S9NSP1MLSPIRIT1 915 MHz Low Power RF Module

ST CONFIDENTIAL February 2014 Doc ID TBD Rev 0.8 Rev 0.8 1/19 www.st.com SPLML-868 and SP1ML-915 SPIRIT1 868 and 915 MHz Low Power RF Modules PRELIMINARY DATASHEET Features  Complete RF ready Spirit1 module  Integrated antenna and crystal  STM32L microcontroller up to 32 MHz  Low power consumption  UART interface with AT command set  Operates from a single 1.8V to 3.6V supply  863 to 870 MHz operation (SP1ML-868)  902 to 928 MHz operation (SP1ML-915)  Output power up to +11.6dBm  Data rates up to 500kbps  Modulation schemes: 2-FSK, GFSK, GMSK, OOK, and ASK  Compact size: 14mm x 13.4mm x 2.5mm  Operating temperature: -40 °C to 85 °C  FCC and CE regulatory approvals Applications  Serial cable replacement  Home automation  M2M industrial control  Service diagnostic  Data acquisition equipment  Machine control  Sensor monitoring  Security systems  Mobile health and medical 2/19 Doc ID TBD Rev 0.8 Rev 0.1 www.st.com Contents 1 Description ........................................................................................... 4 2 Hardware specification........................................................................ 5 2.1 Recommended operating conditions ......................................................................... 5 2.2 Absolute maximum ratings ........................................................................................ 5 2.3 I/O operating characteristics ..................................................................................... 5 2.4 Current consumption ................................................................................................. 6 2.5 RF compliance limits ................................................................................................. 6 2.6 Pin assignment ......................................................................................................... 7 2.7 Pin placement ........................................................................................................... 8 2.8 Hardware block diagram ........................................................................................... 8 3 Hardware design .................................................................................. 9 3.1 Pin usage .................................................................................................................. 9 3.2 Typical application circuit ........................................................................................ 10 3.3 Layout guidelines .................................................................................................... 11 3.4 Recommended footprint .......................................................................................... 12 3.5 Module reflow installation ........................................................................................ 13 4 Mechanical data ................................................................................. 14 4.1 RoHS compliance ................................................................................................... 14 5 Regulatory compliance ..................................................................... 15 5.1 FCC certification ..................................................................................................... 15 5.2 CE certification ........................................................................................................ 15 5.3 Labeling instructions ............................................................................................... 16 5.4 Product manual instructions .................................................................................... 16 6 Ordering Information ......................................................................... 18 Doc ID TBD Rev 0.8 Rev 0.1 3/19 www.st.com List of tables Table 1. Recommended operating conditions .................................................................................... 5 Table 2. Absolute maximum ratings ................................................................................................... 5 Table 3. I/O operating characteristics ................................................................................................. 5 Table 4. Current consumption ............................................................................................................ 6 Table 5. RF compliance limits ............................................................................................................ 6 Table 6. Pin assignment ..................................................................................................................... 7 Table 7. Module pin usage ................................................................................................................. 9 Table 8. Soldering profile ................................................................................................................. 13 Table 12. Ordering information ....................................................................................................... 18 List of figures Figure 1. Pin placement ...................................................................................................................... 8 Figure 2. Hardware block diagram ...................................................................................................... 8 Figure 3. Typical application circuit ................................................................................................... 10 Figure 4. Layout guidelines ............................................................................................................... 11 Figure 5. Recommended footprint ..................................................................................................... 12 Figure 6. Soldering profile ................................................................................................................. 13 Figure 7. Mechanical data ...…

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SPLML – LABELING All dimensions are in millimeters. 13 . 4 14 4 . 14 4 . 89 5 . 1 5 . 85 4.03 4.19 11.22 13.13

This report contains a total of 42 pages and may be reproduced in full only. Partial reproduction may only be done with the written consent of CKC Laboratories, Inc. STMicroelectronics TEST REPORT FOR 915 MHz Low Power RF Module Model SP1ML-915 Tested To The Following Standards: FCC Part 15 Subpart C Sections 15.207 & 15.249 Report No.: 95078-22 Date of issue: January 16, 2014 This test report bears the accreditation symbol indicating that the testing performed herein meets the test and reporting requirements of ISO/IEC 17025 under the applicable scope of EMC testing for CKC Laboratories, Inc. We strive to create long-term, trust based relationships by providing sound, adaptive, customer first testing services. We embrace each of our customers’ unique EMC challenges, not as an interruption to set processes, but rather as the reason we are in business. Page 2 of 42 Report No.: 95078-22 TABLE OF CONTENTS Administrative Information .......................................................................................................................... 3 Test Report Information ............................................................................................................................................ 3 Report Authorization ................................................................................................................................................. 3 Test Facility Information ............................................................................................................................................ 4 Software Versions ...................................................................................................................................................... 4 Site Registration & Accreditation Information .......................................................................................................... 4 Summary of Results ................................................................................................................................................... 5 Conditions During Testing.......................................................................................................................................... 5 Equipment Under Test ............................................................................................................................................... 6 Peripheral Devices ..................................................................................................................................................... 6 FCC Part 15 Subpart C ................................................................................................................................... 7 15.207 AC Conducted Emissions ................................................................................................................................ 7 15.249(a) RF Power Output ..................................................................................................................................... 20 15.249(b) Field Strength of Harmonics .................................................................................................................... 23 15.209 Radiated Emissions ...................................................................................................................................... 27 15.31(e) Voltage Variations ..................................................................................................................................... 30 -20dBc Occupied Bandwidth ................................................................................................................................... 32 Band Edge Compliance ............................................................................................................................................ 37 Supplemental Information .......................................................................................................................... 41 Measurement Uncertainty ...................................................................................................................................... 41 Emissions Test Details .............................................................................................................................................. 41 Page 3 of 42 Report No.: 95078-22 ADMINISTRATIVE INFORMATION Test Report Information REPORT PREPARED FOR: REPORT PREPARED BY: STMicroelectronics Centro Direzionale Colleoni Palazzo Andromeda 3 Agrate Brianza, 20041 Italy Morgan Tramontin CKC Laboratories, Inc. 5046 Sierra Pines Drive Mariposa, CA 95338 REPRESENTATIVE: Giuseppe Scrocchi Project Number: 95078 DATE OF EQUIPMENT RECEIPT: December 16, 2013 DATE(S) OF TESTING: December 16, 2013 - January 6, 2014 Report Authorization The test data contained in this report documents the observed testing parameters pertaining to and are relevant for only the sample equipment tested in the agreed upon operational mode(s) and configuration(s) as identified herein. Compliance assessment remains the client’s responsibility. This report may not be used to claim product endorsement by A2LA or any government agencies. This test report has been authorized for release under quality control from CKC Laboratories, Inc. Steve Behm Director of Quality Assurance & Engineering Services CKC Laboratories, Inc. Page 4 of 42 Report No.: 95078-22 Test Facility Information Our laboratories are configured to effectively test a wide variety of product types. CKC utilizes first class test equipment, anechoic chambers, data acquisition and information services to create accurate, repeatable and affordable test results. TEST LOCATION(S): CKC Laboratories, Inc. 110 Olinda Place Brea, CA 92823 Software Versions CKC Laboratories Proprietary Software Version EMITest Emissions 5.00.14 Immunity 5.00.07 Site Registration & Accreditation Information Location CB # TAIWAN CANADA FCC JAPAN Brea D US0060 SL2-IN-E-1146R 30…

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