QCI-BTSmart Bluetooth Dongle

SM ART Te chnologie s Inc. Suite 600 1177 - 11 th Avenue SW Calgary, AB CANADA T2R 1K9 Tel. 403.245.0333 Fax 403.228.2500 Technologies Inc. Bluetooth Operating Instructions Date: May 10, 2002 Document: Bluetooth Functional Specification Authors: Wallace Kroeker, Manager, Software Development SMART Technologies Inc. Functional Specification Overview The SMART Bluetooth device provides a way for users of a SMART Board to replace the serial cable that connects the SMART Board to a computer. On front projection systems this cable must run across the floor in front of the SMART Board to the user’s computer creating a possible safety issue if the cable is not properly covered. There are two possible modes of operation of the SMART Bluetooth device: a paired set of devices or a single device. Once in place the solutions provide a Bluetooth Radio Frequency serial data (RFCOMM) connection running at 9600 baud. This may be increased in the future as the Cambridge Silicon Radio technology that is being used is rated to run up to 115200 baud for serial devices. Paired SMART Bluetooth devices The paired SMART Bluetooth devices are two identical devices configured in the factory to only recognize each other. No other Bluetooth devices are allowed to connect to these devices. A SMART Board user installs one device on the SMART Board and the other device on the computer connected to a serial port via a short cable. Power is then supplied to both Bluetooth devices and they find each other and establish an RFCOMM connection. With the RFCOMM connection established, the SMART Board user can use the equipment just as they would have with a regular serial cable connection. Single SMART Bluetooth device The single SMART Bluetooth device allows the user to establish an RFCOMM connection through a preexisting industry standard Bluetooth device on the computer. The SMART Board user must follow the instruction provided by the manufacturer of the Bluetooth device (e.g. USB, PC-Card or built-in) on their computer to establish the connection. Generally the steps are as follows: • Locate the SMART Bluetooth device. The SMART Bluetooth device has a recognizable name such as SMART SC7B. • Determine which virtual serial COM port on their computer is used to establish serial RFCOMM connections via the computer Bluetooth device. • Specify this COM port in the SMART Board software. When this is specified the manufacturer software usually gives a list of Bluetooth devices and the user selects the SMART Bluetooth device from the list. • With the RFCOMM connection established the SMART Board user can use the equipment just as they would have with a regular serial cable connection. Note that this is a general description of the connection establishment process and will vary between manufacturers of the computer Bluetooth devices.

– 1 – SM ART Te chnologie s Inc. Suite 600 1177 - 11 th Avenue SW Calgary, AB CANADA T2R 1K9 Tel. 403.245.0333 Fax 403.228.2500 Technologies Inc. Bluetooth Design Date: May 10, 2002 Document: Bluetooth Block Diagram, Theory of Operation and Input/Output Specifications Aut hor: Lucien Pot vin, P.Eng. Senior R&D Electronics Engineer SMART Technologies Inc. Block Diagram Theory of Operation The Bluetooth Module (BTM) is one end of a wireless link. It is controlled by an on board embedded microprocessor and communicates to the host computer via the RS232 Serial link. The BTM is supplied to Smart Technologies as a complete pre-tested module by Mitsumi Electronics Corporation. The BTM software is provided by Cambridge Silicon Radio CSR and modified by Smart Technologies. The host computer software is also supplied by CSR and modified by Smart Technologies. A bank of LEDs is provided to display system status. 1234 A B C D 4 321 D C B A Title Num berRe vi si onSi z e A Dat e :10 -Ma y- 200 2Sh ee t of Fi l e:D: \P ro 99 SE pr oj ec ts \ BT4. d dbDr awn By : STA TUS LEDs RS232 TRANSCEIV ERBLUETOOTH MODULE DB9 CONNECTOR PO WER S UPPL Y DC J ACK HEA DER FLA SH PROGRAMMING BLUETOOTH DONGLE BLOCK DIA GRAM 1A A NTENNA IS ON MODULE – 2 – SM ART Te chnologie s Inc. Suite 600 1177 - 11 th Avenue SW Calgary, AB CANADA T2R 1K9 Tel. 403.245.0333 Fax 403.228.2500 Technologies Inc. The FLASH Programming interface connects to a computer parallel port via a special FLASH programming cable supplied by Smart Technologies. Programming of the BTM is controlled by a CSR utility program running in the PC. The Power Supply is designed in 2 stages as follows: o The pre-regulator ( Switch Mode Power Supply - SMPS ) accepts a 4.9V to 18V DC voltage from an external wall mount power supply and regulates down to 3.3V o The second regulator is a linear, Low Drop Out ( LDO ) type. It accepts the 3.3V from the pre-regulator and provides a further regulated 3.0V to the BTM. Only the BTM is supplied by the 3.0V LDO, all other chips are supplied by the 3.3V pre-regulator. Input/Output Specifications DC Jack, Power Input o Pin 1, 4.8V to 18V, typically 12VDC ~500mA unregulated (to supply both the BTM and the Sc7) DB9 connector RS232 signals, the data rate is controlled by software, but limited to 115Kbaud by the hardware. o Pin 2, Data In (from the PC) at nRXD o Pin 3, Data Out (to the PC) at nTXD o Pin 6, Handshaking (from the PC) at CTS o Pin 7, Handshaking (to the PC) at RTS Power output to the Sc7 WB Controller card o Pin 1, Power from the BTM to the Sc7 o Pin 9, Gnd to the Sc7 FLASH Programming Cable The signals on this cable are of Serial Peripheral Interface (SPI standard) format o Pin 1, RESET from PC to BTM, pulled low (inactive), reset signal o Pin 2, SPI_CLK from PC to BTM, clock signal o Pin 3, SPI_MOSI from PC to BTM, serial data o Pin 4, SPI_CSB from PC to BTM, device select signal o Pin 7, SPI_MISO from BTM to PC, serial data End.

Functional Description 25/Apr/2001 MITSUMI Bluetooth Module “ WML-C06##” Hardware: Version 1 Ultra-small and thin size achieved through use of high density mounting technology. 1. APPLICATIONS Notebook PCs, mobile phones, digital cameras, PC peripherals, PDA. 2. DESCRIPTIONS Wireless communication module conforming to Bluetooth Ver.1.1. 3. FEATURES 1) Ultra-small and thin size achieved through use of high density mounting technology. 2) SMD type can be surface mounted. 3) High sensitivity supports communications of up to 1 0 m. 4) UART, USB and PCMIF interfaces enable wide range of applications. 5) Conforms to FCC, CE and other countries’ EMI standards. 6) Supports Bluetooth Class2. Note) The BLUETOOTH trademarks are owned by Telefonaktiebolaget L M, Ericsson, Sweden. 4. SPECIFICATIONS I t e mS p e c I f I c a t I o n s F r e q u e n c y 2402 to 2480 MHz M o d u l a t I o n FHSS / GFSK Channel intervals 1 MHz Number of channels 7 9 CH Power supply voltage 3.0 V (typ.), 2.9 ~ 3.4V Transmission rate7 2 1 kbps Receive sensitivity -88 dBm typ. Output level (Class2)4 dBm max. TM ©1998-2000 MITSUMI Electronics Corp. All rights reserved. MITSUMI is a trademark of MITSUMI Electronics Corporation. Other company names and products names are trademarks of their respective companies. Product specifications are subject to revisions or changes without notification. 5. TERMINAL DESCRIPTION No.SymbolI/O Description 1PIO [0] / RXENOControl output for external LNA (=PIO [0] ) 2PIO [1] / TXENOControl output for external PA (=PIO [1] ) 3GNDGround 4GNDGround 5PIO [4] / IRQ1I/OProgrammable I/O line/Interrupt request1 6PIO [5] / IRQ2I/OProgrammable I/O line/Interrupt request2 7PIO [6]I/OProgrammable I/O line 8PIO [7]I/OProgrammable I/O line 9PCM_OUTOSynchronous PCM data out 10PCM_CLKI/OSynchronous PCM data clock 11PCM_INISynchronous PCM data input 12PCM_SYNCI/OSynchronous data strobe 13GNDGround 14VDDSupply voltage 3.0 15GNDGround 16SPI_CSBIChip select for Synchronous Serial Interface 17SPI_MOSIISynchronous Serial Interface data input 18SPI_CLKISynchronous Serial Interface Clock 19SPI_MISOOSynchronous Serial Interface data output 20UART_CTS/USB_D-IAsynchronous serial data CTS/USB Data- 21UART_RTS/USB_D+OAsynchronous serial data RTS/USB Data+ 22UART_RXIAsynchronous serial data input 23UART_TXOAsynchronous serial data output 24PIO [3]I/OData line for EEPROM 25PIO [2]ICLOCK for EEPROM 26RSTINot Available 27GNDGround 28ANTI/ORF input/output 6. BLOCK DIAGRAM 7. PCM IF PCM_OUT, PCM_IN, PCM_CLK, PCM_SYNC carry one of bi-directional channel of voice data using 13bits PCM at 8ks/s. PCM_SYNC operates at a fixed clock frequency of 8kHz. PCM_CLK operates at a fixed clock frequency of 256kHz. Bits 1 to 13 of the PCM_OUT data carry the current output sample value. Bits 14 to 16 carry a three bit signal level value. Reference PCM audio device is MC145483. 8. PIO PORT The PIO port is general purpose IO interface and the ports consists of 8 programmable, Bi-directional PIO [0:7]. The maximum current drive capability is 4mA. PIO [0], PIO [1] are recommended to be open if they are not used. UART/ USB UART_TX UART_RX UART_RTS/USB D+ UART_CTS/USB D- SPI_CSB SPI_CLK SPI_MOSI SPI_MISO PCM_OUT PCM_IN PCM_SYNC PCM_CLK SPI PCM/IF MEMORY DRIVER PIO FLASH ROM 256kx16 RAM RF Receiver RF Transmitter 1st Synthesizer Baseband- Controller Memory- Management 2 nd Synthesizer REG 16bits Micro- Processor XT Driver 16MHz VDD ANT BPF SW TX_EN RX_EN BC01b-USRT / BC01b-USB Balun PIO [0], ... ,PIO [7] 9. OVERALL APPEARANCE Module without antenna WML-C06N# Module with antenna WML-C06A#

MITSUMI Bluetooth TM Module WML-C06 OUTLINE Wireless communication module conforming to Bluetooth Ver. 1.1. This product was Bluetooth standard certified in June, 2001. Notebook PCs, Head Set, Mobile Phones, Digital Camera, PC Peripherals, PDA. * The "Bluetooth" trademarks are owned by Telefonaktiebolaget LM Ericsson, Sweden. Telecommunication component SPECIFICATIONS FEATURES 1. Ultra-small and thin size achieved through use of high density mounting technology. 2. SMD type can be surface mounted. 3. High sensitivity supports communications of up to 10m. 4. UART, USB and PCMIF interfaces enable wide range of applications. 5. Conforms to FCC, CE and other countries'EMI standards. 6. Supports Bluetooth Class2 (CLASS 1-supporting WML-C07 also available.). 7. Two types of models: With/without an antenna are provided. ItemSpecifications Frequency2402 to 2480MHz Modulation FHSS/GFSK Channel intervals 1MHz Number of channels 79CH Power suppIy voltage3±0.1V Transmission rate 721kbps Receive sensitivity -80dBm typ. Output level (Class2) 4dBm max. MITSUMI DIMENSIONS Bluetooth TM Module VIEW Z 1 14 28 24 23 22 21 20 19 18 17 16 15 1211109876543211314 25262728 Z 1 ± 0.2 1 ± 0.2 1 ± 0.2 1.426-P= 28-1 2.3 ±0.2 0.15 0.35 28-R 0.3 C 2 2 2 +0.2 0 13.6 ± 0.15 23 +0.3 0 5 1.9 ± 0.2 8 15 +0.2- 0.1 28 +0.3 0 0.6 ø 2 2 13.6 ± 0.15 2 +0.2 0 0.6 ø 1 ± 0.2 26-P=1.4 2.5 ±0.2 0.15 23 +0.3 0 15 +0.2- 0.1 28-1 1 ± 0.2 1 ± 0.2 0.3528-R 0.3 C Z 28 27 26 25 1413123456789101112 15161718192021222324 14 1 15 VIEW Z Unit : mm * For the technical details of the products in this page, please refer to Sales promotion Dept., TOCHIGI MITSUMI Co., Ltd. Phone: 0283 (23) 3332. TERMINALS 1. PIO [0] /RX_EN15. GND 2. PIO [1] /TX_EN16. SPI_CSB 3. GND17. SPI_MOSI 4. GND18. SPI_CLK 5. PIO [4] /IRQ119. SPI_MISO 6. PIO [5] /IRQ220. UART_CTS/USB_D- 7. PIO [6] 21. UART_RTS/USB_D+ 8. PIO [7] 22. UART_RX 9. PCM_OUT23 UART_TX 10. PCM_CLK24. PIO [3] 11. PCM_IN25. PIO [2] 12. PCM_SYNC26. 13. GND27. GND 14. V DD28. NC TERMINALS 1. PIO [0] /RX_EN15. GND 2. PIO [1] /TX_EN16. SPI_CSB 3. GND17. SPI_MOSI 4. GND18. SPI_CLK 5. PIO [4] /IRQ119. SPI_MISO 6. PIO [5] /IRQ220. UART_CTS/USB_D- 7. PIO [6] 21. UART_RTS/USB_D+ 8. PIO [7] 22. UART_RX 9. PCM_OUT23. UART_TX 10. PCM_CLK24. PIO [3] 11. PCM_IN25. PIO [2] 12. PCM_SYNC26. 13. GND27. GND 14. V DD28. ANT

BILL OF MATERIALS REV B0 ITEM# SMART PART# DESCRIPTION CCT REF. PKG. CLASS QTY/UNIT Comments/ Changes 1 09-049 CAP, 0.01UF, 25V, 20%, CERAMIC C18 C0603 1 2 09-00098 Cap, 47pF, 50V, 5%, CERAMIC C1 C2 C3 C4 C5 C6 C7 C8 C9C10 C11 C12 C13 C0603 13 3 09-048 CAP, 0.1uF, 25V, 20%, CERAMIC C14 C15 C16 C17 C19 C20 C21 C22 C23 C0805 9 4 12-070 Connector, DB9F, R. Angle, J3 DB9F 1 5 39-003 Inductor, 47uH L1 DO3316 1 6 09-071 CAP, 10 μ F, 16V, 20%, ELECTROLYTIC E3 EB 1 7 09-053 CAP, 100 μ F, 35V,20%, ELECTROLYTIC E2 EF 1 8 09-054 CAP, 220UF, 16V, 20%, ELECTROLYTIC E1 EF 1 9 12-00178 HEADER 2X4 J1 FTR2X4 1 10 18-00051 LED, 3.5mm, RED, SIDE VIEW LD1 LD2 LD3 LD4 HDRM1X2 4 11 18-00052 LED Specer, Square, 9.5mm LD1 LD2 LD3 LD4 4 12 12-001 DC Jack J2 PWR_CON 1 13 69-00187 RES, 4K87, 1% R38 R0603 1 14 69-106 RES, 10K0, 1% R40 R41 R42 R43 R0603 4 15 69-00166 RES, 0R, JUMPER R46 R0603 1 16 69-096 RES, 1K OHM, 1% R8 R33 R35 R37 R0603 4 17 69-087 RES, 47K, 5% R32 R47 R0603 2 18 69-00167 Res,47R,1/16W, 5% R1 R2 R3 R4 R5 R6 R7 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R27 R28 R0603 26 19 69-098 RES, 4K7, 5% R26 R30 R34 R36 R0603 4 20 69-00188 RES, 7K50, 1% R31 R0603 1 21 69-103 RES, 1R0, 5% R29 R1206 1 22 12-00179 SOCKET, 2X14, SM M1 RSM2X14 1 23 18-021 DIODE, SCHOTTY, SMA, B140 S1,S2 SMA 2 24 90-00022 Voltage Reg. 150mA, MIC2951-3.3BM U1 SO-8 1 25 36-00162 Buffer, Low Vol. Hex Inverter74LCX04 U2 SOL-14 1 26 90-00029 Voltage Reg.,MIC4574-3.3BWM U3 SOL-14 1 27 36-00163 RS232 Line Driver , MAX3232ECWE U4 SOL-16 1 28 18-012 Transient supp. 20V ZZ1 ZZ2 ZZ3 ZZ4 SOT-23S 4 29 09-00099 Cap,4.7uF, TANT, 16V T1 T2 TA 2 32 25-028-00 Circuit Board (PCB) 1 Firmware N/A Documentation PCB FABRICATION detail 25-028-00B0_FAB.zip Documentation PCB Assembly detail 26-028-00B0_MAN.zip Documentation Assembly Drawing 26-028-00B0.dwg Documentation Total Parts 96 Assy Name: BLUETOOTH DATE: 29 APR 02 SMART Technologies Inc. Assembly Number: 26-028-00 243343 07/19/01

BILL OF MATERIALS REV B0 ITEM# SMART PART# DESCRIPTION CCT REF. PKG. CLASS QTY/UNIT Comments / Notes / Most recent change 1 09-048 Cap, 0.1uF, 25V, 20% , Ceramic C1 C0805 1 2 12-00177 Header, 2x14, SM M1 FTR2X14 1 3 03-00032-00 BLUETOOTH RADIO MODULE, 10M , 2.4G H M2 C06A 1 4 25-029-00 Circuit Board (PCB) 1 Firmware N/A Documentation PCB FABRICATION detail 25-029-00B0_FAB.zip Documentation PCB Assembly detail 26-029-00B0_MAN.zip Documentation Assembly Drawing 26-029-00B0.dwg Documentation Total Parts 4 Assy Name: BLUETOOTH DAUGHTER CARD DATE: 29 APR 02 SMART Technologies Inc. Assembly Number: 26-029-00 …

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1234 A B C D 4321 D C B A Title NumberRevisionSize B Date:15-Apr-2002Sheet of File:D:\Protel Projects\BT4 to LP 12apr02.ddbDrawn By: E3 10uF 16V 12 C19 0.1uF 1 2 C20 0.1uF 1 2 C22 0.1uF 12 C23 0.1uF 12 C21 0.1uF G PG 6 SG 4 OFF 5 OUT 12 IN 10 FB 3 U3 MIC4574-3.3BWM 1 2 C18 0.01uF1 2 C17 0.1uF E2 100uF 35V 1 2 R47 47K 1 2 R45 8K45 1 2 R44 4K75 1 2 C16 0.1uF E1 220uF 16V T1 10uF 16V 1 2 R32 47K T2 10uF 16V G 1.23V S2 B140 12 L1 47uH 12 R29 1R 5-12VDC Power Input ZZ4 20V ZZ3 20V ZZ2 20V ZZ1 20V nRXD nTXD CTS RTS Serial and Power Cable RXD TXD nCTS nRTS G G Bluetooth 2 - Motherboard A 1 2 C14 0.1uF To Sc7 Wall Mount PS Flash Cable 1 2 R31 7K50 1 2 R38 4K87 G 12 R33 1K0 12 R35 1K0 12R37 1K0 12R8 1K0 12 C15 0.1uF G FILTER 2 3 8 7 5 6 1 4 9 J3 DB9RA 12 R28 47R 12 R27 47R 1 2 C13 47pF G F1-1F1-2 F1-2F1-1 12 R24 47R 12 R23 47R 1 2 C12 47pF G F2-1F2-2 12 R21 47R 12 R20 47R 1 2 C11 47pF G F3-1F3-2 12 R2 47R 12 R1 47R 1 2 C1 47pF G F4-2F4-1 12 R17 47R 12 R16 47R 1 2 C10 47pF G F5-1F5-2 12 R7 47R 12 R6 47R 1 2 C5 47pF G F6-2F6-1 12 R4 47R 12 R3 47R 1 2 C2 47pF G F7-1F7-2 12 R15 47R 12 R14 47R 1 2 C9 47R G F8-1F8-2 12 R11 47R 12 R10 47R 1 2 C7 47pF G F9-1F9-2 12 R5 47R 12 R22 47R 1 2 C3 47pF G F10-1F10-2 12 R9 47R 12 R18 47R 1 2 C4 47pF G F11-1F11-2 12 R12 47R 12 R19 47R 1 2 C6 47pF G F12-1F12-2 12 R13 47R 12 R25 47R 1 2 C8 47pF G F13-1F13-2 F2-1F2-2 F3-2 F4-2 F5-2 F3-1 F4-1 F5-1 F6-1F6-2 F7-1F7-2 F8-2 F9-2 F8-1 F9-1 F10-1F10-2 F11-1 F12-1 F13-1 F11-2 F12-2 F13-2 C2+ 4 C2- 5 VSS 6 nRXD 8 nTXD 7 CTS 13 RTS 14 C1+ 1 C1- 3 VDD 2 RXD 9 TXD 10 nCTS 12 nRTS 11 G 15 V 16 U4 MAX3232ECWE R46 0R OUT 1 IN 8 S 2 SD 3 V 6 FB 7 G 4 ER 5 U1 MIC2951-03BM R39 0R OPTION 3V3 OR VAROPTION 3V3 OR VAR S1 B140 1V23 1 2 R34 4K7 1 2 R30 4K7 1 2 R36 4K7 1 2 R26 4K7 G G G G G G In0 1 In1 3 In2 5 In3 13 In4 11 In5 9 G 7 V 14 Out5 8 Out4 10 Out3 12 Out2 6 Out1 4 Out0 2 U2 74LCX04 or MIC4574BWM G G MIC2951-3.3BM 1 2 R43 10K 1 2 R41 10K 1 2 R42 10K G 1 2 R40 10K G G SPI_CLK 18 SPI_MOSI 17 SPI_CSB 16 SPI_MISO 19 RXD 22 TXD 23 nCTS 20 nRTS 21 PIO_0 1 PIO_2 25 PIO_3 24 PIO_4 / IRQ1 5 PIO_5 / IRQ2 6 PIO_6 7 PIO_7 8 PIO_1 2 VDD 14 G 15 G 4 G 3 PCM_OUT 9 PCM_CLK 10 PCM_IN 11 PCM_SYNC 12 G 13 G 27 RESET 26 ANT 28 M1 C06X G G 1 2 3 J2 DC Jack 1 2 3 4 5 6 7 8 J1 HEADER1X8 LD4 LD LD3 LD LD2 LD LD1 LD BT41 Lucien Potvin 1 of 1 3V3 3V0 3V0 3V3 3V3 3V3 3V0 3V3 FID1 FID FID2 FID FID3 FID FID4 FID

Test Report:2W04622 Applicant:SMART TECHNOLOGIES INC. 3 Iber Road Stittsville Ontario K2S 1E6 Equipment Under Test:Smart Bluetooth Dongle FCC ID: In Accordance With:FCC Part 15, Subpart C Frequency Hopping Spread Spectrum Transmitters 2400 - 2483.5 MHz Tested By:Nemko Canada Inc. 303 River Road, R.R. 5 Ottawa, Ontario K1V 1H2 Authorized By: J. Harrington, RF Group Manager Date:6 May 2002 Total Number of Pages:54 Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 2 of 54 Table of Contents Section 1. Summary of Test Results......................................................................................3 Section 2. General Equipment Specification........................................................................5 Section 3. Powerline Conducted Emissions..........................................................................7 Section 4. Channel Separation............................................................................................11 Section 5. Pseudorandom Hopping Algorithm...................................................................13 Section 6. Time of Occupancy.............................................................................................32 Section 7. Occupied Bandwidth..........................................................................................35 Section 8. Peak Power Output.............................................................................................39 Section 9. Spurious Emissions.............................................................................................43 Section 10.Block Diagrams....................................................................................................53 Section 11.Test Equipment List............................................................................................54 Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 3 of 54 Section 1.Summary of Test Results General All measurements are traceable to national standards. These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with Part 15, Subpart C, Paragraph 15.247 for Frequency Hopping Spread Spectrum devices. Radiated tests were conducted is accordance with ANSI C63.4-1992. Radiated emissions are made on an open area test site. A description of the test facility is on file with the FCC. THIS TEST REPORT RELATES ONLY TO THE ITEM(S) TESTED. THE FOLLOWING DEVIATIONS FROM, ADDITIONS TO, OR EXCLUSIONS FROM THE TEST SPECIFICATIONS HAVE BEEN MADE. See “ Summary of Test Data”. TESTED BY: Glen Westwell, Wireless Technologist Date:30 April 2002 Nemko Canada Inc., a testing laboratory, is accredited by the Standards Council of Canada. The tests included in this report are within the scope of this accreditation. The results apply only to the samples tested. Nemko Canada Inc. authorizes the above named company to reproduce this report provided it is reproduced in its entirety and for use by the company’s employees only. Any use which a third party makes of this report, or any reliance on or decisions to be made based on it, are the responsibility of such third parties. Nemko Canada Inc. accepts no responsibility for damages, if any, suffered by any third party as a result of decisions made or actions based on this report. This report applies only to the items tested. Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 4 of 54 Summary Of Test Data Name Of TestPara. No.Result Powerline Conducted Emissions15.207(a)Complies Channel Separation15.247(a)(1)Complies Pseudorandom Hopping Algorithm15.247(a)(1)Complies Time of Occupancy15.247(a)(1)(ii)Complies 20 dB Occupied Bandwidth15.247(a)(1)Complies Peak Power Output15.247(b)Complies Spurious Emissions (Radiated)15.247(c)Complies Footnotes: Test Conditions: IndoorTemperature:22°C Humidity:38% OutdoorTemperature:10°C Humidity:40% Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 5 of 54 Section 2.General Equipment Specification Manufacturer: Smart Technologies Inc. Model No.: Smart Bluetooth Dongle Serial No.: 9152 Date Received In Laboratory: 26 March 2002 Nemko Identification No.: #11 Frequency Range:2402 – 2480MHz Number of Channels:79 Channel Spacing:1MHz (typical) Rated Output Power (into antenna):-6 to +4dBm, (0dBm typical) Antenna Gain:2.15dBi Emission Designator:983KF1D Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 6 of 54 Nemko Canada Inc.FCC PART 15, SUBPART C FREQUENCY HOPPING TRANSMITTERS PROJECT NO: 2W04622 EQUIPMENT: Smart Bluetooth Dongle Page 7 of 54 Section 3.Powerline Conducted Emissions Para. No.: 15.207 (a) Test Performed By: Glen WestwellDate of Test: 26 Mar. 2002 Test Results:Complies. Measurement Data:See attached graph(s). ConductorFrequency (MHz) CISPR (dBμV) Average (dBμV) BB/NBBB Corr. (dB) Result (dBμV) Neutral13.8451.5…

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