SQG-SONAIF573Sona IF573 802.11ax Wi-Fi 6E Module with Bluetooth 5.4

Laird Connectivity LLC

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Application Details

Equipment Class: DTS - Digital Transmission System
Date of Grant: Aug 31, 2023
Application Purpose: Original Equipment
Date of Application: Aug 22, 2023
Equipment Note: Sona IF573 802.11ax Wi-Fi 6E Module with Bluetooth 5.4
Frequency Range: 2412.00000000 - 2462.00000000
Company: Laird Connectivity LLC
Country: United States

Documents & Files

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

A Datasheet Sona™ IF573 Version 0.2 Sona IF573 Datasheet https://www.lairdconnect.com/ 2 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 REVISION HISTORY Version Date Notes Contributors Approver 0.1 8 June 2023 Initial version Various Andy Ross 0.2 13 July 2023 Updates to Table 37: M.2 2230 E-Key pin definitions – WL_DEV_WAKE and BT_DEV_WAKE voltage Jacky Kuo Andrew Chen Sona IF573 Datasheet https://www.lairdconnect.com/ 3 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 CONTENTS 1 Scope .................................................................................................................................................................................. 5 2 Introduction .......................................................................................................................................................................... 5 2.1 General Description.................................................................................................................................................... 5 3 Sona IF573 Series Features Summary ............................................................................................................................... 6 4 Specifications ...................................................................................................................................................................... 7 5 WLAN Functional Description ............................................................................................................................................ 14 5.1 Overview .................................................................................................................................................................. 14 6 Bluetooth Functional Description ....................................................................................................................................... 17 7 Block Diagrams ................................................................................................................................................................. 19 7.1 M.2 1318 Solder-down ............................................................................................................................................. 19 7.2 M.2 2230 E-Key ....................................................................................................................................................... 20 8 Electrical Characteristics ................................................................................................................................................... 20 8.1 Absolute Maximum Ratings ...................................................................................................................................... 20 8.2 Recommended Operating Conditions ...................................................................................................................... 21 8.3 DC Electrical Characteristics .................................................................................................................................... 21 8.4 WLAN Radio Receiver Characteristics ..................................................................................................................... 21 8.7 WLAN Transmitter Characteristics ........................................................................................................................... 25 9 Bluetooth Radio Characteristics ........................................................................................................................................ 31 10 Host Interface Specifications ............................................................................................................................................. 34 10.1 SDIO Specifications ................................................................................................................................................. 34 10.1.1 Default Speed, High-Speed Modes .................................................................................................................... 34 10.1.2 SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V) .................................................................................... 35 10.1.3 SDR104 Mode (208 MHz) (1.8V) ....................................................................................................................... 36 10.2 PCI Express Interface .............................................................................................................................................. 37 10.3 PCM Interface Specifications ................................................................................................................................... 38 10.3.1 PCM Interface .................................................................................................................................................... 38 10.3.2 PCM Interface Timing ......................................................................................................................................... 38 10.4 JTAG Interface ......................................................................................................................................................... 43 11 Power-Up Sequence and Timing ....................................................................................................................................... 44 11.1 Description of Control Signals .................................................................................................................................. 44 11.2 Control Signal Timing Diagrams ............................................................................................................................... 44 12 Pin Definitions …

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Users Manual

Sona IF573 Datasheet https://www.lairdconnect.com/ 66 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 16.2.2 M.2 2230 E-Key Module Figure 32: Sona IF573 M.2 2230 Shipping Tray, Bottom, 161-00355 Sona IF573 Datasheet https://www.lairdconnect.com/ 67 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 Figure 33: Sona IF573 M.2 2230 Shipping Tray, Top, 161-00356 Sona IF573 Datasheet https://www.lairdconnect.com/ 68 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 Figure 34: Sona IF573 M.2 2230 Packaging Process, 453-00119-PKG The following label is placed on the bag and the inner box. Sona IF573 Datasheet https://www.lairdconnect.com/ 69 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 Figure 35: Sona IF573 M.2 2230 Bag and Box Product Identifier Label, 160-02373 The following label is located on the adjacent sides of the master carton. Sona IF573 Datasheet https://www.lairdconnect.com/ 70 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 Figure 36: Sona IF573 M.2 2230 Carton Product Identifier Label, 160-02374 16.3 Required Storage Conditions 16.3.1 Prior to Opening the Dry Packing The following are required storage conditions prior to opening the dry packing:  Normal temperature: 5~40 ̊C  Normal humidity: 80% (Relative humidity) or less  Storage period: One year or less Note: Humidity means relative humidity. 16.3.2 After Opening the Dry Packing The following are required storage conditions after opening the dry packing (to prevent moisture absorption):  Storage conditions for one-time soldering: – Temperature: 5-25°C – Humidity: 60% or less – Period: 72 hours or less after opening  Storage conditions for two-time soldering – Storage conditions following opening and prior to performing the 1 st reflow:  Temperature: 5-25°C  Humidity: 60% or less  Period: A hours or less after opening Sona IF573 Datasheet https://www.lairdconnect.com/ 71 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 – Storage conditions following completion of the 1 st reflow and prior to performing the 2 nd reflow  Temperature: 5-25°C  Humidity: 60% or less  Period: B hours or less after completion of the 1 st reflow Note: Should keep A+B within 72 hours. 16.3.3 Temporary Storage Requirements after Opening The following are temporary storage requirements after opening:  Only re-store the devices once prior to soldering.  Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing. The following indicate the required storage period, temperature, and humidity for this temporary storage:  Storage temperature and humidity: *** - External atmosphere temperature and humidity of the dry packing  Storage period: – X1+X2 – Refer to After Opening the Dry Packing storage requirements. Keep is X1+X2 within 72 hours. – Y – Keep within two weeks or less. 16.4 Baking Conditions Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:  The calculated shelf life in a sealed bag is 12 months at <40°C and <80% relative humidity.  Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30 ̊C and <60% relative humidity.  If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ̊C (±5 ̊C). Temperature: +5 to +40°C Humidity: 80% or less Temperature: +5 to +25°C Humidity: 60% or less Temperature: +5 to +40°C Humidity: 80% or less Temperature: +5 to +25°C Humidity: 60% or less *** *** Sona IF573 Datasheet https://www.lairdconnect.com/ 72 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 17 SURFACE MOUNT CONDITIONS The following soldering conditions are recommended to ensure device quality. 17.1 Recommended Stencil Aperture Figure 37: Sona IF573 M.2 1318 stencil aperture Note: The stencil thickness is 0.12mm Sona IF573 Datasheet https://www.lairdconnect.com/ 73 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 17.2 Soldering Note: When soldering, the stencil thickness should be 0.12 mm. Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment) Measuring point – IC package surface Temperature profile: Figure 38: Temperature profile  Solder paste alloy: SAC305(Sn96.5 / Ag3.0 / Cu 0.5)  Pre-heat temperature: 150°C ~ 200°C; Soak time: 60 second ~ 120 second  Peak temperature: 235°C ~ 250°C  Time above 220°C: 40 second ~ 90 second  Optimal cooling rate < 3°C/second  The oxygen concentration < 2000 ppm Sona IF573 Datasheet https://www.lairdconnect.com/ 74 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852-2762-4823 17.2.1 Cautions When Removing the M.2 1318 from the Platform for RMA  Bake the platform before removing the Sona IF573 module from the platform. Reference Baking Conditions.  Remove the Sona IF573 module by using a hot air gun. This process should be carried out by a skilled technician. Recommended conditions:  One-side component platform: – Set the hot plate at 280°C. – Put the platform on the hot plate for 8~10 seconds. – Remove the device from platform.  Two-side comp…

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Attestation Statements

Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Laird Connectivity LLC and SQG Attestation Statement Reference: a) FCC CFR section 2.911(d)(5)(i) b) FCC Section 2.911(d)(5)(ii) c) FCC Section 2.911(d)(7) a) [Laird Connectivity LLC] certifies that the equipment [FCC ID: SQG-SONAIF573] for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules; b) [Laird Connectivity LLC] certifies that, as of the date of the filing of the application, the applicant [is not] identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing “covered” equipment; c) [Laird Connectivity LLC] as required by section 2.911(d)(7), will also serve as the agent for service of process for the above referenced FCC Grantee Code. The service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. The applicant acknowledges that they will maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The applicant further acknowledges their responsibility to inform the FCC whenever the following agent information changes. Designated Agent Company name: Laird Connectivity LLC Grantee Code: SQG Contact Name: Brian Petted, Technology Leader Street Address: W66 N220 Commerce Court City/Province/Zip: Cedarburg, Wisconsin, 53012 Telephone No: (262)-421-4974 Email: [email protected] FRN: 0022590616 Sincerely yours, Signed by the Applicant Name: Brian Petted Title: Technology Leader Date: July 26, 2023

Attestation Statements

Cover Letter(s)

Date: July 26, 2023 Subject: Ad Hoc Mode Function Declaration FCC ID: SQG-SONAIF573 IC ID: 3147A-SONAIF573 To Whom it may concern, We, Laird Connectivity LLC declare that the device does not support any non-US channels, country code selection and Channel 12 and 13 in 2.4 GHz band in all the operational mode(s). Also, the client software and associated drivers will not initiate any transmission on DFS frequencies without initiation by a master and the device without support DFS detection capability. This includes restriction on transmissions for beacons and support for ad-hoc peer-to-peer modes. Regards, Brian Petted Technology Leader Laird Connectivity LLC [email protected] Tel: 262-421-4974

Cover Letter(s)

Laird Connectivity LLC W66N220 Commerce Court, Cedarburg, Wisconsin 53012, USA Confidentiality Request Letter Date: 2023/7/26 Federal Communications Commission Authorization and Evaluation Division FCC ID：SQG-SONAIF573 Permanent Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, the Applicant Hereby requests confidential treatment of information accompanying this Application As outlined below: 1. Block Diagram 2. Circuit Diagram 3. Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457, disclosure of this Application and all accompanying documentation will not be made before the date of the Grant for this application Sincerely, Brian Petted Technology Leader Laird Connectivity LLC [email protected] Tel: 262-421-4974

Cover Letter(s)

Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: SQG-SONAIF573 Items to be covered by Single modular transmitters. Answer from applicant 1. The modular transmitter must have its own RF shielding. The modular has a shielding Case. Please refer to EUT Photo. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The module contains a CYW55573MIWBGT transceiver which controls the physical data rates and modulation parameters. 3. The modular transmitter must have its own power supply regulation. The module contains a CYW55573MIWBGT transceiver that has an integrated power management system, including internal voltage regulation. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). Antenna Connectors is RP- SMA / I-PEX MHF4L. And no external amplifier will be used with this modular. 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. This modular is tested under stand-alone configuration. Please refer to Test setup photo. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). The modular transmitter is labeled with its own FCC ID number. Please refer to label sample and label location. 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. The modular complies with this requirement. Please refer to user manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. The device complies with this requirement. Please refer to RF exposure report. Brian Petted Technology Leader Laird Connectivity LLC [email protected] Tel: 262-421-4974

Cover Letter(s)

Date: 2023/7/26 Federal Communications Commission 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Product Certification Representative Authorization Letter FCC ID: SQG-SONAIF573 Product name: Sona IF573 802.11ax Wi-Fi 6E Module with Bluetooth 5.4 To whom it may concern: We the undersigned, hereby authorize following person to act as our agent in the preparation of an application for equipment authorization of model Sona IF573 to the FCC Rules and Regulations. International Certification Corp. Address : No.3-1, Lane 6, Wen San 3rd St. Kwei Shan Dist., TaoYuan City 333, Taiwan (R.O.C.) Name : Gary Chang Job Title : Manager e-mail : [email protected] Webs We further certifies that neither the applicant nor any party to this application, as defined in 47 CFR Ch. 1.2002(b), is subject to a denial to Federal benefits, that include FCC benefits, pursuant to section 5301 of the Anti-Drug Abuse Act of 1998, 21 U.S.C. 862. This appointment also includes the authority to complete FCC Form 731 on our behalf and sign the application as an authorized agent. Brian Petted Technology Leader Laird Connectivity LLC [email protected] Tel: 262-421-4974

External Photos

Project No.: EP311701 Page No. : 1 of 1 Photographs of Jig Board

External Photos

Project No.: EP311701 Page No. : 1 of 17 Photographs of EUT Part No.: 453-00117 Project No.: EP311701 Page No. : 2 of 17 Part No.: 453-00118 Project No.: EP311701 Page No. : 3 of 17 Part No.: 453-00119 Project No.: EP311701 Page No. : 4 of 17 Project No.: EP311701 Page No. : 5 of 17 Part No.: 453-00120 Project No.: EP311701 Page No. : 6 of 17

Internal Photos

Project No.: EP311701 Page No. : 7 of 17 Part No.: 453-00117 Project No.: EP311701 Page No. : 8 of 17 Part No.: 453-00118 Project No.: EP311701 Page No. : 9 of 17 Project No.: EP311701 Page No. : 10 of 17 Part No.: 453-00119 Project No.: EP311701 Page No. : 11 of 17 Part No.: 453-00120 Project No.: EP311701 Page No. : 12 of 17 Project No.: EP311701 Page No. : 13 of 17 ANT.: PCB Dipole, P/N: EMF2471A3S-10MH4L ANT.: PIFA, P/N: EFB2471A3S-10MH4L Project No.: EP311701 Page No. : 14 of 17 ANT.: PIFA, P/N: EFD2471A3S-10MH4L Project No.: EP311701 Page No. : 15 of 17 ANT.: Dipole, P/N: TWX-100BRSAX-2001 Project No.: EP311701 Page No. : 16 of 17 Project No.: EP311701 Page No. : 17 of 17

RF Exposure Info

Report No.: FA311701 Page : 1 of 8 Report Version: Rev. 01 FCC RF Exposure Report FCC ID : SQG-SONAIF573 Equipment : Sona IF573 802.11ax Wi-Fi 6E Module with Bluetooth 5.4 Model No. : Sona IF573 Brand Name : Laird Connectivity Applicant : Laird Connectivity LLC Address : W66N220 Commerce Court, Cedarburg, WI 53012 United States Of America Standard : 47 CFR FCC Part 2.1091 Received Date : Jan. 17, 2023 Tested Date : Apr. 07 ~ Jun. 28, 2023 We, International Certification Corporation, would like to declare that the tested sample has been evaluated and in compliance with the requirement of the above standards. The test results contained in this report refer exclusively to the product. It shall not be reproduced except in full without the written approval of our laboratory. Reviewed by: Approved by: Along Chen / Assistant Manager Gary Chang / Manager Report No.: FA311701 Page : 2 of 8 Report Version: Rev. 01 Table of Contents 1 MPE EVALUATION OF MOBILE DEVICES ......................................................................................... 4 1.1 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE............................................. 4 1.2 MPE EVALUATION FORMULA ............................................................................................................. 4 1.3 REFERENCE GUIDANCE ..................................................................................................................... 4 1.4 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE ................................... 4 1.5 MEASUREMENT UNCERTAINTY ......................................................................................................... 4 1.6 MPE EVALUATION RESULTS .............................................................................................................. 5 1.7 MPE EVALUATION OF SIMULTANEOUS TRANSMISSION ................................................................ 7 2 TEST LABORATORY INFORMATION ................................................................................................. 8 Report No.: FA311701 Page : 3 of 8 Report Version: Rev. 01 Release Record Report No. Version Description Issued Date FA311701 Rev. 01 Initial issue Jul. 28, 2023 Report No.: FA311701 Page : 4 of 8 Report Version: Rev. 01 1 MPE EVALUATION OF MOBILE DEVICES 1.1 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE Frequency Range (MHz) Power Density (mW /cm 2 ) Averaging Time (minutes) 300~1500 F/1500 30 1500~100000 1.0 30 1.2 MPE EVALUATION FORMULA Pd = 2 **4RPi Pt Where Pd= Power density in mW/cm 2 Pt= EIRP in mW Pi= 3.1416 R= Measurement distance 1.3 REFERENCE GUIDANCE 447498 D01 General RF Exposure Guidance v06 1.4 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE None 1.5 MEASUREMENT UNCERTAINTY The measurement uncertainties given below are based on a 95% confidence level (based on a coverage factor (k=2)). Parameters Uncertainty Conducted power ±0.808 dB Declaration of Conformity: The test results with all measurement uncertainty excluded are presented in accordance with the regulation limits or requirements declared by manufacturers. Comments and Explanations: The declared of product specification for EUT presented in the report are provided by the manufacturer, and the manufacturer takes all the responsibilities for the accuracy of product specification. Report No.: FA311701 Page : 5 of 8 Report Version: Rev. 01 1.6 MPE EVALUATION RESULTS Non-beamforming mode Frequency Range (MHz) Maximum Conducted Power (dBm) Maximum Tune Up Limit (dBm) Antenna Gain (dBi) Distance (cm) Power Density (mW/cm 2 ) Limit (mW/cm 2 ) *Ratio Pass / Fail WLAN 2412-2462 21.02 21.5 2.4 20 0.049 1 0.049 Pass 5180-5240 21.39 21.5 4.4 20 0.077 1 0.077 Pass 5260-5320 21.55 22.0 4.4 20 0.087 1 0.087 Pass 5500-5720 21.67 22.0 4.4 20 0.087 1 0.087 Pass 5745-5825 21.61 22.0 4.4 20 0.087 1 0.087 Pass BT 2402-2480 8.24 8.5 2.4 20 0.002 1 0.002 Pass Frequency Range (MHz) EIRP(dBm) Maximum Tune Up Limit (dBm) Distance (cm) Power Density (mW/cm 2 ) Limit (mW/cm 2 ) *Ratio Pass / Fail 5925-6425 14.36 14.5 20 0.006 1 0.006 Pass 6425-6525 14.26 14.5 20 0.006 1 0.006 Pass 6525-6875 14.25 14.5 20 0.006 1 0.006 Pass 6875-7125 14.34 14.5 20 0.006 1 0.006 Pass *Ratio = Power density / Limit. Report No.: FA311701 Page :…

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Contact Information

Applicant

Brian Petted(Technology Leader)

[email protected]2624214974Fax: 262-375-4248

Test Firm

International Certification Corp.Fu-Cheng Chuang

[email protected]886-3-271-8666Fax: 886-3-318-0155

Technical Specifications

#	Rule Parts	Frequency Range	Power Output
2	15C	2.41 GHz - 2.46 GHz	628.00 mW

Modular Type

Single Modular Approval

Confidentiality

Long Term

Grant Notes

Single Modular Approval. Output power listed is conducted. This device supports 2x2 MIMO and operating bandwidth of 20 MHz. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multiple transmitters product guidelines. Approved for OEM integration only. The grantee must provide OEM integrators with installation and operating instructions for satisfying RF exposure compliance and multi-transmitter product guidelines. The module (Part Number: 453-00118) can only be used with a host antenna circuit trace layout design in strict compliance with the OEM instructions provided.