OK836287HT022.4GHz Crdls Phn w/ID & CW

PA GE .42 GH z 2.4 GHz CORDLESS CALLER ID TELEPHONE WITH CALL WAITING 50 CHANNEL AUTOSCAN Model GH9457 PLEASE READ THIS MANUAL CAREFULLY BEFORE USE. KEEP FOR YOUR REFERENCE. OWNER'S MANUAL INSTALLATION AND OPERATING INSTRUCTIONS 5 © 1995, 2002 BellSouth Corporation . 4 2 GHz TAL K DIR ME NU SAVE RE DIAL ongratulations on your selection of a quality BellSouth Product. With proper care, and by following the setup and user instructions in this manual, this unit will provide you with years of trouble free service. BellSouth is committed to providing quality products that fit your needs. We would like to have any comments or suggestions you might have on this product. You may mail your comments to: U.S. Electronics 105 Madison Avenue New York, NY 10016 When examining your new BellSouth cordless telephone, you will find an array of special features including: Filtered Sound™ System - Receives considerably less noise than conventional cordless telephones because of a special circuit which delivers the clearest possible reception. 50 Channel Autoscan - Press the DEL/CHAN button on the HANDSET to find and lock on to the clearest channel for any call. Desk or Wall Mount - Use this equipment as a desk phone or as a wall phone. TONE or PULSE Dialing - Use this phone for either TONE (rotary) or PULSE (push- button) dialing. Automated Functions - Redial the last number called and automatic STANDBY mode. Security - Ensures greater privacy because a built-in security code with 65,536 combinations prevents use of your telephone line by another nearby cordless telephone. Dependable Battery - Recharge your BATTERY PACK many times with the built-in charger. The battery low warning tone tells you when the BATTERY PACK needs recharging (See page 27). Special Services - Use the EDIT/FLASH button to access special services such as Call Waiting supplied by your telephone company or company switchboard. STANDBY Mode - When in STANDBY mode (ON-HOOK), the telephone is capable of receiving a call. When the HANDSET is on the BASE UNIT, it is automatically in the STANDBY mode (ON-HOOK). When the HANDSET is taken off the BASE UNIT, it remains in the STANDBY mode until you activate the button. Battery Power Saver - Once fully charged, in STANDBY mode, the HANDSET can receive/send calls for a maximum of five days without the need for recharging. Length of charge depends on frequency of use. HANDSET Ringer Level - Select the ringer sound level (HI, LOW, OFF). HANDSET Volume Control Switch - Select the receiver volume level (HI, MID, LOW). HEADSET JACK - Your telephone can utilize a headset for hands-free communication. BELT CLIP - Use the BELT CLIP to hang your HANDSET on your belt. C Special Features CALLER ID SYSTEM Multi-Function Large LCD Screen - Shows the number you are dialing and, with Caller ID service (available through subscription from your local telephone company), displays information about the caller before you answer the call. Name and Number Directory - Stores up to 40 names and numbers so that you can call them with a single key stroke. Caller List - Available with Caller ID service. Stores up to 80 calls to keep track of everyone who called. The name, phone number, time and date of the call are recorded. Allows you to return their calls with a single key stroke. Preferred Calls - You can mark the name and number of a welcome caller in the DIRECTORY. When that number calls in, the caller’s name will appear on the DISPLAY and a special ring sound will be heard. Blocked Calls - You can mark the name and number of an unwelcome caller in the DIRECTORY. When that number calls in, the caller’s name will appear on the DISPLAY and the ringer will be disabled. Repeat Call Indicator - Shows if a new incoming call has called more than once. Unavailable Call Indicator - Advises you that the origin of the incoming call does not support the Caller ID system. Call Waiting Service - Displays the name and number of the second caller, if you have subscribed for Call Waiting service from your local telephone company (see page 13). Voice Mail - Indicates message waiting signal if you subscribed to Voice Mail message service and requested Visual Message Indication from your local telephone company (see page 13). This telephone also detects a Stutter Dial Tone signal every time there is a Voice Mail message for you from your Voice Mail message provider if you have subscribed to Voice Mail message service. Special Features .42GHz TALK DIR MENUSAVE R EDIAL 1. LARGE LCD SCREEN 11. DIR (DIRECTORY) BUTTON Pg. 14, 15, 16, 18, 19 15. DEL (DELETE)/CHAN (CHANNEL) BUTTON Pg. 9, 15, 16, 18, 19, 12. REDIAL/SAVE BUTTON Pg. 10, 15, 16, 18, 20~25 9. MESSAGE WAITING LED INDICATOR Pg. 13 NEW CALL/ 13. VOLUME CONTROL (HI, MID, LOW) SWITCH 10. BATT LOW INDICATOR Pg. 27 5. HEADSET JACK Pg. 11 4. MENU/VOICE MAIL BUTTON Pg. 13, 20~25 6. TELEPHONE KEYPAD Pg. 16~18, 20, 21, 24, 25 8. FLASH BUTTON Pg. 13, 14, 16, 18, 20~25 EDIT/ 16. CHARGE CONTACTS HANDSET Controls HANDSET Controls 1. items. 2. SCROLL UP-DOWN/SHIFT LEFT-RIGHT BUTTON Pg. 12, 14~16, 18~24 3. TALK BUTTON Pg. 6, 7, 9, 10, 13, 14, 18, 29 2. SCROLL UP -DOWN , SHIFT LEFT -RIGHT Button: 3. Button: Press to move around Press to answer an incoming call or to place a call. Press to end a call the large LCD Screen. Pg. 14, 19 7 14. OPTION BUTTON Pg. 9, 12 TALK HANDSET Controls 4. /VOICE MAIL Button: (MENU) Press to access the special functions operation in STANDBY mode. (For special functions see page 20~21.) (VOICE MAIL) Press to automatically dial the Voice Mail Post Code in your area to access your Voice Mail message. 5.HEADSET JACK: For connecting your headset plug to enjoy hands-free communication. (See page 11 for detail.) 6.TELEPHONE KEYPAD Buttons: Allows you to make a call depending on pressed button. (For TELEPHONE KEYPAD characters, see page 17.) 7.TEMPORARY TONE Button: Press to temporarily change the dialing mode from PULSE to TONE for Rotary Service Users. (Press once before enteri…

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9457bbd.sch-1 - Wed Jan 16 19:19:20 2002 9457hbd.sch-1 - Wed Jan 16 19:21:31 2002

Block 2 Laodong 2 nd Industrial Area, Xixian, Baoan, Shenzhen, China Tel.: +86-755-7917824 Fax: +86-755-7917944 August 26, 2002 Federal Communications Commission 7435 Oakland Mills Road Columbia, Maryland, 21046 Sir/Madam, Reg: FCC part 15 grand for model 36287, FCC ID: OK836287HT02 We, Lionda Technology Co., Ltd., agrees to allow Shenzhen Baoan Hantong Electronics Factory ( Block 11 & 12 Jinbi Industrial Area Hwang Tian, Baoan Shenzhen, China), to use our testing data and all technical documentations for our FCC ID: O63GH9457LD02. Under FCC docket number 20780 and general docket number 80-284 pursuant to part 15, FCC rules and regulations. Sincerely, Signature : Printed Name : Dan Coronia Title : Senior Engineer SHENZHEN BAOAN HANTONG ELECTRONICS FACTORY Block 11 & 12, Jinbi Industrial Area, Hwang Tian, Baoan, Shenzhen, China. TEL.: +86-755-7506260 FAX: +86-755-7506248 Bay Area Compliance Laboratory 230 Commercial Street Sunnyvale CA 94085 Date: August 26, 2002 Sir/Madam, I, the undersigned, hereby confirm that the model 36287 is identical to original certified device (GH9457/GH9458) such as software, circuitry, RF module, features and functionality. The only difference is the shape of the cabinet which were modified for marketing purposes. Sincerely, Signature : Printed Name : Dan Coronia Title : Senior Engineer

APPENDIX C - EUT EXTERNAL PHOTOGRAPHS Handset - Top View Handset - Bottom View Base - Top View Base - Back View AC/DC Power Adapter

APPENDIX A - FCC PRODUCT LABELING AND WARNING STATEMENT FCC ID Label Specifications: Text is black or white in color and is left justified. Labels are silk-screened and shall be “permanently affixed” at a conspicuous location on the EUT. Proposed Label Location on EUT Back Side of Base/Proposed FCC ID Label Location / Handset FCC Warning Statement A FCC Warning Statement is provided in the product manual. FCC ID: OK836287HT02 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Privacy of communications may not be ensured when using this phone. 2.1875" 1.0"

APPENDIX C - EUT INTERNAL PHOTOGRAPHS Handset - Component View Handset - Solder View Base - Component View Base - Solder View Handset Transmitter - Component View Handset Transmitter - Solder View Base Receiver - Component View Base Receiver - Solder View

LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT GH9457desc Page 1 16-Jan-02 CIRCUIT DESCRIPTION Model: GH9457,GH9458 Base a. RF Transmitter Section – RF Board Compressed audio signal is frequency modulated through the varactor diode D3, D4. Diode D3, D4, L4 and Q5 the external components formed the voltage controlled oscillator circuit for the transmitter part. This circuit generates the TX VCO frequency. A portion of this signal is fed back to the PLL IC’s pin1 (FIN1) for phase comparison. Once the phase of oscillation stabilized, the PLL circuit generates the error voltage necessary for the VCO to oscillate at the desired transmitter’s RF frequency. The VCO circuit impedance is matched with the succeeding circuit through the transistor Q2 that also acts as the buffer amplifier. RF amplifier Q7 boosts the signal for transmission. This amplified RF signal is trimmed to the desired frequency band by BPF2403 so as not to interfere with the receiver circuit. The transmitter RF signal is then propagated through the antenna. b. RF Receiver Section - RF Board The Base Unit antenna receives RF signal. Band Pass Filter BPF2475 trims the signal to the desirable frequency band. Transistor Q6 & Q3 is a low noise amplifier that boosts the RF signal to a specific level for mixing. PLL IC1 (KB8825B) is used as a Universal Phase Lock Loop circuit. The frequency from the Voltage Controlled Oscillator (VCO) D1, L5 and Q4, is fed back to the PLL IC through pin 16 (FIN2) for phase comparison. During channel scanning or turning the unit on, once the phase of oscillation stabilized (locked), the PLL circuit generates the first local oscillator frequency for down-converting the received RF signal into the first IF frequency 10.7MHz. This process is accomplished through the IF mixer circuit Q1. Q1 is used for matching the impedance of the mixer circuit with the succeeding circuits. The resulting IF signal is kept constant by the IF Filter FL1 to 10.7MHz which is then mixed with the second local oscillator frequency 11.150MHz (derived from X1 & C47) to produced a much lower IF frequency. This lower IF frequency if further filtered by IF Filter FL4 to produce a more stable signal of 450AKHz. Quadrature signal detection is accomplished internally by the Narrow-band Detector IC2 (KA3361) with the IF coil L7. The recovered audio frequency can be taken from IC2 audio output pin9. Double conversion of received signal is utilized to improve the image frequency rejection of the unit. c. Transmitter Audio Section – Main Board Audio Frequency signal from the telephone line is compressed through the compressor part of IC4 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC4 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC4 for expansion thus retrieving the original Audio signal with noise filtered out. Q5 is used as buffer circuit. Bridge rectifier D12-D15 isolates the high-voltage telephone line to the rest of the circuit. D12-D15 is 1 LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT GH9457desc Page 2 16-Jan-02 also act as a hybrid transformer to create a two-way path for audio transmission to and reception from the telephone line. Handset a. RF Transmitter Section – RF Board Refer to portion 1.b for this section. All circuit performance is the same except that Band Pass Filter BPF2403 is changed to BPF2475 for the handset transmission. b. RF Receiver Section – RF Board Refer to portion 1.b for this section. All circuit performance is the same except that Band Pass Filter BPF2475 is changed to BPF2403 for the handset reception. c. Transmitter Audio Section – Main Board Audio Frequency signal from the handset or from the headset microphone is compressed through the compressor part of IC1 to minimize the transmission noise. The degree of compression depends on the external RC combinations. AGC is also utilized by IC1 to avoid shock noise caused by abrupt change of audio levels. The compressed audio is filtered and amplified for better acoustical performance. Q3 is a switching transistor that controls the power supply for the TX RF part. d. Receiver Audio Section – Main Board The compressed Audio Frequency signal is passed through passive RC filters for acoustic compliance. The filtered audio is then fed to the Compander IC1 for expansion thus retrieving the original audio signal with noise filtered out. Q2 & Q10 act as audio amplifier to sufficiently drive the handset speaker. Q7 and Q8 are switching transistors that control the power supply for the RF part, the Compander part and the AF amplifier respectively. An earphone jack is provided for an optional headset unit for handsfree conversation on the handset. OTHERS (Handset): a. Charging and Reset Controls Recharging the handset battery is accomplished by putting the handset on the cradle. IC5 detects this action and sends a command to the CPU for proper exchange of security code. b. Ring Detection When the handset receives the ring command from the base unit, the CPU will send buzzer signal to the ringer amplifier Q5 and Q6 that drives the Buzzer. 3 2 LIONDA TECHNOLOGY COMPANY LIMITEDLIONDA TECHNOLOGY COMPANY LIMITED ENGINEERING DEPARTMENTENGINEERING DEPARTMENT GH9457desc Page 3 16-Jan-02 OTHERS (Base): a. Hook Switching and Dialing Hook switching and the transistor Q6 that is controlled by the CPU accomplishes pulse dialing. DTMF signal from the ladder circuit internal to the CPU is filtered and amplified by Q5. b. Over-voltage Protection Fuse1 and varistor Z1 act as high current and high…

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Note: This test report is specially limited to the above client company and the product model only. It may not be duplicated without prior written consent of Bay Area Compliance Laboratory Corporation. This report must not be used by the client to claim product endorsement by NVLAP or any agency of the U.S. Government. FCC PART 15 SUBPART C EMI MEASUREMENT AND TEST REPORT For Shenzhen Baoan Hantong Electronics Factory Block 11 & 12, Jinbi Industrial Area, Hwang Tian, Baoan, Shenzhen, China FCC ID: OK836287HT02 September 4, 2002 This Report Concerns: Original Report Equipment Type: Cordless Telephone w/ CID and Call Waiting Test Engineer: Jeff Lee Test Date: January 15, 2001 Reviewed By: Benjamin Jing Prepared By: Bay Area Compliance Laboratory Corporation 230 Commercial Street Sunnyvale, CA 94085 Tel (408) 732-9162 Fax (408) 732-9164 Shenzhen Baoan Hantong Electronics Factory FCC ID: OK836287HT02 Report # S0208267Rpt Page 2 of 15 FCC Part 15 Subpart C Test Report TABLE OF CONTENTS 1 - GENERAL INFORMATION..................................................................................................................................3 1.1 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) ..............................................................................3 1.2 OBJECTIVE.............................................................................................................................................................3 1.3 RELATED SUBMITTAL(S)/GRANT(S) ......................................................................................................................3 1.4 TEST METHODOLOGY............................................................................................................................................3 1.5 TEST FACILITY.......................................................................................................................................................4 1.6 TEST EQUIPMENT LIST...........................................................................................................................................4 1.7 LOCAL SUPPORT EQUIPMENT LIST AND DETAILS...................................................................................................5 1.8 EXTERNAL I/O CABLING LIST AND DETAILS.........................................................................................................5 2 - SYSTEM TEST CONFIGURATION.....................................................................................................................6 2.1 DESCRIPTION OF TEST CONFIGURATION................................................................................................................6 2.2 EQUIPMENT MODIFICATIONS.................................................................................................................................6 2.3 CONFIGURATION OF TEST SYSTEM.........................................................................................................................7 2.4 TEST SETUP BLOCK DIAGRAM...............................................................................................................................7 3 - CONDUCTED EMISSIONS ...................................................................................................................................8 3.1 MEASUREMENT UNCERTAINTY..............................................................................................................................8 3.2 EUT SETUP............................................................................................................................................................8 3.3 SPECTRUM ANALYZER SETUP................................................................................................................................8 3.4 TEST PROCEDURE..................................................................................................................................................8 3.5 SUMMARY OF TEST RESULTS.................................................................................................................................9 3.6 CONDUCTED EMISSIONS TEST DATA.....................................................................................................................9 3.7 PLOT OF CONDUCTED EMISSIONS TEST DATA.......................................................................................................9 4 - RADIATED EMISSIONS .....................................................................................................................................10 4.1 MEASUREMENT UNCERTAINTY............................................................................................................................10 4.2 EUT SETUP..........................................................................................................................................................10 4.3 SPECTRUM ANALYZER SETUP..............................................................................................................................10 4.4 TEST PROCEDURE................................................................................................................................................11 4.5 CORRECTED AMPLITUDE & MARGIN CALCULATION...........................................................................................11 4.6 SUMMARY OF TEST RESULTS...............................................................................................................................11 4.7 RADIATED EMISSIONS TEST RESULT DATA.........................................................................................................12 5 - BAND EDGES TESTING .....................................................................................................................................14 5.1 TEST PROCEDURE................................................................................................................................................1…

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APPENDIX B - TEST SETUP PHOTOGRAPHS Base Conducted Emission Base Radiated Emission Handset Radiated Emission