S9NZB32C2ZigBee Module

SPZB32W1A2.1 / SPZB32W1C2.1 IEEE 802.15.4 Module Tentative FEATURES • Integrated 2.4GHz , IEEE 802.15.4-compliant transceiver • 3 dBm nominal TX output power • -99 dBm RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Integrated IEEE 802.15.4 PHY and MAC • 128kB Embedded flash and 8kB integrated RAM for program and data storage • 22 GPIO with alternate functions: • GPIOs • UART • I2C • SPI • ADC • 2 16-bit general purpose timers; one 16-bit sleep timer • ADC , sigma-delta converter with 12 bit resolution • On board 24 MHz stable Xtal • Selectable Integrated RC oscillator ( typ 10KHz) or 32.768kHz Xtal for low power operation • 0.8 uA typ power consumption in Deep sleep mode • Watchdog timer and power on reset • Pins available for Non-intrusive debug interface (SIF) • Integrated Antenna (SPZB32W1A2.1) or integrated RF UFL connector for external antenna (SPZB32W1C2.1) • Single voltage supply • FCC and CE compliant • Small Form Factor : 16.4 x 26.5 mm APPLICATIONS • Industrial controls • Sensor Networking • Monitoring of remote systems • Home/Building Automation • Security systems • Lighting controls DESCRIPTION SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use ZigBee ® modules optimized for embedded applications requiring short range performances. These high- performance, very compact modules enable OEMs to easily add short range reach wireless capability to electronic devices by optimizing time-to-market, cost and size of their target applications. The modules are based on STM32W single chip ZigBee® solution which integrates a 2.4GHz, IEEE 802.15.4- compliant transceiver together with an embedded processor. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per ZigBee ® specifications; additionally a 32.768kHz Xtal is provided for low power operation. A single supply voltage is requested to power the modules. An innovative 2.5 GHz RF design and the relevant internal RF Amplifier aboard ensure the optimal exploitation of the link budget, an excellent sensitivity and still low power consumption for battery powered operation. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. A 128kB of embedded flash memory and 8kB of RAM are available for data and program storage. To support user defined applications, a number of peripherals such as GPIO,UART,I2C, ADC and general purpose timers are available and user selectable. Modules are available with two different antenna options: • SPZB32W1A2.1 with integrated ceramic antenna aboard • SPZB32W1C2.1 with UFL RF connector for the connection of an external antenna. (for details on STM32W refer to the related Datasheet ) SPZB32W1A2.1 / SPZB32W1C2.1 2/12 Contents 1 Block diagram ........................................................................................ 3 2 Pin Configuration ....................................................................................3 3 Electrical Characteristics ......................................................................... 4 3.1 Absolute Maximum Ratings ..................................................................... 4 3.2 Recommended Operating Conditions ........................................................... 4 3.3 DC Electrical characteristics ..................................................................... 4 3.4 Digital I/O Specifications ....................................................................... 4 3.5 RF Electrical characteristics ..................................................................... 4 4 Pins Description ....................................................................................5 5 Mechanical Dimensions ............................................................................. 8 6 Soldering ............................................................................................... 9 7 Appendix A - FCC Statement ................................................................. 10 SPZB32W1A2.1 / SPZB32W1C2.1 3/12 1-BLOCK DIAGRAM 2-PIN CONFIGURATION 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 1. SPZB32W1A2.1 Block diagram Figure3. Pin configuration 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 2. SPZB32W1C2.1 Block diagram SPZB32W1A2.1 / SPZB32W1C2.1 4/12 3 – ELECTRICAL CHARACTERISTICS 3.1 - ABSOLUTE MAXIMUM RATINGS Table 1. Absolute maximum ratings Symbol Parameter Min Max Unit VDD Module supply voltage - 0.3 3.6 V Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V Tstg Storage tempeature -40 +85 °C Tsold. Soldering temperature < 10s 250 °C 3.2 - RECOMMENDED OPERATING CONDITIONS Table 2. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD Module supply voltage -40°C < T < +85 C 2.8 3.3 3.6 V Tstg Operating ambient temperature -40 +85 °C 3.3 - DC ELECTRICAL CHARACTERISTICS Table3. DC Electrical Characteristics Symbol Parameter Conditions Min Typ Max Unit IRX RX current Vdd = 3.3 V T= 25 °C 28 mA ITX TX current Po = 3 dBm Vdd = 3.3 V T= 25 °C F=2450 Mhz 32 mA IDS Deep Sleep Current (32.768kHz oscillator) Vdd = 3.3 V T = 25°C 1.3 μΑ 3.4 - DIGITAL I/O SPECIFICATIONS Table 4. Digital I/O Specifications Symbol Parameter Conditions Min Typ Max Unit VIL Low Level Input Voltage 2.8 < Vdd < 3.6 V 0 0.5 x Vdd V VIH High level input voltage 2.8 < Vdd < 3.6 V0.62 x Vdd Vdd V Iil Input current for logic 0 2.8 < Vdd < 3.6 V -0.5 μΑ Iih Input current for logic 1 2.8 < Vdd < 3.6 V 0.5 μΑ Ripu Input pull-up resistor 30 κΩ Ripd Input pull-down resistor 30 κΩ VOL Low level output voltage 0 0.18 x Vdd V VOH High level output voltage 0.82 x Vdd Vdd V IOHS Output source current (standard ) 4 mA IOLS Output sink current (standard) 4 mA IOHH Output source current (high current) 8 mA IOLH Output sink current (high current) 8 mA IOTot Total output current for I/O 40…

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SPZB32W1A2.1 / SPZB32W1C2.1 3/10 1-BLOCK DIAGRAM 2-PIN CONFIGURATION 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 1. SPZB32W1A2.1 Block diagram Figure3. Pin configuration 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 2. SPZB32W1C2.1 Block diagram

SPZB32W1A2.1 / SPZB32W1C2.1 11/12 A.2 - Special requirement for Modular application The following requirements are fulfilled: 1) The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2) The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles. 3) The modular transmitter must have its own power supply regulation: The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. 5) The modular transmitter must be tested in a stand-alone configuration: The RF module was tested in a stand-alone configuration. 6) The modular transmitter must be labelled with its own FCC ID number: The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. 7) The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. 8) The modular transmitter must comply with any applicable RF exposure requirements. • Maximum measured power output: 1.90 mW (2.77 dBm ) • Maximum antenna gain: 2.2 dBi (see also FCC test report) Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm². The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation.

ANTENNA TYPE DEMO BOARD SPZB32W1A2.1 SPZB32W1A2.1 + demo board SPZB32W1C2.1 SPZB32W1C2.1 + demo board

SPZB32W1x2.1 Antenna Gain

SPZB32W1A2.1 / SPZB32W1C2.1 IEEE 802.15.4 Module Tentative FEATURES • Integrated 2.4GHz , IEEE 802.15.4-compliant transceiver • 3 dBm nominal TX output power • -99 dBm RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Integrated IEEE 802.15.4 PHY and MAC • 128kB Embedded flash and 8kB integrated RAM for program and data storage • 22 GPIO with alternate functions: • GPIOs • UART • I2C • SPI • ADC • 2 16-bit general purpose timers; one 16-bit sleep timer • ADC , sigma-delta converter with 12 bit resolution • On board 24 MHz stable Xtal • Selectable Integrated RC oscillator ( typ 10KHz) or 32.768kHz Xtal for low power operation • 0.8 uA typ power consumption in Deep sleep mode • Watchdog timer and power on reset • Pins available for Non-intrusive debug interface (SIF) • Integrated Antenna (SPZB32W1A2.1) or integrated RF UFL connector for external antenna (SPZB32W1C2.1) • Single voltage supply • FCC and CE compliant • Small Form Factor : 16.4 x 26.5 mm APPLICATIONS • Industrial controls • Sensor Networking • Monitoring of remote systems • Home/Building Automation • Security systems • Lighting controls DESCRIPTION SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use ZigBee ® modules optimized for embedded applications requiring short range performances. These high- performance, very compact modules enable OEMs to easily add short range reach wireless capability to electronic devices by optimizing time-to-market, cost and size of their target applications. The modules are based on STM32W single chip ZigBee® solution which integrates a 2.4GHz, IEEE 802.15.4- compliant transceiver together with an embedded processor. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per ZigBee ® specifications; additionally a 32.768kHz Xtal is provided for low power operation. A single supply voltage is requested to power the modules. An innovative 2.5 GHz RF design and the relevant internal RF Amplifier aboard ensure the optimal exploitation of the link budget, an excellent sensitivity and still low power consumption for battery powered operation. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. A 128kB of embedded flash memory and 8kB of RAM are available for data and program storage. To support user defined applications, a number of peripherals such as GPIO,UART,I2C, ADC and general purpose timers are available and user selectable. Modules are available with two different antenna options: • SPZB32W1A2.1 with integrated ceramic antenna aboard • SPZB32W1C2.1 with UFL RF connector for the connection of an external antenna. (for details on STM32W refer to the related Datasheet ) SPZB32W1A2.1 / SPZB32W1C2.1 2/12 Contents 1 Block diagram ........................................................................................ 3 2 Pin Configuration ....................................................................................3 3 Electrical Characteristics ......................................................................... 4 3.1 Absolute Maximum Ratings ..................................................................... 4 3.2 Recommended Operating Conditions ........................................................... 4 3.3 DC Electrical characteristics ..................................................................... 4 3.4 Digital I/O Specifications ....................................................................... 4 3.5 RF Electrical characteristics ..................................................................... 4 4 Pins Description ....................................................................................5 5 Mechanical Dimensions ............................................................................. 8 6 Soldering ............................................................................................... 9 7 Appendix A - FCC Statement ................................................................. 10 SPZB32W1A2.1 / SPZB32W1C2.1 3/12 1-BLOCK DIAGRAM 2-PIN CONFIGURATION 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 1. SPZB32W1A2.1 Block diagram Figure3. Pin configuration 24 MHz Xtal STM32W Tranceiver Vdd SIF GPIO CONTR SIGN RF antenna 32.768 kHz Xtal balun BPF Figure 2. SPZB32W1C2.1 Block diagram SPZB32W1A2.1 / SPZB32W1C2.1 4/12 3 – ELECTRICAL CHARACTERISTICS 3.1 - ABSOLUTE MAXIMUM RATINGS Table 1. Absolute maximum ratings Symbol Parameter Min Max Unit VDD Module supply voltage - 0.3 3.6 V Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V Tstg Storage tempeature -40 +85 °C Tsold. Soldering temperature < 10s 250 °C 3.2 - RECOMMENDED OPERATING CONDITIONS Table 2. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD Module supply voltage -40°C < T < +85 C 2.8 3.3 3.6 V Tstg Operating ambient temperature -40 +85 °C 3.3 - DC ELECTRICAL CHARACTERISTICS Table3. DC Electrical Characteristics Symbol Parameter Conditions Min Typ Max Unit IRX RX current Vdd = 3.3 V T= 25 °C 28 mA ITX TX current Po = 3 dBm Vdd = 3.3 V T= 25 °C F=2450 Mhz 32 mA IDS Deep Sleep Current (32.768kHz oscillator) Vdd = 3.3 V T = 25°C 1.3 μΑ 3.4 - DIGITAL I/O SPECIFICATIONS Table 4. Digital I/O Specifications Symbol Parameter Conditions Min Typ Max Unit VIL Low Level Input Voltage 2.8 < Vdd < 3.6 V 0 0.5 x Vdd V VIH High level input voltage 2.8 < Vdd < 3.6 V0.62 x Vdd Vdd V Iil Input current for logic 0 2.8 < Vdd < 3.6 V -0.5 μΑ Iih Input current for logic 1 2.8 < Vdd < 3.6 V 0.5 μΑ Ripu Input pull-up resistor 30 κΩ Ripd Input pull-down resistor 30 κΩ VOL Low level output voltage 0 0.18 x Vdd V VOH High level output voltage 0.82 x Vdd Vdd V IOHS Output source current (standard ) 4 mA IOLS Output sink current (standard) 4 mA IOHH Output source current (high current) 8 mA IOLH Output sink current (high current) 8 mA IOTot Total output current for I/O 40…

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C communication are strictly prohibite d. Copyright STMicroelectronics. Unhauthorized reproduction and 1 E D 23 (This template format is described o n ADCS procedure No.7353879). B 1 A 2 C 5467 E D DESCRIPTION OF REVISION AND AUTOR 54 VERS.DATE 6 B 7 A 3 TOLERANCES (except where otherwise stated) Material Subsystem Product Group ALL DIMENSIONS ARE IN mm (inch.). REMOVE ALL BURRS AND SHARP EDGES. Colour Page size R 0.812.53.20.2 Machine finish Finish LINEAL MEASURES Drawing No. Code Scale Passed by Drawn by ANG. MEASURES Approved by Date Sheetof Doc. ref. x ROUGHNESS (um) &SCALE A3 A FIRST ISSUE MAGGIONI .XX = 0.01mm .X = 0.05mm No decimal = 0.1mm .X = 030' No decimal = 1 18.42 0 10.67 14.6716.5717.17 18.42 13.31 0 13.31 0 06.3712.3716.5717.17 5.77 6.37 9.37 14.51 15.71 2.4 1.2 2.96 5.96 15.71 16.51 2.4 3.2 0.3 19 13.9 2.7 0.8 0.3 SHIELD FOR STM32W alpacca spessore 0.3 5 : 1 21.06.10 1/1 MNOR 1754 SVILUPPO PEZZO SCALA 2 : 1 8286570A 0ADL 821G 01.09.10 SOLCO PIEGATURA PROFONDITA' 0.15 SCALA 1.000 SCALA 1.000 SCALA 3.000

T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 2 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY CONTENTS 1 General Description of Equipment under Test ........................ 1-3 1.1 APPLICANT............................................................................... 1-3 1.2 MANUFACTURER..................................................................... 1-3 1.3 EQUIPMENT CLASSIFICATION ............................................... 1-3 1.4 BASIC DESCRIPTION OF EQUIPMENT UNDER TEST ..........1-4 1.5 FEATURE OF EQUIPMENT UNDER TEST.............................. 1-5 2 Test Configuration of Equipment under Test .......................... 2-7 2.1 ENVIRONMENTAL CONDITIONS ............................................ 2-7 2.2 DESCRIPTION OF SUPPORT EQUIPMENT............................ 2-7 2.3 INTERFACE IDENTIFICATION AND CONNECTION DIAGRAM OF TEST SYSTEM.......................................................................... 2-8 3 Operation of Equipment under Test ......................................... 3-9 3.1 OPERATING TEST CONDITIONS ............................................ 3-9 4 Tests Identification and Results ............................................. 4-10 4.1 METHODS OF MEASUREMENT ............................................ 4-12 4.2 FREQUENCY RANGE INVESTIGATED ................................. 4-12 5 Measurements and Tests Data................................................ 5-13 6 Additional Technical Information............................................ 6-66 6.1 ELECTROMAGNETICALLY RELEVANT COMPONENTS: .... 6-66 6.2 RFI SUPPRESSION DEVICES: .............................................. 6-66 6.3 EMI PROTECTION DEVICES: ................................................ 6-66 7 Technical Documentation........................................................ 7-67 8 Photographic Documentation ................................................. 8-68 8.1 EUT IDENTIFICATION ............................................................ 8-68 8.2 TEST SET-UP ......................................................................... 8-74 9 Measurement and Test Equipment Instrumentation............. 9-77 T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 3 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY 1 GENERAL DESCRIPTION OF EQUIPMENT UNDER TEST 1.1 APPLICANT NAME STMicroelectronics ADDRESS Via C. Olivetti, 2 – I-20041 Agrate Brianza (MI) COUNTRY ITALY 1.2 MANUFACTURER NAME STMicroelectronics ADDRESS Via C. Olivetti, 2 – I-20041 Agrate Brianza (MI) COUNTRY ITALY 1.3 EQUIPMENT CLASSIFICATION According to the definition 15.3 (o) EUT is a Intentional Radiator operating within the bands 2400-2483,5 MHz so it shall fulfil provisions of 47CFR Part 15 Subpart C – Intentional radiators – and Section 15.247. T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 4 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY 1.4 BASIC DESCRIPTION OF EQUIPMENT UNDER TEST Parameters Value Type of equipment :
ZigBee module general purpose Model:
SPZB32W1A2.1
SPZB32W1C2.1 FCC ID. :
S9NZB32C2 Trade Name:
STMicroelectronics Data cable :
/ Telecom cable :
/ Power supply type :
DC 3.3V AC power input cable :
/ DC power input cable :
/ Model Description SPZB32W1C2.1 Provided with external ANTENOVA Antenna connected with RF reverse SMA connector SPZB32W1A2.1 Provided with integrated RAINSUN Antenna Remark: Between the two models no changes to the basic frequency determining and stabilizing circuitry (including clock and data rates), frequency multiplication stages, basic modulator circuit or maximum conducted output power. No simultaneous transmission is possible. T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 5 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY 1.5 FEATURE OF EQUIPMENT UNDER TEST Power specification
3.3 V dc Operating frequency:
2405 ÷ 2480 MHz (16 Channels) Maximum RF output power:
4,97 dBm Modulation:
O-QPSK Channel Spacing:
>1 MHz Antenna:
Dedicated antenna (1 dBi gain) Rainsun p.n. AN0835
Dedicated antenna (2,2 dBi gain) Antenova mod. Titanic 2.4GHz Part No. 2010B6090-01 RX sensitivity:
-99 dBm Main SW identification
/ Main HW Board identification
/ Peripherals included (for system application)
None Interfaces :
None Integrated interfaces :
None AC adapter:
None T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 6 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY CHANNEL CONFIGURATION Channel (No.) Frequency (MHz) 11 2405.00 12 2410.00 13 2415.00 14 2420.00 15 2425.00 16 2430.00 17 2435.00 18 2440.00 19 2445.00 20 2450.00 21 2455.00 22 2460.00 23 2465.00 24 2470.00 25 2475.00 26 2480.00 T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 7 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY 2 TEST CONFIGURATION OF EQUIPMENT UNDER TEST 2.1 ENVIRONMENTAL CONDITIONS TEST CONDITIONS MEASURED Ambient Temperature 20 ÷ 25 °C Relative Humidity 50 ÷ 60 % Atmospheric Pressure 900 ÷ 1000 mbar 2.2 DESCRIPTION OF SUPPORT EQUIPMENT Here following the details concerning equipment needed for correct operation or loading of the EUT: EQUIPMENT MANUFACTURER MODEL Personal Computer IBM ------------ Test Jig STMicroelectronics ------------ T&TT Laboratory Test Report No. ARSK00174 Date 2010-09-20 page 8 of 77 T ELECOMMUNICATIONS & T ELEMATICS FOR T RANSPORTS L ABORATORY 2.3 INTERFACE IDENTIFICATION AND CONNECTION DIAGRAM OF TEST SYSTEM # Interface Description Maximum length Ref. Document 1 Enclosure Open frame board / / 2 AC mains power input/output port Port not present / / 3 DC power port +5V dc via USB Port furnished on test jig board; ZigBee module: +3.3 V dc / / 4 Signal / control port Port not present / / 5 Antenna port (RF) Dedicated SMD antenna integrated on ZigBee module & external dedicated Antenna / antenna description RF EUT POWER DATA N N N N N N AC TEL B C A DATA N…

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SETUP PHOTO

SETUP RADIATED EMISSION SPZB32W1A2.1 SETUP RADIATED EMISSION SPZB32W1C2.1