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RU8HI-505SDBluetooth GPS

HAICOM Electronics Corp.
Bluetooth GPS - FCC ID RU8HI-505SD - HAICOM Electronics Corp.
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Application Details

Equipment Class
DSS - Part 15 Spread Spectrum Transmitter
Date of Grant
May 16, 2007
Application Purpose
Original Equipment
Date of Application
May 16, 2007
Equipment Note
Bluetooth GPS
Frequency Range
2402.00000000 - 2480.00000000
Company
HAICOM Electronics Corp.
Country
Taiwan

Documents & Files

Select a file to view

Users Manual

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Parts List/Tune Up Info

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

HI-505SD Bluetooth ® GPS Receiver with SD interface USER MANUAL To insert in: Push down to the end and hear a “click” sound Take out the device 2 1 To take it out: Push down to the end and HI-505SD will spring up 1 2 1 HI-505SD Bluetooth ® GPS receiver with SD (Security Digital) interface Introduction: HI-505SD is a standard Bluetooth ® GPS receiver with standard miniSD™ to SD adaptor. HI-505SD equipped with the most recent 20 channel ultra high sensitive SiRF StarIII GPS chipsets and wireless Bluetooth ® module. Simply plug HI-505SD into any devices equipped with the standard SD slot, user can instantly enjoy the state of the art wireless GPS navigation. The basic concept of the HI-505SD is that the Bluetooth ® /GPS section only taking power from the host device (like PDA, UMPC, tabletPC, laptopPC, etc.) via the miniSD™ to SD adaptor. In the meantime, users can still using the miniSD™ memory card without worry about the SD slot was occupied. 1 1 HI-505SD advantages: 1. Simply plug in the HI-505SD into any SD slot from the standard mobile device with Bluetooth ® features, the device become the all-in-one GPS navigator. HI-505SD provides the flexibility for GPS enable in different devices and different occasion usages. 2. Unlike other SD GPS receivers occupied the SD slot, HI-505SD allow user to use any memory size miniSD™ card while using the HI-505SD simultaneously. 3. Unlike most SD GPS receivers with fixed build-in memory, HI-505SD provide the flexibility for using any separate memory size miniSD™ card depend on how big the memory size needed. 4. Unlike regular SDIO GPS receiver require complicated software and driver installation, user can easily use HI-505SD and enjoy the GPS navigation simply set up the standard Bluetooth ® connection between the devices. 5. As soon as plug in HI-505SD, user can start using the wireless GPS navigation without worry about the Bluetooth ® GPS receiver battery life. 6. Equipped with the 20 channel ultra high sensitive SiRF StarIII GPS module, HI-505SD can get 3D fixed in any outdoor locations and without using the external antenna. 7. Unlike normal Bluetooth ® GPS receiver moving around dashboard while driving, HI-505SD fixed on the mobile device and not to worry about where to place the unit. 8. HI-505SD module concept allow HI-505SD become a wired GPS receiver. By connecting with different optional cables via the adapting box, HI-505SD can also be used as a regular GPS mouse. HI-505SD can not only be wireless Bluetooth GPS receiver and also be the wired GPS receivers, like, USB GPS receiver, RS232 GPS receiver, PDA GPS receiver, etc. 2 2 Accessories: Standard Accessories: 1 23 1. 2. 3. Model Name HI-505SD Bluetooth ® GPS receiver unit Tool CD User Manual model # HI-505SD CDR-01 MAU-505 3 3 Optional Accessories: 1 2 1. 2. 3. Adapting box MMCX External antenna PDA charging cable (plug on the adapting box) 4 4 HI-505SD Bluetooth ® GPS receiver installed on cigarette lighter outlet LED off LED f lashing LED stay on Bluetooth ® switch off Bluetooth ® searching Bluetooth ® connected LED Indicator (Blue) LED off LED f lashing LED stay on Receiver switch off GPS Position Fixed GPS Signal searching LED Indicator (Red) MMCX external antenna plug Bluetooth ® / GPS status LED 5 5 HI-505SD on a PDA: A complete all-in-one GPS navigator HI-505SD + PDA with horizontal mapping software 6 6 HI-505SD with PDA phone as a all-in-one GPS navigator HI-505SD with laptop PC with SD Slot 7 7 HI-505SD + PDA as a portable navigator 8 8 Dimension: 46mm 80mm 34mm 13mm18mm 43mm24mm 20mm 18mm 9 9 GPS Receiver Specification Chipset Interfaces Protocol Baud Rate Max. Update Rate Datum Channel Frequency Hot Start Warm Start Cold Start Reacquisition Tike Position Accuracy Macimum Altitude Maximum velocity Voltage Power consumption Antenna Type External Antenna Connector Dimension LED Indicator SiRF Star III Bluetooth ® & Mini-1394 NMEA0183 GGA, GSA, GSV, RMC, GLL 4800, N, 8, 1 1 Hz WGS84 20 channel L1, 1575.42MHz 8 sec. Aver age 38 sec. Aver age 48 sec. Aver age 100 ms 15m 2D RMS, S A off 18,000m 515m/s DC 3.3V+-10% 90mA continuous mode Built-in active antenna MMCX (Optional) Fold: 46 (L) x 43 (W) x 20 (H)mm Unfold: 80 (L) x 43 (W) x 18 (H)mm 3D P ositioning (blinking) or Searching GPS (on) 10 10 Bluetooth ® Specifications: V1.1 Compliances Frequency Range: Interface: Receiver Sensetivity: Transmitting Power: RF Input Impedance: Frequency hopping: Baseband Crystal OSC: Data Rate: Operating Temperature: Storage Temperature: Transmitting Range: Power Consumption: 2.4 ~ 2.4835 GHz unlicensed ISM band USB/UAR T/SPI -80 dBm @ 0.1% BER Class 2 -6 dBm ~ +4 dBm 50 ohms 1600hops/sec. 16MHz Up to 723Kb/s -20∞C ~ +80∞C -30∞C ~ +90∞C 10 meters (T ypical) 65 mA (T ypical) Bluetooth ® 11 11 HI-505SD as a regular GPS mouse: By connection different optional connecting cables, HI-505SD can be all kinds of independent wired GPS receiver solutions. 12 12 Connecting to a Notebook Connect HI-505SD to your Notebook as a USB GPS Receiver 13 13 Disassemble Step 1: Turn the silver knob down to the end Step 2: The silver knob spring out Step 3: Separate the two parts 14 14 Assemble Step 1: Put two parts in position Step 2: Push the silver knob in Step 3: Turn the silver knob back to other end 15 15 * Make sure two triangle align during disassemble or assemble Bluetooth ® Installatio n Follow the instructions below to link HI-505SD to a PDA (Personal Digital Assistant). 1. Activate “Bluetooth Manager” on your pocket PC. Tap New, Connect, to access other devices via Bluetooth. 16 16 2. Search Bluetooth device “HI-505SD”. Select Explore a Bluetooth device, and tap Next. 3. Search for the Bluetooth device. Tap Next, and then select HI-505SD 17 17 4. To establish Bluetooth link, select Connect to SPP Slave, tap Next and then Finish. 5. Tap HAICOM BT GPS:SPP slave, and select Connect from the dropdown menu. The installation has been completed. 18 18 For Connected with device Select the correct com port Start GPS, NM…

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Cover Letter(s)

1 Chris Harvey From: Iris Lin [[email protected]] Sent: Wednesday, May 16, 2007 11:35 PM To: [email protected] Cc: R00/劉尚昇 Subject: Fw: Fw: HAICOM Electronics Corp., FCC ID: RU8HI-505SD, Assessment NO.: AN07T6783, Notice#1 Attachments: Exhibit-L-Antenna_Info..pdf; Exhibit-G-Schematics_rev.pdf Exhibit-L-Antenna_I nfo..pdf (1... Exhibit-G-Schematic s_rev.pdf (... Dear Chris, Ans#1: Please refer to the updated schematics for your reference as attachment. Ans#2: Please refer to the attached antenna information for your reference. Ans#3: Yes. It's version 1.1. ELECTRONICS TESTING CENTER, TAIWAN IRIS LIN (林慧君) TEL: 886-2-26023052 ext.10 FAX: 886-2-26010910 ----- Original Message ----- From: "SS" <[email protected]> To: "R00/林慧君" <[email protected]> Sent: Wednesday, May 09, 2007 5:16 PM Subject: Fw: HAICOM Electronics Corp., FCC ID: RU8HI-505SD, Assessment NO.: AN07T6783, Notice#1 > > ----- Original Message ----- > From: <[email protected]> > To: <[email protected]> > Cc: <[email protected]> > Sent: Wednesday, May 09, 2007 1:38 PM > Subject: HAICOM Electronics Corp., FCC ID: RU8HI-505SD, Assessment NO.: > AN07T6783, Notice#1 > > > > Dear SS Liou, > > The above referenced TCB application ahs been reviewed. The items > > below > must be addressed before the review can be continued: > > > > 1. The schematic diagram submitted includes a place for the > > Bluetooth > Module, but the schematics did not include the Bluetooth Module circuitry. > Please revise the schematics to include the Bluetooth RF circuit. > > > > 2. Please provide the antenna specifications for the Bluetooth > > antenna > (should include peak gain). > > > > 3. Please note that the Users Manual indicated that this device is > compliant with the Bluetooth CORE version 1.1. If this is not correct > please provide Bluetooth CORE compliance evidence. > > 2 > > The items indicated above must be submitted before processing can continue > on the above referenced application. Failure to provide the requested > information within 30 days of the original e-mail date may result in > application dismissal and forfeiture of the filing fee. Also, please > note that partial responses increase processing time and should not be submitted. > Any questions about the content of this correspondence should be > directed to > the e-mail address listed below the name of the sender. > > > > Best regards, > > > > Chris Harvey > > [email protected] > > > > > > > > >

Cover Letter(s)

Bluetooth Declaration Per FCC 15.247 Requirements 1 Output power and channel separation of a Bluetooth device in the different operating modes: The different operating modes (data-mode, acquisition-mode) of a Bluetooth device don’t influence the output power and the channel spacing. There is only one transmitter which is driven by identical input parameters concerning these two parameters. Only a different hopping sequence will be used. For this reason the check of these RF parameters in one op-mode is sufficient. 2 Frequency range of a Bluetooth device: Hereby we declare that the maximum frequency of this device is: 2402 – 2480 MHz. This is according the Bluetooth Core Specification V 1.0B (+ critical errata) for devices which will be operated in the USA. This was checked during the Bluetooth Qualification tests (Test Case: TRM/CA/04-E). Other frequency ranges ( e.g. for Spain, France, Japan) which are allowed according the Core Specification are not supported by this device. 3 Co-ordination of the hopping sequence in data mode to avoid simultaneous occupancy by multiple transmitters: Bluetooth units which want to communicate with other units must be organized in a structure called piconet. This piconet consist of max. 8 Bluetooth units. One unit is the master the other seven are the slaves. The master co-ordinates frequency occupation in this piconet for all units. As the master hop sequence is derived from it’s BD address which is unique for every Bluetooth device, additional masters intending to establish new piconets will always use different hop sequences. 4 Example of a hopping sequence in data mode: Example of a 79 hopping sequence in data mode: 40, 21, 44, 23, 42, 53, 46, 55, 48, 33, 52, 35, 50, 65, 54, 67, 56, 37, 60, 39, 58, 69, 62, 71, 64, 25, 68, 27, 66, 57, 70, 59, 72, 29, 76, 31, 74, 61, 78, 63, 01, 41, 05, 43, 03, 73, 07, 75, 09, 45, 13, 47, 11, 77, 15, 00, 64, 49, 66, 53, 68, 02, 70, 06, 01, 51, 03, 55, 05, 04 5 Equally average use of frequencies in data mode and behaviour for short transmissions: The generation of the hopping sequence in connection mode depends essentially on two input values: 1. LAP/UAP of the master of the connection 2. Internal master clock The LAP (lower address part) are the 24 LSB’s of the 48 BD_ADDRESS. The BD_ADDRESS is an unambiguous number of every Bluetooth unit. The UAP (upper address part) are the 24 MSB’s of the 48 BD_ADDRESS. The internal clock of a Bluetooth unit is derived from a free running clock which is never adjusted and is never turned off. For synchronisation with other units only offset are used. It has no relation to the time of the day. Its resolution is at least half the RX/TX slot length of 312.5 μs. The clock has a cycle of about one day (23h30). In most case it is implemented as 28 bit counter. For the deriving of the hopping sequence the entire LAP (24 bits), 4 LSB’s (4 bits) (Input 1) and the 27 MSB’s of the clock (Input 2) are used. With this input values different mathematical procedures (permutations, additions, XOR-operations) are performed to generate the sequence. This will be done at the beginning of every new transmission. Regarding short transmissions the Bluetooth system has the following behaviors: The first connection between the two devices is established, a hopping sequence was generated. For transmitting the wanted data the complete hopping sequence was not used. The connection ended. The second connection will be established. A new hopping sequence is generated. Due to the fact that the Bluetooth clock has a different value, because the period between the two transmission is longer (and it cannot be shorter) than the minimum resolution of the clock (312.5 μs). The hopping sequence will always differ from the first one. 6 Receiver input bandwidth and behaviors for repeated single or multiple packets: The input bandwidth of the receiver is 1 MHz. In every connection one Bluetooth device is the master and the other one is the slave. The master determines the hopping sequence (see chapter 5). The slave follows this sequence. Both devices shift between RX and TX time slot according to the clock of the master. Additionally the type of connection (e.g. single or multislot packet) is set up at the beginning of the connection. The master adapts its hopping frequency and its TX/RX timing according to the packet type of the connection. Also the slave of the connection will use these settings. Repeating of a packet has no influence on the hopping sequence. The hopping sequence generated by the master of the connection will be followed in any case. That means, a repeated packet will not be send on the same frequency, it is send on the next frequency of the hopping sequence. 7 Dwell time in data mode The dwell time of 0.3797s within a 30 second period in data mode is independent from the packet type (packet length). The calculation for a 30 second period is a follows: Dwell time = time slot length * hop rate / number of hopping channels *30s Example for a DH1 packet (with a maximum length of one time slot) Dwell time = 625 μs * 1600 1/s / 79 * 30s = 0.3797s (in a 30s period) For multislot packet the hopping is reduced according to the length of the packet. Example for a DH5 packet (with a maximum length of five time slots) Dwell time = 5 * 625 μs * 1600 * 1/5 *1/s / 79 * 30s = 0.3797s (in a 30s period) This is according the Bluetooth Core Specification V 1.0B (+ critical errata) for all Bluetooth devices. There for all Bluetooth devices comply with the FCC dwell time requirement in data mode. This was checked during the Bluetooth Qualification tests. The Dwell time in hybrid mode is measured and stated in the test report. 8 Channel Separation in hybrid mode The nominal channel spacing of the Bluetooth system is 1Mhz independent of the operating mode. The maximum “initial carrier frequency tolerance” which is allowed for Bluetooth is fcenter = 75 kHz. This was checked during the Bluetooth Qualification tests (Test Case:…

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External Photos

ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Top View of EUT Side View of EUT ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Rear View of EUT Side View of EUT ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Front View of EUT Bottom View of EUT

ID Label/Location Info

Model : HI-505SD,HI-505 FCC ID : RU8HI-505SD 25mm 15mm

Internal Photos

ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Internal View of EUT ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Component View of PCB Component View of PCB ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 CONSTRUCTED PHOTOS of EUT Solder View of PCB Solder View of PCB

Parts List/Tune Up Info

Walsin Technology Corporation Page 1 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 MULTILAYER CERAMIC ANTENNA RFANT Series 2.4 GHz ISM Band Working Frequency     *Contents in this sheet are subject to change without prior notice. Walsin Technology Corporation Page 2 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 REVISION HISTORY Rev P/N Description Date V01 RFANT3216090A0T First Version 2004-12-10 V02 RFANT3216090A0T 1.Change “LAND PATTERN” suggestion: Pad connected to Ground dimension “Wg” from 0.70 ± 0.10 mm to 0.60 ± 0.10 mm Pad connected to 50 Ө Transmission Line dimension “Lh” from 0.20 ± 0.10 mm to 0.30± 0.10 mm 2005-02-25 V03 RFANT3216090A0T Delete Original Approval Sheet "P8~P12" of RFANT3216090A0T. Please refer to Application Note of RFANT3216090A0T for identical information. 2005-03-30 Walsin Technology Corporation Page 3 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 FEATURES  Surface Mounted Devices with a small dimension of 3.2 x 1.6 x 0.9 mm 3 meet future miniaturization trend. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product. High Stability in Temperature / Humidity Change APPLICATIONS Bluetooth Wireless LAN ISM band 2.4GHz wireless applications DESCRIPTION Walsin Technology Corporation develops a new ceramic embedded antenna specified for 2.4 GHz ISM Band application, as shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b/g and Bluetooth TM typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the friendly usage for antenna, this antenna has been designed to a typical 350MHz bandwidth through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. This antenna has a rectangular ceramic body with a tiny dimension of 3.2x 1.6 x 0.9 mm 3 meet the future SMT automation and miniaturization requirements on modern portable devices. CONSTRUCTION Fig 1. Outline of 2.4GHz Antenna – RFANT3216090A0T DIMENSIONS Figure Dimension Port definition L 3.20 ± 0.15 mm - W 1.60 ± 0.15 mm - T 0.90 ± 0.10 mm - F 0.50 ± 0.10 mm Feed termination G 0.50 ± 0.10 mm Ground termination P 1 0.50 ± 0.10 mm Solder termination C 0.60 ± 0.15 mm - Walsin Technology Corporation Page 4 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 ELECTRICAL CHARACTERISTICS Item Specification Working Frequency Range 2.4 GHz Д 2.5GHz Gain 2 dBi (Typical) VSWR 2 max. Polarization Linear Azimuth Beamwidth Omni-directional Impedance 50 W Rated Power (max.) 500 mW Operation Temperature -40 ̓ C ~ +85 ̓ C Remark: The specification is defined based on the test board dimension as in below Antenna on Test Board                  Walsin Technology Corporation Page 5 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 Antenna S11 on Test Board ------------------------------------------------------------------------------------------------------------------------------ -10dB bandwidth 370MHz Walsin Technology Corporation Page 6 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 SOLDER LAND PATTERN DESIGN Figure Symbol Dimension L 4.20 ± 0.10 mm Lp 0.60 ± 0.10 mm Wp 0.70 ± 0.10 mm Lf 0.80 ± 0.10 mm Lg 1.00 ± 0.10 mm Wg 0.60 ± 0.10 mm Lh 0.30 ± 0.10 mm Wd 0.70 ± 0.10 mm RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. The specification of RFANT3216090A0T antenna was measured based on the test board size and the antenna installation position as shown in the below:            ! " # W"$$$% " #&'(     )*  *   *  W "$$$%     Walsin Technology Corporation Page 7 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 Vertical Horizontal Y - Z Plane Average Gain= 0.318 dBi Peak Gain = 3.81dBi Average Gain = -0.35 dBi Peak Gain= -3.78dBi Average Gain=-8.14 dBi X - Z Plane Average Gain=- 2.224 dBi Peak Gain= -5.12 dBi Average Gain= -10.24dBi Peak Gain= 1.96 dBi Average Gain= -2.97 dBi X - Y Plane Average Gain= - 2.173 dBi Peak Gain= -2.16 dBi Average Gain= -9.20dBi Peak Gain= 2.58 dBi Average Gain= -3.84 dBi z Y z Y z X z X X Y X Y Walsin Technology Corporation Page 8 of 10 ASC_RFANT3216090A0T_V03 Mar. 2005 RELIABILITY TEST  Mechanical performance Test item Test condition / Test method Specification Solderability Solder temp. : 235 ± 5 ∞ C Immersion time: 2 ± 1 sec Solder: SN63 95% min. coverage of all metabolised area Resistance to soldering heat Solder: Sn63 Preheating temperature: 150 ± 10 ∞ C Solder Temperature: 260 ± 5 ∞ C Immersion time: 10 ± 1 sec Measurement to be made after keeping at room temp. for 24±2 hrs. No mechanical damage. Ceramic surface shall not be exposed in the middle of the termination or on the terminated product edge by leaching. Drop test Height : 75 cm Times : 3 times No mechanical damage. Samples shall satisfy electrical specification after test.. Environmental characteristics Test item Test condition / Test method Specification Humidity Resistance Humidity:90% to 95% R.H. Tempertaure:40±2∞C Time: 500±24 hours. Measurement: After placing for 24 hours Minimum. No mechanical damage. Samples shall satisfy electrical specification after test. Temperature cycle 1. 30±3 minutes at -40∞C±3∞C, 2. 10~15 minutes at room temperature, 3. 30 ± 3 minutes at +85 ∞± 3 ∞ C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement after placing for 48±2 hrs min. No mechanical damage. Samples shall satisfy electrical specification after test. High temperature Temperature: 85 ∞ C ± 2 ∞ C Test duration: 24 hours Measurement must be taken after subjection to the above conditions, followed by exposure in room environment for 1 to 2 hours. No mechanical damage. Samples shall satisfy electrical specification after test. Low temperature Temperature: -40∞C…

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Test Report

Rev. No 1.0 FCC Part 15 EMI TEST REPORT of E.U.T. : BLUETOOTH GPS Model : HI-505SD FCC ID : RU8HI-505SD for APPLICANT : HAICOM ELECTRONICS CORP. ADDRESS : 3F-11, NO. 130, Jian-Kang Rd., Chung Ho, Taipei Hsien, Taiwan R.O.C. Test Performed by ELECTRONICS TESTING CENTER, TAIWAN NO.34, LIN 5, DINGFU TSUEN, LINKOU SHIANG TAIPEI COUNTY, TAIWAN, 24442, R.O.C. Tel:(02)26023052 Fax:(02)26010910 http://www.etc.org.tw ; e-mail : [email protected] Report Number : 07-04-RBF-013-03 ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 1.0 TEST REPORT CERTIFICATION Applicant : HAICOM ELECTRONICS CORP. 3F-11, NO. 130, Jian-Kang Rd., Chung Ho, Taipei Hsien, Taiwan R.O.C. Manufacture : HAICOM ELECTRONICS CORP. 3F-11, NO. 130, Jian-Kang Rd., Chung Ho, Taipei Hsien, Taiwan R.O.C. Description of Device : a) Type of EUT : BLUETOOTH GPS b) Trade Name : HAICOM c) Model No. : HI-505SD d) Power Supply : Power From PDA e) The data also apply to : HI-505 Regulation Applied : FCC Rules and Regulations Part 15 Subpart C (2006) I HEREBY CERTIFY THAT: The data shown in this report were made in accordance with the procedures given in ANSI C63.4, and the energy emitted by the device was founded to be within the limits applicable. I assume full responsibility for accuracy and completeness of these data. Note: 1. The result of the testing report relate only to the item tested. 2. The testing report shall not be reproduced expect in full, without the written approval of ETC. Issued Date : Apr. 30, 2007 Test Engineer : ( Vincent Chang ) Approve & Authorized Signer : Will Yauo, Manager EMC Dept. II of ELECTRONICS TESTING CENTER, TAIWAN ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 1.0 Table of Contents Page 1 GENERAL INFORMATION ...................................................................................................... 1 1.1 Product Description...................................................................................................................... 1 1.2 Characteristics of Device ............................................................................................................. 1 1.3 Test Methodology ........................................................................................................................ 1 1.4 Test Facility.................................................................................................................................. 1 2 PROVISIONS APPLICABLE ..................................................................................................... 2 2.1 Definition ..................................................................................................................................... 2 2.2 Requirement for Compliance ....................................................................................................... 3 2.3 Restricted Bands of Operation ..................................................................................................... 5 2.4 Labeling Requirement .................................................................................................................. 6 2.5 User Information .......................................................................................................................... 6 3 SYSTEM TEST CONFIGURATION ......................................................................................... 7 3.1 Justification .................................................................................................................................. 7 3.2 Devices for Tested System........................................................................................................... 7 4 RADIATED EMISSION MEASUREMENT.............................................................................. 8 4.1 Applicable Standard ..................................................................................................................... 8 4.2 Measurement Procedure............................................................................................................... 8 4.3 Measuring Instrument ................................................................................................................ 10 4.4 Radiated Emission Data ............................................................................................................. 11 4.4.1 Tx Portion .......................................................................................................................................... 11 4.4.2 Radiated Emissions in Restricted Bands ............................................................................................ 14 4.4.3 Other Emissions ................................................................................................................................. 15 4.5 Field Strength Calculation ......................................................................................................... 16 4.6 Photos of Radiation Measuring Setup........................................................................................ 17 5 CONDUCTED EMISSION MEASUREMENT ....................................................................... 18 5.1 Standard Applicable ................................................................................................................... 18 5.2 Measurement Procedure............................................................................................................. 18 5.3 Conducted Emission Data .......................................................................................................... 19 5.4 Result Data Calculation ............................................................................................................. 23 5.5 Conducted Measurement Equipment ......................................................................................... 23 5.6 Photos of Conduction Measuring Setup................................................................................…

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Test Setup Photos

ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 Photos of Radiation Measuring Setup ETC Report No. : 07-04-RBF-013-03 FCC ID.: RU8HI-505SD Rev. No 2.1 Photos of Conduction Measuring Setup

Contact Information

Applicant

Victor Chuang(Engineer)
[email protected]886-2-32349610Fax: 886-2-82211522

Test Firm

Electronics Testing Center, TaiwanWill Yauo
[email protected]886-3-3280026Fax: 886-3-3280034

Technical Specifications

#Rule PartsFrequency RangePower Output
115C2.40 GHz - 2.48 GHz1.20 mW
Confidentiality
Long Term
Grant Notes
Power Output is Conducted. The antennas must not be co-located or operating in conjunction with any other antenna or transmitter. End-users and installer must be provided with operating instructions for satisfying RF exposure compliance requirements.

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