RUN-USBKW24DUSB Dongle

© Freescale Semiconductor, Inc., 2013. All rights reserved. Freescale Semiconductor Advance Information This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Document Number: MKW22D512V Rev. 0.1, 01/2013 MKW24D512V Package Information Plastic Package 8x8 56-pin LGA Case 2234-01 MC13242


MKW24D512V Ordering Information Device Program flash System RAM Package MKW24D512V (USB) 512 K64 K8x8 LGA MKW22D512V (USB) 512 K64 K8x8 LGA MKW21D256V256 K32 K8x8 LGA 1Introduction The MKW2xDxxxV devices consists of two separate ICs: a 2.4 GHz transceiver and a microcontroller. The MCU is done in the 90 nm thin film storage (TFS) process, is built from the Kinetis platform and is part of the Kinetis portfolio. The transceiver is built using a 180 nm process. The primary target for the MKW2xDxxxV portfolio is to meet the higher performance requirements of ZigBee Pro and ZigBee IP based applications, especially Smart Energy and Commercial Building Automation. This product is a cost-effective solution that matches or exceeds competitive solutions. The following content describes the MKW2xDxxxV. The MKW2xDxxxV portfolio consist of a system on chip for the IEEE® 802.15.4 standard that incorporates a complete, low power, 2.4 GHz 802.15.4 compliant radio frequency transceiver and a Kinetis family low power, mixed-signal ARM® eCortex™- M4 MCU, with a functional set of MCU peripherals integrated into a single package. MKW24D512V Also covers MKW22D512V and MKW21D256V 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Transceiver description . . . . . . . . . . . . . . . . . 6 4 System and power management . . . . . . . . 11 5 Radio Peripherals . . . . . . . . . . . . . . . . . . . . . 12 6 MKW2xDxxxV operating modes . . . . . . . . . 15 7 MKW2xDxxxV electrical characteristics . . 19 8 MCU Electrical characteristics . . . . . . . . . . 22 9 Transceiver electrical characteristics . . . . 66 10Crystal oscillator reference frequency . . . . 70 11Pin assignments . . . . . . . . . . . . . . . . . . . . . . 71 12Packaging information . . . . . . . . . . . . . . . . 76 MKW2xDxxxV Product Electrical Specification, Rev. 0.1 2Freescale Semiconductor 1.1Ordering information 2Features This section provides a simplified block diagram and highlights MKW2xDxxxV features. 2.1Block diagram Figure 1 shows a simplified block diagram of the MKW2xDxxxV, which is an IEEE®802.15.4 standard compatible transceiver. Figure 1. MKW2xDxxxV simplified block diagram Table 1. Orderable parts details Device Program flash System RAM MKW24D512V (USB)512 K64 K MKW22D512V (USB)512 K64 K MKW21D256V256 K32 K MKW2xDxxxV Product Electrical Specification, Rev. 0.1 Freescale Semiconductor3 2.2Radio features •2.4 GHz frequency band of operation •250 kbps data rate with O-QPSK modulation in 5.0 MHz channels with direct sequence spread-spectrum (DSSS) encode and decode •Operates on one of 16 selectable channels per IEEE 802.15.4 specification •Programmable output power •Supports 2.36 to 2.4 GHz Medical Band (MBAN) frequencies with same modulation as IEEE 802.15.4 •Small RF footprint — Differential input/output port used with external balun — Integrated transmit/receive switch — Supports single ended and diversity antenna options — Low external component count — Supports external PA and LNA •Hardware acceleration for IEEE® 802.15.4 2006 packet processing — Random number generator — Support for dual PAN mode •32 MHz crystal reference oscillator with on board trim capability to supplement external load capacitors •Programmable frequency clock output (CLK_OUT) •Bit stream mode (BSM) to monitor packet data with synchronization clock •Advanced Security Module with support for AES encryption •GPIO for Antenna Diversity control •Clocks — 32 MHz crystal oscillator — Internal 1 kHz low power oscillator — DC to 32 MHz external square wave input clock 2.3Microcontroller features In addition all MKW2xDxxxV devices contain the below microcontroller features: •Core: — ARM Cortex-M4 Core delivering 1.25 DMIPS/MHz with DSP instructions (floating-point unit available on certain Kinetis families) — 16-channel DMA for peripheral and memory servicing with minimal CPU intervention •Reliability, Safety and Security: — Hardware cyclic redundancy check engine for validating memory contents/communication data and increased system reliability — Independent-clocked COP for protection against code runaway in fail-safe applications MKW2xDxxxV Product Electrical Specification, Rev. 0.1 4Freescale Semiconductor — External watchdog monitor — Analog tamper detects (voltage, temperature, and clock) — External tamper detect — 256-bit secure storage (asynchronously erased on tamper detect) •Ultra-low power: — 10 low power operating modes for optimizing peripheral activity and wake-up times for extended battery life. — Low–leakage wake-up unit, low power timer, and low power RTC for additional low power flexibility — Industry-leading fast wake-up times •Memory: — FlexMemory with up to 512 KB FlexNVM and up to 4 KB FlexRAM. FlexNVM can be partitioned to support additional program flash memory (ex. bootloader), data flash (ex. storage for large tables), or EEPROM backup. FlexRAM supports — EEPROM byte-write/byte-erase operations and dictates the maximum EEPROM size. — EEPROM endurance capable of exceeding 10 million cycles — EEPROM erase/write times an order of magnitude faster than traditional EEPROM •Connectivity and Communications: — UART, I2C and DSPI •Mixed-signal analog: — Fast, high precision 16-bit ADC. Powerful signal conditioning, conversion and analysis capability with reduced system cost •Timing and Control: — Powerful FlexTimers which support general purpose, PWM, and motor control functions — Programmable Interrupt Timer for RTOS task scheduler time base or trigger source for ADC conversion and pro…

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Document Number: USB-KW2XHWRM Rev. 0.1 03/2014 USB-KW2X Hardware Reference Manual How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale, the Freescale logo, AltiVec, CodeWarrior, ColdFire, ColdFire+,Energy Efficient Solutions logo, PowerQUICC, QorIQ, StarCore, Symphony, and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. CoreNet, Layerscape, QorIQ Qonverge, QUICC Engine, Tower, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ARM and Cortex are registered trademarks of ARM Limited. ARMnnn is the trademark of ARM Limited. © 2014 Freescale Semiconductor, Inc. USB-KW2x Hardware Reference Manual, Rev. 0.1 Freescale Semiconductoriii About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.1Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.2Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.3Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.4Antenna Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.126 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.3Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.4Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Chapter 2 USB-KW24D512 Development Platform Overview and Description 2.1Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2.1USB-KW24D512 Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.3Software and Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Chapter 3 USB-KW24D512 3.1USB-KW24D512 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1.1PCB Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1.2Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1.3Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.2Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.2.1RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.2.2Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 3.2.3Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 3.2.4USB-KW24D512 Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.3Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.3.1Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Chapter 4 PCB Manufacturing Specifications 4.1Single PC…

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§ 15.247(i) Maximum Permissible Exposure RF Exposure Requirements: §1.1307(b)(1) and §1.1307(b)(2): Systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy levels in excess of the Commission’s guidelines. RF Radiation Exposure Limit: §1.1310: As specified in this section, the Maximum Permissible Exposure (MPE) Limit shall be used to evaluate the environmental impact of human exposure to radiofrequency (RF) radiation as specified in Sec. 1.1307(b), except in the case of portable devices which shall be evaluated according to the provisions of Sec. 2.1093 of this chapter. MPE Limit Calculation: EUT’s operating frequencies @ 2400-2483.5 MHz; highest conducted power = -6.03dBm (peak) therefore, Limit for Uncontrolled exposure: 1 mW/cm 2 or 10 W/m 2 EUT maximum antenna gain = 2 dBi. Equation from page 18 of OET 65, Edition 97-01 S = PG / 4R 2 or R = √PG / 4S where, S = Power Density (1 mW/cm 2 ) P = Power Input to antenna (0.25 mW) G = Antenna Gain (1.58 numeric) S = (0.25*1.58/ 4*3.14*400) = 0.00008 mW/cm2

MET Laboratories, Inc. Safety Certification - EMI - Telecom Environmental Simulation 914 WEST PATAPSCO AVENUE • BALTIMORE, MARYLAND 21230-3432 • PHONE (410) 354-3300 • FAX (410) 354-3313 33439 WESTERN AVENUE • UNION CITY, CALIFORNIA 94587 • PHONE (510) 489-6300 • FAX (510) 489-6372 3162 BELICK STREET • SANTA CLARA, CA 95054 • PHONE (408) 748-3585 • FAX (510) 489-6372 13301 MCCALLEN PASS • AUSTIN, TEXAS 78753 • PHONE (512) 287-2500 • FAX (512) 287-2513 The Nation’s First Licensed Nationally Recognized Testing Laboratory June 16, 2014 Freescale Semiconductor Inc. 3501 Ed Bluestein Blvd. Austin, TX 78721 Dear Terrance de Silva, Enclosed is the EMC Wireless test report for compliance testing of the Freescale Semiconductor Inc., KW24D512-USB as tested to the requirements of Title 47 of the CFR, Ch. 1 (10-1-06 ed.), Part 15, Subpart B and ICES-003, Issue 5 August 2012 for a Class B Digital Device, and FCC Part 15 Subpart C and RSS-210, Issue 8, Dec. 2010 for Intentional Radiators. Thank you for using the services of MET Laboratories, Inc. If you have any questions regarding these results or if MET can be of further service to you, please feel free to contact me. Sincerely yours, MET LABORATORIES, INC. Jennifer Warnell Documentation Department Reference: (\Freescale Semiconductor Inc.\EMCA41798-FCC247) Certificates and reports shall not be reproduced except in full, without the written permission of MET Laboratories, Inc. Electromagnetic Compatibility Freescale Semiconductor Inc. Cover Page KW24D512-USB CFR Title 47, Part 15B, 15.247; RSS-210, Issue 8, Dec. 2010 & ICES-003 MET Report: EMCA41798-FCC247 © 2014, MET Laboratories, Inc. Page ii of viii DOC-EMC702 6/18/2009 Electromagnetic Compatibility Criteria Test Report for the Freescale Semiconductor Inc. KW24D512-USB Tested under the FCC Certification Rules contained in Title 47 of the CFR, Parts 15 Subpart B & ICES-003 for Class B Digital Devices & 15.247 Subpart C & RSS-210, Issue 8, Dec. 2010 for Intentional Radiators MET Report: EMCA41798-FCC247 June 16, 2014 Prepared For: Freescale Semiconductor Inc. 3501 Ed Bluestein Blvd. Austin, TX 78721 Prepared By: MET Laboratories, Inc. 914 W. Patapsco Ave. Baltimore, MD 21234 Electromagnetic Compatibility Freescale Semiconductor Inc. Cover Page KW24D512-USB CFR Title 47, Part 15B, 15.247; RSS-210, Issue 8, Dec. 2010 & ICES-003 MET Report: EMCA41798-FCC247 © 2014, MET Laboratories, Inc. Page iii of viii DOC-EMC702 6/18/2009 Electromagnetic Compatibility Criteria Test Report for the Freescale Semiconductor Inc. KW24D512-USB Tested under the FCC Certification Rules contained in Title 47 of the CFR, Parts 15 Subpart B & ICES-003 for Class B Digital Devices & 15.247 Subpart C & RSS-210, Issue 8, Dec. 2010 for Intentional Radiators Andy Shen, Project Engineer Jennifer Warnell Electromagnetic Compatibility Lab Documentation Department Engineering Statement: The measurements shown in this report were made in accordance with the procedures indicated, and the emissions from this equipment were found to be within the limits applicable. I assume full responsibility for the accuracy and completeness of these measurements, and for the qualifications of all persons taking them. It is further stated that upon the basis of the measurements made, the equipment tested is capable of operation in accordance with the requirements of the FCC Rules Parts 15B, 15.247 and Industry Canada standards ICES-003, Issue 5 August 2012, RSS-210, Issue 8, Dec. 2010 under normal use and maintenance. Asad Bajwa, Director, Electromagnetic Compatibility Lab Electromagnetic Compatibility Freescale Semiconductor Inc. Report Status KW24D512-USB CFR Title 47, Part 15B, 15.247; RSS-210, Issue 8, Dec. 2010 & ICES-003 MET Report: EMCA41798-FCC247 © 2014, MET Laboratories, Inc. Page iv of viii DOC-EMC702 6/18/2009 Report Status Sheet Revision Report Date Reason for Revision  June 16, 2014 Initial Issue. Electromagnetic Compatibility Freescale Semiconductor Inc. Table of Contents KW24D512-USB CFR Title 47, Part 15B, 15.247; RSS-210, Issue 8, Dec. 2010 & ICES-003 MET Report: EMCA41798-FCC247 © 2014, MET Laboratories, Inc. Page v of viii DOC-EMC702 6/18/2009 Table of Contents I. Executive Summary .................................................................................................................................................1 A. Purpose of Test ...................................................................................................................................................2 B. Executive Summary ............................................................................................................................................2 II. Equipment Configuration .......................................................................................................................................3 A. Overview .............................................................................................................................................................4 B. References ...........................................................................................................................................................5 C. Test Site ..............................................................................................................................................................5 D. Description of Test Sample .................................................................................................................................6 E. Equipment Configuration ....................................................................................................................................6 F. Support Equipment .............................................................................................................................................6 G. Mode of Operation .........................................................................................................................…

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Photograph 1. Conducted Emissions, Test Setup, Front Photograph 2. Conducted Emissions, Test Setup, Rear (1) Photograph 3. Conducted Emissions, Test Setup, Rear (2) Photograph 4. Radiated Emissions, Test Setup, 30 MHz – 1 GHz, Front Photograph 5. Radiated Emissions, Test Setup, 30 MHz – 1 GHz, Rear Photograph 6. Radiated Emissions, Test Setup, 30 MHz – 1 GHz, Antenna Photograph 7. Radiated Emissions, Test Setup, 1 GHz – 18 GHz, Front Photograph 8. Radiated Emissions, Test Setup, 1 GHz – 18 GHz, Rear Photograph 9. Radiated Emissions, Test Setup, 1 GHz – 18 GHz, Antenna Photograph 10. Conducted Emissions, 15.207(a), Test Setup Photograph 11. Radiated Spurious Emissions, 30 MHz – 1 GHz, Test Setup Photograph 12. Radiated Spurious Emissions, 1 GHz – 18 GHz, Test Setup