Z64-CC256XEMTexas Instruments Bluetooth and Dual mode controller (2.4GHz)

CC256x BPF Antenna 26 MHz XTAL 32.768 KHz Slow Clock LDO Current Measurements COM Interface EM Interface 3.3v – 1.8V IO Selection Debug Pins uFL Connector SCLK Selection PCM . UART . BT RESET SCLK VBAT 1.8V Wednesday, March 20, 2013

Model: CC256xEM FCC ID: Z64-CC256XEM IC: 451I-CC256XEM

CC256x QFN Board – Operational and Technical Description The CC256x QFN EM board is the evaluation and development board for the Texas Instruments (TI) CC256x device. It plugs directly into many TI Microcontroller’s MSP430 and Stellaris Evaluation Boards with header connectors that simplify prototype wiring and field trials. When coupled with this Microcontroller Units (MCU), the CC256x QFN EM board provides flexibility and best-in-class RF performance for different applications. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is pre-integrated with TI's MSP430 and Stellaris MCUs. Some of the profiles supported today include: Serial port profile (SPP), Advanced audio distribution profile (A2DP) and several BLE profiles (these profiles vary based on the supported MCU). The TI CC256x device is a Bluetooth BR/EDR/LE Host Controller Interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the device brings a product-proven solution that supports Bluetooth 4.0 dual mode (BR/EDR/LE) protocols. TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. Key Features • Bluetooth Specification v4.0, Bluetooth & Bluetooth Low Energy • Easy PCB Layout Using Cadence Tools • 4 Layer PCB design • High sensitivity (-93 dBm typ.) • H4 UART and PCM/I2S Interface • Fast Time to Market

Texas InstrumentsWBU-ECSCC256x QFN EM Rev 1.2 BOM REV: 1.2 EDGE: 654620 0 DNI Do Not Install December 6, 2012 Item Qty Ref Des Value Part Description Temp °C Manufacturer Manufacturer Part Number Alternate Part Note 1 1 ANT1 2.4-2.5 GHz PCB ANTENNA N/A N/A Copper Antenna on PCB 2 4 C1 C5 C10 C34 10uF CAP CER 10UF 6.3V X5R 0603 -55 to 85 Taiyo Yuden JMK107BJ106MA-T 3 16 C2 C6 C9 C11 C12 C13 C14 C15 C16 C17 C27 C28 C29 C30 C33 C35 0.1uF CAP CER 0.1UF 6.3V 10% X7R 0402 -55 to 125 Kemet C0402C104K9RACTU 3 4 C18 C19 C24 C36 0.1uF CAP CER 0.1UF 6.3V 10% X7R 0402 -55 to 125 Kemet C0402C104K9RACTU DNI 4 3 C7 C20 C21 1.0uF CAP CER 1.0UF 6.3V X5R 10% 0402 -55 to 85 Taiyo Yuden JMK105BJ105KV-F 5 1 C32 1.0uF CAP CER 1.0UF 6.3V X5R 10% 0402 -55 to 85 Taiyo Yuden JMK105BJ105KV-F DNI 6 1 C8 0.01uF CAP CER 0.01uF 6.3V 10% X5R 0402 -40 to 85 Murata GRM155R60J103KA01D 7 2 C22 C23 12pF CAP CER 10PF 50V 5% NP0 0402 -55 to 125 Murata Electronics GRM1555C1H120JZ01D 8 2 C25 C26 0.47uF CAP CER .47UF 6.3V X5R ±10% 0402 -55 to 85 Taiyo Yuden JMK105BJ474KV-F 9 1 C31 22pF CAP CER 22PF 25V 5% NP0 0201 -55 to 125 Murata Electronics North America GRM0335C1E220JD01D 10 1 D1 GRN LED GREEN HI BRT SS TYPE LO CUR SM OSRAM Opto Semiconductors Inc LG L29K-G2J1-24-Z 11 3 FB1 FB2 FB3 BK1005HS680-T FERRITE BEAD 68 OHM 0402 Taiyo Yuden BK1005HS680-T 12 1 FL1 2.45GHz FILTER CER BAND PASS 2.45GHZ SMD Murata Electronics LFB212G45SG8C341 Place Brown Marking Up 13 1 LB1 Line 1 Line 2 650x200 Label UL,CSA,AGA approved Brady THT-14-423-10 See Assembly Drawing for Location 14 1 OSC1 MC_32.768kHz Misc_MC_32.768kHz_OSC_4_SM_130x6 0x40 Micro Crystal OV-7604-C7 DNI 15 1 P1 EDGE CARD PCB PRINTED N/A N/A DNI EDGE CARD mates with SAMTEC MEC6-150 SERIES SOCKET, 0.025" PITCHMEC6-160-02-S-DV-A 16 1 P2 2x9 HEADER_2x9_100_THVT_M_430L Samtec HMTSW-109-07-G-D-230 DNI 17 1 P3 COAXIAL RECEPTACLE_CON_COAXIAL_UFL-R- SMT Hirose U.FL-R-SMT-1 18 5 R6 R18 R26 R29 R35 0 RES 0.0 OHM 1/10W 0402 SMD -100/+600ppm/°C Panasonic - ECG ERJ-2GE0R00X DNI 19 9 R1 R2 R3 R5 R8 R9 R11 R36 R30 0 RES 0.0 OHM 1/10W 0402 SMD -100/+600ppm/°C Panasonic - ECG ERJ-2GE0R00X 20 7 R13 R14 R21 R22 R23 R24 R25 0 RES 0.0 OHM 1/10W 0402 SMD -100/+600ppm/°C Panasonic - ECG ERJ-2GE0R00X DNI for COM Only 21 1 R4 680 RES Thick Film 680 OHM 1/10W 5% 0402 ±200ppm/°C Panasonic - ECG ERJ-2GEJ681X 22 1 R19 10K RES 10K OHM 1/10W 5% 0402 SMD ±200ppm/°C Panasonic - ECG ERJ-2GEJ103X 23 3 R12 R15 R20 10K RES 10K OHM 1/10W 5% 0402 SMD ±200ppm/°C Panasonic - ECG ERJ-2GEJ103X DNI for COM Only 24 1 R27 10K RES 10K OHM 1/10W 5% 0402 SMD ±200ppm/°C Panasonic - ECG ERJ-2GEJ103X DNI 25 1 R28 100K RES 100K OHM 1/10W 5% 0402 SMD ±200ppm/°C Panasonic - ECG ERJ-2GEJ104X DNI 26 1 R34 10.0K RES 10.0K OHM 1/10W 1% 0402 SMD ±100ppm/°C Panasonic - ECG ERJ-2RKF1002X 27 2 RF1 RF2 2x10 SMVT SMT-20pin-30Au 50ni-Double Row- Alignment pin -55 to 125 Samtec SFM-110-02-L-D-A DNI for COM Only See Assembly for Pin 1 Location 28 1 SHLD1 RF SHIELD FRAME BOARD SHIELD .65X.65" FRAME Laird Technologies EMI BMI-S-202-F DNI 29 2 TP1 TP2 Blk TEST POINT .025" SQR POST HDR BLACK Components Corporation TP-105-01-00 30 3 TP3 TP4 TP5 XX TP_VIA_030RND020 XX XX No Part. Test Pad Only 31 1 U1 LP2985-18DBV IC REG LDO 1.8V 0.15A SOT23-5 -40 to 125 Texas Instruments LP2985-18DBV 32 2 U2 U4 SN74AVC4T774RSV IC BUS TRANSCVR 4BIT WITH 1.2-3.6V 16-UQFN -40 to 85 Texas Intruments SN74AVC4T774RSV 33 1 U3 SN74AVC4T774RSV IC BUS TRANSCVR 4BIT WITH 1.2-3.6V 16-UQFN -40 to 85 Texas Intruments SN74AVC4T774RSV DNI for COM Only 34 1 U5 CC2560RVM Bluetooth BR/EDR/LE and ANT Single- Chip Solution Texas Instruments CC256xRVM 35 1 XSHLD1 RF SHIELD COVER BOARD SHIELD .650X.650" COVER Laird Technologies EMI BMI-S-202-C DNI 36 1 Y1 26MHz CRYSTAL 26MHz -20 to 70 NDK NX2016SA (EXS00A- CS06025) TST - TZ1325D 37 2 R7 R10 0.10 0805 DNI 38 2 J1 J2 1X2 THVT HDR_THVT_1x2_100_M Samtec HMTSW-102-07-G-S-230 Label each bag with Part Number Board Revision and BOM RevisionCustomer:Group:Board:Date: 3/20/2013 Page 1 of 1 CC256x_QFN_EM_BOM_v1.2.xls

Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 where:S = power density P = power input to the antenna G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna Maximum peak output power at antenna input terminal:8.8(dBm)* Maximum peak output power at antenna input terminal:7.6(mW) Antenna gain(maximum):3.3(dBi)* Maximum antenna gain:2.14(numeric) Time Averaging:100(%)* Prediction distance:20(cm)* Prediction frequency:2450(MHz)* MPE limit for uncontrolled exposure at prediction frequency:1.000(mW/cm^2) Power density at prediction frequency:0.003 (mW/cm^2) This equates to:0.03 W/m^2 2 4R PG S  

55 44 33 22 11 D D C C B B A A Board Interface Configuration Notes: 01-EM 02-COM RF1 Install Install RemovedRemoved RF2 Added C32, C36 R33 0 ohm resistor was deletedR33 when installed connected MLDO_OUT to VBAT_CCDelete net SLOW_CLK_DBG, connect net SLOW-CLK-EDGE to P2 pin 10. REVISION HISTORY HCI_TX_1V8HCI_RX_1V8HCI_CTS_1V8HCI_RTS_1V8 AUD_CLK_1V8AUD_FSYNC_1V8AUD_IN_1V8AUD_OUT_1V8 TX_DEBUG_1V8 nSHUTDOW N_1V8 VDD_1V8 VBAT 1V8_IN VBAT_EDGE VBAT_MCU VIO_HOST VIO_HOST HCI_RX_1V8 P2,3 HCI_TX_1V8 P2,3 HCI_CTS_1V8 P2,3 HCI_RTS_1V8 P2,3 TX_DEBUG_1V8 P3 AUD_FSYNC_1V8 P2,3 nSHUTDOW N_1V8 P2,3 AUD_CLK_1V8 P2,3 AUD_IN_1V8 P2,3 AUD_OUT_1V8 P2,3 CLK_REQ_OUT_1V8 P3 SLOW _CLK_EDGE P3 nSHUTDN_3V3 P2 HCI_CTS_3V3 P2 SLOW _CLK_EXT_3V3 P2 HCI_RX_3V3 P2 HCI_TX_3V3 P2 HCI_RTS_3V3 P2 AUD_OUT_3V3 P2 AUD_IN_3V3 P2 AUD_FSYNC_3V3 P2 AUD_CLK_3V3 P2 SLOW _CLK_EDGE P3 Size EDGE No RevPage of Title Drawn ByDesignerLayout Approval Date CC256xQFN-EM Wednesday, February 13, 2013 1 3 B 1.2 JOHN MCDOWELL 6546200 JOHN MCDOWELL CRAIG BOHREN Size EDGE No RevPage of Title Drawn ByDesignerLayout Approval Date CC256xQFN-EM Wednesday, February 13, 2013 1 3 B 1.2 JOHN MCDOWELL 6546200 JOHN MCDOWELL CRAIG BOHREN Size EDGE No RevPage of Title Drawn ByDesignerLayout Approval Date CC256xQFN-EM Wednesday, February 13, 2013 1 3 B 1.2 JOHN MCDOWELL 6546200 JOHN MCDOWELL CRAIG BOHREN TP2 GND Blk RF2 SFM-110-02-L-D-A 2018161412108642 1917151311 97531 P1 EDGE CARD MEC6 24681012141618202224262830323436384044464850525456586062646668707274767880828486889092949698100 13579 111315171921232527293133353739434547495153555759616365676971737577798183858789919395979941 42 C34 10uF 6.3V C20.1uF6.3V RF1 SFM-110-02-L-D-A 2018161412108642 1917151311 97531 R1 0 LB1 Line 1 Line 2 P22x9 DEBUG HDR 1 24681012141618 3579 11131517 TP1 GND Blk C110uF6.3V 55 44 33 22 11 D D C C B B A A VDDIO 1.8V 100mA Bluetooth Power supply (2.2-4.8V rail + 1p8 IO supp ly) Level Shifters Power / Level Shifter Configuration Notes: 01-EM 02-COM R2 Removed Install InstallRemoved R3 VOUT VIN VDD_1V8 VDD_1V8_32K 1V8_IN VDD_1V8_LS VDD_1V8_LS VIO_HOST VDD_1V8_LSVDD_1V8_LS VBAT_EDGE VBAT_MCU VIO_HOSTVIO_HOST VIO_HOST VBAT_CC VBAT AUD_FSYNC_3V3 P1 AUD_CLK_3V3 P1 AUD_IN_3V3 P1 AUD_OUT_3V3 P1 AUD_CLK_1V8 P1,3 AUD_FSYNC_1V8 P1,3 AUD_IN_1V8 P1,3 AUD_OUT_1V8 P1,3 HCI_RX_1V8 P1,3 HCI_CTS_1V8 P1,3 HCI_TX_1V8 P1,3 HCI_RTS_1V8 P1,3 HCI_CTS_3V3 P1 HCI_RX_3V3 P1 HCI_TX_3V3 P1 HCI_RTS_3V3 P1 SLOW _CLK_EXT_1V8 P3 nSHUTDOW N_1V8 P1,3 SLOW _CLK_EXT_3V3 P1 nSHUTDN_3V3 P1 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 2 3 B 1.2 6546200 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 2 3 B 1.2 6546200 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 2 3 B 1.2 6546200 R15 10K R24 0 J1 VDD_1V8 1 2 R13 0 BK1005HS680-TFB268 OHM 100MHz 12 C1010uF6.3V U2SN74AVC4T774RSV DIR1 15 B1 12 B2 11 GND 8 B3 10 B4 9 VCCB 13 OE 7 DIR2 16 VCCA 14 A4 4 A3 3 A2 2 A1 1 DIR3 5 DIR4 6 R18 0 DNI BK1005HS680-T FB1 68 OHM100MHz 1 2 U3SN74AVC4T774RSV DIR1 15 B1 12 B2 11 GND 8 B3 10 B4 9 VCCB 13 OE 7 DIR2 16 VCCA 14 A4 4 A3 3 A2 2 A1 1 DIR3 5 DIR4 6 R4680 C15 0.1uF 6.3V TP3 R2010K U1 LP2985-18DBV 1.8V IN 1 EN 3 OUT 5 NR/FB 4 GND 2 C60.1uF6.3V R14 0 R5 0 C80.01uF6.3V R7 0.101/4W R1910K R110 R21 0 R8 0 C510uF6.3V R10 0.101/4W U4SN74AVC4T774RSV DIR1 15 B1 12 B2 11 GND 8 B3 10 B4 9 VCCB 13 OE 7 DIR2 16 VCCA 14 A4 4 A3 3 A2 2 A1 1 DIR3 5 DIR4 6 R22 0 R20DNI J2 VBAT_CC 1 2 R6 0 DNI C11 0.1uF 6.3V D1GRN 1V8 PW R 12 BK1005HS680-TFB368 OHM 100MHz 12 C7 1.0uF 6.3V C13 0.1uF 6.3V C16 0.1uF 6.3V C12 0.1uF 6.3V R9 0 C14 0.1uF 6.3V C90.1uF6.3V R30 R23 0 R12 10K 55 44 33 22 11 D D C C B B A A CC256x HCI Class 1.5 capable Bluetooth device CC256xQFN Internal Clock DNI DNI DNI DNI DNI DNI DNI DCLO CLO ALO SLO UBAL5 BT_RF BT_RF_IN RF_ANT ANT DIG_LDO_OUT SLOW _CLK_INT_1V8 MLDO_OUT VBAT_CC VDD_1V8 VDD_1V8_32K HCI_CTS_1V8 P1,2 HCI_RTS_1V8 P1,2 HCI_TX_1V8 P1,2 HCI_RX_1V8 P1,2 AUD_IN_1V8 P1,2 AUD_OUT_1V8 P1,2 AUD_CLK_1V8 P1,2 AUD_FSYNC_1V8 P1,2 nSHUTDOW N_1V8 P1,2 TX_DEBUG_1V8 P1 CLK_REQ_OUT_1V8 P1 SLOW _CLK_EXT_1V8 P2 SLOW _CLK_EDGE P1 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 3 3 B 1.2 6546200 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 3 3 B 1.2 6546200 Size EDGE No RevPage of TitleDate CC256xQFN-EM Wednesday, February 13, 2013 3 3 B 1.2 6546200 C190.1uF6.3V R28100K C31 22pF 25V C360.1uF6.3V C260.47uF6.3V C180.1uF6.3V C300.1uF6.3V R25 0 C33 0.1uF 6.3V R26 0 R29 0 R36 0 C270.1uF6.3V C2212pF50V R30 0 DNI C2312pF50V XSHLD1 RF SHIELD COVER DNI C21 1.0uF 6.3V GG Y1 26MHz 8pF 13 42 R35 0 C20 1.0uF 6.3V FL1 2.45GHz LFB212G45SG8C341 43 21 C290.1uF6.3V C250.47uF6.3V P3 COAXIAL TEST PORT 1 2 3 C350.1uF6.3V SHLD1 DNI G1 1 G2 2 G3 3 G8 8 G4 4 G5 5 G6 6 G7 7 OSC1 32.768KHz 15pF VCC 4 OUT 3 GND 2 EN 1 EPAD U5CC2560RVM HCI_TX A33 HCI_RX A26 HCI_RTS A32 HCI_CTS A29 AUD_FSYNC A35 AUD_CLK B32 AUD_IN B34 AUD_OUT B33 SLOW _CLK_IN A25 FREFP B4 FREFM A4 CLK_REQ_OUT A14 nSHUTD A6 TX_DBG B24 DIG_LDO_OUT_1 A2 DIG_LDO_OUT_2 A3 DIG_LDO_OUT_3 B15 DIG_LDO_OUT_4 B26 DIG_LDO_OUT_5 B27 DIG_LDO_OUT_6 B35 DIG_LDO_OUT_7 B36 DCO_LDO_OUT A12 CL1.5_LDO_OUT A7 ADCPPA_LDO_OUT A8 SRAM_LDO_OUT B1 MLDO_OUT_1 A5 BT_RF B8 VDD_IO_1 A17 CL1.5_LDO_IN B6 MLDO_IN B5 MLDO_OUT_4 B7 MLDO_OUT_3 B2 MLDO_OUT_2 A9 VDD_IO_2 A34 VDD_IO_3 A38 VDD_IO_4 B18 VDD_IO_5 B19 VDD_IO_6 B21 VDD_IO_7 B22 VDD_IO_8 B25 VSS_1 A24 VSS_2 A28 VSS_3 EPAD VSS_DCO B11 VSS_FREF B3 NC_1 A1 NC_2 A10 NC_4 A18 NC_3 A11 NC_6 A20 NC_8 A22 NC_5 A19 NC_7 A21 NC_13 A40 NC_10 A27 NC_12 A31 NC_15 B10 NC_14 B9 NC_16 B16 NC_9 A23 NC_11 A30 NC_17 B17 NC_18 B20 NC_19 B23 NC_24 A37 NC_20 A13 NC_23 A36 NC_21 A15 NC_25 A39 NC_22 A16 NC_31 B31 NC_28 B14 NC_27 B13 NC_30 B30 NC_29 B29 NC_26 B12 NC_32 B28 C32 1.0uF 6.3V R27 10K C170.1uF6.3V ANT1 Copper Antenna on PCB FEED 1 G1 3 G2 2 C280.1uF6.3V C240.1uF6.3V R34 10.0K

Nemko Test Report: 10238472RUS1 Applicant: Texas Instruments, Inc 12500 TI Blvd Dallas, TX 75243 USA Equipment Under Test: CC256x QFN EM (E.U.T.) FCC ID#: Z64-CC256xEM IC ID# 451I-CC256xEM In Accordance With: FCC Part 15, Subpart C, 15.247 and Industry Canada RSS-210, Issue 8 Tested By: Nemko USA Inc. 802 N. Kealy Lewisville, Texas 75057-3136 TESTED BY: DATE: 04 April 2013 David Light, Senior Wireless Engineer APPROVED BY: DATE: 5-Apr-2013 Michael Cantwell Total Number of Pages: 83 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 2 of 85 Table of Contents SECTION 1. SUMMARY OF TEST RESULTS 3 SECTION 2. EQUIPMENT UNDER TEST (E.U.T.) 5 SECTION 3. CHANNEL SEPARATION 7 SECTION 4. TIME OF OCCUPANCY 18 SECTION 5. PEAK POWER OUTPUT 22 SECTION 6. SPURIOUS EMISSIONS (ANTENNA CONDUCTED) 36 SECTION 7. SPURIOUS EMISSIONS (RADIATED) 53 SECTION 8. POWERLINE CONDUCTED EMISSIONS 62 SECTION 9. PEAK POWER SPECTRAL DENSITY 64 SECTION 10. OCCUPIED BANDWIDTH 68 SECTION 11. TEST EQUIPMENT LIST 73 ANNEX A - TEST DETAILS 74 ANNEX B - TEST DIAGRAMS 83 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 3 of 85 Section 1. Summary of Test Results Manufacturer: Texas Instruments, Inc. Model No.: CC256x QFN EM Serial No.: 2825200002 (Radiated) and 2825200002 (Conducted) General: All measurements are traceable to national standards. These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with Part 15, Subpart C, Paragraph 15.247 and Industry Canada RSS-210, Issue 8 for operation in the band 2400 to 2483.5 MHz. Radiated tests were conducted is accordance with ANSI C63.4-2003. Radiated emissions are made on an open area test site. A description of the test facility is on file with the FCC and Industry Canada. New Submission Production Unit Class II Permissive Change Pre-Production Unit THIS TEST REPORT RELATES ONLY TO THE ITEM(S) TESTED. THE FOLLOWING DEVIATIONS FROM, ADDITIONS TO, OR EXCLUSIONS FROM THE TEST SPECIFICATIONS HAVE BEEN MADE. See “ Summary of Test Data”. This report must not be used to claim product certification, approval, or endorsement by NVLAP, NIST, or any agency of the Federal Government. Nemko USA, Inc. is a NVLAP accredited laboratory. Nemko USA Inc. authorizes the above named company to reproduce this report provided it is reproduced in its entirety and for use by the company’s employees only. Any use which a third party makes of this report, or any reliance on or decisions to be made based on it, are the responsibility of such third parties. Nemko USA Inc. accepts no responsibility for damages, if any, suffered by any third party as a result of decisions made or actions based on this report. This report applies only to the items tested. Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 4 of 85 Summary Of Test Data NAME OF TEST PARA. NO. RESULT Powerline Conducted Emissions 15.207(a) / RSS-Gen 7.2.4 Complies Channel Separation 15.247(a)(1) / RSS-210 A8.1(b) Complies Time of Occupancy 15.247(a)(1) / RSS-210 A8.1(d) Complies 20 dB Occupied Bandwidth 15.247(a)(1) / RSS-210 A8.1(a) Complies Peak Power Output 15.247(b) / RSS-210 A8.4 Complies Spurious Emissions(Antenna Conducted) 15.247(d) / RSS-210 A8.5 Complies Spurious Emissions (Radiated) 15.247(d) / RSS-Gen 7.2.2 Complies 6 dB Occupied Bandwidth 15.247(a)(2) / RSS-210 A8.2 Complies Peak Power Spectral Density 15.247(e) / RSS-210 A8.2(b) Complies Footnotes: Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 5 of 85 Section 2. Equipment Under Test (E.U.T.) General Equipment Information Frequency Band: 902 – 928 MHz 2400 – 2483.5 MHz 5725 – 5850 MHz Operating Frequency Range: 2402 to 2480 MHz Number of Channels: 79 Channel Spacing: 1 MHz User Frequency Adjustment: Software controlled Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 6 of 85 Description of EUT The CC256x QFN EM is a Bluetooth evaluation module. System Diagram Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 7 of 85 Section 3. Channel Separation NAME OF TEST: Channel Separation PARA. NO.: 15.247(a)(1) A8.1(b) TESTED BY: David Light DATE: 29 January 2013 Test Results: Complies. Measurement Data: See 20 dB BW plot Measured 20 dB bandwidth: 1.383 MHz Max Channel Separation: 1 MHz Equipment Used: 1036-1082-1472 Measurement Uncertainty: 1X10 -7 ppm Temperature: 22 C Relative Humidity: 60 % Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 8 of 85 Test Data – Channel Separation Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 9 of 85 Test Data – 20 dB Bandwidth Occupied Bandwidth Low Channel GFSK Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 10 of 85 Test Data – 20 dB Bandwidth Occupied Bandwidth Mid Channel GFSK Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 11 of 85 Test Data – 20 dB Bandwidth Occupied Bandwidth High Channel GFSK Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 12 of 85 Test Data – 20 dB Bandwidth Occupied Bandwidth Low Channel EDR2 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Issue 8 EQUIPMENT: CC256x QFN EM PROJECT NO.:10238472RUS1 Page 13 of 85 Test Data – 20 dB Bandwidth Occupied Bandwidth Mid Channel EDR2 Nemko USA, Inc. FCC PART …

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