RUN1231X-MRBDevelopmental Board
Freescale Semiconductor, Inc.
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Application Details
- Equipment Class
- DXT - Part 15 Low Power Transceiver, Rx Verified
- Date of Grant
- Aug 02, 2012
- Application Purpose
- Original Equipment
- Date of Application
- Jul 09, 2012
- Equipment Note
- Developmental Board
- Frequency Range
- 915.00000000 - 915.00000000
- Country
- United States
Documents & Files
Document Text
Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
Users Manual
Document Number: 12311DHRM Rev. 1 03/2012 12311 Development Hardware Reference Manual How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 [email protected] Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008, 2009, 2010, 2011, 2012. All rights reserved. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductoriii Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.1Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.2Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.3Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.4Antenna Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.126 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.3Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.4Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Chapter 2 MC12311 Development Platform Overview and Description 2.1Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.2.1TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 2.3Driver Considerations . . . . . . . . . . . …
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Attestation Statements
July 24, 2012 American Certified Body, Inc. 6731 Whittier Ave, Suite C110 McLean, VA 22101 Attn: Rich Fabina Ref: FCC ID: RUN1231X-MRB & IC: 6744A-1231XMRB for Freescale Model Numbers: TWR-12311-NA, T W R-12311-KIT-NA, 1231XMRB Dear Rich, This letter is to indicate that the second port on the above referenced models numbers does not function as delivered to the customers. If in the future, Freescale enables this port, Freescale will re-validate thru testing that the port functions within permissible FCC limits. Sincerely, Monica A. Dettling Operations Manager Freescale Semiconductor Dear Rich, Please see responses inserted below Best Regards, Monica From: Rich Fabina [mailto:[email protected]] Sent: Thursday, August 02, 2012 11:52 AM To: Dettling Monica-RA9832; 'Richard Fabina'; 'Richard Fabina'; 'Richard Fabina'; 'Richard Fabina'; 'Richard Fabina'; 'Richard Fabina'; 'Richard Fabina' Cc: Montgomery Steve-RTTT80; 'customerservice' Subject: RE: (STATUS) Request for Technical Information on FCC ID: RUN1231X-MRB & IC: 6744A- 1231XMRB for Freescale Semiconductor (loctite 638) Monica, I need two additional items from you to complete the FCC filing. They are listed below. (1) Please confirm that the Loctite 638 will be applied to the antenna at the factory before the units are shipped to the customers. [Dettling Monica-RA9832] Yes, the Loctite will be applied to the antenna at the factory before the units are shipped to the customers (2) Testing of the lower power SMA connector is not required since we received confirmation that no software has been developed for its use. Please confirm that you understand that a Class II permissive change must be filed in the future should software be developed to make this second SMA port useful for customers. ACB will take care of the rest. [Dettling Monica-RA9832] Please see letter sent to you previously and reattached to this email. We understand we would have to re-test/recertify. Sorry for the slow response but my computer system has been in disarray since we sold our house and moved. I literally spend 1 ½ days trying to get my PDF printer to work so I can send images of the FCC grants to customers like you. Hopefully I got it fixed this morning. Rich Fabina Examining Engineer American Certification Body email: [email protected] USA direct phone: 703-635-2881 USA Corporate: 703-847-4700 USA Corporate fax: 703-847-6888
Block Diagram
12311-MRB Block Diagram
ID Label/Location Info
Board S/N: ##### FCC ID: RUN1231X-MRB IC ID: 6744A-1231XMRB Board S/N: ##### FCC ID: RUN1231X-MRB IC ID: 6744A-1231XMRB Label for Board Model: 1231X-MRB Model: 1231X-MRB 8 mm 22 mm
Internal Photos
EUT(top) EUT (bottom) EUT with ruler (top) EUT with ruler (bottom) Antenna
Operational Description
Document Number: 12311DHRM Rev. 1 03/2012 12311 Development Hardware Reference Manual How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 [email protected] Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008, 2009, 2010, 2011, 2012. All rights reserved. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductoriii Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.1Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.2Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.3Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.4Antenna Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.126 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.3Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.4Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Chapter 2 MC12311 Development Platform Overview and Description 2.1Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.2.1TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 2.3Driver Considerations . . . . . . . . . . . …
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Parts List/Tune Up Info
ItemQuantityAgilePNASSY_OPTReferenceValueDescriptionMfg NameMfg Part Number 14510-75297BH1,BH2,BH3,BH4125 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER 25150-75265DNPC1,C7,C8,C11,C2310PFCAP CER 10PF 50V 5% C0G 0402AVX04025A100JAT2A 31150-78484C23.3pfCAP CER 3.3PF 25V 0.1PF -- 0402AVX04023J3R3BBSTR 42150-30300C3,C96.8PFCAP CER 6.8PF 50V 0.5PF C0G 0402MURATAGRM1555C1H6R8DZ01J 51150-75521C45.6PFCAP CER 5.6PF 50V +/-0.25PF C0G CC0402MURATAGJM1555C1H5R6CB01D 63150-75265C5,C6,C1210PFCAP CER 10PF 50V 5% C0G 0402AVX04025A100JAT2A 71150-75169C1047PFCAP CER 47PF 50V 5% C0G 0402CAL-CHIPGMC04CG470J50NT-LF 81150-30084C138.2PFCAP CER 8.2PF 50V 0.25PF C0G 0402AVX04025A8R2CAT2A 910150-75182C14,C19,C20,C21,C24,C30,C31,C33,C37,C380.1UFCAP CER 0.1UF 16V 10% X7R 0402KEMETC0402C104K4RAC 101150-76335C154.7PFCAP CER 4.7PF 50V 0.25PF C0G 0402MURATAGRM1555C1H4R7CA01D 112150-30297C16,C18220PFCAP CER 220PF 50V 5% C0G 0402KEMETC0402C221J5GAC 123150-30114C17,C27,C280.01UFCAP CER 0.01UF 50V 10% X7R 0402MURATAGCM155R71H103KA55D 134150-75680C22,C25,C34,C3512PFCAP CER 12PF 50V 5% C0G 0402MURATAGRM1555C1H120JZ01D 141150-75204C2610UFCAP CER 10UF 10V 10% X5R 0805MURATAGRM21BR61A106KE19_ 151150-78564C292.2UFCAP CER 2.2UF 10V 10% X7R 0603MURATAGRM188R71A225KE15D 161150-78462C321UFCAP CER 1.0UF 10V 10% X7R 0603MURATAGRM188R71A105KA61D 171150-76334C361000pFCAP CER 1000PF 50V 5% C0G 0402MURATAGRM1555C1H102JA01D 181370-76462D1GREENLED GRN SGL 30MA SMT 0805LITE ONLTST-C171KGKT 192480-75176D2,D3MBR0520LT1GDIODE SCH 0.5A 20V SOD-123ON SEMICONDUCTORMBR0520LT1G 201370-76461D4REDLED RED CLEAR SGL 30MA SMT 0805LITE ONLTST-C171KRKT 212210-75870J1,J2CON_1_SMACON 1 COAX SMA SKT TH -- 376H AUSAMTECSMA-J-P-H-ST-TH1 226210-76752J3,J4,J6,J7,J10,J11HDR 1X2HDR 1X2 TH 100MIL SP 330H SN 115LSAMTECTSW-102-07-T-S 231210-75698J5HDR 2X3HDR 2X3 TH 100MIL CTR 335H AU 95LSAMTECTSW-103-07-S-D 242210-75726J8,J9HDR TH 1X3HDR 1X3 TH 100MIL SP 339H AU 100LSAMTECTSW-103-07-G-S 251210-79741J12961204-6404-ARHDR 2X2 TH 100MIL CTR 323H AU 130L3M961204-6404-AR 261210-75541J13HDR_2X4HDR 2X4 TH 100MIL CTR 330H AU 100LSAMTECTSW-104-07-S-D 271210-11415-09J14HDR 2X9HDR 2X9 TH 100MIL CTR 330H AUSAMTECTSW-109-07-S-D 281210-76001J15HDR_10X2HDR 2X10 TH 100MIL CTR 330H AU 100LSAMTECTSW-110-07-S-D 292180-76516L1,L35.6NHIND AIR 5.6NH@100MHZ 300MA 0.3NH 0402muRataLQG15HN5N6S02D 302180-30075L2,L40.0068UHIND -- 0.0068UH@100MHZ 300MA 5% 0402MURATALQG15HS6N8J02D 312180-75099L5,L633nHIND -- 0.033UH@100MHZ 200MA 5% 0402TOKO INC.LL1005-FHL33NJ 321180-30073L70.0039UHIND -- 0.0039UH@100MHZ 300MA +/-0.3NH 0402MURATALQG15HN3N9S02D 331470-79965R10RES MF ZERO OHM 1/10W -- 0402PanasonicERJ-2GE0R00X 342470-75414R2,R44.7KRES MF 4.7K 1/10W 5% 0603VISHAY INTERTECHNOLOGYCRCW06034K70JNEA 351470-75613R3330RES MF 330 OHM 1/16W 5% 0402VISHAY INTERTECHNOLOGYCRCW0402330RJNED 366470-75407R5,R7,R8,R9,R10,R110RES MF ZERO OHM 1/10W -- 0603VISHAY INTERTECHNOLOGYCRCW06030000Z0EA 371470-75416R610.0KRES MF 10.0K 1/16W 1% 0402VISHAY INTERTECHNOLOGYCRCW040210K0FKED 381470-30313R1215KRES MF 15K 1/16W 5% 0402VISHAY INTERTECHNOLOGYCRCW040215K0JNED 391470-77949R13422RES MF 422 OHM 1/10W 1% 0603YAGEO AMERICARC0603FR-07422RL 401510-77653SW1SW_MOMSW SPST MOM PB 50MA 12V SMTALPS ELECTRIC (USA) INC.SKQYPDE010 413211-75906TL1,TL2,TL3TESTLOOPTEST POINT PAD SIZE 3.4MM X 1.8MM SMTKEYSTONE ELECTRONICS5015 4222211-76643 TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,TP10,T P11,TP12,TP13,TP14,TP15,TP16,TP17,TP18,TP1 9,TP20,TP21,TP22 TPAD_040 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDER NOTACOMPONENTNOTACOMPONENT 431TMP-WF-14692U1MC12311 IC MCU 8BIT 32KB FLASH 2KB RAM 50MHZ 1.8- 3.6V LGA60 Freescale SemiconductorMC12311 441312-79597U2LP2985AIM5-3.3IC VREG LDO 3.3V 150MA 3.8-16V SOT-23-5NATIONAL SEMICONDUCTORLP2985AIM5-3.3/NOPB 451230-77690Y132MHZXTAL 32MHZ 9PF -- SMT 3.2X2.5MMNDKEXS00A-CS02368 461230-76374Y232.768KHZXTAL 32.768KHZ SMT ROHS COMPLIANTEPSON ELECTRONICSFC-135 32.7680KA-A3
Schematics
55 44 33 22 11 D D C C B B A A Table of Contents Block Diagram 2 NOTES3 Revisions Rev DescriptionX1 Initial Release Approved Julio Muñoz Date 31/03/2011 MAIN SCHEMATIC 4 A Proto release 21/04/2011 Julio Muñoz Drawing Title:Size Document Number Rev Date: Sheet of Page Title: Designer:Drawn by:Approved: Wireless Connectivity Operation6501 William Cannon Drive WestAustin, TX 78735-8598 This document contains information proprietary to F reescale Semiconductor and shall not be used for engineering design, procurement or manufacture in w hole or in part without the express written permiss ion of Freescale Semiconductor. ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 TITLE PAGE K.ManjulaJ. MUNOZK.Manjula 1 4 ____ ___ X Drawing Title:Size Document Number Rev Date: Sheet of Page Title: Designer:Drawn by:Approved: Wireless Connectivity Operation6501 William Cannon Drive WestAustin, TX 78735-8598 This document contains information proprietary to F reescale Semiconductor and shall not be used for engineering design, procurement or manufacture in w hole or in part without the express written permiss ion of Freescale Semiconductor. ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 TITLE PAGE K.ManjulaJ. MUNOZK.Manjula 1 4 ____ ___ X Drawing Title:Size Document Number Rev Date: Sheet of Page Title: Designer:Drawn by:Approved: Wireless Connectivity Operation6501 William Cannon Drive WestAustin, TX 78735-8598 This document contains information proprietary to F reescale Semiconductor and shall not be used for engineering design, procurement or manufacture in w hole or in part without the express written permiss ion of Freescale Semiconductor. ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 TITLE PAGE K.ManjulaJ. MUNOZK.Manjula 1 4 ____ ___ X 55 44 33 22 11 D D C C B B A A 1. Unless Otherwise Specified: All resistors are in ohms, 5%, 1/8 WattAll capacitors are in uF, 20%, 50VAll voltages are DCAll polarized capacitors are aluminum electrolytic 2. Interrupted lines coded with the same letter or letter combinations are electrically connected.3. Device type number is for reference only. The nu mber varies with the manufacturer.4. Special signal usage: _B Denotes - Active-Low Signal<> or [] Denotes - Vectored Signals 5. Interpret diagram in accordance with American National Standards Institute specifications, curren t revision, with the exception of logic block symbolo gy. Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 NOTES 2 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 NOTES 2 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 NOTES 2 4 X ___ ___ 55 44 33 22 11 D D C C B B A A Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 Block Diagram 3 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 Block Diagram 3 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 Block Diagram 3 4 X ___ ___ 55 44 33 22 11 D D C C B B A A RESET 20-PIN GPIOSTANDARD HEADER GPIO POWER ON 3.3V LDO REGULATOR BDM J6:»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3 V »SHUNT 3->2 ONLY IF V_EXT = 3V»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PIN S 3 & 4 SHUNTED J5: EXTERNAL SUPPLY POWER MANAGEMENT GPIO MAPPING 32MHz XTAL 32kHz XTAL XTAL_32M XTAL_32K EXTAL_32K XTAL_32K EXTAL_32K XTAL_32K RESET_OUT_B RESET_B EXTAL_32KXTAL_32KKBI1P0 KBI1P0 KBI1P1 KBI1P1 SDASCL SDASCL BKGD BKGD TPM1CH2TPM2CH2 TPM1CH2 KBI2P2 TXD1RXD1KBI1P6KBI1P7KBI1P6 KBI1P7 TPM2CH12TPM1CH12 TPM2CH12 TPM1CH12RESET_IN_BTPM3CH1TPM3CH2TPM3CH3TPM3CH4TPM3CH3TPM3CH1 TPM3CH2 TPM3CH4TPM3CH5 TPM3CH5 UART_CTSUART_RTS UART_CTSUART_RTS RESET_OUT_B RESET_OUT_B TPM2CH2 KBI2P2 TXD1RXD1 V_EXT_IN XTAL_32M_R V_LDO_R PTA5 ENBYP RST_IND_R RESET_SW RST_IND EXTAL_32K_EXT PTB6 DIO5/CLKOUT PTB7 PTB7 DIO5/CLKOUT PTA5 RESET_IN_B VREF_HVREF_L PTD2 PTB6PTB7 EXTAL_32MXTAL_32M MRB-SPI_MOSIMRB-SPI_SS_BMRB-SPI_MISO PTA0PTA1PTA2PTA3PTA4PTA5PTA6PTA7 MRB-SPI_CLK PTA0 PTA1 PTA2PTA3 PTA4 PTA6 PTB0PTB1PTB2PTB3PTB4PTB5 PTB2 PTB3 PTB4 PTB5 PTC0PTC1PTC2PTC3PTC4PTC5PTC6PTC7 PTC3PTC1 PTC2 PTC4 PTC5 PTC6 PTC7 DIO5/CLKOUTDIO4DIO2DIO1PTD3PTD4DIO0 PTD3PTD4 VR_PA RFIO_EXT PA_BOOST RFIO PA_BOOST_EXT PTA5 PTB6 PTA7 PTD2DIO2 DIO3 RESET_IN_B PTA5 EXTAL_32M XTAL_32M DIO3 PTB1PTB0 V_IC VDD V_LED V_IC V_EXT V_BRD V_BRD V_LDO V_UNREG V_LED V_RFV_BRD V_IC V_UNREG V_IC V_IC V_IC VSSA V_IC V_IC V_IC VSSA V_IC V_RF V_BRD V_BRD V_IC Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 MAIN SCHEMATIC 4 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 MAIN SCHEMATIC 4 4 X ___ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-27108 PDF: SPF-27108 A X-1231x-MRB(Navajo) C Tuesday, April 26, 2011 MAIN SCHEMATIC 4 4 X ___ ___ C200.1UFC200.1UF C23.3pfC23.3pf C2212PFC2212PF TP7TP7 BH3 125 BH3 125 C7 10PF DNP C7 10PF DNP C18220PFC18220PF…
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Test Report
1601 North A.W. Grimes Blvd., Suite B Round Rock, TX78665 e-mail:[email protected] (512)244-3371 Fax:(512)244-1846 Freescale Semiconductor, Inc. 6501 William Cannon Dr Austin, TX 78735 Dear applicant: Enclosed is the Wireless Test Report for the Navajo Zigbee Radio by Freescale Semiconductors. This report can be used to demonstrate compliance with FCC and IC requirements for wireless devices in the United States and Canada. If you have any questions, please contact me. Sincerely, Jeffrey A. Lenk President Enclosure Professional Testing (EMI), Inc. Freescale Semiconductor–Navajo Zigbee Radio, Wireless Test Report 13156-10 February 24, 2012 Page 2 of 30 Project 13138-10 Freescale Semiconductor Navajo Zigbee Radio Wireless Test Report Revision 1 Prepared for: Freescale Semiconductor, Inc. 6501 William Cannon Dr Austin, TX 78735 Professional Testing (EMI), Inc. 1601 N. A.W. Grimes Blvd., Suite B Round Rock, Texas78665 February 24, 2012 Reviewed by Written by Jeffrey A. Lenk President Jesse Banda EMC Engineer Professional Testing (EMI), Inc. Freescale Semiconductor–Navajo Zigbee Radio, Wireless Test Report 13156-10 February 24, 2012 Page 3 of 30 Table of Contents Title Page .........................................................................................................................................1 1.0 Introduction ...........................................................................................................................5 1.1 Scope ................................................................................................................................5 1.2 EUT Description ..............................................................................................................5 1.3 Modifications ...................................................................................................................5 1.4 Test Site ...........................................................................................................................6 1.5 Applicable Documents .....................................................................................................6 1.6 Applicable Tests...............................................................................................................6 2.0 Fundamental Field Strength Measurements..........................................................................7 2.1 Test Procedure .................................................................................................................7 2.2 Test Criteria .....................................................................................................................7 2.3 Test Equipment ................................................................................................................8 2.4 Test Results ......................................................................................................................8 3.0 Occupied Bandwidth ...........................................................................................................10 3.1 Test Procedure ...............................................................................................................10 3.2 Test Criteria ...................................................................................................................10 3.3 Test Equipment ..............................................................................................................10 3.4 Test Results ....................................................................................................................10 4.0 Out of Band Spurious Emissions ........................................................................................13 4.1 Test Procedure ...............................................................................................................13 4.2 Test Criteria ...................................................................................................................13 4.3 Test Equipment ..............................................................................................................14 4.4 Test Results ....................................................................................................................14 5.0 Antenna Requirements ........................................................................................................25 5.1 Evaluation Procedure .....................................................................................................29 5.2 Evaluation Criteria .........................................................................................................29 5.3 Evaluation Results .........................................................................................................29 End of Report .............................................................................................................................30 THIS REPORT SHALL NOT BE REPRODUCED EXCEPT IN FULL, WITHOUT THE WRITTEN APPROVAL OF PROFESSIONAL TESTING (EMI), INC. NOTICE:(1) This Report must not be used to claim product endorsement, by NVLAP, NIST, the FCC or any other Agency. This report also does not warrant certification by NVLAP or NIST. (2) This report shall not be reproduced except in full, without the written approval of Professional Testing (EMI), Inc. (3) The significance of this report is depende…
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Contact Information
Applicant
Robert Fielding(Director, Regulatory and Governmental Affairs)
Technical Contact
Professional Testing (EMI), Inc.Jese Banda
[email protected]512-286-2175
1601 North A.W. Grimes · Round Rock · United States
Test Firm
Professional Testing (EMI), Inc.Larry Finn
Technical Specifications
| # | Rule Parts | Frequency Range | Power Output |
|---|---|---|---|
| 1 | 15C | 915 MHz - 915 MHz | - |
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