UDV-1005242010007SIM900B Wireless Module

Shanghai Simcom Ltd. Mounting SIM900B onto the application platform Use the connector SUNCAGEY BB530-06001-20R to fix the SIM900B onto the customer platform We recommend to use SUNCAGEY Company’s BB530-06001-20R as the board-to-board connector. They are fully compatible each other. This high density SMT connector is designed for parallel PCB-to-PCB applications. It is ideal to use in VCRs, notebook PCs, cordless telephones, mobile phones, audio/visual and other telecommunications equipment where reduced size and weight are important. Following is parameter of BB530-06001-20R. For more details, you can login http://www.suncagey.com for more information. Shanghai Simcom Ltd. Mechanical dimensions of the SUNCAGEY BB530-06001-20R Figure 1: SUNCAGEY BB530-06001-20R board-to-board connector Antenna Interface The RF interface has an impedance of 50Ω. To suit the physical design of individual applications, SIM900B offers alternatives:
Recommended approach: antenna connector on the component side of the PCB
Antenna pad and grounding plane placed on the bottom side. Shanghai Simcom Ltd. Figure 2 : The RF interface of module The antenna can be soldered to the pad, or attached via contact springs. The RF connector in module side is a ultra small surface mount coaxial connectors (Part Number: U.FL-R-SMT, vended by HRS). It has high performance with wide frequency range, surface mountable and reflows solderable. Following is parameter (Figure 36). Certainly the user can visit http://www.hirose-connectors.com/ for more information. To get good RF performance in customer’s design, we suggest the customer to use the matching RF adapter cable which is also supplied by HRS (Part Number: U.FL-LP（V）-040), the following figure 41 is the dimensions of U.FL series RF adapter cable. The customer can get it from the cable’s manufacturer HRS, and for details, please visit http://www.hirose-connectors.com/. Shanghai Simcom Ltd. Unit:mm Figure 3: U.FL-R-SMT Unit:mm Consideration for antenna selection SIM900B module is to be used in mobile or fixed applications only. For other antenna(s) selection, the antenna gain including cable loss must not exceed 7.3 dBi in the 850 MHz Cellular band and 9.0 dBi in the PCS 1900 MHz band, for the purpose of satisfying the requirements of FCC 2.1043 and 2.1091. Consideration for antenna installation The antenna used for this module must be installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located or operating in conjunction with other antennas or transmitters within a host device, except in accordance with FCC multi-transmitter product Shanghai Simcom Ltd. procedures. Compliance of this module in all final product configurations is the responsibility of the Grantee. OEM integrators must be provided with specific information required to satisfy RF exposure compliance for all final host devices and installations. Consideration for antenna maintain OEM integrators can replace the antenna by themselves. They should comply with Consideration for antenna selection and Consideration for antenna installation.

a Hardware Design SIM900B_HD_V1.03 SIM900B Hardware Design Document Title: SIM900B Hardware Design Ve r s i o n : 1.03 Date: 2010-06-24 Status: Release Document Control ID: SIM900B_HD_V1.03 General Notes SIMCom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by SIMCom. The information provided is based upon requirements specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information which is the property of SIMCom Limited, copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2010 SIM900B_HD_V1.03 24.06.2010 2 SIM900B Hardware Design Contents Contents .....................................................................................................................................................................3 Version history...........................................................................................................................................................7 1 Introduction.............................................................................................................................................................8 1.1 Related Documents.......................................................................................................................................8 1.2 Terms and Abbreviations...............................................................................................................................8 1.3 Safety Caution ............................................................................................................................................. 11 2 SIM900B Overview..............................................................................................................................................13 2.1 SIM900B Key Features...............................................................................................................................13 2.2 SIM900B Functional Diagram....................................................................................................................15 2.3 SIM900B Evaluation Board........................................................................................................................16 3 Application Interface.............................................................................................................................................18 3.1 SIM900B Pin Description...........................................................................................................................18 3.2 Operating Modes.........................................................................................................................................21 3.3 Power Supply..............................................................................................................................................22 3.3.1 Power Supply Pins.............................................................................................................................23 3.3.2 Minimizing Power Losses.................................................................................................................24 3.3.3 Monitoring Power Supply .................................................................................................................24 3.4 Power Up and Power Down Scenarios........................................................................................................24 3.4.1 Turn on SIM900B..............................................................................................................................24 3.4.2 Turn Off SIM900B............................................................................................................................26 3.4.3 Restart SIM900B Using the PWRKEY Pin.......................................................................................28 3.5 Power Saving..............................................................................................................................................28 3.5.1 Minimum Functionality Mode..........................................................................................................28 3.5.2 Sleep Mode (Slow Clock Mode).......................................................................................................29 3.5.3 Wake Up SIM900B from SLEEP Mode...........................................................................................29 3.6 Summary of State Transitions (except SLEEP mode).................................................................................29 3.7 RTC Backup................................................................................................................................................30 3.8 Serial Interfaces...........................................................................................................................................31 3.8.1 Function of serial port & debug port supporting...............................................................................33 3.8.2 Software Upgrade and Software Debug...........................................................…

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Development Kit Manual SIM900B-EVB_UGD_V1.01 SIM900B EVB User Guide SIM900B-EVB_UGD_V1.01 2 14.04.2010 Document Title: SIM900B EVB User Guide Ve r s i o n : 1.01 Date: 2010-04-14 Status: Release Document Control ID: SIM900B-EVB_UGD_V1.01 General Notes Simcom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Simcom. The information provided is based upon requirements specifically provided to Simcom by the customers. Simcom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by Simcom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information which is the property of SIMCOM Limited., copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2010 NOTE ：This device is to be used in mobile or fixed applications only. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located or operating in conjunction with other antennas or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. Compliance of this device in all final product configurations is the responsibility of the Grantee. OEM integrators and end-user must be provided with specific information required to satisfy RF exposure compliance for all final host devices an installations. SIM900B EVB User Guide SIM900B-EVB_UGD_V1.01 3 14.04.2010 Contents Contents ............................................................................................................................................3 1. SIM900B EVB ..............................................................................................................................5 2. EVB accessory ..............................................................................................................................7 3. Accessory Interface .......................................................................................................................8 3.1 Power Interface ...................................................................................................................8 3.2 Audio Interface....................................................................................................................9 3.3 SIM card interface.............................................................................................................10 3.4 Antenna Interface .............................................................................................................. 11 3.5 RS232 Interface.................................................................................................................12 3.6 Operating Status LED .......................................................................................................13 4. Test Interface ...............................................................................................................................13 4.1 Serial Interface ..................................................................................................................14 4.2 J2---KEY & CTRL............................................................................................................15 4.3 J3---LCD & I/O.................................................................................................................16 5. EVB and accessory equipment....................................................................................................17 6. Illustration: ..................................................................................................................................18 6.1 Running:............................................................................................................................18 6.2 Connecting Net and calling ...............................................................................................18 6.3 Downloading .....................................................................................................................18 6.4 Turns off ............................................................................................................................18 Figure Index FIGURE 1： EVB TOP VIEW ............................................................................................................... 5 FIGURE 2： EVB BOTTOM VIEW...................................................................................................... 6 FIGURE 3： EVB ACCESSORY........................................................................................................... 7 FIGURE 4： POWER INTERFACE ...................................................................................................... 8 FIGURE 5： AUDIO INTERFACE ....................................................................................................... 9 FIGURE 6： SIM CARD INTERFACE ............................................................................................... 10 FIGURE 7： ANTENNA INTERFACE ............................................................................................... 11 FIGURE 8： SERIAL PORT AND DEBUG PORT ............................................................................. 12 FIGURE 9： STATUSLED.............…

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Long Term Confidentiality Request Letter Shanghai Simcom Ltd. Building A, SIM Technology BuildingˈNo.633ˈJinzhong RoadˈChangning DisdrictˈShanghai P.R. China 200335 (date) 2010-6-28 MET Laboratories, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: CONFIDENTIALITY REQUEST FOR (Modular/SIM900B/ FCC ID:UDV-1005242010007) To Whom It May Concern: This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the (Block Diagram, Schematics) required to be submitted with this application be permanently withheld from public review. SPECIFY REASON FOR REQUEST (i.e. the above documents are company proprietary information that could never get into the possession of your competition). Please contact me if there is any information you may need. Sincerely, Print name: Yongsheng Li Title: Director Date: 2010-6-28 TCBJ FORM-4 Issued by: TCB Administrator Revision 5 7/16/2009

{Date} 2010-7-2 Dear Application Examiner, {Company Name: Shanghai Simcom Ltd, model: SIM900B, FCC ID: UDV-1005242010007}, would like to have your authorization as a modular approval specific to {the mobile device such as Access Point and Router.....} The requirements of Public Notice DA00-1407 have been met and shown on the following statements. 1. “The modular transmitter must have its own RF shielding.”: {Details Here} Cover by shield cover 2. “The modular transmitter must have buffered modulation/data inputs.”: Yes, please refer to operational description. 3. “The modular transmitter must have its own power supply regulation.”: DC 3.6V-4.4V 4. “The modular transmitter must comply with the antenna requirements of section 15.203 and 15.204(C).”: {Details Here} Special connector show as below: 5. “The modular transmitter must be tested in a stand-alone configuration”: Yes Shanghai Simcom Ltd 6. “The modular transmitter must be labeled with its own FCC ID number.”: FCC ID:UDV-1005242010007 7. “The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements.”: Yes, please refer to operational description. 8. “The modular transmitter must comply with any applicable RF exposure requirements.”: Complied with FCC rules 47 CFR &2.1091 and FCC OET Bulletin 65 supplement C Please refer to report:SHEMO10050067103 Shanghai Simcom Ltd 9. The device which use this module in final product should contian fellowing infomation in obvious place: This product cotians the module FCC ID:UDV-1005242010007 Please contact me if you have any further questions. Regards, {Name, Title & Signature} Bruce Zhan Project Engineer

Request for Additional Information for EMC Certification TCBJ FORM-13 EMC Issued by: TCB Administrator 4/23/2008 Company: Shanghai Simcom Ltd. Composite Device: Yes: No: MT#: 29534 FCC Direct Filing: Yes: No: Permit But Ask: Yes: No: FCC ID: UDV-1005242010007 FCC Rule Part: 22/24 UPN: 8460A-20100524007 RSS Standard: RSS-132&133 FRN: 0017938671 Class II PC/Reassessment: Yes: No: Dear Bruce, Thank you for your application. In order for us to process your approval, the following must be addressed. Please provide a response in a timely manner to avoid delays or dismissals. Technical Review: 1. This application seems to be for the SIM900B EVB device which incorporates a Modular 22/24 transmitter onto a PCB with interface connections. Please confirm the extent of the EUT. If the Interface Board is included, please include this board in the external and internal photo exhibits. If the interface board is not part of the EUT, please justify the Class B Computer Peripheral application. The SIM900B EVB is just an auxiliary device for test and develop. It will not install in the final house device. 2. The (SIM300B EVB) Users Manual states: For other antenna(s) not described in this filing the antenna gain included cable loss must not exceed 7.3 dBi in the 850 MHz Cellular band and 12.7 dBi in the PCS 1900 MHz band, for the purpose of satisfying the requirements of 2.1043 and 2.1091. Please note that the antenna gain values currently specified in the Manual have not been justified in the application. The MPE estimation has been calculated with a 1 dBi gain antenna in both bands. Please either supply an updated RF Exposure exhibit for the higher gain antennas or provided an updated manual with the maximum gain allowed in the application. We deleted the antenna’s description. The client use only the antenna as the antenna specification. 3. Please note that the 15B Form 731 listed the Equipment Class as PCB, were PCB applies to the Part 22/24 portion and JBP applies to the Class B Computer Peripheral portion of the application. We have updated the 731 form 15B description (JBP). 4. The EVB board photos in the Users Manual show a power input port, which is connected to an accessory 5VDC power adaptor. The Class B Computer Peripheral application indicated that AC Conducted Emissions are not applicable. FCC Part 15 Subpart B requires AC Conducted Emissions on anything that directly or indirectly connects to the AC mains. Please provide AC Conducted Emissions compliance data/information in the test report. We have updated the FCC 15B report – add the AC conducted emission test. 5. The Industry Canada Representative cover letter provided by Micron Electronics Canada Ltd. States that the Applicant is Micron Electronics Canada Ltd, when in fact the Applicant is Shanghai Simcom Ltd. Please provide a revised letter. We have updated the Canadian Representative cover letter. 6. Please submit a Modular Approval Cover letter specific to the Industry Canada IC Number and requirements of RSS-GEN Section 7.1.1. Additionally, part of the modular requirements is that guidance is provided to OEM customers of the labeling requirements of the final host device into which the module is installed. Please provide this guidance and label wording that will be provided to the OEM installers. This has been provided. 7. The Users Manual submitted in this application is a manual only for the EVB Development Kit, not the module itself. Please provide the OEM Installation Manual which clearly provides installation guidance for the Module itself. The Development Kit manual clearly shows that the vehicle-mount antenna is provided, but is this antenna also provided with the module when the module is supplied to the OEM installers? If the module is not supplied with the antenna, how is the OEM made aware of the antenna restrictions for Request for Additional Information for EMC Certification TCBJ FORM-13 EMC Issued by: TCB Administrator 4/23/2008 their installation? Please be sure that the OEM installers are provided with a list of all antennas that can be used with this device. Please see the “SIM900B module usermanual.pdf”, it includes the module’s construction and technical items. At page 49, it explains the Antenna Interface and antenna requirement. 8. The original request indicated that Modular Approval applications must be provided with guidance on labeling that is provided to the OEM installers. You indicated that additional information was provided, but this information was not provided for review. Please provide the OEM Installation guidance for labeling of the final host device. Please amend the FCC Modular Approval request letter to address the modular labeling requirements. Please see the “Modular Approval Letter Request for Additional Information rev2.pdf”. Please see the section 6 of SIM900B module usermanual.pdf for product install requirements. 9. Modular Approval is restricted to the combination of transmitter and antenna. Please update the FCC and IC Modular approval request letters to indicate the antennas that are acceptable for use with this device to ensure compliance. Just stating that there is a unique antenna connector is not sufficient to meet the antenna requirements for modular approval. Please see the document: Modular Approval Letter Request for Additional Information rev2.pdf. Added the information: The device which uses this module in final product should contain following information in obvious place – This product contains the module FCC ID: UDV-1005242010007 According to the GSM 850 MPE evaluation formula S = PG* Duty factor / 4πR 2 (Report: SHEMO10050067103_v1.0_official) section 14.3-page 9), we know that: Peak power = 2041.74mW Duty cycle = ¼ R(distance to the center of radiated of antenna) = 20cm S(limit 0.55mW) we can cal the G(max) = 5.42dBi (GSM850) We also can cal G(max) = 9.85dBi (GSM1900) So, we think the antenna gain limit for OEM installer is 5.42dBi for GSM840, 9.85dBi for GSM1900. Is this r…

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External Photo Front view Back View

Label Location

Internal Photo

General Technical Description Model: SIM900B Date: 2010-05-28 Brand: SIMCOM 1. Scope This document shows and provides the more detail information about the platform we used. The basic description for the Baseband and RF section are also included. SIM900B designed by SIMCOM is a quad band module which support GSM/GPRS. The baseband circuit is based on STE and RF circuit is based on RFMD. It works at quad bands, GSM850, EGSM900, DCS1800, and PCS1900 band. CPU clock is based on 26MHz crystal.The main IC include PNX4851, RF7161 and Combo Flash, etc. Detailed information, please refer to the following. 3. RF We use the PAM RF7161 supports the GSM/GPRS system, which include RF power amplifier and antenna switch for quad-band GSM/GPRS applications. The functional block diagram is as following. Figure 2 This design also has other RF device, such as saw filter and 26M crystal etc. 4. Baseband Baseband architecture comprises mainly 2 chips: Include PNX4851 and Combo Flash. The functional block diagram is as following. Figure 3 The Combo Flash is a Multi Chip Package Memory which combines 64M or 32M bit Nor Flash Memory and 32M or 16M bit pSRAM.

序号料号型号物料描述单耗位号（TOP面） 10 S00011000094 RC0402JR-070RL MCR01MZPJ000 RC1005J000CS 0402WG J0000TCE RES MF 0R +/-5% 1/16W CH 0402 RO 10 R110 R411 R501 FB201 FB501 FB502 R401 R402 R406 R410 S00011000009 MCR01MZPJ180 RC0402JR-0718RL 0402WG J0180TCE RES MF 18R +/-5% 1/16W CH 0402 RO S00011000104 RC0402FR-0718RL 0402WGF180 JTCE RES MF 18R +/-1% 1/16W CH0402 RO 30 S00011000006 MCR01MZSJ101 RC0402JR-07100RL RC1005J101CS 0402WG J0101TCE RES MF 100R +/-5% 1/16W CH 0402 RO 1 R508 S00011000180 MCR01MZPJ331 RC0402JR07330RL 0402WG J0331TCE RES MF 330R +/-5% 1/16W CH0402 RO S00011000139 RC0402FR-07330RL 0402WGF3300TCE RES MF 330R +/-1% 1/16W CH0402 RO 50 S00011000048 MCR01MZSJ222 RC0402JR-072K2L RC1005J222CS 0402WG J0222TCE RES MF 2.2KR +/-5% 1/16W CH 0402 RO 5 R206 R503 R509 R506 R507 60 S00011000002 MCR01-MZS-J-103 RC0402JR-0710KL RC1005J103CS 0402WG J0103TCE RES MF 10KR +/-5% 1/16W CH 0402 RO 3 R202 R205 R407 70 S00011000197 NCP15XH103F03RC RES NTC 10KR +/-1% 1/10W CH 0402 RO 1 R204 80 S00012100454 GRM0335C1H1R0CD01 CAP COG 1PF +/-0.25PF 50V CH0201 RO 2 C124 C125 90 S00012100148 GRM0335C1H1R5CD01 CAP COG 1.5PF +/-0.25P 50V CH0201 RO 2 C130 C131 100 S00012100136 C1005C0G1H1R8CT CC0402CRNPO9BN1R8 GRM1555C1H1R8CZ01D CAP COG 1.8PF +/-0.25PF 50V CH0402 RO 1 C101 110 S00012100197 GRM0335C1H1R8CD01D CC0201CRNPO9BN1R8 CAP COG 1.8PF +/-0.25P 50V CH0201 RO 4 C126 C127 C128 C129 120 S00012100254 GRM1555C1H8R2CZ01D CC0402CRNP09BN8R2 CAP COG 8.2PF +-0.25PF 50V CH0402 RO 2 C104 C107 130 S00012100022 CM05CG220J50AH CC0402JRNPO9BN220 CL05C220JB5NNNC GRM1555C1H220 JZ01D CAP COG 22PF +/-5% 50V CH0402 RO 1 C117 140 S00012100261 CM05CG330J50AH CC0402JRNPO9BN330 CL05C330JB5NNNC GRM1555C1H330JZ01D CAP COG 33PF +/-5% 50V CH0402 RO 17 C108 C109 C110 C112 C113 C301 C506 C507 C509 C510 C511 C512 C513 C514 C515 C517 C302 150 S00012100050 C1005C0G1H560JT UMK105CG560 JV-F CAP COG 56PF +/-5% 50V CH0402 RO 2 C114 C115 S00012100277 GRM1555C1H102JA01D CL05C102 JB5NNNC CAP COG 1NF +/-5% 50V CH0402 RO R102 R104 产品BOM表 BOM名称：SIM900B_V1.02装配料单 BOM编号：SIM900B_V1.02_BOMZ100507 ROHS 【产品名称：SIM900B 产品硬件料号：S2-1042C PCB版本：V1.02 】 拟制：QIUJU.HUANG 审核： 批准： 404 R101 R103 R105 R106 202 C205 C207 C2171603 S00012100278 GRM155R71H102JA01D CHIP C/C 1NF +-5% 50V X7R 0402 RO S00012100109 GRM155R71C104KA88D CL05B104K05NNNC CAP X7R 100NF +/-10% 16V CH0402 RO S00012100298 CC0402KRX5R7BB104 CL05A104KO5NNNC EMK105B J104KV-F CAP X5R 100NF +/-10% CH0402 16V RO S00012100003 CM05X5R104K10AH C1005X5R1A104KT CC0402KRX5R6BB104 GRM155R61A104KA01D CAP X5R 100NF +/-10% 10V CH0402 RO 180 S00012100088 JMK105BJ105KV-F CC0402KRX5R5BB105 CL05A105KQ5NNNC GRM155R60 J105KE19D CAP X5R 1UF +/-10% 6.3V CH0402 RO 5 C206 C208 C211 C212 C213 S00012100008 C1608X5R1A475KT C1608X5R1A475KT CAP X5R 4.7UF +/-10% 10V CH0603 RO S00012100185 C1608Y5V1A475ZT CAP CM2 4.7UF +80/-20% 10V CH0603 RO 200 S00012100344 JMK212BJ226MG-T C2012X5R0J226MT CL21A226MQQNNNE GRM21BR60 J226ME39L CAP X5R 22UF +/-20% 6.3V CH0805 RO 2 C120 C602 S00014100037 MLK1005S1N0STMLK1005S1N0ST RO S00014100164 LQG15HS1N0S02D S00014100368 SDCL1005C1N0STDF S00014100085 LQW15AN2N7B00D IND HIGH 2.7NH +/-0.1NH CH 0402 RO S00014100156 LQW15AN2N7C00D IND HIGH 2.7NH +/-0.2NH CH0402 RO 230 S00014100372 SDCL1005C3N3STDF MLK1005S3N3ST LQG15HS3N3S02D HK10053N3S-T IND HIGH 3.3NH +/-0.3NH CH0402 RO 2 L112 L113 240 S00014100400 LQP03TN5N1H00 IND HIGH 5.1NH +/-3% CH0201 RO 1 L117 S00014100046 LQW15AN15NG00DLQW15AN15NG00D RO S00014100346 SDWL1005C15NJSTF AQ105 15N J-T IND COIL 15NH +/-5% CH0402 RO 260 S00014100324 LQP03TN18NHOOD IND HIGH 18NH +/-3% CH0201 RO 1 L120 S00014100179 CXFU0212-4R7 IND LOW 4.7UH +/-20% CH2.65*2.65 RO S00014100134 NR3010T4R7M IND LOW 4.7UH +/-20% NR3010 RO S00014100309 CXTU0212-4R74.7UH电感 RO S00014100263 CKP25204R7M-T IND LOW 4.7UH +/-20% CH 1008 RO RO S00014200069 MS3V-T1R-32.768KHZ- 12.5PF-30PPM 32K晶振 RO S00014500002 SSP-T7-F(12.5PF,± 20PPM) SSP-T7-F(12.5PF,±20PPM) RO 290 S00013600060 B39182-B9500-L310 SAWEN942MCN0F00 IC SAW GSM1800/GSM900 1.8*1.4 RO 1 U103 S00013600012 SAFEA1G96FA0F00R12FILT 1960MHZSAW DCS4F RO S00013600138 SF14-1960M5UB50 1411 尺寸 1900MHZ RX 声表 面波滤波器 RO S00013600028 B39202-B9403-K610 SAFEA1G96FA0F00R12 IC SAW GSM1.96GHZ 1.4*1.1 RO C205 C207 C217 17012 C118 C210 C215 C216 C305 C502 C503 C504 C505 C518 C519 C601 1603 1906 C202 C203 C209 C214 C508 C516 210 IND HIGH 1NH +/-0.3NH CH0402 RO 2 C102 L110 L111 2501 L102 2201 2701 L201 2801 X201 3001 U105 S00013600011 SAFEA881MFL0F00R12FILT 881.5MHZSAW DCS4F RO S00013600025 B39881-B9400-K610 SAFEA881MFL0F00R12 IC SAW GSM881.5MHZ 1.4*1.1 RO S00014200108 CX3225SB26000E1FZF10 CRY UNIT 26M 9.1PF +/- 10PPM CH3225 RO S00014200117 1C326000AA0AS CRY XO 26M 10PF +/-10PPM CH3225 RO 330 S00013700044 PNX4851EL1UM IC BAS+RF TRANCEIVER+PM RO 1 U101 340 S00013600217 RF7161 IC TRANSMIT MODULE Q-BAND 6.63*5.24 RO 1 U102 350 S00013400139 M36W0R5040U6ZS IC MEMO 32M FLASH+16M SRAM TFBGA56 RO 1 U302 S00013500017 ESDA6V1-5W6(E)TVS RO S00013500035…

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