A8TBM57SPPSYC2ABluetooth Module

Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date Revision Content Version 2012/03/08 Preliminary Draft Version 0.2 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 2 Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ....................................................................................................................................... 3 1.2. Features ........................................................................................................................................................ 3 1.3. Application .................................................................................................................................................... 4 1.4. Certifications ................................................................................................................................................. 4 2. Product Specification ...................................................................................................... 5 2.1. Chipset .......................................................................................................................................................... 5 2.2. Interfaces ...................................................................................................................................................... 5 2.3. Hardware Design Considerations ................................................................................................................. 5 3. Hardware Architecture ................................................................................................... 10 4. Compatibility Requirements .......................................................................................... 10 5. Environmental Requirements ....................................................................................... 11 5.1. Temperature ............................................................................................................................................... 11 5.2. Humidity ...................................................................................................................................................... 11 Appendix A: Dimension and Foot Print ................................................................................. 12 Appendix B: Product Image .................................................................................................... 13 Appendix C: PIN Assignment ................................................................................................. 14 Appendix D: Reflow Profile ..................................................................................................... 16 Appendix E: Schematic ........................................................................................................... 17 Appendix F: Reference Schematic ......................................................................................... 18 Appendix G: Test Board Layout Information ......................................................................... 19 Appendix H: Test Board Layout Information ......................................................................... 19 Appendix H: Label Information ............................................................................................... 19 Appendix I: Packaging Information ........................................................................................ 20 Appendix I: Reversion History ................................................................................................ 21 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 3 1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power consumption to keep low battery. The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification. *Notice: 1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC ID may void the FCC authorization to operate this equipment. 2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains FCC ID: A8TBM57SPPSYC2A”. 1.1. Major Components - iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor) - Serial EEPROM 8K (1024*8) TSSOP 8P 1.2. Features - Bluetooth 3.0 EDR compliant - Low power 1.8V RF operation - RF transmitter output power Class 2 - RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm - Internal ROM and 4Mibts of flash - HCI over UART - I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and the iPod, iPhone and iPad) - 1 LED driver - 2.4GHz ceramic chip antenna CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 4 1.3. Application - GPS - Printers - Electric Scale - Blood Pressure Monitors - Bar code Scanner - Industrial Applications (CNC, PLC, RFID) - Embedded systems 1.4. Certifications - Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511 - FCC ID: A8TBM57SPPSYC2A CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 5 2. Product Specification 2.1. Chipset 7x7 mm 2 48 pin QFN IS1657NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - HCI over URAT up to 921600 bps - I2C …

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ATTACHMENT Photo Documentation Page 1 of 2 Product: Bluetooth Module Type Designation: BM57 SPP+

FCC ID: A8TBM57SPPSYC2A BM57SPPSyC2_V2 Label and Location

ATTACHMENT Photo Documentation Page 2 of 2 Product: Bluetooth Module Type Designation: BM57 SPP+

Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date Revision Content Version 2012/03/08 Preliminary Draft Version 0.2 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 2 Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ....................................................................................................................................... 3 1.2. Features ........................................................................................................................................................ 3 1.3. Application .................................................................................................................................................... 4 1.4. Certifications ................................................................................................................................................. 4 2. Product Specification ...................................................................................................... 5 2.1. Chipset .......................................................................................................................................................... 5 2.2. Interfaces ...................................................................................................................................................... 5 2.3. Hardware Design Considerations ................................................................................................................. 5 3. Hardware Architecture ................................................................................................... 10 4. Compatibility Requirements .......................................................................................... 10 5. Environmental Requirements ....................................................................................... 11 5.1. Temperature ............................................................................................................................................... 11 5.2. Humidity ...................................................................................................................................................... 11 Appendix A: Dimension and Foot Print ................................................................................. 12 Appendix B: Product Image .................................................................................................... 13 Appendix C: PIN Assignment ................................................................................................. 14 Appendix D: Reflow Profile ..................................................................................................... 16 Appendix E: Schematic ........................................................................................................... 17 Appendix F: Reference Schematic ......................................................................................... 18 Appendix G: Test Board Layout Information ......................................................................... 19 Appendix H: Test Board Layout Information ......................................................................... 19 Appendix H: Label Information ............................................................................................... 19 Appendix I: Packaging Information ........................................................................................ 20 Appendix I: Reversion History ................................................................................................ 21 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 3 1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power consumption to keep low battery. The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification. *Notice: 1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC ID may void the FCC authorization to operate this equipment. 2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains FCC ID: A8TBM57SPPSYC2A”. 1.1. Major Components - iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor) - Serial EEPROM 8K (1024*8) TSSOP 8P 1.2. Features - Bluetooth 3.0 EDR compliant - Low power 1.8V RF operation - RF transmitter output power Class 2 - RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm - Internal ROM and 4Mibts of flash - HCI over UART - I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and the iPod, iPhone and iPad) - 1 LED driver - 2.4GHz ceramic chip antenna CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 4 1.3. Application - GPS - Printers - Electric Scale - Blood Pressure Monitors - Bar code Scanner - Industrial Applications (CNC, PLC, RFID) - Embedded systems 1.4. Certifications - Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511 - FCC ID: A8TBM57SPPSYC2A CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 5 2. Product Specification 2.1. Chipset 7x7 mm 2 48 pin QFN IS1657NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - HCI over URAT up to 921600 bps - I2C …

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R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 1 sheet 190-1 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application ANTENNA PRODUCTS Feb, 2008 Ver.5 R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 2 sheet 190-2 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application Quick Reference Data Centre Frequency 2.45 GHz Bandwidth 2.38 ~ 2.59 GHz VSWR 2.0 (Max.) Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 2.45 dBi Impedance 50Ω Operating Temperature -25~85 o C Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to soldering heats 260°C , 10sec. Maximum Power 1W R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 3 sheet 190-3 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 1. Mechanical Data (5.1 x 1x 1 mm³) CAN4311851002453K Bottom-Side View Top-Side View 5.1 mm 1.0 mm 1.0 mm R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 4 sheet 190-4 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 2. Dimension of Footprint 6.1 mm 1.4 mm 1.3 mm 0.80+- 0.15mm 5.1+- 0.1mm 1.05+- 0.1 mm Bottom Side R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 5 sheet 190-5 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 3. Evaluation Board Dimension and Outlook Ground plane in backside 50 ohm Line π-shape match circuit (0 ohm) R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 6 sheet 190-6 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 4. Measured S-parameter S 11 VSWR R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 7 sheet 190-7 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 5.The Definition of X-Y-Z Plane X X Y Y Z Z R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 8 sheet 190-8 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 6. The Environment of Antenna Radiation Pattern Anechoic Chamber Dimension=10(m) × 6(m) × 6(m) R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 9 sheet 190-9 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 7. Radiation Pattern R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 10 sheet 190- 10 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency 8. Reliability Test IEC 384-10/ CECC 32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 Mounting The antenna can be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive No visible damage 4.5 Visual inspection and dimension check Any applicable method using × 10 magnification In accordance with specification (chip off 4mm) 4.6.1 Antenna Central Frequency at 20 o C Standard test board in page 4 4.8 Adhesion A force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate No visible damage Bond strength of plating on end face Mounted in accordance with CECC 32 100, paragraph 4.4 No visible damage 4.9 Conditions: bending 0.5 mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length No visible damage 4.10 20(Tb) Resistance to soldering heat 260 ± 5 °C for 10 ± 0.5 s in a static solder bath Satisfy the original electrical specification after soldering. Resistance to leaching 260 ± 5 °C for 30 ± 1 s in a static solder bath Using visual enlargement of × 10, dissolution of the termination shall not exceed 10% R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 5010 Ceramic Chip Antenna for Bluetooth/Wimax Application CAN4311 851 XX 245 3K Feb, 2009 v5 Tommy Chen Page 11 sheet 190- 11 A4 Justin Liu Oscar Lu Yageo Taiwan / High Frequency IEC 384-10/ CECC 32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.11 20(Ta) Solderability Zero hour test, and test after storage (20 to 24 months) in original atmosphere; un-mounted chips completely immersed for 2 ± 0.5 s in 235 ± 5°C. The termination must be well tinned, at least 75% is well tinned at termination 4.12 4(Na) Rapid change of temperature -25 °C (30 minutes) to +85 °C (30 minutes); 100 cycles No visible damage Central Freq. Change ± 6% 4.14 3(Ca) Damp heat 500 ± 12 hours at 60 °C; 90 to 95 % RH No visible damage 2 hours recovery Central Freq. Change ± 6% 4.15 Endurance 500 ± 12 hours at 85 °C; No visible damage 2 hours recovery Central Freq. Change ± 6% ■ Notice (shipping and storage during transportation) In order to ensure some quality, it is suggested to follow the condition during shipping : • Temperature : -40~70°C • Humidity : 45~75% ■ Notice (storage condition) In order to ensure the solderability of the termination, it is suggested to follow the condition for storage : • Temperature : 15~30°C • Humidity : 45~75% • Prevent corrosive gas (SO 2 , NO X , NH 3 , Cl 2 , ..etc) • It is better to use products within 6 months. Solderability should be confirmed again if exceed 6 months. R&D Print date 09/02/24 June, 2008 v3 Sept, 2008 v4 501…

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Item Part Number Q'ty Description Reference Value QVL 1 59.300032.81 1 XTAL 16M 9pF 5pF 3.2*2.5 10ppm FUND. SMD X1 X4P-16MHZ SIWARD 2 61.65010C.01 1 ANT CAN431185104245 2.4GHZ L5.0 W1.0 H1.0 ANT1 CAN4311851042453K YAGEO 3 62.100221.71 1 CHIP RES 10K 5% 1/16W 0402 R4 10K EVER OHMS 4 62.220141.71 2 CHIP RES 2.2K 1% 1/16W 0402 R2,R1 2K2/1% WALSIN; EVER OHMS 5 62.470121.71 1 CHIP RES 4.7K 5% 1/16W 0402 R3 4K7 EVER OHMS 6 63.100311.22 1 CHIP CAP C 0.1U 16V K 0603 X7R C18 0.1u/16V 7 63.100411.22 1 CHIP CAP C 1U 16V K 0603 X7R C9 1u/16V EDEN, TDK 8 63.100431.36 5 CHIP CAP C 1U 10V K 0402 X5R C14,C15,C16,C17,C19 1u/10V TDK 9 63.100501.26 4 CHIP CAP C 10U 6.3V K 0603 X5R C3,C5,C8,C12 10u/6.3V TDK 10 63.1C2047.31 1 CHIP CAP C 1.2P 50V B 0402 NPO C6 1.2p/50V EDEN;WALSIN 11 63.1C8046.31 1 CHIP CAP C 1.8P 50V C 0402 NPO C4 1.8p/50V WALSIN 12 63.9C0046.31 2 CHIP CAP C 9P 50V C 0402 NPO C13,C11 9p/50V TDK; EDEN 13 67.2L700S.31 1 CHIP IND 2.7nH S 0402 L1 2.7nH ACX 14 67.4L700S.31 1 CHIP IND 4.7nH S 0402 L2 4.7nH ACX 15 72.CP20CU.00 1 Apple iPod Authentication Coprocessor 2.0C DFN 8P U5 iPod CP Apple 16 73.24C08D.00 1 IC EEPROM IS24C08A 8K(1024*8) TSSOP 8P U4 IS24C08A ISSI 17 iSSC main chip 1 iSSC 1657NM Bluetooth chip U2 IS1657NM-406 iSSC

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 17 Appendix E: Schematic EAN LDO18_O C12 10u/6.3V LDO33_O RST_N USB_DP P20 C8 10u/6.3V P27 SW_BTN BT_RF ANT1 CAN4311851042453K 21 P16 C4 1.8p/50V 5V_IN C11 9p/50V C19 1u/10V LDO18_O SAR_BAT C13 9p/50V C16 1u/10V P25 C14 1u/10V LDO18_O P13 R3 4K7 1 2 C15 1u/10V WAKEUP LDO18_O C9 1u/16V P04 C6 1.2p/50V LDO33_O LDO18_O QFN48-SPP Bridge IS1657NM 8 48 6 1 3 7 27 9 25 5 2 11 2021 12 13 29 35 26 22 32 34 33 28 191823 3841404945 4 474346443942 10 1415161724 37 36 31 30 P1_6/WP 1V8_GND P1_4/TX_CLS1 LDO18_O PMULDO_O P1_5/RX_CLS1 VDD_IO P1_2/SCL HCI_TXD P0_4 WAKEUP GND P2_1P2_2 1V8 VDD_IO P2_7/MISO XO _ P 1V8 EAN P0_7 VDD_XO VDD_FIO P2_6/NCS P2_4P2_0RST_N VCC_RF AVDD_SAR RTX EP SW_BTN NC LDO18_IN BAT_IN_5V LDO33_O BAT_IN RX SAR_BAT P1_3/SDA USB_DPUSB_DMUSB_VDD1V8_U_PHCI_RXD LED1 XO _ N P2_5/SCLK P2_3/MOSI USB_DM P24 P21 L2 4.7nH 12 LDO33_O PMULDO_O P26 C3 10u/6.3V LDO33_O P23 HCI_RXD P12 L1 2.7nH 12 LDO33_O LED1 P07 LDO18_O LDO18_O C5 10u/6.3V P22 HCI_TXD C17 1u/10V LDO18_O VBAT_IN X1 X4P-16MHZ-HLT 41 32 C7 NP-0402 1 2 SW_BTN P21 HCI_RXD P27 P24 P23 LDO33_O P16 BM57_V2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1617 18 19 32 31 30 29 28 27 26 25 24 23 22 21 20 15 GND SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DMP20 P24 P21 BT_RF GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 USB_DP P12 LED1 P20 P22 USB_DM USB_DP P07 HCI_TXD LDO18_O P13 EAN P26 VBAT_IN 5V_IN SAR_BAT PMULDO_O P25 RST_NP04 WAKEUP

Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 2 von 37 Page 2 of 37 TEST SUMMARY 5.1.1 ANTENNA REQUIREMENT RESULT: Passed 5.1.2 PEAK OUTPUT POWER RESULT: Passed 5.1.3 20DB BANDWIDTH RESULT: Passed 5.1.4 CONDUCTED SPURIOUS EMISSIONS AND FREQUENCY BAND EDGE MEASURED IN 100KHZ BANDWIDTH RESULT: Passed 5.1.5 SPURIOUS EMISSION RESULT: Passed 5.1.6 FREQUENCY SEPARATION RESULT: Passed 5.1.7 NUMBER OF HOPPING FREQUENCY RESULT: Passed 5.1.8 TIME OF OCCUPANCY RESULT: Passed 6.1.1 ELECTROMAGNETIC FIELDS RESULT: Passed Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 3 von 37 Page 3 of 37 Contents 1. GENERAL REMARKS......................................................................................................... 4 1.1 COMPLEMENTARY MATERIALS.......................................................................................... 4 2. TEST SITES...................................................................................................................... 5 2.1 TEST FACILITIES............................................................................................................... 5 2.2 LIST OF TEST AND MEASUREMENT INSTRUMENTS............................................................... 5 2.3 TRACEABILITY.................................................................................................................. 6 2.4 CALIBRATION................................................................................................................... 6 2.5 MEASUREMENT UNCERTAINTY........................................................................................... 6 3. GENERAL PRODUCT INFORMATION.................................................................................... 7 3.1 PRODUCT FUNCTION AND INTENDED USE........................................................................... 7 3.2 RATINGS AND SYSTEM DETAILS........................................................................................ 7 3.3 INDEPENDENT OPERATION MODES.................................................................................... 8 3.4 NOISE GENERATING AND NOISE SUPPRESSING PARTS....................................................... 9 3.5 SUBMITTED DOCUMENTS.................................................................................................. 9 4. TEST SET-UP AND OPERATION MODES............................................................................ 10 4.1 PRINCIPLE OF CONFIGURATION SELECTION...................................................................... 10 4.2 TEST OPERATION AND TEST SOFTWARE.......................................................................... 10 4.3 SPECIAL ACCESSORIES AND AUXILIARY EQUIPMENT........................................................ 10 4.4 COUNTERMEASURES TO ACHIEVE EMC COMPLIANCE....................................................... 11 4.5 TEST SETUP DIAGRAM.................................................................................................... 11 5. TEST RESULTS............................................................................................................... 13 5.1 TRANSMITTER REQUIREMENT & TEST SUITES.................................................................. 13 5.1.1 Antenna Requirement ................................................................................................................13 5.1.2 Peak Output Power ....................................................................................................................14 5.1.3 20dB Bandwidth .........................................................................................................................18 5.1.4 Conducted spurious emissions and Frequency Band Edge measured in 100kHz Bandwidth ..22 5.1.5 Spurious Emission .....................................................................................................................27 5.1.6 Frequency Separation ................................................................................................................28 5.1.7 Number of hopping frequency....................................................................................................30 5.1.8 Time of Occupancy ....................................................................................................................32 6. SAFETY HUMAN EXPOSURE............................................................................................. 34 6.1 RADIO FREQUENCY EXPOSURE COMPLIANCE................................................................... 34 6.1.1 Electromagnetic Fields...............................................................................................................34 7. PHOTOGRAPHS OF THE TEST SET-UP.............................................................................. 35 8. LIST OF TABLES............................................................................................................. 37 9. LIST OF PHOTOGRAPHS.................................................................................................. 37 Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 4 von 37 Page 4 of 37 1. General Remarks 1.1 Complementary Materials All attachments are integral parts of this test report. This applies especially to the following appendix: Appendix 1: Photo (File:10036005APPENDIX1) Appendix 2: Test Result of Radiated Emissions (File: 10036005APPENDIX2) Test Specifications The following standards were applied (in bold: product standards, otherwise: basic standards). Table 1: Applied Standard and Test Levels Radio FCC CFR47 Part 15: Subpart C Section 15.247 DA 00-705 of March 30, 2000 Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 5 von 37 Page 5 of 37 2. Test Sites 2.1 Test Facilities TUV Rheinland Taiwan Ltd. 11F. No.758, Sec. 4, Bade Rd., Songshan Dist. Taipei City 105 Taiwan (R.O.C.) FCC Registration No.: 365730 2.2 List of Test and Measurement Instru…

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Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 35 von 37 Page 35 of 37 7. Photographs of the Test Set-Up Photograph 1: Set-up for Spurious Emissions (Front View) Photograph 2: Set-up for Spurious Emissions (Back View) Produkte Products Prüfbericht - Nr.: Test Report No. 10036005 001 Seite 36 von 37 Page 36 of 37 Photograph 3: Set-up for Conducted testing