2AK9F-FT8FPods FS100

Statement NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Quick Start Guide TRULY WIRELESS STEREO EARPODS WITH QUAD MIC ENVIRONMENTAL NOISE CANCELLATION FCC Compliance FCC ID2AK9F-FT8 FCC Compliance This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1)this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Titan Company Limited Agent Authorization Company: Titan Company Limited Address: Integrity, #193, Veerasandra, Electronics City P.O., Off Hosur Main Road Bangalore India Product Name: FPods FS100 Model Number(s): FT8 Product Description: FPods FS100 We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature: Date: 2023-01-13 Name: Somprabh Singh Company: Titan Company Limited

Report No.: AGC12162230101AP03 Page 1 of 4 EXTERNAL PHOTOS WHOLE VIEW OF EUT TOP VIEW OF EUT Report No.: AGC12162230101AP03 Page 2 of 4 BOTTOM VIEW OF EUT FRONT VIEW OF EUT Report No.: AGC12162230101AP03 Page 3 of 4 BACK VIEW OF EUT LEFT VIEW OF EUT Report No.: AGC12162230101AP03 Page 4 of 4 RIGHT VIEW OF EUT ****************************************End of Report*************************************

FCC ID Label Location The product does not have enough space to place the label, and FCC ID label is reflected in the user manual and package, as below:

Report No.: AGC12162230101AP03 Page 1 of 6 INTERNAL PHOTOS Left - VIEW OF EUT(PORT) OPEN VIEW OF EUT Report No.: AGC12162230101AP03 Page 2 of 6 VIEW OF BATTERY INTERNAL VIEW OF EUT (FIGURE 1) BT Antenna Report No.: AGC12162230101AP03 Page 3 of 6 INTERNAL VIEW OF EUT (FIGURE 2) INTERNAL VIEW OF EUT (FIGURE 3) Report No.: AGC12162230101AP03 Page 4 of 6 Right - VIEW OF EUT(PORT) OPEN VIEW OF EUT Report No.: AGC12162230101AP03 Page 5 of 6 VIEW OF BATTERY INTERNAL VIEW OF EUT (FIGURE 1) BT Antenna Report No.: AGC12162230101AP03 Page 6 of 6 INTERNAL VIEW OF EUT (FIGURE 2) INTERNAL VIEW OF EUT (FIGURE 3) ****************************************End of Report*************************************

RF EXPOSURE EVALUATION 1. PRODUCT INFORMATION Product Description FPods FS100 Model Name FT8 FCC ID 2AK9F-FT8 2. EVALUATION METHOD According to 447498 D01 General RF Exposure Guidance v06 The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances ≤ 50 mm are determined by: [(max. power of channel, including tune-up tolerance, mW)/(min. test separation distance, mm)] ·[√f(GHz)] ≤ 3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. Where f(GHz) is the RF channel transmit frequency in GHz Power and distance are rounded to the nearest mW and mm before calculation 3. CALCULATION BR&EDR: P t =1.935dBm=1.56mW The value of the Maximum output power P t is referred to the test report of the CFR47 §15.247. The result for RF exposure evaluation SAR=(1.56mW / 5mm).[√2.480GHz)]=0.490<3.0 for 1-g SAR and ≤ 7.5 for 10-g extremity SAR. 4. CONCLUSION The SAR evaluation is not required.

承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN3216F245H08 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type H08 版本 VERSION ： V1.6 日期 ISSUE DATE ： 2022/01/05 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 11261台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 11261, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 3216 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 P/N: WAN3216F245H08 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 3216 F 245 H 08 A B C D E F A Product Series Antenna B Dimension L x W 3.2 x 1.6mm (±0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode PIFA & Single Feeding F Antenna type Type = 08 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN3216F245H08 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.75 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension 2 nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=5.9*5.0mm) FootPrint (Unit : mm) ◆ 2 nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) Matching Circuit 50 ohm transmission Line 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 81.46% 1.67 dBi 2.56 dBi 2450MHz 84.75% 1.75 dBi 2.46 dBi 2500MHz 82.68% 1.70 dBi 2.52 dBi Chamber Coordinate System X Y Z 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 8 9.0±0.5 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40°C and 30~70% RH. 2. Recommended products shoul…

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Page 1 of 56 FCC Test Report Report No.: AGC12162230101FE03 FCC ID : 2AK9F-FT8 APPLICATION PURPOSE : Original Equipment PRODUCT DESIGNATION : FPods FS100 BRAND NAME : Fastrack MODEL NAME : FT8 APPLICANT : Titan Company Limited DATE OF ISSUE : Jan. 13, 2023 STANDARD(S) : FCC Part 15.247 REPORT VERSION : V1.0 Attestation of Global Compliance (Shenzhen) Co., Ltd Report No.: AGC12162230101FE03 Page 2 of 56 REPORT REVISE RECORD Report Version Revise Time Issued Date Valid Version Notes V1.0 / Jan. 13, 2023 Valid Initial Release Report No.: AGC12162230101FE03 Page 3 of 56 TABLE OF CONTENTS 1. VERIFICATION OF CONFORMITY .................................................................................................................. 5 2. GENERAL INFORMATION .............................................................................................................................. 6 2.1. PRODUCT DESCRIPTION ........................................................................................................................ 6 2.2. TABLE OF CARRIER FREQUENCYS ....................................................................................................... 6 2.3. RECEIVER INPUT BANDWIDTH .............................................................................................................. 7 2.4. EXAMPLE OF A HOPPING SEQUENCY IN DATA MODE ......................................................................... 7 2.5. EQUALLY AVERAGE USE OF FREQUENCIES AND BEHAVIOUR ......................................................... 7 2.6. RELATED SUBMITTAL(S) / GRANT (S) .................................................................................................... 8 2.7. TEST METHODOLOGY ............................................................................................................................. 8 2.8. SPECIAL ACCESSORIES ......................................................................................................................... 8 2.9. EQUIPMENT MODIFICATIONS ................................................................................................................. 8 2.10. ANTENNA REQUIREMENT..................................................................................................................... 8 3. MEASUREMENT UNCERTAINTY ................................................................................................................... 9 4. DESCRIPTION OF TEST MODES ................................................................................................................. 10 5. SYSTEM TEST CONFIGURATION ................................................................................................................ 11 5.1. CONFIGURATION OF EUT SYSTEM ...................................................................................................... 11 5.2. EQUIPMENT USED IN TESTED SYSTEM .............................................................................................. 11 5.3. SUMMARY OF TEST RESULTS .............................................................................................................. 11 6. TEST FACILITY .............................................................................................................................................. 12 7. PEAK OUTPUT POWER ................................................................................................................................ 13 7.1. MEASUREMENT PROCEDURE ............................................................................................................. 13 7.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 13 7.3. LIMITS AND MEASUREMENT RESULT .................................................................................................. 14 8. 20DB BANDWIDTH ........................................................................................................................................ 18 8.1. MEASUREMENT PROCEDURE ............................................................................................................. 18 8.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 18 8.3. LIMITS AND MEASUREMENT RESULTS ............................................................................................... 19 9. CONDUCTED SPURIOUS EMISSION........................................................................................................... 23 9.1. MEASUREMENT PROCEDURE ............................................................................................................. 23 Report No.: AGC12162230101FE03 Page 4 of 56 9.2. TEST SET-UP (BLOCK DIAGRAM OF CONFIGURATION) .................................................................... 23 9.3. MEASUREMENT EQUIPMENT USED .................................................................................................... 23 9.4. LIMITS AND MEASUREMENT RESULT .................................................................................................. 23 10. RADIATED EMISSION ................................................................................................................................. 37 10.1. MEASUREMENT PROCEDURE ........................................................................................................... 37 10.2. TEST SETUP ......................................................................................................................................... 39 10.3. LIMITS AND MEASUREMENT RESULT ............................................................................................... 40 10.4. TEST RESULT........................................................................................................................................ 40 11. NUMBER OF HOPPING FREQUENCY .............................................................................................…

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Report No.: AGC12162230101AP02 Page 1 of 2 TEST SETUP PHOTOS RADIATED EMISSION TEST SETUP BELOW 1GHz RADIATED EMISSION TEST SETUP ABOVE 1GHz Report No.: AGC12162230101AP02 Page 2 of 2 RF CONDUCTED TEST SETUP ****************************************End of Report*************************************