
Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
TI Proprietary Information - Strictly Private 2014 1 CC3200-LAUNCHXL User’s Guide, Ver 1.0 ABSTRACT This document describes the CC3200-LAUNCHXL (CC3200 Launchpad). It details the features of the hardware and also explains the correct usage of the board. CC3200-LAUNCHXL User’s Guide 2 CC3200-LAUNCHXL User’s Guide Contents Introduction............................................................................................................................................. 2 Board overview ................................................................................................................................ 2 Features .......................................................................................................................................... 3 Hardware description ............................................................................................................................... 4 Connector description ....................................................................................................................... 4 1.1.1.1 P1 connector assignment ....................................................................................................................................... 4 1.1.1.2 P2 connector assignment ....................................................................................................................................... 5 1.1.1.3 P3 connector assignment ....................................................................................................................................... 5 1.1.1.4 P4 connector assignment ....................................................................................................................................... 5 1.1.1.5 Jumper settings ..................................................................................................................................................... 6 1.1.2 Power selection ............................................................................................................. 7 1.1.3 USB connections ............................................................................................................ 7 1.1.4 JTAGsignals ................................................................................................................... 7 1.1.5 User LEDs and push-buttons ........................................................................................... 8 1.1.6 On-board sensors .......................................................................................................... 8 Hardware documents ............................................................................................................................... 8 LP V2.0 RevA- PG 1.11 ....................................................................................................................... 8 Software Information ................................................................................................................................ 8 1.1.7 USB driver (For BP/LP) .................................................................................................... 8 Introduction Board overview This board is designed to be used as a standalone development platform for application development using the CC3200 device. It can be also used in conjunction with compatible booster-packs to enhance the peripherals available in the system. The board features on-board emulation using FTDI device and has an array of sensors for an out of the box experience. This board can be directly connected to the PC using software development platforms including CCS and IAR. CC3200-LAUNCHXL User’s Guide CC3200-LAUNCHXL User’s Guide 3 Features CC3200 WIFI application processor USB interface to PC for CCS/IAR using XDS ICDI USB drivers Flash update over the USB using Simple Link Programmer. 2x20 pin Connectors : Compatible to TI MCU Launch Pads with added functions. Standalone development platform featuring sensors, LEDs and push-buttons Power from USB for the launchpad as well as external boosterpack Operates from 2xAA alkaline battery. Push buttons for RESET 3 user LEDs On-board antenna and U.FL connector selectable using a capacitor re-work. Sensors including temperature, 3-axis accelerometer. CC3200-LAUNCHXL User’s Guide 4 CC3200-LAUNCHXL User’s Guide Hardware description Connector description 1.1.1.1 P1 connector assignment Pin No Signal name Direction w.r.t CC3200 Comments P1.1 VCC(3.3V) OUT Max 100mA for peripherals P1.2 GPIO03/ADC_CH2 IN P1.3 GPIO_02/UART1_RX IN P1.4 GPIO_01/UART1_TX OUT P1.5 OUT UNUSED P1.6 GPIO_04/ADC_CH3 IN P1.7 GPIO_14/SPI_CLK OUT P1.8 GPIO_11 P1.9 GPIO_10/GPIO_12/I2C_SCL BD 2.2K pull-ups on board P1.10 GPIO_11/GPIO_13/I2C_SDA BD 2.2K pull-ups on board CC3200-LAUNCHXL User’s Guide CC3200-LAUNCHXL User’s Guide 5 1.1.1.2 P2 connector assignment Pin No Signal name Direction w.r.t CC3200 Comments P2.1 GND PWR P2.2 GPIO_22 OUT P2.3 GPIO_17/SPI_CS OUT P2.4 GPIO_28 OUT P2.5 RESET OUT Reset output from board P2.6 GPIO_16/SPI_DOUT OUT P2.7 GPIO_15/SPI_DIN IN P2.8 GPIO_10 BD P2.9 GPIO_12 BD P2.10 GPIO_13 BD 1.1.1.3 P3 connector assignment Pin No Signal name Direction w.r.t CC3200 Comments P3.1 5V P3.2 GND P3.3 GPIO_23/TDI IN P3.4 GPIO_24/TDO OUT P3.5 GPIO_28/TCK IN P3.6 GPIO_29/TMS IN P3.7 GPIO_08/AUD_SYNC OUT P3.8 GPIO_30/AUD_CLK OUT P3.9 GPIO_09/AUD_DOUT OUT P3.10 GPIO_00/AUD_DIN IN 1.1.1.4 P4 connector assignment Pin No Signal name Direction w.r.t CC3200 Comments P4.1 GPIO_26 OUT P4.2 GPIO_27 OUT P4.3 GPIO_25 OUT P4.4 GPIO_00/GPIO_07/UART1_RTS OUT CC3200-LAUNCHXL User’s Guide 6 CC3200-LAUNCHXL User’s Guide P4.5 GPIO_06/UART1_CTS IN P4.6 GPIO_28 I/O P4.7 GPIO_07/NWP_LOGGER OUT P4.8 GPIO_05/WLAN_LOGGER OUT P4.9 GPIO_04/WL_RS232_RX IN P4.10 GPIO_03/WL_RS232_TX OUT 1.1.1.5 Jumper settings 1.1.1.5.1 Power Reference Function Value Comments J22 ICDI Power Closed Supplies 3.3V to the ICDI J23 Board power 2-3 1-2 Supplies 3.3V to the board from USB Supplies po…
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CC3200-LAUNCHXL Block Diagram: CC3200 LDO 3.3V 2xAA BattConn LEDs Push buttons 2x20 headers VCC 32KHz Oscillator Option FTDI ICDI USB Conn Acc BMA222 Temp Sensor TMP006 Chip ant S-Flash 8Mbit I 2 C JTAG 1xUART JTAG 32KHz Xtal 40MHz Xtal U.FL Filt er Texas Instruments Incorporated
CC3200-LAUNCHXL External Photos: Top Side: Bottom Side: MODEL: CC3200-LAUNCHXL FCC ID: Z64-CC3X0XKIT IC: 451I-CC30X0KIT Texas Instruments Incorporated
CC3200-LAUNCHXL FCC ID/IC labeling: The product ID’s are printed in silk on the circuit board as shown below. Bottom side of circuit board MODEL: CC3200-LAUNCHXL FCC ID: Z64-CC3X0XKIT IC: 451I-CC3X0XKIT ~58.4 mm ~94 mm Texas Instruments Incorporated
CC3200-LAUNCHXL External Photos: Top Side: Bottom Side: MODEL: CC3200-LAUNCHXL FCC ID: Z64-CC3X0XKIT IC: 451I-CC30X0KIT Texas Instruments Incorporated
notice_e-01 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product infor mation in this catalog is as of October 2009. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be- for e practical application or usage of the Products. P lease note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo- ra ting such products, which are caused under the conditions other than those specified in this catalog or individual sp ecification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is av ailable. Please conduct validation and verification of products in actual condition of mounting and operating environment be fore commercial shipment of the equipment. 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I n addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil- it y evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to in stall a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu- to rs (so called TA IYO YUDENs official sales channel). It is only applicable to the products purchased from any of TAIYO YUDEN s of ficial sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc- cu r in connection with a third party's intellectual property rights and other related rights arising from your usage of pr oducts in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export C ertain items in this catalog may require specific procedures for export according to Fo reign Exchange and For- eign Trade Control Law o f Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. S hould you have any question or inquiry on this matter, please contact our sales staff. 148 chipantenna01_e-01 ■ FEATURES ■ ORDERING CODE ■ EXTERNAL DIMENSIONS/STANDARD QUANTITY ■ PART NUMBERS ■ APPLICATIONS AF 216M Type, AF 816M Type, AF 116M Type AH 104F Type AH 316M Type AH 104N Type AH 122F Type AH 083F Type AH 086M Type * This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ◦ Compact and Low-profile ◦ Wide bandwidth and High Gain ◦ St able temperature characteristics ◦ Bl uetooth ® , Wireless LAN, GPS, WiMAX, ZigBee, UWB CHIP ANTENNA ❶Type AHMultilayer Antenna AFH elical Antenna ❸Dimensions (case size) [mm] 2162.5×1.6 8168.0×1.6 11611.0×1.6 3163.2×1.6 0838.0×3.0 10410.0×4.0 12212.0×2.0 0868.0×6.0 ❹Special Code FInverted F MMo no Pole N Mo no Pole (D ual) ❺Frequency [MHz] example 15751574.397~1576.443 24502400~2500 55503100~8000 1. Describe Center Frequency 2. Lower Frequency for Dualband ❻Spec Code 01~ S1~Applicable to AH104F ❼Packaging ーTTape & Reel ❷Electrode Code △With Plating △=Blank space AF△216M245001-T ❶❷❸❹❺❻❼ E TypeLWTEabc Standard Quantity (pcs) Em bossed Tape AF 2 16M2. 5±0.21.6±0.21.6±0.20.5±0.3ーーー 2000AF 816M8±0. 21.6±0.21.6±0.20.5±0.3ーーー AF 116M11±0 .21.6±0.21.6±0.20.5±0.3ーーー AH 316M3. 2±0.151.6±0.150.5±0.10.5±0.2ー1.0 min.ー3000 AH 083F8±0. 33±0.31±0.3ー3.1±0.31±0.31.15±0.31000 AH 104F10±0 .34±0.31±0.3ー2.5±0.31±0.31±0.3 2000AH 122F12±0 .32±0.30.95±0.3ー5.1±0.31±0.33.1±0.3 AH 104N10±0 .34±0.31±0.3ー3±0.30.8±0.31.5±0.3 AH 086M8±0. 36±0.31±0.3ー1.8±0.21±0.3ー1000 Unit : mm (inch) ApplicationsOrdering CodeExternal Dimensions (mm)Center Frequency (MHz) GPS AF816M1575028.0×1.6×1.61575 AF116M15750211.0×1.6×1.61575 AH316M1575013.2×1.6×0.51575 W-LAN (2.4GHz) Bl uetooth ® WiMAX (2.5GHz) ZigBee AF216M2450012.5×1.6×1.62450 AH316M2450013.2×1.6×0.52450 AH083F2450018.0×3.0×1.02450 AH104F2450S110.0×4.0×1.02450 AH104F2650S110.0×4.0×1.02650 AH122F24500112.0×2.0×0.952450 W-LAN (2.4GHz/5G Hz)AH104N2450D110.0×4.0×1.02450/5400 UWB & WiMAX (3.5GHz) AH 086M5550018.0×6.0×1.05550 AH086M5550038.0×6.0×1.05550 REFLOW HIGH FREQUENCY DIELECTRIC COMPONENT 149 chipantenna01_e-01 ■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS * This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Typical Characteristics on Taiyo Yuden evaluation b…
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CC3200-LAUNCHXL Operating Description: The CC3200-LAUNCHXL is an evaluation board for the CC3200 device from Texas Instruments. The CC3200 device is an ARM Cortex M4 microcontroller with an on-chip 802.11bgn Wi-Fi Network Processor. The ARM Cortex M4 microcontroller is available for application development and therefore allows a single chip embedded Wi-Fi solution. The CC3200-LAUNCHXL evaluation board allows a developer to evaluate the CC3200 and to execute application code on the on-chip microcontroller. The CC3200-LAUNCHXL interfaces to a PC host using a USB cable. The CC3200-LAUNCHXL evaluation board comes with a software development kit that allows the developer to write and execute application code to evaluate the Wi-Fi function and features of the CC3200 device. The user can also execute application code written for their specific application. The code is downloaded to the CC3200-LAUNCHXL in board flash memory through the USB cable. The on-chip microcontroller executes this code and can issue high level commands and associated data to the on-chip 802.11 bgn Wi-Fi Network processor. The on-chip 802.11 bgn Wi-Fi Network processor will then translate the commands and data into the associated 802.11 bgn Wi-Fi protocol and transmit using the on board antenna or through an optional cable connector for conductive testing. Texas Instruments Incorporated
CC3200-LAUNCHXL Bill of materials Date : 23-Jan-2014 Item NumberQuantityPart ReferenceValueMfr_NameMfr_Part_NumberDescription 12C1 C410uFMurataGRM21BR61A106KE19LCAP CER 10UF 10V 10% X5R 0805 225C2 C3 C7 C8 C9 C11 C14 C15 C17 C18 C19 C20 C21 C22 C28 C29 C30 C31 C35 C37 C39 C41 C42 C44 C450.1uFTaiyo YudenLMK105BJ104KV-FCAP CER 0.1UF 10V 10% X5R 0402 31C533000 pFSamsungCL05B333KO5NFNCCAP 33000PF 16V CERAMIC X7R 0402 41C615pFMurata Electronics North AmericaGRM1555C1H150JA01DCAP CER 15PF 50V 5% NP0 0402 52C10 C1227pFMurata Electronics North AmericaGRM1555C1E270JA01DCAP CER 27PF 25V 5% NP0 0402 65C13 C16 C27 C32 C4310uFMurata Electronics North AmericaGRM188R60J106ME47DCAP CER 10UF 6.3V 20% X5R 0603 72C23 C24100 uFAvxF930J107MAACAP 100UF 6.3V TANTALUM TEL SMD 82C25 C2610pFMurata Electronics North AmericaGRM1555C1H100FA01DCAP CER 10PF 50V 1% NP0 0402 93C33 C38 C404.7uFSamsung Electro-Mechanics America, IncCL05A475MQ5NRNCCAP CER 4.7UF 6.3V 20% X5R 0402 102C34 C3622uFTaiyo YudenAMK107BBJ226MAHTCAP CER 22UF 4V 20% X5R 0603 111C460.033uFMurata Electronics North AmericaGRM155R61A333KA01DCAP CER 0.033UF 10V 10% X5R 0402 122C47 C486.2pFMurata Electronics North AmericaGRM1555C1H6R2BA01DCAP CER 6.2PF 50V NP0 0402 131C4910pFAVX Corporation04025U100CAT2ACAP CER 10PF 50V NP0 0402 141C501.0pFMurata Electronics North AmericaGJM1555C1H1R0BB01DCAP CER 1PF 50V NP0 0402 152D1 D6LEDOSRAM Opto Semiconductors IncLY Q976-P1S2-36LED CHIPLED 587NM YLW 0603 SMD 162D2 D5LEDOSRAM Opto Semiconductors IncLG Q971-KN-1LED CHIPLED 570NM GREEN 0603 SMD 171D3CD0603-B00340Bourns IncCD0603-B00340DIODE SCHOTTKY 40V 0.03A 0603 182D4 D7LEDOSRAM Opto Semiconductors IncLS Q976-NR-1LED CHIPLED 633NM RED 0603 SMD 191E12.45GHz AntTaiyo YudenAH316M245001-TANT BLUETOOTH W-LAN ZIGBEE WIMAX 201FL12.4GHz FilterTDK-EpcosDEA202450BT-1294C1FILTER BANDPASS 2.45GHZ WLAN SMD 211J1CONN_MICRO_USBFCI10118194-0001LFCONN USB MICRO B RECPT SMT R/A 2213J2 J3 J4 J8 J9 J10 J11 J12 J13 J14 J15 J16 J17HEADER_2TE Connectivity5-146285-2CONN HEADR BRKWAY .100 2POS STR 234J6 J7 J19 J20HEADER_3TE Connectivity5-146282-3CONN HDR BRKWAY .100 3POS VERT 241J18CONN_U.FLEmerson Network Power Connectivity Johnson128-0711-201CONN UMC RCPT STR 50 OHM SMD 252J22 J23CONN_RCPT_10x2Major LeagueCRD-081413-A-GCONN RCPT .100" 20POS DUAL GOLD 261J24RF SWITCHMurataMM8030-2610RJ3CONN SWG JACK STR 50 OHM SMD 272L1 L2FBSamsungCIM10U800NCFERRITE CHIP 80 OHM 600MA 0603 SMD 281L310uHTaiyo YudenCB2518T100KINDUCTOR POWER 10UH 1007 292L5 L72.2uHMurata Electronics North AmericaLQM2HPN2R2MG0LINDUCTOR 2.2UH 20% 1300MA 1008 301L61uHMurataLQM2HPN1R0MJ0LINDUCTOR POWER 1.0UH 1007 311L93.6nHMurata Electronics North AmericaLQP15MN3N6B02DINDUCTOR 3.6NH 0.1NH 0402 324Q1 Q3 Q4 Q5BSS138LT3GOn SemiBSS138LT3GMOSFET N-CH 50V 200MA SOT-23 331Q2SI2323DS-T1-GE3VishaySI2323DS-T1-GE3MOSFET P-CH 20V 3.7A SOT23-3 341R1100RPanasonic - ECGERJ-2GEJ101XRES 100 OHM 1/10W 5% 0402 SMD 353R2 R62 R640.1 RPanasonicERJ-S6SFR10VRES 0.1 OHM 1/4W 1% 0805 SMD 366R3 R4 R20 R125 R126 R127270Panasonic Electronic ComponentsERJ-3GEYJ271VRES 270 OHM 1/10W 5% 0603 SMD 376R5 R58 R59 R118 R120 R122100kYageoRC0402JR-07100KLRES 100K OHM 1/16W 5% 0402 SMD 3819R6 R7 R11 R13 R14 R16 R22 R30 R33 R44 R45 R49 R50 R61 R117 R119 R121 R123 R12810kYageoRC0402JR-0710KLRES 10K OHM 1/16W 5% 0402 SMD 392R8 R928YageoRC0402FR-0728RLRES 28.0 OHM 1/16W 1% 0402 SMD 401R101.5kYageoRC0402FR-071K5LRES 1.50K OHM 1/16W 1% 0402 SMD 411R122.2KPanasonicERJ-2GEJ222XRES 2.2K OHM 1/10W 5% 0402 SMD 4215R15 R19 R25 R26 R28 R29 R34 R35 R36 R40 R41 R46 R52 R53 R5633YageoRC0402FR-0733RLRES 33.0 OHM 1/16W 1% 0402 SMD 431R1751KSamsungRC1005F513CSRES 51K OHM 1/16W 1% 0402 441R1830.1KYageoRC0402FR-0730K1LRES 30.1K OHM 1/16W 1% 0402 SMD 451R21470YageoRC0402FR-07470RLRES 470 OHM 1/16W 1% 0402 SMD 4644R23 R27 R32 R38 R39 R42 R43 R48 R51 R55 R60 R65 R66 R67 R68 R69 R70 R72 R73 R75 R78 R80 R82 R84 R87 R89 R91 R93 R95 R96 R98 R99 R101 R102 R103 R104 R105 R106 R107 R108 R109 R111 R115 R1290 RPanasonic Electronic ComponentsERJ-2GE0R00XRES 0.0 OHM 1/10W JUMP 0402 SMD 4713R24 R31 R63 R71 R74 R76 R77 R83 R85 R92 R94 R97 R110DNPDNPDNPDO NOT MOUNT 481R37DNPDNPDNPDO NOT MOUNT 492R47 R543.3KPanasonic - ECGERJ-2GEJ332XRES 3.3K OHM 1/10W 5% 0402 SMD 503R57 R116 R1241kYageoRC0402JR-071KLRES 1.0K OHM 1/16W 5% 0402 SMD 511R1003.3MYageoRC0402FR-073M3LRES 3.30M OHM 1/16W 1% 0402 SMD 523SW1 SW2 SW3SW TACTPanasonicEVQ-11A04MSWITCH TACTILE SPST-NO 0.02A 15V 531TP1TP_1206TE Connectivity1625854-41206 PROBE PAD 541U1TPD2EUSB30TITPD2EUSB30DRTRIC ESD SOLUTION 2CH SOT3 551U293LC46B-I/MSMicrochip93LC46B-I/MSIC SRL EE 1K 64X16 2.5V 8MSOP 561U3TPS79601TEXAS INSTRUMENTS INCTPS79601DCQRIC,VREG,LDO,1.2V-5.5V,2.7V-5.5V,--,6PIN,SOT-223 571U5FT2232DFUTURE TECHNOLOGY DEVICES INTERNATIONAL LTDFT2232DIC, USB UART/FIFO, MPSSE, 12/48MHz, 48-PIN, LQFP 581U6TMP006Texas InstrumentsTMP006AIYZFRIC SENSOR THERMOPILE 8DSBGA 591U8TPS61097-33DBVRTEXAS INSTRUMENTS INCTPS61097-33DBVRIC REG BST SYNC 3.3V .1A SOT23-5 601U10BMA222BoschBMA222E3-AXIS ACCELEROMETER DIGITAL SMD 612U11 U12SN74LVC1T45DTEXAS INSTRUMENTS INCSN74LVC1T45DCKRIC, BUS XCVR, 1-BIT, NON INVERTING, 3-STATE, 6-PIN, SOT-23 621U13CC3101Texas InstrumentsCC3101ZRTDRARM M4 MCU with 802.11bg WIFI 631U158M (1M x 8)Micron Technology IncM25PX80-VMN6TPIC FLASH 8MBIT 75MHZ 8SO 642U4 U9SN74LVC125APWRTEXAS INSTRUMENTS INCSN74LVC125APWRIC BUS BUFF TRI-ST QD 14TSSOP 651U7SN74LVC126APWRTEXAS INSTRUMENTS INCSN74LVC126APWRIC BUS BUFF TRI-ST QD 14TSSOP 661Y1CRYSTALEpsonCA-301 6.0000M-C:PBFREECRYSTAL 6MHZ 18PF THRU 671Y2CrystalAbracon CorporationABS07-32.768KHZ-TCRYSTAL 32.768KHZ 12.5PF SMD 681Y3CrystalEpsonQ24FA20H00396CRYSTAL 40MHZ 8PF SMD
Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 where:S = power density P = power input to the antenna G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna Maximum peak output power at antenna input terminal:21.7(dBm)* Maximum peak output power at antenna input terminal:147.9(mW) Antenna gain(maximum):2 (dBi)* Maximum antenna gain:1.58(numeric) Time Averaging:100(%)* Prediction distance:20(cm)* Prediction frequency:2450(MHz)* MPE limit for uncontrolled exposure at prediction frequency:1.000 (mW/cm 2 ) Power density at prediction frequency:0.047(mW/cm 2 ) This equates to:0.47W/m 2 2 4R PG S π =
55 44 33 22 11 D D C C B B A A Revision history : (Compared to ver 2.0A)------------------------1. Replaced Emualtion circuit with FTDI instead of ICDI 2. Re-arranged the pin assignment of the P1,P2,P3,P 4 to align with the MCU convention. 3. Added pull-down on the LED driver to prevent the m from floating. 4. SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 1 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 1 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 1 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 55 44 33 22 11 D D C C B B A A 50 Ohm 50 Ohm Place overlapped at 90 deg angle 50 Ohm 50 Ohm 50 Ohm Check special layout needs for antenna TO FTDI VDD_ANA PA_SWP PA_SWN FL_SWP FL_SWN VDD_FL VDD_RAM VDD_PLL VDD_DIG_CC VDD_PA SFL_CSSFL_DINSFL_DOUTSFL_CLK SOP0SOP1SOP2 SFL_CSSFL_DINSFL_DOUTSFL_CLK VBAT_CC VBAT_CC VCC_BRD VBAT_CC VCC_DCDC_3V3 CC_nRESET CC_GPIO_08CC_GPIO_09CC_GPIO_10CC_GPIO_11CC_GPIO_00CC_GPIO_01CC_GPIO_02CC_GPIO_03CC_GPIO_04CC_GPIO_05CC_GPIO_06CC_GPIO_07CC_GPIO_12CC_GPIO_13CC_GPIO_14CC_GPIO_15CC_GPIO_16CC_GPIO_17CC_GPIO_22CC_GPIO_28CC_GPIO_30 CC_GPIO_26CC_GPIO_27 BRD_JTAG_TDOBRD_JTAG_TCKBRD_JTAG_TMSBRD_JTAG_TDI CC_GPIO_24CC_GPIO_23 CC_GPIO_31 LP_GPIO_25 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 2 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 2 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 2 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 J10HEADER_2 1 2 C334.7uF C3422uF C440.1uF J18 CONN_U.FL 1 2A 2B C476.2pF Y3 Crystal 40 MHzQ24FA20H00396 1 3 2 4 R650 R J17HEADER_2 1 2 Feed E1 2.45GHz Ant C404.7uF C486.2pF C410.1uF C3622uF C4910pF C390.1uF U13 CC3101 GPIO_10 1 GPIO_11 2 GPIO_12 3 GPIO_13 4 GPIO_14 5 GPIO_15 6 GPIO_16 7 GPIO_17 8 VDD_DIG1 9 VIN_IO1 10 SSPI_CLK 11 SSPI_DOUT 12 SSPI_DIN 13 SSPI_CS 14 GPIO_22 15 GPIO_23/JTAG_TDI 16 GPIO_24/JTAG_TDO 17 GPIO_28 18 GPIO_28/JTAG_TCK 19 GPIO_29/JTAG_TMS 20 GPIO_25/SOP2 21 WLAN_XTALM 22 WLAN_XTALP 23 VDD_PLL 24 LDO_IN2 25 NC_26 26 RES_27 27 RES_28 28 GPIO_26 29 GPIO_27 30 RF_BG 31 nRESET 32 VDD_PA_IN 33 SOP1 34 SOP0 35 LDO_IN1 36 VIN_DCDC_ANA 37 DCDC_ANA_SW 38 VIN_DCDC_PA 39 DCDC_PA_SW_P 40 DCDC_PA_SW_N 41 DCDC_PA_OUT 42 DCDC_DIG_SW 43 VIN_DCDC_DIG 44 DCDC_FLASH_SW_P 45 DCDC_FLASH_SW_N 46 VDD_FLASH 47 VDD_ANA1 48 VDD_RAM 49 GPIO_00 50 RTC_XTAL_P 51 RTC_XTAL_N 52 GPIO_30 53 VIN_IO2 54 GPIO_01 55 VDD_DIG2 56 GPIO_02 57 GPIO_03 58 GPIO_04 59 GPIO_05 60 GPIO_06 61 GPIO_07 62 GPIO_08 63 GPIO_09 64 GND_TAB 65 C310.1uF C420.1uF L8DNP J16HEADER_2 1 2 R640.1 R L5 2.2uH C2610pF C280.1uF U15 8M (1M x 8) M25PX80-VMN6TP CS 1 DOUT 2 DIN 5 CLK 6 VCC 8 GND 4 RESET 7 WP 3 C2510pF C350.1uF J9HEADER_2 1 2 FL1 2.4GHz Filter IN 1 OUT 3 GND1 2 GND2 4 R6110k U14 W25Q80BLUXIG CS 1 DOUT 2 DIN 5 CLK 6 VCC 8 GND 4 RESET 7 WP 3 TAB 9 J8HEADER_2 1 2 R571k C3210uF R58100k C290.1uF C501.0pF C4310uFL4 DNP R59100k J11HEADER_2 1 2 L9 3.6nH R60 0 R C300.1uF J15HEADER_2 1 2 J14HEADER_2 1 2 L72.2uH R111 0 R C384.7uF R110 DNP R101 0 R C370.1uF Y2Crystal 32.768KHz C2710uF L61uH GND GND J24 RF SWITCH 1 24 3 C450.1uF 55 44 33 22 11 D D C C B B A A Place on bottom sideMale headers on top SCLSDAGPIOSPI CLKANA INGPIORXTXANA INPWR PWR GND I2S FSYNCI2S CLKI2S DOUTI2S DIN PWM/GPIOPWM/GPIOPWM/GPIOPWM/GPIOCCP/GPIOCCP/GPIOGPIO/NWP_LOGGPIO/WLAN_LOGGPIO/RS232_RX GPIOSPI_CSTESTSPI_MOSISPI_MISOGPIOGPIOGPIO P1 P2 P3 P4 GPIO/RS232_TX RESET FLASH PROGRAMMING LEVEL SHIFTER P1.1P1.2P1.3P1.4P1.5P1.6P1.7P1.8P1.9P1.10 P3.1P3.2P3.3P3.4P3.5P3.6P3.7P3.8P3.9P3.10 P2.1P2.2P2.3P2.4P2.5P2.6P2.7P2.8P2.9P2.10 P4.1P4.2P4.3P4.4P4.5P4.6P4.7P4.8P4.9P4.10 SWAP MOSI/MISO Alternate RTS Set 2-3 for flashing For Antenna diversity Alternate CTS ANA INANA IN Place on bottom sideMale headers on top LEVEL SHIFTER VCC_MCU_5V VCC_BRD VCC_BRD VCC_LDO_3V3 VCC_BRD VCC_BRD VCC_LDO_3V3 LP_RESET_OUTCC_GPIO_16CC_GPIO_15CC_GPIO_17 CC_GPIO_24CC_GPIO_05CC_GPIO_24 CC_GPIO_28CC_GPIO_22LP_GPIO_25LP_GPIO_01CC_GPIO_31 CC_GPIO_07 CC_GPIO_03CC_GPIO_13 CC_GPIO_12 CC_GPIO_04 CC_GPIO_14CC_GPIO_10CC_GPIO_11 CC_GPIO_08CC_GPIO_30CC_GPIO_09CC_GPIO_00 CC_GPIO_02 LP_GPIO_01 LP_GPIO_02 CC_GPIO_07 CC_GPIO_07 FTDI_RX FTDI_TX CC_GPIO_15CC_GPIO_16 LP_GPIO_25CC_GPIO_23CC_GPIO_28 CC_GPIO_06 CC_GPIO_06 LP_GPIO_02CC_GPIO_05 CC_GPIO_26CC_GPIO_27 CC_GPIO_09CC_GPIO_10CC_GPIO_11CC_GPIO_00 CC_GPIO_03CC_GPIO_04 CC_GPIO_07CC_GPIO_05CC_GPIO_26CC_GPIO_27 CC_GPIO_01 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 3 6 A2 66/3 Bagmane Tech ParkCV Raman NagarBangalore B Prajay M <Project Number> TessolvePrajay M +91-80-2509-9599 DateDateDate ENG1 SizeScale Project No Rev Sheet of Title Drawn By DesignerLayout Date Approval Date CC3101 LP Ver 3.0 Texas Instruments Thursday, January 16, 2014 3 6 A2 66/3 Bagman…
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Nemko Test Report: 2014_251898_FCC_15247 Applicant: Texas Instruments, Inc. 12500 TI Blvd. Dallas, TX 75243 USA Equipment Under Test: CC3200-LAUNCHXL (E.U.T.) FCC Identifier: Z64-CC3X0XKIT Industry Canada Identifier: 451I-CC3X0XKIT In Accordance With: FCC Part 15, Subpart C, 15.247 and Industry Canada RSS-210, Issue 8 Digital Transmission Systems Tested By: Nemko USA, Inc. 2210 Faraday Ave. Suite 150 Carlsbad, CA 92008 TESTED BY: DATE: 17 February 2014 David Light, Wireless Engineer APPROVED BY: DATE: 17 February 2014 Number of Pages: 69 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Digital Transmission Systems EUT: CC3200-LAUNCHXL Test Report: 2014_251898_Launch_FCC_15247 Table of Contents SECTION 1. SUMMARY OF TEST RESULTS 3 SECTION 2. EQUIPMENT UNDER TEST (E.U.T.) 5 SECTION 3. OCCUPIED BANDWIDTH 6 SECTION 4. MAXIMUM PEAK OUTPUT POWER 19 SECTION 5 SPURIOUS EMISSIONS AT ANTENNA TERMINALS 29 SECTION 6. RADIATED EMISSIONS 42 SECTION 7. PEAK POWER SPECTRAL DENSITY 44 SECTION 8. POWERLINE CONDUCTED EMISSIONS 54 SECTION 9. TEST EQUIPMENT LIST 57 ANNEX A - TEST DETAILS 58 ANNEX B - TEST DIAGRAMS 67 Page 2 of 69 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Digital Transmission Systems EUT: CC3200-LAUNCHXL Test Report: 2014_251898_Launch_FCC_15247 Section 1. Summary of Test Results Manufacturer: Texas Instruments, Inc. Model No.: CC3200-LAUNCHXL Serial No.: K251 General: All measurements are traceable to national standards. These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with Part 15, Subpart C, Paragraph 15.247 and Industry Canada RSS-210, Issue 8 for Digital Transmission Systems. Radiated tests were conducted is accordance with ANSI C63.4-2003. Radiated emissions are made on an open area test site. A description of the test facility is on file with the FCC and Industry Canada. New Submission Production Unit Class II Permissive Change Pre-Production Unit Family Listing THIS TEST REPORT RELATES ONLY TO THE ITEM(S) TESTED. THE FOLLOWING DEVIATIONS FROM, ADDITIONS TO, OR EXCLUSIONS FROM THE TEST SPECIFICATIONS HAVE BEEN MADE. See “Summary of Test Data”. NVLAP Lab Code 200116-0 This report must not be used to claim product certification, approval, or endorsement by NVLAP, NIST, or any agency of the Federal Government. Nemko USA, Inc. is a NVLAP accredited laboratory. Nemko USA Inc. authorizes the above named company to reproduce this report provided it is reproduced in its entirety and for use by the company’s employees only. Any use which a third party makes of this report, or any reliance on or decisions to be made based on it, are the responsibility of such third parties. Nemko USA Inc. accepts no responsibility for damages, if any, suffered by any third party as a result of decisions made or actions based on this report. This report applies only to the items tested. Page 3 of 69 Nemko USA, Inc. FCC PART 15, SUBPART C and Industry Canada RSS-210 Digital Transmission Systems EUT: CC3200-LAUNCHXL Test Report: 2014_251898_Launch_FCC_15247 Summary Of Test Data NAME OF TEST PARA. NO. RESULT Powerline Conducted Emissions FCC 15.207(a) / RSS-Gen 7.2.4 Complies Minimum 6 dB Bandwidth FCC 15.247(a)(2) / RSS-210 A8.2(a) Complies Maximum Peak Power Output FCC 15.247(b)(3) / RSS-210 A8.4(4) Complies Spurious Emissions (Antenna Conducted) FCC 15.247(d) / RSS-210 A8.5 Com…
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| # | Rule Parts | Frequency Range | Power Output |
|---|---|---|---|
| 3 | 15C | 2.41 GHz - 2.46 GHz | 135.00 mW |
802.11 b/g/n/ax WLAN + BLE Radio Module
Equipment Class
DTS - Digital Transmission System
Radio Module
Equipment Class
DTS - Digital Transmission System
Radio Module
Equipment Class
DTS - Digital Transmission System
Evaluation board
Equipment Class
DTS - Digital Transmission System
Evaluation board
Equipment Class
DTS - Digital Transmission System