RUN1323X-MRBDeveloper Board

Document Number: 1323xDHRM Rev. 1.0 04/2011 1323x Development Hardware Reference Manual How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. 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All rights reserved. 1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductori Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety Information 1.1FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.1Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.2Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.3Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.4Antenna Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.2.126 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.3Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1.4Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Chapter 2 MC1323x Development Platform Overview and Description 2.1Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.3Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 2.4General System Specifications . . . . . . . . . …

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1323x Remote Control Motherboard 1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor4-7 Again referring to Figure 4-3, a number of zero-ohm resistors are provided to isolate different circuits and to allow current measurement: •VCC (main 1323x-RCM supply) - resistor R35 •V_LED (all LEDs supply) - resistor R36 •V_TPD (touchpad supply) - resistor R37 •V_ACC (accelerometer supply) - resistor R40 •V_BUZ (buzzer supply) - resistor R42 •V_MRB (1323x-MRB supply) - resistor R43 4.2.2GPIO Connection to 1323x-MRB IO Connectors J8 and J9 (see Figure 4-1) are receptacles that accept the 1323x-MRB pin headers to mount the daughter card. Figure 2-1 shows the 1323x-RCM with the 1323x-MRB mounted. Receptacles J8 and J9 connect to the MC13233 GPIO. To provide better access and versatility to the GPIO, a secondary set of pin headers P1 and P2 is connected in series with the IO signals: •Jumpers must be installed on P1 and P2 to connect 1323x-RCM peripherals and functions •The pin headers provide direct access for connecting custom circuitry to the GPIO •Power and ground to primary connectors J8 and J9 are not enabled though the pin headers Figure 4-4 shows IO Header P1 andP2 pin mapping. External DC Supply1x2 Pin Header J14 2.3 V - 6 VThe input voltage range is determined by the U8 regulator and the diode isolation circuit Two AA BatteriesBattery Holder2.0 V - 3.1 V 1 • The input voltage range reflects the usable range of alkaline cells and the voltage drop incurred by the diode isolation circuit. • The battery source is disabled if another source is connected 1 The minimum operating battery voltage is determined by use model, see Note, Section 4.2.1, “Power Management” Table 4-2. 1323x-RCM Voltage Sources Source Connector Input Voltage Range Description 1323x Remote Control Motherboard 1323x Development Hardware Reference Manual, Rev. 1.0 4-8Freescale Semiconductor Figure 4-4. 1323x-RCM IO Connector J8 and J9 Pin Mapping Table 4-3 list the P1 and P2 pin header function as it relates to the MC13233. Table 4-3. 1323x-RCM P1 and P2 Pin Header Function Description 1323x-REM Header Pins MC13233 Signal Name Description1323x-REM Application / Notes P1-27, P1-28 PTA0/XTAL_32KPort A Bit 2 / 32.768 kHz oscillator output • Drives LED1; jumper required • 32.768 kHz oscillator can be enabled on MRB P1-25, P1-26 PTA1/EXTAL_32KPort A Bit 3 / 32.768 kHz oscillator input • Drives Buzzer; jumper required • 32.768 kHz oscillator can be enabled on MRB P1-13, P1-14 RESET Device asynchronous hardware reset. Active low. Onboard Pullup • Drives touchpad reset; jumper required • Reset signal driven from MRB P1-29, P1-30 PTA2Port A Bit 2. Onboard pull-down for TM • Drive LCD_CTL0; jumper required • Application is LCD enable clock • TM enable P2-13, P2-14 PTA3/IRQPort A Bit 3 / IRQ. • Used; jumper required • Provides interrupt request input IRQ (active low) from accelerometer and touchpad P2-17, P2-18 PTA4/ XTAL_32KOUT Port A Bit 4 / Buffered 32.768 kHz clock output • Drives LED2; jumper required • Optional 32.768 kHz output clock for measuring reference oscillator accuracy (ppm) P1-19, P1-20 PTA5/SDAPort A Bit 5 / IIC Bus data • Used; jumper required • Connects to accelerometer • Defaults to open drain for IIC • Pullup on MRB P1-23, P1-24 PTA6/SCLPort A Bit 6 / IIC Bus clock • Used; jumper required • Connects to accelerometer • Defaults to open drain for IIC • Pullup on MRB P2-1, P2-2PTB0/KBI1P0Port B Bit 0 / KBI1 Input Bit 0RCM switch matrix; jumper required P2-3, P2-4PTB1/KBI1P1Port B Bit 1 / KBI1 Input Bit 1RCM switch matrix; jumper required MR B -SP I _MI SO MR B -U AR T_TXD MR B- KBI 2P2 MR B- KBI 2P0 MRB-SPI_SS MR B -SP I _MOS I MRB-PTA2/LCD_CTL0LCD_CTL0 MR B- PTD 1/ TPM1 MR B- KBI 1P1 MR B- KBI 1P3 MR B- KBI 1P4 MR B- KBI 1P2 UART_TXD MR B- PTD 3/ TPM3 LED1MRB-PTA0 MR B- PTD 4/ C MT MR B- KBI 1P5 BUZZERMRB-PTA1MR B- KBI 2P3 IRQb MR B- KBI 1P0 MR B- KBI 2P1 SPI_CLKMR B -SP I _C LK UART_RXDMR B -U AR T_R XD MR B- KBI 1P6 MRB-PTA4/32K_OUT RSTbMR B -R STbMR B- PTA3/ I RQb LED3MR B -TPM0 12 34 65 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 P1 HDR_2X16 UART_RTSMR B -U AR T_R TS/ K BI 1P7 KMD 1 I2C_SDAMRB -I 2C _SD A KBI 1P6 MRB-PTD7/32M_OUT KMD 3 12 34 65 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 P2 HDR_2X16 MRB-UART_CTS/TPM2UART_CTS KMD 2 KMD 0 KBI 1P3 LED4 KMD 4 KBI 1P4 KBI 1P2 KBI 1P1 KBI 1P0 KBI 1P5 KMD5 SPI _MOSI LED2 I2C_SCLMRB-I2C_SCL 1323x Remote Control Motherboard 1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor4-9 P2-5, P2-6PTB2//KBI1P2Port B Bit 2 / KBI1 Input Bit 2RCM switch matrix; jumper required P2-7, P2-8PTB3//KBI1P3Port B Bit 3 / KBI1 Input Bit 3RCM switch matrix; jumper required P2-9, P2-10PTB4//KBI1P4Port B Bit 4 / KBI1 Input Bit 4RCM switch matrix; jumper required P2-11, P2-12 PTB5//KBI1P5Port B Bit 5 / KBI1 Input Bit 5RCM switch matrix; jumper required P2-21, P2-22 PTB6//KBI1P6Port B Bit 6 / KBI1 Input Bit 6RCM switch matrix; jumper required P1-17, P1-18 PTB7//KBI1P7Port B Bit 7 / KBI1 Input Bit 7 • UART flow control RTS input to MCU; jumper required • Connects to RCM USB <> UART device P2-15, P2-16 PTC0/KBI2P0Port C Bit 0 / KBI2 Input Bit 0RCM switch matrix; jumper required P2-23, P2-24 PTC1/KBI2P1Port C Bit 1 / KBI2 Input Bit 1RCM switch matrix; jumper required P2-19, P2-20 PTC2/KBI2P2Port C Bit 2 / KBI2 Input Bit 2RCM switch matrix; jumper required P2-25, P2-26 PTC3/KBI2P3Port C Bit 3 / KBI2 Input Bit 3RCM switch matrix; jumper required P1-9, P1-10PTC4/SPICLKPort C Bit 4 / SPI clock • Used; jumper required • Connected to serial FLASH on MRB • Connected to serial LCD interface P1-2PTC5/SSPort C Bit 5 / SPI slave select • Unused on RCM • Must be in-active for LCD access • Connected to serial FLASH on MRB P1-6PTC6/MISOPort C Bit 6 / SPI MISO • Unused on RCM • Connected to serial FLASH on MRB P1-3, P1-4PTC7/MOSIPort C Bit 7 / SPI MOSI • Used; jumper required • Connected to serial FLASH on MRB • Connected to serial LC…

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MC13233 TRANSMITTER BLOCK DIAGRAM The MC13233 transmitter block diagram is shown in Figure 1. PSM PA ENCODED DATA (2 M-chips/sec) 16MHz LO1 (2.4 GHz) VCO Synthesizer 32MHz Clock Generation Control Voltage Ref Osc Figure 1. MC13233 Transmitter Block Diagram The transmitter is compatible with the IEEE 802.15.4 Standard 2450 MHz band: • Modulation is 16‐ary quasi‐orthogonal modulation using 0‐QPSK • The LO1 frequency has a tuning range of 2400‐2483.5 MHz • Standard usage for the radio includes 16 channels (using 5 MHz channel spacing) within the tuning range: 1. Channel 11 ‐ 2405 MHz 2. Channel 12 ‐ 2410 MHz 3. Channel 13 ‐ 2415 MHz 4. Channel 14 ‐ 2420 MHz 5. Channel 15 ‐ 2425 MHz 6. Channel 16 ‐ 2430 MHz 7. Channel 17 ‐ 2435 MHz 8. Channel 18 ‐ 2440 MHz 9. Channel 19 ‐ 2445 MHz 10. Channel 20 ‐ 2450 MHz 11. Channel 21 ‐ 2455 MHz 12. Channel 22 ‐ 2460 MHz 13. Channel 23 ‐ 2465 MHz 14. Channel 24 ‐ 2470 MHz 15. Channel 25 ‐ 2475 MHz 16. Channel 26 ‐ 2480 MHz • Logic clock to the Phase Shift Modulator (PSM) is 16 MHz • Digital encoded data is presented to the PSM as “chips” (logic levels) at the rate of 2 mega‐chips/sec. • All clocks are derived from a 32 MHz crystal reference oscillator.

C‐008452 Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB External Photos C‐008452 Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB RF Board Top view C‐008452 Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB RF Board Bottom View

C‐008452 Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB Internal Photos RF Board Top view C‐008452 Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB RF Board Bottom View

1.0 EUT DESCRIPTION 1.1 CONFIGURATION Name Model Revision Serial Number EUT 1323X-MRB 1323X-RCM 1323X-REM 1323X-RCB (MRB+RCM) 1323X-REB (MRB+REM) E4 N/A Power Supply Sceptre PXX5020AWPLUSB/S3 N/A N/A Device Classification Mobile Antenna Integral (5dBi) Modulation O-QPSK EUT Size with Enclosure (H x W x D) (in mm) 1323X-MRB (18.1 x 66.5 x 51); 1323X-RCB (47.1 x 93 x 208.75); 1323X-REB (45.6 x 78.7 x 117.9) EUT Weight (in grams) 1323X-MRB (13.05gr); 1323X-RCB (146.15gr); 1323X-REB (56.2gr) Channels/Frequency Range 16 Channels, 2405 MHz – 2480 MHz Functional Description The application boards included in the kits (RCM, REM, and MRB) are intended as developer boards for OEM’s. The purpose is to aid OEM’s in evaluation and development in order to incorporate the MC1323x ZigBee radio chip into their products. The primary end use is with the integral antenna. The external SMA connector is for OEM’s to verify RF performance. The embedded software, which is loaded onto the MC1323X radio chip mounted onto the MRB, limits the maximum power across all frequencies. The RF circuitry is limited to the MRB. The RCM and REM are the two mother boards that the MRB will work with. The RCM has a two line display, a touchpad, a button array, an accelerometer and a buzzer, whereas the REM has a two row button array only. Both boards can be controlled via USB and powered by USB, batteries or external supply. The MC1323x chip contains an RF transceiver which is an 802.15.4 Standard - 2006 compliant radio that operates in the 2.4 GHz ISM frequency band. The transceiver includes a low noise amplifier, 1mW nominal output power amplifier (PA), internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. This family of products is targeted for wireless RF remote control and other cost-sensitive applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer (RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes. 1.1.1 EUT POWERS Voltage 2.5 VDC Battery, 5 VDC USB, 120/240 VAC 60/50 Hz with Septre Power Supply Model PXX5020AWPLUSB/S3 Number of Feeds 1 (1 Hot, 1 Return)

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The test without permission f Fax: 403-568-69 bit Mode 23X-MR 3XMRB odel 1323x-M CC ID: RUN1 C: 6744A-1323 _________ results do not cov from the testing bod 970 1323X RB B MRB 323X-MRB 3XMRB __________ ver models or prod dy and the custome April 27, 2 MRB ____ ucts not er. 2011 Freescale C0008454 _______ The test resul referred herei NTS Produ c Confident 1.0 IN 1.1 P This Maxi and RSS - which are distance i The user closer th a 1.2 A The Mode • 5 2.0 R In complia environme Limits fo Freque Rang (MHz 30-30 300-15 1500-10 30-30 300-15 1500-10 Friis Tran Pd = (Pou Where, Pd = pow Pout = o u G = gain o R = distan The result Power De e Semicondu 42 _________ lts contained in this n. This test report s ct Integrity Labora tial NTRODUC URPOSE mum Permis s -102 Issue 4, e categorized s maintained documentati o an 20 cm to he ANTENNA SP el 1323xMRB dbi Antenna RF EXPOSU ance with FCC ental impact o r Maximum P ency ge z) E 00 500 0,000 (B) L 00 500 0,000 nsmission Fo ut * G) / (4πR er density (m utput power to of antenna in nce between ted power de ensity = (EIRP uctor __________ s report refer exclu should not be publi atory, 5151-47 th TION sive Exposure RF Exposure as “mobile”. between the on available to ead or body. PECIFICATIO have the foll o Integral ante URE LIMIT C CFR 47 1.1 of human exp Permissible Electric Field Strength (V/m) (A) Limits for 61.4 - - imits for Gen 27.5 - - ormula: ²) W/cm²) o antenna (mW linear scale observation p nsity at a dist P * Duty cycle MPE Calculatio __________ usively to the produ ished or duplicated Street N.E. 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The test without permission f Fax: 403-568-69 mpliance with 3xMRB applies when sion antenna at the Module fications: he table below (RF) radiation Power (mw posures (f=fre 1 f/3 5 ed Exposure 0 f/1 1 iator (cm) culated as follo odel 1323x-M CC ID: RUN1 C: 6744A-1323 _________ results do not cov from the testing bod 970 FCC CFR 47 20 cm or gre s. and antenna w shall be us n as specified r Density w/cm2) equency) 1.0 300 5.0 (f=frequency 0.2 1500 1.0 ows: MRB 323X-MRB 3XMRB __________ ver models or prod dy and the custome April 27, 2 7 1.1310, 2.10 eater separati must not be ed to evalua t d in 1.1303 (b) Average Tim (minutes) 6.0 6.0 6.0 y) 30.0 30.0 30.0 ____ ucts not er. 2011 091 on used te the ). me ) Freescale C0008454 _______ The test resul referred herei NTS Produ c Confident 3.0 M For the pu 3.1 C M Tr S S The table Freq. MHz C 2405 2440 2480 Result Complian 4.0 R 2.5.1 Exe Page 26 o This devi c from the a 2.5.2 Ex e The peak The maxi m The calcu Therefor e e Semicondu 42 _________ lts contained in this n. This test report s ct Integrity Labora tial MPE FIGUR urposes of thi CALCULATION O Maximum EIRP ransmitter Duty (power density (power density below contai Conducted EUT Power (dBm) 3.440 3.550 3.680 t. RSS-102 IS emption from of the Produc ce must be in antenna to a p emption from power outpu mum antenna ulated maximu e the unit is ex uctor __________ s report refer exclu should not be publi atory, 5151-47 th RE s report wors OF WORST CAS = Conducted p y Cycle = 3 y) = (EIRP * Du y) = 0.004788 ns MPE Valu Ant. Gain TX Dut cycl % 5.000 32.6 5.000 32.6 5.000 32.6 SUE 4, RF m Routine Eva t User Manua stalled to ens person. m Routine Eva t of the device a gain is 5 dB um radiated e xempt from R MPE Calculatio __________ usively to the produ ished or duplicated Street N.E. Tel: P st case MPE v SE MPE FIGU power + Antenn 2.62 % duty cy uty Cycle) / (4π 87 W/m² ues for all mea X ty le EIRP (dBm) 20 8.440 20 8.550 20 8.680 EXPOSUR aluation Lim al defines the sure a separa aluation Lim e is 3.68 dBm Bi e.i.r.p. is 8.68 RSS-102 Issue on _________ uct(s) presented fo d in whole or part w 403-568-6605, Page 3 of 3 value is provid RE na gain = 3.68 ycle πR²) = (7.379 m asured chann EIRP (mW) D cy corr So ba E (m 6.982 7.161 7.379 RE EVALUA mits – SAR Ev distance as; ation distance mits – RF Exp m at 2405 MH dBm (0.002 4 e 4, routine ev Mo FC IC __________ or testing. The test without permission f Fax: 403-568-69 ded for highe (dbm) + 5.0 db mW *.3262 )/ ( nels Duty ycle rected ource ased IRP mw) Po Den (s) @ c mw/ 2.2780.00 2.3360.00 2.4070.00 ATION valuation of at least 2 0 posure Evalu z 407 W) which valuation limit odel 1323x-M CC ID: RUN1 C: 6744A-1323 _________ results do not cov from the testing bod 970 st gain anten bi = 8.68 dBm o 4π* 20²) = 0.0 ower nsity @ 20 cm /cm^2 FCC Lim 20 mw/ 00453 1. 00465 1. 00479 1. 0 cm (8 inche ation is less than 5 ts MRB 323X-MRB 3XMRB __________ ver models or prod dy and the custome April 27, 2 na or 7.379 mW 00479 mW/cm C MPE mit @ 0 cm /cm^2 Po De (s) @ c W/ 000 0.00 000 0.00 000 0.00 s) 5 W ____ ucts not er. 2011 m² ower nsity @ 20 cm /M^2 IC M Limi @ 2 cm W/m 4531210 4647410 4788710 MPE it 0 m^2 0 0 0

1323x Development Hardware Reference Manual, Rev. 1.0 5-12Freescale Semiconductor 1323x Remote Extender Motherboard 5.3 Schematic, Board Layout , and Bill of Material Figure 5-8. 1323x-REM Schematic (1 of 2) 55 44 33 22 11 D D C C B B A A V_3V6 V_DC V_LED V_BHL V_MRB V_JACK V_LED V_DC V_SER V_JACK V_BUS V_SER V_BUS V_IRX V_BAT V_USB VCC V_BAT V_USB V_BUS V_MAIN V_SER DATA_MDATA_P Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ POWER ON EXTERNAL SUPPLY.NEVER SHUNT!!! 3.3V BUCK/BOOST REGULATORTO USE TPS63000,REPLACE RESISTORS WITHTHE FOLLOWING VALUES:R45 = 100 OHM, R47 = 1.24MAND POPULATE R46.OUTPUT VOLTAGE WILL BE 3.6V LEDINFRARRED RX 3.3V POWER NETWORK MODULAR REFERENCE BOARD R470R470 TL2TL2 SL14P2T SWITCHSL14P2T SWITCH 123456 789101112 TL5TL5 D11MBR0520LT1GD11MBR0520LT1G TP21TP21 R43 0 R43 0 TP20TP20 12 34 +D -D G V J15USB_TYPE_B 12 34 +D -D G V J15USB_TYPE_B 1234S1S2 C4210UFC4210UF C4310UFC4310UF R46200KDNPR46200KDNP TP27TP27 D12MBR0520LT1GD12MBR0520LT1G F1 0.5A F1 0.5A 1 2 C410.01UFC410.01UF BH4125BH4125 C330.1UFC330.1UF FID2FIDFID2FID L460OHML460OHM 1 2 BT1BATTERY HOLDERBT1BATTERY HOLDER 12 TL3TL3 Q4SI2305Q4SI2305 1 32 R40 0 R40 0 D13MBR0520LT1GD13MBR0520LT1G TP29TP29 R36 0 R36 0 D9 MBR0520LT1G D9 MBR0520LT1G R450R450 BH3125BH3125 TL4TL4 TP25TP25 R39330R39330 C3210UFC3210UF FID1FIDFID1FID D8 MBR0520LT1G D8 MBR0520LT1G BH2125BH2125 LED5REDLED5RED 21 BH1125BH1125 TP19TP19 TP24TP24 J14HDR 1X2J14HDR 1X2 12 TL1TL1 R384.7KR384.7K C404.7uFC404.7uF L3 3.3uH L3 3.3uH 1 2 C390.1UFC390.1UF R4110KR4110K D10 MBR0520LT1G D10 MBR0520LT1G FID3FIDFID3FID TP23TP23 U8 TPS63001 U8 TPS63001 EN 6 GND 9 L1 4 L2 2 PS/SYNC 7 VOUT 1 VIN 5 VINA 8 FB 10 PGND 3 PPAD 11 R35 0 R35 0 1323x Remote Extender Motherboard 1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor5-13 Figure 5-9. 1323x-REM Schematic (2 of 2) 55 44 33 22 11 D D C C B B A A V_3V6 V_DC V_LED V_BHL V_MRB V_JACK V_LED V_DC V_SER V_JACK V_BUS V_SER V_BUS V_IRX V_BAT V_USB VCC V_BAT V_USB V_BUS V_MAIN V_SER DATA_MDATA_P Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ Drawing Title:Size Document Number Rev Date: Sheet of Page Title: ICAP Classification: FCP: FIUO: PUBI: SCH-26117 PDF: SPF-26117 B 1323X REMOTE EXTENDER MOTHERBOARDC Friday, October 02, 2009 POWER MANAGEMENT 44 X_ __ ___ POWER ON EXTERNAL SUPPLY.NEVER SHUNT!!! 3.3V BUCK/BOOST REGULATORTO USE TPS63000,REPLACE RESISTORS WITHTHE FOLLOWING VALUES:R45 = 100 OHM, R47 = 1.24MAND POPULATE R46.OUTPUT VOLTAGE WILL BE 3.6V LEDINFRARRED RX 3.3V POWER NETWORK MODULAR REFERENCE BOARD R470R470 TL2TL2 SL14P2T SWITCHSL14P2T SWITCH 123456 789101112 TL5TL5 D11MBR0520LT1GD11MBR0520LT1G TP21TP21 R43 0 R43 0 TP20TP20 12 34 +D -D G V J15USB_TYPE_B 12 34 +D -D G V J15USB_TYPE_B 1234S1S2 C4210UFC4210UF C4310UFC4310UF R46200KDNPR46200KDNP TP27TP27 D12MBR0520LT1GD12MBR0520LT1G F1 0.5A F1 0.5A 1 2 C410.01UFC410.01UF BH4125BH4125 C330.1UFC330.1UF FID2FIDFID2FID L460OHML460OHM 1 2 BT1BATTERY HOLDERBT1BATTERY HOLDER 12 TL3TL3 Q4SI2305Q4SI2305 1 32 R40 0 R40 0 D13MBR0520LT1GD13MBR0520LT1G TP29TP29 R36 0 R36 0 D9 MBR0520LT1G D9 MBR0520LT1G R450R450 BH3125BH3125 TL4TL4 TP25TP25 R39330R39330 C3210UFC3210UF FID1FIDFID1FID D8 MBR0520LT1G D8 MBR0520LT1G BH2125BH2125 LED5REDLED5RED 21 BH1125BH1125 TP19TP19 TP24TP24 J14HDR 1X2J14HDR 1X2 12 TL1TL1 R384.7KR384.7K C404.7uFC404.7uF L3 3.3uH L3 3.3uH 1 2 C390.1UFC390.1UF R4110KR4110K D10 MBR0520LT1G D10 MBR0520LT1G FID3FIDFID3FID TP23TP23 U8 TPS63001 U8 TPS63001 EN 6 GND 9 L1 4 L2 2 PS/SYNC 7 VOUT 1 VIN 5 VINA 8 FB 10 PGND 3 PPAD 11 R35 0 R35 0

Confidentiality Statement: This report and the information contained herein represent the results of testing articles/products identified and selected by the client. The tests were performed to specifications and/or procedures approved by the client. National Technical Systems (“NTS”) makes no representations expressed or implied that such testing fully demonstrates efficiency, performance, reliability, or any other characteristic of the articles being tested, or similar products. This report should not be relied upon as an endorsement or certification by NTS of the equipment tested, nor does it represent any statement whatsoever as to its merchantability or fitness of the test article or similar products for a particular purpose. This document shall not be reproduced except in full without written approval from National Technical Systems (“NTS”) and the customer. Certification Test Report Freescale Semiconductor 1323X-MRB+1323X-RCM 1323X-MRB+1323X-REM FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB Project Code C-0084542 (Report C-0084542-RA-1-1) March 31, 2011 Prepared for: Freescale Semiconductor Author: Lixin Wang EMC Technologist Approved by: Nick Kobrosly Director of Canadian Operations C-0084542-RA-1-1 1323X-MRB with RCM and REM motherboard Certification Test Report Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB ______________________________________________________________________ The test results contained in this report refer exclusively to the product(s) presented for testing. The test results do not cover models or products not referred herein. This test report should not be published or duplicated in whole or part without permission from the testing body and the customer. NTS Product Integrity Laboratory, 5151-47 th Street N.E. Tel: 403-568-6605, Fax: 403-568-6970 Confidential Page 2 of 49 March 31, 2011 Report Summary Test Facility: National Technical Systems, Canada Product Integrity Laboratory 5151-47 th Street, N.E. Calgary Alberta T3J 3R2 Accreditation Numbers: 0214.22 Electrical 0214.23 Mechanical Accredited by A2LA The American Association for Laboratory Accreditation CLIENTS SERVED: All interested parties FIELDS OF TESTING: Electrical/Electronic, Mechanical/Physical ACCREDITATION DATE:: May 14, 2009 VALID TO: December 31, 2011 Applicant: Freescale Semiconductor, Inc. 2100 E Elliot Road MD EL5 Tempe, AZ 85284 Tel: 480-413-4730 [email protected] Customer Representative: Name: Mark Williams Phone #: 480-413-4730 Email Address: [email protected] C-0084542-RA-1-1 1323X-MRB with RCM and REM motherboard Certification Test Report Freescale Semiconductor FCC ID: RUN1323X-MRB IC: 6744A-1323XMRB ______________________________________________________________________ The test results contained in this report refer exclusively to the product(s) presented for testing. The test results do not cover models or products not referred herein. This test report should not be published or duplicated in whole or part without permission from the testing body and the customer. NTS Product Integrity Laboratory, 5151-47 th Street N.E. Tel: 403-568-6605, Fax: 403-568-6970 Confidential Page 3 of 49 March 31, 2011 Test Summary Appendix Test/Requirement Description Deviations* from: Pass / Fail Applicable FCC Rule Parts Applicable Industry Canada Rule Parts Base Standard Test Basis NTS Procedure A Power line Conducted Emission No No No Pass FCC Subpart C 15.207 (a) FCC Subpart B 15.107 RSS-Gen Issue 3 7.2.4 ICES-003 Issue 4 B 6 dB Bandwidth No No No Pass FCC Subpart C 15.247 (a) (2) RSS 210 Issue 8 A8.2 (a) C Occupied Bandwidth (99% emission bandwidth) No No No N/A N/A RSS-Gen Issue 3 4.6.1 D Pe…

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