OK8362802.4GHz Filtered TM Snd 50-Chnnl Autoscan Crdls Phn

CORDLESS TELEPHONE OWNER'S MANUAL INSTALLATION AND OPERATING INSTRUCTIONS PLEASE READ THIS MANUAL CAREFULLY BEFORE USE. KEEP FOR YOUR REFERENCE. 4 I N U S E / C H A R G E . 4 2 G H z I N U S E / B A T T L O W T A L K S C AN P A U SE . 4 2 G H z R E D IAL 1995, 2002 BellSouth Corporation C Special Features ongratulations on your selection of a quality BellSouth Product. With proper care, and by following the setup and user instructions in this manual, this unit will provide you with years of trouble free service. BellSouth is committed to providing quality products that fit your needs. We would like to have any comments or suggestions you might have on this product. You may mail your comments to: U.S. Electronics 105 Madison Avenue New York, NY 10016 When examining your new BellSouth cordless telephone, you will find an array of special features including: Filtered Sound™ System - Receives considerably less noise than conventional cordless telephones because of a special circuit which delivers the clearest possible reception. 50 Channel Autoscan - Press the button on the HANDSET to find and lock on to the clearest channel for any call. Telephone Number Storage - Store up to 10 frequently called numbers. Desk or Wall Mount - Use this equipment as a desk phone and as a wall phone. TONE or PULSE Dialing - Use this phone for either TONE (push-button) or PULSE (rotary) dialing. Automated Functions - Redial the last number called, speed dial 10 numbers and automatic STANDBY mode. Security - Ensures greater privacy because a built-in security code with 65,536 combinations prevents use of your telephone line by another nearby cordless phone. Dependable Battery - Recharge your BATTERY PACK many times with the built-in charger. The battery low warning tone tells you when the BATTERY PACK needs recharging. (See page 11.) Special Services - Use the FLASH button to access special services such as Call Waiting supplied by your telephone company or company switchboard. STANDBY Mode - When in STANDBY mode (ON-HOOK), the phone is capable of receiving a call. When the HANDSET is on the BASE UNIT, it is automatically in the STANDBY mode (ON-HOOK). When the HANDSET is off the BASE UNIT, it remains in the STANDBY mode until you activate the button. Battery Power Saver - Once fully charged, in STANDBY mode, and with the RINGER SWITCH in the “ON” position, the HANDSET can receive/send calls for a maximum of five days without the need for recharging. Length of charge depends on frequency of use. HANDSET Volume Control Switch - Select the receiver volume level (HI, MID, LOW). HEADSET JACK - Your telephone can utilize a headset for hands-free communication. BELT CLIP - Use the BELT CLIP to hang your HANDSET on your belt. C TALK SCAN 1. HANDSET ANTENNA 5. IN USE/BATT LOW INDICATOR Pg. 7, 8, 11 3. PAUSE BUTTON Pg. 9 2. TALK BUTTON Pg. 5, 7, 8, 9, 13 6. MEMO BUTTON Pg. 8, 9 7. VOLUME CONTROL (HI, MID, LOW) SWITCH 12. CHARGE CONTACTS 8. SCAN BUTTON Pg. 7,10, 13, 16 4. FLASH BUTTON 9. REDIAL BUTTON Pg. 9 10. HEADSET JACK Pg. 10 11. TONE BUTTON 4 IN USE/ BATT LOW TALK SCANPAUSE .42GHz R EDIA L IMPORTANT In order to get maximum life from the HANDSET BATTERY PACK, be sure to charge the HANDSET for 12 hours before initial use. HANDSET Controls 1.HANDSET ANTENNA 2. Button: Press to answer an incoming call or to place a call. Press to end a call. 3. Button: Press to insert a PAUSE while dialing. (You will need the PAUSE button to dial numbers which use an alternative Long Distance Access Code.) 4. Button: Press to answer an incoming call if you have Call Waiting. 5. IN USE/BATT LOW LED Indicator: Lights up when the HANDSET is in TALK mode. Blinks when the battery charge is low. (See page 11 for detail.) 6. Button: Press to store phone numbers in memory or to call a number you have previously stored. 7. HANDSET Volume Control (hi, mid, low) Switch: Select the receiver volume level (HI, MID, LOW). 8. Button : Press to change the operating channel when you hear interference. 9. Button : Press to REDIAL the last number you called. 10.HEADSET JACK: For connecting your headset plug to enjoy hands-free communication. (See page 10 for detail). 11. Button: Press to change the dialing mode from PULSE to TONE. 12.CHARGE CONTACTS: For charging the BATTERY PACK inside the HANDSET. We recommend cleaning the CHARGE CONTACTS periodically with a damp cloth. SCAN REDIAL PAUSE MEMO FLASH TALK TONE 1. TELEPHONE LINE CONNECTION JACK Pg. 4, 6, 13 3. TONE/PULSE SELECT SWITCH Pg. 5, 13 2. POWER-IN CONNECTION JACK Pg. 4 7. CHARGE TERMINALS 4. ANTENNA Pg. 9, 16 6. IN USE/CHARGE LED INDICATOR Pg. 8 5. PAGE BUTTON PAGE IN USE/ CHARGE .42 GHz BASE UNIT Controls 1.TELEPHONE LINE CONNECTION JACK 2.POWER-IN CONNECTION JACK 3.TONE/PULSE Select Switch 4.HANDSET RETAINER TAB: For holding the HANDSET to rest securely in the BASE UNIT CRADLE during wall mounting. 5.BASE UNIT ANTENNA 6.CHARGE TERMINALS: For charging the BATTERY PACK inside the HANDSET. We recommend cleaning the CHARGE TERMINALS periodically with a damp cloth. 7. Button: Press to page the HANDSET. Press again to stop. 8.IN USE/CHARGE LED Indicator: Lights up when the HANDSET is in TALK mode or when the HANDSET is placed on the BASE UNIT for charging. IMPORTANT Placing your BASE UNIT near appliances such as televisions, refrigerators, radios, or microwave ovens may cause interference. PAGE Contents Safety Instructions.......................................................................................................................2 Getting Started.............................................................................................................................4 Desk Mounting..............................................................................................................................6 Wall Mounting...............................................................................................................................6 Basic Operation..............................…

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GH9407bbd.sch-1 - Thu Feb 21 14:32:11 2002 GH9407hbd.sch-1 - Thu Feb 21 14:55:14 2002

Block 2 Laodong 2 nd Industrial Area, Xixian, Baoan, Shenzhen, China Tel.: +86-755-7917824 Fax: +86-755-7917944 August 26, 2002 Federal Communications Commission 7435 Oakland Mills Road Columbia, Maryland, 21046 Sir/Madam, Reg: FCC part 15 grand for model 36280, FCC ID: OK836280HT02 We, Lionda Technology Co., Ltd., agrees to allow Shenzhen Baoan Hantong Electronics Factory ( Block 11 & 12 Jinbi Industrial Area Hwang Tian, Baoan Shenzhen, China), to use our testing data and all technical documentations for our FCC ID: O63GH9407LD02. Under FCC docket number 20780 and general docket number 80-284 pursuant to part 15, FCC rules and regulations. Sincerely, Signature : Printed Name : Dan Coronia Title : Senior Engineer SHENZHEN BAOAN HANTONG ELECTRONICS FACTORY Block 11 & 12, Jinbi Industrial Area, Hwang Tian, Baoan, Shenzhen, China. TEL.: +86-755-7506260 FAX: +86-755-7506248 Bay Area Compliance Laboratory 230 Commercial Street Sunnyvale CA 94085 Date: August 26, 2002 Sir/Madam, I, the undersigned, hereby confirm that the model 36280 is identical to original certified device (GH9407/GH9408) such as software, circuitry, RF module, features and functionality. The only difference is the shape of the cabinet which were modified for marketing purposes. Sincerely, Signature : Printed Name : Dan Coronia Title : Senior Engineer

APPENDIX C - EUT EXTERNAL PHOTOGRAPHS Base - Top View Base - Bottom View Handset - Top View Handset - Bottom View

APPENDIX A - FCC PRODUCT LABELING AND WARNING STATEMENT FCC ID Label FCC ID: OK836280HT02 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Privacy of communications may not be ensured when using this phone. 2.1875" 1.0" Specifications: Text is black or white in color and is left justified. Labels are silk-screened and shall be “permanently affixed” at a conspicuous location on the EUT. Proposed Label Location on EUT Port Side of EUT Base/Proposed FCC ID Label Location / EUT Handset FCC Warning Statement A FCC Warning Statement is provided in the product manual.

APPENDIX C - EUT INTERNAL PHOTOGRAPHS Base - Component View Base - Solder View Base - Transceiver Component View Base - Transceiver Solder View Handset - Component View Handset - Solder View Handset - Transceiver Component View Handset - Transceiver Solder View

LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT MH9002 desc Page 1 21-Feb-02 CIRCUIT DESCRIPTION Model: GH9407/GH9408 Base a. RF Transmitter Section – RF Board Compressed audio signal is frequency modulated through the varactor diode D3, D4. Diode D3, D4 choke coil L5 and the external components formed the voltage controlled oscillator circuit for the transmitter part. This circuit generates the TX VCO frequency. A portion of this signal is fed back to the PLL IC’s pin1 (FIN1) for phase comparison. Once the phase of oscillation stabilized, the PLL circuit generates the error voltage necessary for the VCO to oscillate at the desired transmitter’s RF frequency. The VCO circuit impedance is matched with the succeeding circuit through the transistor Q5 that also acts as the buffer amplifier. RF pre-amplifier Q2 and amplifie Q7 boosts the signal for transmission. This amplified RF signal is trimmed to the desired frequency band by BPF2403 so as not to interfere with the receiver circuit. The transmitter RF signal is then propagated through the antenna. b. RF Receiver Section - RF Board The Base Unit antenna receives RF signal. Band Pass Filter BPF2475 trims the signal to the desirable frequency band. Transistor Q6 & Q3 is a low noise amplifier that boosts the RF signal to a specific level for mixing. PLL IC1 (KB8825) is used as a Universal Phase Lock Loop circuit. The frequency from the Voltage Controlled Oscillator (VCO) D1, is fed back to the PLL IC through pin 16 (FIN2) for phase comparison. During channel scanning or turning the unit on, once the phase of oscillation stabilized (locked), the PLL circuit generates the first local oscillator frequency for down-converting the received RF signal into the first IF frequency 10.7MHz. This process is accomplished through the IF mixer circuit Q3. Q1 is used for matching the impedance of the mixer circuit with the succeeding circuits. The resulting IF signal is kept constant by the IF Filter FL1 to 10.7MHz which is then mixed with the second local oscillator frequency 11.150MHz (derived from X1 & C47) to produced a much lower IF frequency. This lower IF frequency if further filtered by IF Filter FL4 to produce a more stable signal of 450KHz. Quadrature signal detection is accomplished internally by the Narrow-band Detector IC2 (KA3361) with the IF coil L7. The recovered audio frequency can be taken from IC2 audio output pin9. Double conversion of received signal is utilized to improve the image frequency rejection of the unit. c. Transmitter Audio Section – Main Board Audio Frequency signal from the telephone line is com pressed through the compressor part of IC4 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC4 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. 1 LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT MH9002 desc Page 2 21-Feb-02 d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC4 for expansion thus retrieving the original Audio signal with noise filtered out. Q1 are used as buffer circuit. Transistor Q2 (A94) isolates the high-voltage telephone line to the rest of the circuit. Q2 (A94) is also used as a hybrid transformer to create a two-way path for audio transmission to and reception from the telephone line. Handset a. RF Transmitter Section – RF Board Refer to portion 1.a for this section. All circuit performance is the same except that Band Pass Filter BPF2403 be changed to BPF2475 for the handset transmission. b. RF Receiver Section – RF Board Refer to portion 1.b for this section. All circuit performance is the same except that Band Pass Filter BPF2475 be changed to BPF2403 for the handset reception. c. Transmitter Audio Section – Main Board Audio Frequency signal from the handset or from the headset microphone is compressed through the compressor part of IC2 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC2 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. Q5 is a switching transistor that controls the power supply for the TX RF part. d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC2 for expansion thus retrieving the original Audio signal with noise filtered out. Q3 act as audio amplifier to sufficiently drive the handset speaker. Q1, Q6 and Q8 are switching transistors that control the power supply for the RF part, the Compander part and the AF amplifier respectively. An earphone jack is provid an optional headset unit for handsfree conversation on the handset. OTHERS (Handset) a. Charging and Reset Controls Recharging the handset battery is accomplished by putting the handset on the cradle. Q200 detects this action and sends a command to the CPU for proper exchange of security code. Switching SW4 to the RING OFF mode can extend Battery life. 2 3 LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT MH9002 desc Page 3 21-Feb-02 b. Ring Detection When the handset receives the ring command from the base unit, the CPU will send buzzer signal to the ringer amplifier Q201 that drives the Buzzer. OTHERS (Base): a. Hook Switching and Dialing Hook switching and pulse dialing is accomplished by the Transistor Q3 (A44) which is controlled by the CPU. DTMF signal from the ladder circuit R65-R70 to the CPU is filtered and ampli U1-D. b. Over…

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GH9407schb.sch-1 - Thu Feb 21 15:09:07 2002 GH9407brf.sch-1 - Thu Feb 21 15:04:25 2002 GH9407schh.sch-1 - Thu Feb 21 15:11:17 2002 GH9407hrf.sch-1 - Thu Feb 21 15:07:09 2002

Note: This test report is specially limited to the above client company and the product model only. It may not be duplicated without prior written consent of Bay Area Compliance Laboratory Corporation. This report must not be used by the client to claim product endorsement by NVLAP or any agency of the U.S. Government. FCC PART 15 SUBPART C EMI MEASUREMENT AND TEST REPORT For Shenzhen Baoan Hantong Electronics Factory Block 11 & 12, Jinbi Industrial Area, Hwang Tian, Baoan, Shenzhen, China FCC ID: OK836280HT02 September 4, 2002 This Report Concerns: Original Report Equipment Type: 2.4GHz 50-Channel Analog Basic Cordless Phone Test Engineer: Benjamin Ming Test Date: February 27, 2002 Reviewed By: Jeff Lee Prepared By: Bay Area Compliance Laboratory Corporation 230 Commercial Street Sunnyvale, CA 94085 Tel (408) 732-9162 Fax (408) 732-9164 Shenzhen Baoan Hantong Electronics Factory FCC ID: OK836280HT02 Report # S0208266Rpt Page 2 of 15 FCC Part 15 Subpart C Test Report TABLE OF CONTENTS 1 - GENERAL INFORMATION..................................................................................................................................3 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ..............................................................................3 1.2 OBJECTIVE.............................................................................................................................................................3 1.3 RELATED SUBMITTAL(S)/GRANT(S) ......................................................................................................................3 1.4 TEST METHODOLOGY............................................................................................................................................3 1.5 TEST FACILITY.......................................................................................................................................................3 1.6 TEST EQUIPMENT LIST...........................................................................................................................................4 1.7 LOCAL SUPPORT EQUIPMENT LIST AND DETAILS...................................................................................................4 1.8 EXTERNAL I/O CABLING LIST AND DETAILS.........................................................................................................4 2 - SYSTEM TEST CONFIGURATION.....................................................................................................................5 2.1 DESCRIPTION OF TEST CONFIGURATION................................................................................................................5 2.2 CONFIGURATION OF TEST SYSTEM.........................................................................................................................6 2.3 TEST SETUP BLOCK DIAGRAM...............................................................................................................................6 2.4 EQUIPMENT MODIFICATIONS.................................................................................................................................6 3 - CONDUCTED EMISSIONS ...................................................................................................................................7 3.1 MEASUREMENT UNCERTAINTY..............................................................................................................................7 3.2 EUT SETUP............................................................................................................................................................7 3.3 SPECTRUM ANALYZER SETUP................................................................................................................................7 3.4 TEST PROCEDURE..................................................................................................................................................7 3.5 SUMMARY OF TEST RESULTS.................................................................................................................................8 3.6 CONDUCTED EMISSIONS TEST DATA.....................................................................................................................8 3.7 PLOT OF CONDUCTED EMISSIONS TEST DATA.......................................................................................................8 4 - RADIATED EMISSIONS .......................................................................................................................................9 4.1 MEASUREMENT UNCERTAINTY..............................................................................................................................9 4.2 EUT SETUP............................................................................................................................................................9 4.3 SPECTRUM ANALYZER SETUP................................................................................................................................9 4.4 TEST PROCEDURE................................................................................................................................................10 4.5 CORRECTED AMPLITUDE & MARGIN CALCULATION...........................................................................................10 4.6 SUMMARY OF TEST RESULTS...............................................................................................................................10 4.7 RADIATED EMISSIONS TEST RESULT DATA.........................................................................................................11 5 - BAND EDGES ........................................................................................................................................................13 5.1 TEST PROCEDURE..............................................................................................................................…

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APPENDIX B - TEST SETUP PHOTOGRAPHS Base Conducted Emission Base Radiated Emission Handset Radiated Emission Handset Radiated Emission