siemic.com.cn 1 EXECUTIVE SUMMARY & EUT INFORMATION The purpose of this test programme was to demonstrate compliance of the Shanghai MXCHIP Information Technology Co.,Ltd, Embedded WiFi module and model: EMW3162 against the current Stipulated Standards. The Embedded WiFi module has demonstrated compliance with the FCC Part 15.247: 2013, ANSI C63.4: 2009. EUT Information EUT Description : Embedded WiFi module Main Model : EMW3162 Serial Model : EMW3162-E,EMW3162-P Antenna Gain : PCB Antenna: 2dBi IPEX antenna: 2dBi Input Power : Voltage Range: 3.0 ~ 3.6V DC Classification Per Stipulated Test Standard : FCC Part 15.247: 2013, ANSI C63.4: 2009 Note: the EMW3162 Serial included two Models（EMW3162-E and EMW3162-P. All models have the same constructions, circuit diagram and PCB layout.EMW3162-E used external antenna, EMW3162-P used PCB antenna, like all the other. Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1-V1 Issue Date: Nobember 28, 2013 Page: 6 of 75 www.siemic.com.cn 2 TECHNICAL DETAILS Purpose Compliance testing of Embedded WiFi module with stipulated standard Applicant / Client Shanghai MXCHIP Information Technology Co.,Ltd 1Room811,Tongpu Building,No.1220,Tongpu Road,Shanghai,China Manufacturer Shanghai MXCHIP Information Technology Co.,Ltd Room811,Tongpu Building,No.1220,Tongpu Road,Shanghai,China Laboratory performing the tests SIEMIC (Nanjing-China) Laboratories NO.2-1,Longcang Dadao, Yuhua Economic Development Zone, Nanjing, China Tel: +86(25)86730128/86730129 Fax: +86(25)86730127 Email: China@si…

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Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1 Issue Date: October 21, 2013 Page: 68 of 75 www.siemic.com.cn Annex B.iii. Photograph 3: Test Setup Photo Conducted Emissions Test Setup Front View Conducted Emissions Test Setup Side View Title: RF Test Report for Embedded WiFi module Main Model: EMW3162 Serial Model: EMW3162-E,EMW3162-P To: FCC Part 15.247: 2013, ANSI C63.4: 2009 Report No.: 13020741-FCC-R1 Issue Date: October 21, 2013 Page: 69 of 75 www.siemic.com.cn Radiated Spurious Emissions Test Setup Below 1GHz - Front View Radiated Spurious Emissions Test Setup Above 1GHz –Front View