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  3. Z64EXP4F5137R9

Z64EXP4F5137R9The MSP-EXP430F5137R9T is a development tool for TIs less than 1GHz CC430F5137 System-on-Chip.

Texas Instruments Incorporated
The MSP-EXP430F5137R9T is a development tool for TIs less than 1GHz CC430F5137 System-on-Chip. - FCC ID Z64EXP4F5137R9 - Texas Instruments Incorporated
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Application Details

Equipment Class
DXX - Part 15 Low Power Communication Device Transmitter
Date of Grant
Feb 13, 2013
Application Purpose
Original Equipment
Date of Application
Feb 13, 2013
Equipment Note
The MSP-EXP430F5137R9T is a development tool for TIs less than 1GHz CC430F5137 System-on-Chip.
Frequency Range
903.49000000 - 926.49000000
Company
Texas Instruments Incorporated
Country
United States

Documents & Files

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Users Manual

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Block Diagram

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Operational Description

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Parts List/Tune Up Info

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Schematics

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

MSP-EXPCC430RFxExperimenterKit ECCN5A002A1A User's Guide LiteratureNumber:SLAU460 November2012 Contents 1MSP-EXPCC430RFxExperimenterKitOverview......................................................................4 1.1Overview..................................................................................................................4 1.2KitContents..............................................................................................................8 2GettingStartedWiththeMSP-EXPCC430RFxExperimenterKit................................................8 2.1HardwarePreparation..................................................................................................8 2.2SoftwarePreparation...................................................................................................9 2.3MSP-EXPCC430RFxUserExperience.............................................................................10 2.4MSP-EXPCC430RFxFirmwareApplications......................................................................10 2.5CC430WirelessNetworkGUI........................................................................................11 3MSP-EXPCC430RFxExperimenterKitHardware....................................................................12 3.1MSP-EXP430F6137RxHardwareDescription.....................................................................12 3.2MSP-EXP430F5137RxHardwareDescription.....................................................................12 3.3Schematics.............................................................................................................13 3.4PCBLayout.............................................................................................................17 4MSP-EXPCC430RFxExperimenterKitFirmware....................................................................19 4.1ImportProjectin CodeComposerStudio...........................................................................19 4.2OpenProjectin IAREmbeddedWorkbench.......................................................................19 4.3SimpliciTI™RFProtocol..............................................................................................19 4.4SimpliciTIConfigurationfortheMSP-EXPCC430RFxUserExperience.......................................19 4.55xx/6xxCoreLibraries................................................................................................20 5MSP-EXPCC430RFxExperimenterKitSoftware.....................................................................20 5.1Requirements...........................................................................................................20 6References.......................................................................................................................20 7BillsofMaterials(BOM)......................................................................................................21 2 TableofContentsSLAU460– November2012 SubmitDocumentationFeedback Copyright© 2012,TexasInstrumentsIncorporated www.ti.com ListofFigures 1MSP-EXPCC430RFxExperimenterKit– MSP-EXP430F6137RxBaseBoard(Front)............................5 2MSP-EXPCC430RFxExperimenterKit– MSP-EXP430F6137RxBaseBoard(Back)............................6 3MSP-EXPCC430RFxExperimenterKit– MSP-EXP430F5137RxSatelliteBoard(Front)........................7 4MSP-EXPCC430RFxExperimenterKit– MSP-EXP430F5137RxSatelliteBoard(Back)........................7 5MSP-EXP430F6137RxBaseBoardHardware........................................................................12 6MSP-EXP430F5137RxSatelliteBoardHardware....................................................................12 7MSP-EXP430F6137RxBaseBoardSchematic– Page1...........................................................13 8MSP-EXP430F6137RxBaseBoardSchematic– Page2...........................................................14 9MSP-EXP430F6137RxBaseBoardSchematic– Page3...........................................................15 10MSP-EXP430F5137RxSatelliteBoardSchematic....................................................................16 11MSP-EXP430F6137RxBaseBoardLayout...........................................................................17 12MSP-EXP430F5137RxSatelliteBoardLayout........................................................................18 ListofTables 1MSP-EXP430F6137R9BaseBoard(HW-V2.1)BOM................................................................21 2MSP-EXP430F5137R9TSatelliteBoard(HW-V2.0)BOM...........................................................25 3MSP-EXP430F6137R4BaseBoard(HW-V2.1)BOM................................................................26 4MSP-EXP430F5137R4TSatelliteBoard(HW-V2.0)BOM...........................................................30 3 SLAU460– November2012ListofFigures SubmitDocumentationFeedback Copyright© 2012,TexasInstrumentsIncorporated User's Guide SLAU460– November2012 MSP-EXPCC430RFxExperimenterKitUser’s Guide 1MSP-EXPCC430RFxExperimenterKitOverview 1.1Overview TheMSP-EXPCC430RFxExperimenterKitis thecompletesub-GHzdevelopmentplatformfortheCC430 devicesfromtheMSP430™family.Thekitprovidestwosub-GHzwirelessmodules:theMSP- EXP430F6137RxBaseBoardwiththeCC430F6137,andtheMSP-EXP430F5137RxSatelliteBoardwith theCC430F5137.Outofthebox,thetwomodulesenabledemonstrationofa SimpliciTI™wirelesssensor networkandtakefulladvantageofa highly-integratedLCDandPCconnection.Additionally,thekitalso enablesa completedevelopmentandprototypingenvironmenttodesigna wirelessapplication. MSP430,SimpliciTIaretrademarksofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 4 MSP-EXPCC430RFxExperimenterKitUser’s GuideSLAU460– November2012 SubmitDocumentationFeedback Copyright© 2012,TexasInstrumentsIncorporated www.ti.comMSP-EXPCC430RFxExperimenterKitOverview Figure1.MSP-EXPCC430RFxExperimenterKit– MSP-EXP430F6137RxBaseBoard(Front) 5 SLAU460– November2012MSP-EXPCC430RFxExperimenterKitUser’s Guide SubmitDocumentationFeedback Copyright© 2012,TexasInstrumentsIncorporat…

Text truncated - open the document above for the full version.

Block Diagram

EM430F6147RF900 CC430F6147 SoC Matching Antenna MCU 26MHz XTAL Power Supply

ID Label/Location Info

Description of label for the Texas Instruments MSP-EXP430F5137R9T: - Relevant sticker on PCB o Vendor: Texas Instruments o Product number/name: MSP-EXP430F5137R9T o FCC ID: Z64EXP4F5137R9 Approx. 60mm

Operational Description

Technical description for Texas Instruments MSP-EXP430F5137R9T: The MSP-EXP430F5137R9T is an evaluation board for the CC430F5137 chip from Texas Instruments and the Amber-Wireless AMB8520 module. The board will only fully function together with the MSP-EXP430F6137Rx base board or at least an eZ430 series emulator to program and control the device. The user needs to program the board with application code as described in the User’s Guide (SLAU460) or the corresponding Quick start guide of the MSP-EXPCC430RF9 kit of which this board is part of. The CC430F5137 System on Chip has a differential RF output. On the AMB8520 module (mounted on the MSP-EXP430F5137R9T board) this differential output is transformed to a single ended, 50 ohm signal through a passive component (capacitor/inductor) balun. The output of the balun is filtered to reduce harmonic radiation and then connected to a chip antenna. The chip antenna mounted on the board is 0920AT50A080 from JTI. The datasheet of the antenna is attached for further details. Frequency range: 902 – 928MHz (North America) Type of modulation: 2-GFSK Occupied bandwidth: 11.6kHz Antenna connector: chip antenna mounted on PCB This evaluation board is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use.

Operational Description

920 MHz AntennaP/N 0920AT50A080 Detail Specification: 04/07/05 Page 1 of 4 General Specifications Part Number0920AT50A080Input Power5W max. Frequency Range880 - 960 MhzImpedance50 Ω Peak Gain-0.7 dBi typ. (XZ-V)Operating Temperature-40 to +85°C Average Gain-2.6 dBi typ. (XZ-V)Reel Quanity1,000 Return Loss8.5 dB min. Terminal Configuration Mechanical Dimensions No. Function Inmm1NC L±±2Feed Point W±±3NC T±±4NC a±±5NC b±±6NC c±±7NC 8NC Mounting Considerations Mount these devices with brown mark facing up. Units: mm Line width should be designed to provide 50Ω impedance matching characteristics. a) Without Matching Circuitsb) With Matching Circuits Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 931 Via Alondra • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2003 Johanson Technology, Inc. All Rights Reserved 0.0200.0120.500.30 0.0200.0120.500.30 0.0120.30 1.00 "High Frequency Ceramic Solutions" 0.20 5.10 0.039 0.0590.008 0.008 0.433 0.201 11.000.0120.30 1.500.20 0 Ohm 4.5 mm 9.6 mm 0. 6mm 1.3 mm 0.8 mm 1.5 mm 12.6 mm 5.5 mm 0.7 mm 1 mm 3.9 pF 3.9 pF 10 nH Via 0.7 mm 0.7 mm 1 2 3 4 5 6 7 8 T L W a bc 920 MHz AntennaP/N 0920AT50A080 Detail Specification: 04/07/05 Page 2 of 4 Typical Electrical Characteristics (T=25 o C) Test Board: Return Loss a) Without Matching Circuit Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 931 Via Alondra • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2003 Johanson Technology, Inc. All Rights Reserved "High Frequency Ceramic Solutions" ) ) ) ) ) ) ) ) ) 40 mm 96. 2 mm 80.1 mm 31.9 mm 50 Ohm feed Ground clearance Shorting Piece 920 MHz AntennaP/N 0920AT50A080 Detail Specification: 04/07/05 Page 3 of 4 Typical Electrical Characteristics (T=25 o C) Test Board: Return Loss b) With Matching Circuit Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 931 Via Alondra • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2003 Johanson Technology, Inc. All Rights Reserved "High Frequency Ceramic Solutions" ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) 40 mm 96. 2 mm 80.1 mm 31.9 mm 50 Ohm feed Ground clearance Matching Circuit 920 MHz AntennaP/N 0920AT50A080 Detail Specification: 04/07/05 Page 4 of 4 Typical Radiation Patterns Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 931 Via Alondra • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 2003 Johanson Technology, Inc. All Rights Reserved "High Frequency Ceramic Solutions" ) ) ) ) ) ) ) ) ) XY-V/XY-H 180° 270° 0° 90° X Z Y XY-cut scanning direction XY cut @ 920 MHz Vertical Horizontal XZ-V/XZ-H YZ-V/YZ-H 180° 270° 0° 90° X Z Y XZ-cut scanning direction 180° 270° 0° 90° X Z Y YZ-cut scanning direction XZ cut @ 920 MHz Vertical Horizontal YZ cut @ 920 MHz Vertical Horizontal

Parts List/Tune Up Info

Part List Report for EM430F6147RF900 Date: 20/01/2011 Initial Version from CAD Rev4.025.04.2012 MPTools BOM Rev3.320.01.2011 THInitial Version from CAD 20.01.2011 THJumperplan ergänzt 27.01.2011 THU2,L2,C8,C9 vorerst DNP 23.03.2011 THmod, added Pos 6 7 31 47 48 Rev3.4 and Rev3.4S11.07.2011 THcopied from V3.3, JP9 added, BOM prepared for PCB Rev 3.4(U1 direct) and 3.4S(U1 with Socket) 19.10.2011 THPCB Name changed to EM430F6147RF900 Rev4.020.4.2012 THonly Layoutchange , no part depending Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed. 2. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 3. All values with DNP means this Part is not mounted 4. Ref designators marked with RED cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Capacitors w/o detailed MFGR and Supplier could have 20% and >= 16V 6. Resistors w/o detailed MFGR and Supplier could have 5%. ItemQtyReferenceValueDescriptionMFGRMFGR#MFGR-FootprintSupplierSupplier#Provided by 12ABO1-2BohrungBohrungLayout--Layout-DNP 21APCB1 PCB EM430F6147RF900 Rev4 Tools PCB Coordinate Lower/Left-----DNP 33AVB1-3Fiducial Mark Bottom-SeiteFiducial MarkLayout--Layout-DNP 4 3AVT1-3Fiducial Mark Top-SeiteFiducial MarkLayout--Layout-DNP 514C1-5 C112 C252 C381 C391 C421 C431 C451 C522 C5620.1uFCAP, SMD, Ceramic, 0402, 0.1uF, 16V, 10%, X5RAVX0402YC104KAT2A402tbdtbd 61C722uFCapacitor, Ceramic, 1206, 16V, X5R, 20%SanyoGRM31CR61C226ME15L1206tbdtbd 72C8-92.2uFCAP, SMD, Ceramic, 0402, 2.2uF, X5RMurataGRM155R60J225ME15D402tbdtbd 81C0414.7uFCAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%, X5Rtbdtbd603tbdtbd 94C46-47 C392 C482pFCAP, SMD, Ceramic, 0402, 2pF, 50V, +/-0.1pF, COGMurataGRM1555C1H2R0BZ01402tbdtbd 101C1010.47uFCAPACITOR,SMT,0603,CERAMIC,0.47uF,16V,10%,X5RAVX0603YD474KAT2A603tbdtbd 114C111 C251 C521 C5611uFCAPACITOR,SMT,0603,CERAMIC,1uF,6.3V,10%,X5RPANASONICECJ-1VB0J105K603tbdtbd 122C361 C37127pFCAP, SMD, Ceramic, 0402, 27pF, 50V, 5%, COG(NPO)MurataGRM36COG270J50402tbdtbd 131C4011pFCAPACITOR,SMT,0402,CER,1pF,50V,+/-0.25pF,NP0MurataGJM1555C1H1R0CB01D402tbdtbd 144C402 C411-412 C4141.5pFCAPACITOR,SMT,0402,CERAMIC,1.5pF,50V,+/-0.25pF,C0G(NP0)MurataGRM1555C1H1R5CZ01402tbdtbd 151C403100pFCAPACITOR,SMT,0402,CERAMIC,100pF,50V,+/-5%,C0G(NP0)MurataGRM1555C1H101JZ01402tbdtbd 161C4138.2pFCAPACITOR,SMT,0402,CERAMIC,8.2pF,50V,+/-0.25pF,C0G(NP0)MurataGRM1555C1H8R2CZ01402tbdtbd 171C5112.2nFCAPACITOR,SMT,0402,CER,2200pF,50V,10%,X7RPANASONICECJ-0EB1H222K402tbdtbd 182C554 C55112pFCAPACITOR,SMT,0402,CER,12pF,50V,5%,NPOPANASONICECJ-0EC1H120J402tbdtbdDNP 199CON1-92x4Pin,Rm.2.54(DNP)Header, THD, Male 2x4 Pin, 100mil spacingtbdtbd2x4Pin,Rm.2.54tbdtbdDNP, but put in box 201CON102x5Pin,Wanne(DNP)Header, THD, Male 2x5 Pin, Wanne, 100mil spacingtbdtbd2x5Pin,WannetbdtbdDNP 211CON112x7Pin,WanneHeader, THD, Male 2x7 Pin, Wanne, 100mil spacingtbdtbd2x7Pin,Wannetbdtbd 221CON12Molex1x3Pinheader 1x3, Grid: 2.5mmMolex3/22/50351x3Pin,Rm2.5mmtbdtbd 23a4JP3 JP5 JP9 JP101x2PinPinheader 1x2; Grid: 100mil / 2.54 mm 23b2CON13 JP71x2PinPinheader 1x2; Grid: 100mil / 2.54 mmDNP 241D1SMD LED LAMP(GREEN)LED,SMT,0603,GREEN,2.1VKINGBRIGHTAPT1608MGC1.6mmX0.8mm-- 251D2SMD LED LAMP(Red)LED,SMT,0603,RED,2.0VKINGBRIGHTAPT1608EC1.6mmX0.8mm-- 261JP12x4PinPinheader 2x4 Grid: 100mil / 2.54 mm 271JP1A2x3PinPinheader 2x3: Grid: 100mil / 2.54 mm 283JP2 JP6 JP81x3PinPinheader 1x3, Grid: 100mil / 2.54mm 291JP42x2PinPinheader 2x2: Grid: 100mil / 2.54 mmDNP 303L1 L401 L41112nHInductor, SMD, 0402, 12nH, 5%, 370mA, 250MHzMurataLQW15AN12NJ00402tbdtbd 311L22.2uHInductor, SMD, 0805, 2.2uH, 20%, 600mA, 50MHzMurataLQM21PN2R2MC0805tbdtbd 322L402 L41218nHInductor, SMD, 0402, 18nH, 5%, 460mA, 250MHzMurataLQW15AN18NJ00402tbdtbd 331L41315nHInductor, SMD, 0402, 15nH, 5%, 370mA, 250MHzMurataLQW15AN15NJ00402tbdtbd 341L4142.2nHINDUCTOR,SMT,0402,2.2nH,+/-0.2nH,1000mA,250MHzMurataLQW15AN2N2C10402tbdtbd 351L41515nHINDUCTOR,SMT,0402,15nH,+/-5%,460mA,250MHzMurataLQW15AN15NJ00402tbdtbd 361L45112nHInductor, SMD, 0402, 12nH, 5%, 370mAMurataLQW15AN12NJ00402tbdtbd 371Q126MHz( CUSTOMER SUPPLY ) CRYSTAL,SMT,4P,26MHzAKER ELECTRONICASX-531(CS)5.2mmX3.4mmCompoTEKCTA531-26.000-16-10/10/A 381Q232.768k(DNP)CRYSTAL,SMT,4P,32.768 kHzSEIKOSSP-T7-F7mmX1.5mm--DNP 391Q332.768k(DNP)UNINSTALLED CRYSTAL,SMT,3P,MS1V (Customer Supply)MICRO CRYSTALMS1V-T1K (UN)8.1mmX2mm--DNP, but put in box 402R1 R7 R551 R5540RRESISTOR/JUMPER,SMT,0R,1/16WERJ-2GE0R00Xtbd402PANASONICtbd 413R2-3 R6330RRESISTOR,SMT,0402,THICK FILM,5%,1/16W,330ERJ-2GEJ331tbd402PANASONICtbd 426R5 R4 R221 R231 0R(DNP)RESISTOR/JUMPER,SMT,0R,1/16WERJ-2GE0R00Xtbd402PANASONICtbdDNP 431R44156k/1%RES, SMD, 0402, 1/16W, x%tbdtbd402tbdtbd 441R51147kRES, SMD, 0402, 1/16W, x%DALECRCW04024702F100402tbdtbd 452S1-2B3U-1000PULTRA-SMALL TACTILE SWITCH,SMT,2P,SPST-NO,1.2x3x2.5mm,0.05A,12VOMRONB3U-1000P4mmX2.5mm-- 461SMA1SMASMA STRIGHT JACK, SMTRosenberger32K10A-40ML5xxRosenberger32K10A-40ML5 471U1CC430F6147IC, MCU, SMD, 9.15x9.15mm Thermal PadTexas InstrumentsCC430F6147 ??tbdtbdTexas Instruments 481U2TPS62730IC, Step Down Converter with Bypass Mode for Low Power WirelessTexas InstrumentsDRY(R-PDSO-N6)Texas Instruments 4912XJMPJumper/Shunt see JumperlistJumper/Shunt with Handlez.B Tycoz.B. 4-0881545-2Shunttbdtbd Jumperlist: (place Jumper on)JP3, JP5, JP10, JP2/1-2, JP1/1-2, JP1/3-4, JP1/5-6, JP1/7-8, JP1a/3-5, JP1a/4-6 JP6/1-2, JP8/1-2

Parts List/Tune Up Info

Satellite Board_HW-V1 (MSP-EXP430F5137R9T) Bill of MaterialHW-V2.0 Date:29/04/11 PartValueTol.Package Manufacturer Details Distributor Part no.usedunitpricecost Capacitors C1100uFC1210yes C2n.m.C0402no C3n.m.C0402no C4n.m.C0402no Resistors R1470R0402yes Miscellaneous SW1B3U-1000PB3U-1000POmronM66210110yes SW2B3U-1000PB3U-1000POmronM66210110yes MODUL1A85200101AMBER wirelessAMB8520 - ungeprüftyes CON110X2_SAMTEC_FSamtec10x2, femaleSFM-110-02-S-D-A-Kyes CON210X2_SAMTEC_FSamtec10x2, femaleSFM-110-02-S-D-A-Kyes CON322-03-50351x3, 2.5mmMolexmale22-03-5035yes CON4n.m.2x9, 2.54mmPinheadno CON5BL31-006U1x6, 1.27mmMPEMPEBL31-006Uyes LED1APT1608SRCPRV0603Kingbrightredyes ANT1n.m.Johanson433MHz, SMDJohanson0433AT62A0020 no PCB yes Legend: yes ≙ part is placed on PCB and considered in calculation no≙ part neither placed on PCB nor considered in calculation ≙ price is not available MSP-EXP430F5137R9T-HW-V2.0-BOM.XLS, Satellite Board_HW-V2.0 868MHzpage 1 of 1printed: 11/21/2012

Schematics

EM430F6147RF900 06.JUL.11 06.JUL.11 TI Freising MSP430 E E 8 7 8 7 1 1 see ** A3 Cl.Kuch Cl.Kuch 6 5 4 3 2 1 A B C D TI Internal Data A B C D Design: Appr.: Rev.: Comment: Drawing#: Revision: Page: File: Size: Title of Schematic of Mentor Pads Logic V9 Date: Name: 6 5 4 3 2 1 EM430F6147RF900_4_0_(S)Schematic.sch Decoupling RF VCC BOOST JTAG_BASE JTAG Test TDI TMS TCK (May be added close to the respective pins to reduce emissions at 5GHz to level required by ETSI) JTAG Matrix SBW JTAG BSLTX BSLRX For BSL usage add: placed 0ohms 0ohms R231 R221 external supply voltage: 0ohms DNP R5 R4 internal supply voltage: DNP 0ohms UNINSTALLED Port 1 Port 2 Port 3 Port 4 Port 5 4.0 : U1 direct soldered 4.0S : U1 with Socket, Soldermask zone ** Correspondig Layout Revisions: C361 27pF C371 27pF C392 2pF C391 0.1uF C46 2pF C47 2pF C48 2pF 1 P1.7/R03(ROSC) 2 P1.6/R13/LCDREF 3 P1.5/R23 4 LCDCAP/R33 5 COM0 6 P5.7/COM1/S26 7 P5.6/COM2/S25 8 P5.5/COM3/S24 9 P5.4/S23 10 VCORE 11 DVCC 12 P1.4/S22 13 P1.3/S21 14 P1.2/S20 15 P1.1/S19 16 P1.0/S18 17 P3.7/S17 18 P3.6/S16 19 P3.5/S15 20 P3.4/S14 21 P3.3/S13 22 P3.2/S12 23 P3.1/S11 24 P3.0/S10 25 DVCC 26 P4.7/S9 27 P4.6/S8 28 P4.5/S7 29 P4.4/S6 30 P4.3/S5 31 P4.2/S4 32 P4.1/S3 33 P4.0/S2/RF_ATEST) 34 P5.3/S1 35 P5.2/S0 36 RF_XIN 37 RF_XOUT 38 AVCC_RF 39 AVCC_RF 40 RF_P 41 RF_N 42 AVCC_RF 43 AVCC_RF 44 R_BIAS 45 GUARD 46 PJ.0/TDO 47 PJ.1/TDI/TCLK 48 PJ.2/TMS 49 PJ.3/TCK 50 TEST/SBWTCK 51 NRST/NMI/SBWTCK 52 DVCC 53 AVSS 54 P5.1/XOUT 55 P5.0/XIN 56 AVCC 57 P2.7/CB7/A7 58 P2.6/CB6/A6 59 P2.5/CB5/A5/VREF+/VEREF+ 60 P2.4/CB4/A4/VREF-/VEREF- 61 P2.3/CB3/A3 62 P2.2/CB2/A2 63 P2.1/CB1/A1 64 P2.0/CB0/A0 65 EPAD U1 CC430F6147 L451 12nH D1 SMD LED LAMP(GREEN) R441 56k/1% D2 SMD LED LAMP(Red) R551 0R R554 0R Q3 32.768k Q2 32.768k C551 12pF C554 12pF C041 4.7uF C101 0.47uF C511 2.2nF R3 330R R511 47k C451 0.1uF C431 0.1uF C421 0.1uF C381 0.1uF L401 12nH L411 12nH C401 1pF L402 18nH C411 1.5pF C403 100pF C402 1.5pF C412 1.5pF L412 18nH C414 1.5pF L413 15nH L415 15nH L414 2.2nH C413 8.2pF C111 1uF C112 0.1uF C252 0.1uF C522 0.1uF C562 0.1uF R231 0R R221 0R 1 2 3 JP2 R4 0R R5 0R C5 0.1uF 1 STAT 2 SW 3 VIN 4 GND 5 ON/BYP 6 FB U2 TPS62730 L2 2.2uH R7 0R C8 2.2uF C2 0.1uF C3 0.1uF R1 0R C4 0.1uF C9 2.2uF C7 uninstalled 1210 C251 1uF C521 1uF C561 1uF 1 2 3 4 5 6 7 8 CON1 1 2 3 4 5 6 7 8 CON2 1 2 3 4 5 6 7 8 CON3 1 2 3 4 5 6 7 8 CON4 1 2 3 4 5 6 7 8 CON5 1 2 3 4 5 6 7 8 CON6 1 2 3 4 5 6 7 8 CON7 1 2 3 4 5 6 7 8 CON8 1 2 3 4 5 6 7 8 CON9 S1 B3U-1000P S2 B3U-1000P 1 2 3 4 5 SMA1 SMA 1 2 3 4 5 6 7 8 9 10 CON10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CON11 R2 330R R6 330R Q1 26MHz 1 2 3 4 5 6 7 8 JP1 1 2 3 4 5 6 JP1A 1 2 3 4 JP4 JP5 JP10 1 2 JP3 1 2 CON13 1 2 JP7 1 2 3 JP8 1 2 3 JP6 1 2 3 CON12 AVT1 Fiducial Mark Top-Seite AVT2 Fiducial Mark Top-Seite AVT3 Fiducial Mark Top-Seite AVB1 Fiducial Mark Bottom-Seite AVB2 Fiducial Mark Bottom-Seite AVB3 Fiducial Mark Bottom-Seite ABO1 ABO2 C1 0.1uF L1 12nH XJMP 14x Jumper/Shunt see Jumperlist APCB1 PCB EM430F6147RF900 Rev3.4 or 3.4S 1 2 JP9 U1# Socket for U1 (only for PCB Version 3.4S) RVCC AVCC RVCC RVCC PORT_BUS P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 P5.0 P5.1 P5.2 P5.3 P5.4 P5.5 P5.6 P5.7 PORT_BUS P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P1.0 P1.7 P3.6 P2.0 P2.2 P2.4 P2.6 P2.7 P2.5 P2.3 P2.1 P3.0 P3.2 P3.4 P3.6 P3.7 P3.5 P3.3 P3.1 P4.0 P4.2 P4.4 P4.6 P4.7 P4.5 P4.3 P4.1 P5.0 P5.1 P5.2 P5.3 P5.4 P5.5 P5.6 P5.7 P5.0 P5.1 P5.0 P5.1 DVCC DVCC DVCC DVCC DVCC RVCC_1 RF-SINGLE DVCC AVCC VCC P1.6 P1.5 VCC VCC VCC_1 RVCC_1 AVCC P1.1 P5.4 RVCC_1 AVCC DVCC AGND DVCC

Test Report

Nemko Oy  P.O.Box 19, FI-02601 Espoo, Finland Street address: Perkkaantie 11, FI-02600 Espoo Telephone +358 (0)424 5454 1  Telefax +358 (0)9 5489 6371 TEST REPORT Date: ESPOO 25.05.2012 Page: 1 (22) Appendices  Date of handing in: 12.05.2012 Number: 201498 No. 1 / 1 Tested by: Timo Hietala, Test Engineer Reviewed by: Janne Nyman, Compliance Specialist SORT OF EQUIPMENT: - MARKETING NAME: TYPE: MSP-EXP430F5137R9 MANUFACTURER: Texas Instruments CLIENT: Texas Instruments, Germany ADDRESS: Haggertystrasse 1, Freising, D-85356, Germany TELEPHONE: +49 8161 80 0 / Claus Kuch TEST LABORATORY: Nemko Oy FCC REG. NO. 359859 October 20, 2011 IC FILE NO. 2040F-1 December 1, 2010 SUMMARY: In regard to the performed tests the equipment under test fulfils the requirements defined in the test specifications, see page 2 for details The test results are valid for the tested unit only. Without a written permission of Nemko Oy it is allowed to copy this report as a whole, but not partially. Version f1.00 Type: MSP-EXP430F5137R9 Test report: 201498 Page 2 (22) Date 25.05.2012 Summary of performed tests and test results Section in CFR 47 Section in RSS-210 Result 15.249, a A2.9 (a) Field strength of fundamental PASS 15.249, a A2.9 (a) Band-edge compliance PASS 15.249, a A2.9 (a) Spurious radiated emissions PASS 15.215 (c) 20 dB bandwidth PASS 15.35 (c) RSS-Gen 4.5 Duty cycle PASS 15.207 Conducted emissions AC line Not tested 1) 1) Only battery operated. Explanations: PASS The EUT passed that particular test. FAIL The EUT failed that particular test. X The measurement was done, but there is no applicable performance criteria. Type: MSP-EXP430F5137R9 Test report: 201498 Page 3 (22) Date 25.05.2012 Contents Summary of performed tests and test results .......................................................................................... 2 1. EUT and Accessory Information ......................................................................................................... 4 1.1 EUT description ........................................................................................................................ 4 1.2 EUT and accessories ................................................................................................................ 4 2. Test setups .......................................................................................................................................... 5 3. Standards and measurement methods ............................................................................................... 6 4. Test results .......................................................................................................................................... 6 4.1 Field strength of fundamental ................................................................................................... 6 4.1.1 EUT operation mode ................................................................................................................. 6 4.1.2 Test method and limit ............................................................................................................... 6 4.1.3 Test results ............................................................................................................................... 7 4.2 Band-edge compliance ........................................................................................................... 10 4.2.1 EUT operation mode ............................................................................................................... 10 4.2.2 Test method and limit ............................................................................................................. 10 4.2.3 Limits and test results ............................................................................................................. 11 4.3 Spurious radiated emission .................................................................................................... 13 4.3.1 EUT operation mode ............................................................................................................... 13 4.3.2 Test method and limit ............................................................................................................. 13 4.3.3 Test results ................................................................ ............................................................. 14 4.4 20 dB Bandwidth ..................................................................................................................... 17 4.4.1 EUT operation mode ............................................................................................................... 17 4.4.2 Test data ................................................................................................................................. 17 4.5 Duty cycle ............................................................................................................................... 19 4.5.1 EUT operation mode ............................................................................................................... 19 4.5.2 Test method and limit ............................................................................................................. 19 4.5.3 Test data ................................................................................................................................. 19 5. List of test equipment ........................................................................................................................ 21 6. Photographs ...................................................................................................................................... 22 Type: MSP-EXP430F5137R9 Test report: 201498 Page 4 (22) Date 25.05.2012 1. EUT and Accessory Information 1.1 EUT description The EUT is a development platform for System on Chip. Alignment range: 902-928 MHz Channels: 1 Operating Voltage: 3.0 VDC Battery: 2xAAA Antenna: Chip …

Text truncated - open the document above for the full version.

Test Setup Photos

Type: MSP-EXP430F5137R9 Test report: 201498 Page 22 (22) Date 25.05.2012 6. Photographs Photograph 1, Radiated emissions test setup

Contact Information

Applicant

Marian Kost(Product Line Manager, Connectivity)
[email protected]214-567-2462Fax: 214-479-5605

Technical Contact

Texas InstrumentsFritz R. Ward
[email protected](214) 567-9484

12500 TI Boulevard, M/S 8669 · Dallas · United States

Non-Technical Contact

Nemko USA, Inc.Zarah G. MacIvor
[email protected]214-629-5683

Test Firm

NEMKO OyJyrki Leino
[email protected]358-424-54541Fax: 358-9548-96371

Technical Specifications

#Rule PartsFrequency RangePower Output
115C903.49 MHz - 926.49 MHz-

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