2ADHKWBZ451H

Microchip Technology Inc.

Wireless MCU module with BLE 5.2 compliant and Zigbee 3.0 Radio

Application Details

Equipment Class: DTS - Digital Transmission System
Date of Grant: Apr 18, 2024
Application Purpose: Original Equipment
Date of Application: Apr 18, 2024
Equipment Note: Wireless MCU module with BLE 5.2 compliant and Zigbee 3.0 Radio
Frequency Range: 2405.00000000 - 2480.00000000
Company: Microchip Technology Inc.
Country: United States

Documents & Files

Select a file to view

Attestation Statements

Cover Letter(s)

ID Label/Location Info

RF Exposure Info

Test Report

Contact Information

Applicant

HRUSHIKESH VASUKI(Vice President, Business Unit General Manager, WSG)

[email protected]480-792-0762Fax: 480-792-4112

Technical Contact

Microchip Technology Inc.HRUSHIKESH VASUKI

[email protected]480-792-0762

2355 West Chandler Blvd. · CHANDLER, Arizona · United States

Test Firm

TUV Rheinland Taiwan Ltd. Taipei Testing Lab.Ivan Hsieh

[email protected]+886 2-2172-7000Fax: +886-2-2172-1322

Technical Specifications

#	Rule Parts	Frequency Range	Power Output
2	15C	2.40 GHz - 2.48 GHz	118.60 mW

Modular Type

Single Modular Approval

Confidentiality

Long Term

Grant Notes

Single Modular Approval. Output power listed is peak conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM integrators. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and not be co-located with any other transmitters except in accordance with FCC multi-transmitter product procedures. OEM integrators must be provided with transmitter operating conditions for satisfying RF exposure compliance. Only the antenna(s) listed in this filing can be used. The Grantee is responsible for providing the documentation required for modular use. The responsibility for the use of this module, in all configurations utilized or contemplated, remains with the Grantee. The host integrator must follow the integration instructions provided by the module manufacturer and ensure that the composite system end product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules and to KDB Publication 996369.