KKI-F-6188Bluetooth Module

--------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn The Bluetooth module F-6188 manual Product overview Intelligent wireless audio data transmission products F-6188 Bluetooth module for the independent development of our company, is the high price of stereo wireless transmission scheme of low cost, module uses BEKEN chip to provide the high quality and compatibility for the module, the overall better performance. F-6188 Bluetooth module with free driving mode, customers only need to access the application module products, wireless transmission can quickly realize the music, enjoy wireless music. Field of application This module is mainly used for music transmission in short distance, can be connected with mobile phone and personal computer, conveniently, the connection between PDA and other digital products, enjoy bluetooth wireless transmission of music. Bluetooth audio Bluetooth stereo headset hands-free phone The Bluetooth wireless audio transmission Essential qualities Bluetooth Profiles Bluetooth v3.0 specification support A2DPv1.2 AVRCPv1.0 HFPv1.5 GAVDP1.2 HSP1.2 IOP Performance parameters Model F-6188 v4.0 Bluetooth Bluetooth V3.0 --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn specification supply voltage DC2.8-4.2V Support Bluetooth protocol HFPV1.5, A2DPV1.2,AVRCPV1.4HSP1.2, GAVDP1.2IOP working current 60mA standby current <500uA temperature range -40ºC to +85ºC The wireless tranmission range <10 meter Transmission power CLASS24dbm sensitivity -80dBm<0.1%BER frequency range 2.4GHz-2.480GHz External Port I2C, SPI and UART interface audio performance SBCdecode The audio Signal to Noise Ratio 75dB Module size 25X13.5X1.8MM The size graph of the module --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn Module pin definition diagram Pin description --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn Pin Symb I/O Description 1 RF_GND RF_GND RF_GND 2 ANT ANT ANT PORT 3 RF_GND RF_GND RF_GND 4 TMS(GPIO19) Digital I/O JTAG pin 5 TCK(GPIO18) Digital I/O JTAG pin 6 TDO(GPIO21) Digital I/O JTAG pin 7 TDI(GPIO20 Digital I/O JTAG pin 8 RSTN Digital I/O JTAG pin / Reset pin-low active 9 MBISTEN Digital I/O Memory bit check 10 GPIO0(TX) Digital I/O UART TX 11 GPIO1(RX) Digital I/O UART RX 12 GPIO2 Digital I/O GPIO2 13 GPIO3 Digital I/O GPIO3 14 GPIO4 Digital I/O GPIO4 15 GPIO5 Digital I/O GPIO5 16 GND GND Ground connect battery negative 17 AGND AGND Ground connect battery negative 18 GPIO10 Digital I/O GPIO10 19 LINR AUX_INPUT LINR 20 LINL AUX_INPUT LINL 21 MICINN MIC- MICINN 22 MICINP MIC+ MICINP 23 MICBIAS MICBIAS MICBIAS 24 AUDIOLN Audio output Left channel audio output negative 25 AUDIOLP Audio output Left channel audio output positive 26 AUDIORP Audio output Right channel audio output positive 27 AUDIORN Audio output Right channel audio output negative 28 VBUS Charge port VBUS 29 VBAT Power supply Power supply 30 3V0 Power 3.0V output 31 ADC Power ADC input 32 --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn Connection circuit notice The F-6188 module in the application process, please pay attention to avoid the influence of power amplifier, a boost circuit to avoid interference source module, module power supply circuit with high power circuit unit to form a series circuit, in order to improve the SNR Notice AAbout the Bluetooth wireless application environment, wireless signal includes a Bluetooth application are influenced by the surrounding environment, such as Wood, metal and other obstacles will be absorbed on the wireless signal, thus in the practical application, influence the distance of data transmission BBecause Bluetooth module to complete the existing system, placed in the shell. Because of the metal shell on the radio frequency signal Is a shielding effect. It is recommended not to install in a metal shell. CPCB LayoutThe antenna part of the Bluetooth module is the PCB antenna,the metal will weaken the function of antenna,while to the module layout,below the antenna module is prohibit paving and walk the line,if hollow out it is better Application ciriuit --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn NoticeThe module has built-in antenna, external antenna as the need increases MIC circuit --------------------------------------------------------------------------------------------------------------------------------------------- 0755-29179480/1FAX: 0755-84736169 A3 www.c-chip.com.cn MIC Recommended Specification:sensitivity-38dB/+-2dB DC2V working voltage 公司：深圳芯中芯科技有限公司 电话 ：0755-29179480/1/2，FAX: 0755-84736169 地址：深圳市宝安西乡大道德信商务中心701 公司网址：www.c-chip.com.cn 6 The output power of this device is less than 20mW.The SAR test is not required. This device complies with Part 15 of the FCC Rules and with RSS-210 of Industry Canada. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may c…

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Request for Modular Approval FCC ID: KKI-F-6188 Item Requirements EUT 1 Have its own RF shielding Device is equipped with metal shielding to cover RF section. Refer to external and photos. 2 Have buffered modulation/data inputs (if such inputs are provided) All inputs to the modules are buffered through logic and microprocessor inputs(BK8000L) 3 Have its own power supply regulation Module chipset incorporates voltage regulation to transceiver circuitry 4 Meet the antenna requirements of section 15.203 The device has a fixed PCB antenna. 5 Demonstrate compliance in a stand-alone configuration Device is tested in a test fixture in a standalone configuration 6 The licensed module must have a FCC ID label on the module itself. That FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: Contains “FCC ID: KKI-F-6188” FCC ID label format will be included in the filling. Host ID label will be displayed on the host system. 7 The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements. Please refer to “User Manual” Exhibit 8 The module must comply with RF exposure requirements. See FCC Rules. Spread Spectrum transmitters must comply with RF exposure limits in 15.247. RF exposure evaluation is exempted because of low output power (EIRP: 0.24mW). Thank you for your attention to this matter. Yours Sincerely, Ivy Zhu,Certification Manager

External Photos 1. EUT front view 2. EUT rear view 3. EUT left side view 4. EUT right side view 5. EUT top view 6. EUT bottom view 7. ANT view

FCC/IC label and label location 1. Label 2. Label location

External Photos 1. EUT front view 2. EUT rear view 3. EUT left side view 4. EUT right side view 5. EUT top view 6. EUT bottom view 7. ANT view

MORLAB GROUP FL1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Tel : 86-755-36698555 Fax: 86-755-36698525 Block67, BaoAn District, ShenZhen , GuangDong Province, P. R. China Http://www.morlab.com E-mail: [email protected] Page 2 0f 83 REPORT No.：SZ14090006W01 DIRECTORY TEST REPORT DECLARATION ··········································································································· 5 1. TECHNICAL INFORMATION ·········································································································· 6 1.1. APPLICANT INFORMATION ··············································································································· 6 1.2. EQUIPMENT UNDER TEST (EUT) DESCRIPTION ················································································ 6 1.2.1. IDENTIFICATION OF ALL USED EUTS ····································································································· 6 1.3. TEST STANDARDS AND RESULTS ···································································································· 7 1.3.1. TEST ENVIRONMENT CONDITIONS ······································································································· 7 2. 47 CFR PART 15C REQUIREMENTS ···························································································· 8 2.1. ANTENNA REQUIREMENT ················································································································· 8 2.1.1. APPLICABLE STANDARD························································································································ 8 2.1.2. RESULT: COMPLIANT ····························································································································· 8 2.2. NUMBER OF HOPPING FREQUENCY ································································································· 8 2.2.1. REQUIREMENT ······································································································································ 8 2.2.2. TEST DESCRIPTION ······························································································································ 8 2.2.3. TEST PROCEDURE ································································································································ 9 2.2.4. TEST RESULT ······································································································································ 10 2.3. PEAK OUTPUT POWER ·················································································································· 14 2.3.1. REQUIREMENT ···································································································································· 14 2.3.2. TEST DESCRIPTION ···························································································································· 14 2.3.3. TEST RESULT ······································································································································ 14 2.3.3.1. GFSK MODE ······································································································································· 15 2.3.3.2. ∏/4-DQPSK MODE ··························································································································· 15 2.3.3.3. 8- DPSK MODE ··································································································································· 15 2.4. 20DB BANDWIDTH ························································································································ 16 2.4.1. DEFINITION ·········································································································································· 16 2.4.2. TEST DESCRIPTION ···························································································································· 16 2.4.3. TEST PROCEDURE ······························································································································ 16 2.4.4. TEST RESULT ······································································································································ 17 2.4.4.1. GFSK MODE ······································································································································· 17 2.4.4.2. ∏/4-DQPSK MODE ··························································································································· 19 2.4.4.3. 8- DPSK MODE ··································································································································· 21 MORLAB GROUP FL1-3, Building A, FeiYang Science Park, No.8 LongChang Road, Tel : 86-755-36698555 Fax: 86-755-36698525 Block67, BaoAn District, ShenZhen , GuangDong Province, P. R. China Http://www.morlab.com E-mail: [email protected] Page 3 0f 83 REPORT No.：SZ14090006W01 2.5. CARRIED FREQUENCY SEPARATION ······························································································ 23 2.5.1. DEFINITION ·········································································································································· 23 2.5.2. TEST DESCRIPTION ···························································································································· 23 2.5.3. TEST PROCEDURE ······························································································································ 24 2.5.4. TEST RESULT ······································································································································ 24 2.6. TIME OF OCCUPANCY (DWELL TIME) ··············································································…

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Test Setup Photos 1. Radiated emission (9KHz-30MHz) 2. Radiated emission (30MHz-1GHz) 3. Radiated emission (above 1GHz) 4. Conducted emission antenna’s port