2ADXK-1680Pulse Oximeter

ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China) AttestationStatements NotCoveredEntityApplicant&NotCoveredEquipment To:FederalCommunicationsCommissionDate::September19, 2025 7435OaklandMillsRoad, Columbia,MD21046,USA Ref:InformationRequiredbySection2.911(d)(5)(i)&(ii) FCCID:2ADXK-1680 ShenzhenViatomTechnologyCo.,Ltd.(“theapplicant”)certifiesthat,asofthedateofthefilingofthe application,theapplicantisnotidentifiedontheCoveredList,establishedpursuantto§1.50002of referencechapter,asanentityproducing“covered”communicationequipment.Theequipmentfor whichauthorizationissoughtisnot“covered”telecommunicationsequipmentandvideosurveillance equipmentproducedbyentitiesidentifiedontheCommission’sCoveredListthatprohibitedfrom receivinganequipmentauthorizationpursuanttosection§2.903oftheFCCrules. Sincerelyyours, ApplicantSignature PrintedName:BingWang Title:ManagerofR&D Address:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China Email:[email protected]

ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China) 1|Page AttestationStatements To:FederalCommunicationsCommissionDate:Sep.19,25 7435OaklandMillsRoad, Columbia,MD21046,USA Subject:AttestationofCompliancewithFCCCoveredListSoftwareRequirements FCCID:2ADXK-1680 ProductName:PulseOximeter Thisletterservesasanattestationthattheequipmentidentifiedabove☐is/☒isnot(selectone)"covered" softwareasdefinedundertheFederalCommunicationsCommission(FCC)CoveredListrequirements,as outlinedinFCC22-84andKDB986446. Specifically,theundersignedcertifiesthattheequipmentforwhichauthorizationissought: 1.Doesnotcontaincybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab, Inc.oranyofitssuccessors,assignees,parents,subsidiaries,affiliates,oranyentitythathasrebranded orrelabeledsoftwareproducedbytheaforementionedentities. 2.Doesnothavethecapabilitytostore,run,ordeliveranysoftwareidentifiedontheFCCCoveredList, includingbutnotlimitedtocybersecurityandanti-virussoftware. Tosupportthisattestation,theappendixevaluationdocumentationhasbeenpreparedandisincludedinthe certificationfiling. Thisattestationisbasedonathoroughevaluationofthedevice'sdesign,functionality,andsoftware environment.Theundersignedaffirmsthattheinformationprovidedisaccurateandcompletetothebestof theirknowledge. Sincerelyyours, ApplicantSignature PrintedName:BingWang Title:ManagerofR&D Address:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China Tel.:+8675586638929 Email:[email protected] ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China) 2|Page EvaluationregardingtotheCoveredListSoftware: Compliance Methodology EvaluationProcessResults Deviceis Inherent compliance ☒ TheChipset(s)usedislimitedtorun theCybersecurityoranti-virus software. Compliance ☒ TheMemoryusedislimitedtorunthe Cybersecurityoranti-virussoftware. Compliance ☒ Thereisstoragecapacitylimitationfor storeorinstalltheCybersecurityor anti-virussoftware. Compliance ☒ Operatingsystemusedislimitedto run,installordelivertheCybersecurity oranti-virussoftware. Compliance Deviceisnot Inherent compliance ☐ EvaluationBasedonSoftware BillofMaterials(SBoM) Seeattached“SBoM“ Note:TheSBoMcontentislimited tothescopeofcoveredlist software(e.g.antivirusand cybersecuritysoftware). ☐ EvaluationBasedonScanfor Softwareonthedevice ☐ EvaluationBasedonFilesystemscan ☐ EvaluationBasedonRunning softwarecheck SBOM(SoftwareBillofMaterials)[ForDeviceisnotInherentcompliance] SectionComponentNameVersionSupplier 1 2 3

ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,NanshanDistrict, Shenzhen,518055,Guangdong,P.R.China) U.S.AgentLetterofAttestation To:FederalCommunicationsCommission 7435OaklandMillsRoad,Columbia,MD21046,USA Date::September19, 2025 Ref: AttestationStatement–Part 2.911(d)(7)filing FCCID:2ADXK-1680 [ ShenzhenViatomTechnologyCo.,Ltd. ](“theapplicant”)certifiesthat,asofthedateofthefilingofthe application,[GOLDENVICTORYINTERNATIONALTRADINGCOLTD](“theagent”)isourdesignated U.S.agentforserviceofprocessfortheabovereferenceFCCID.Theapplicantacceptstomaintain anagentforserviceofprocessintheUnitedStatesfornolessthanoneyearaftereitherthe granteehaspermanentlyterminatedallmarketingandimportationoftheapplicableequipment withintheU.S.,ortheconclusionofanyCommission-relatedadministrativeorjudicialproceeding involvingtheequipment,whicheverislater.Theapplicantfurtheracknowledgesitisour responsibilitytoinformtheFCCwhenevertheagentinformationchanges. [GOLDENVICTORYINTERNATIONALTRADINGCOLTD]("theagent)understanditistheagent's obligationtoacceptserviceofprocessintheUnitedStatesformattersrelatedtotheapplicable equipment,andatthephysicalU.S.addressandemailaddress. DesignatedU.S.Agent CompanyName:GOLDENVICTORYINTERNATIONALTRADINGCOLTD FRN:0036377570 Address:11016THSTREETSUITE1400 DENVER,CO80202UnitedStates Signature: ContactPerson:LeonHowar Tel:(337)255-0461 Email: [email protected] Applicant CompanyName: ShenzhenViatomTechnologyCo.,Ltd. FRN:0024194888 Address:901,BuildingWest,LepuTower,No.66 XingkeRoad,XiliCommunity,XiliStreet,Nanshan District,Shenzhen,518055,Guangdong,P.R.China Signature: ContactPerson:BingWang Tel:+8675586638929Email:[email protected]

ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,Nanshan District,Shenzhen,518055,Guangdong,P.R.China) Date:September19,2025 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Subject:ConfidentialityRequestfor:FCCID:2ADXK-1680 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestpermanent confidentialtreatmentoftheexhibitsaccompanyingthiscertificationapplicationasoutlinedbelow: BlockDiagram  Schematics  OperationalDescription Theaboveexhibitscontaintradesecretsand/orproprietaryinformationthatarenotpubliclyavailableand materialsthattheApplicanthasspentconsiderableeffortsindeveloping.Publicdisclosureofthesemay beharmfultotheApplicantandgiveanunfairadvantagetocompetitorsonthemarket. PursuanttoDA04-1705,theapplicantalsorequeststemporaryconfidentialtreatmentoftheexhibits outlinedbelowforaperiodof(upto180)daysfromthedateofequipmentauthorizationandpriorto marketingintheUnitedStatestopreventtheprematurereleaseofanysensitiveinformation.Applicantis awareoftheirresponsibilitytonotifyDERYCOMintheeventinformationregardingtheproductorthe productismadeavailabletothepublicbeforetherequestedperiodhasexpired. UserManual InternalPhotos TestSetupPhotos Sincerely, (Signature) Title:ManagerofR&D Address:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,Nanshan District,Shenzhen,518055,Guangdong,P.R.China Tel.:+8675586638929 Email:[email protected]

ShenzhenViatomTechnologyCo.,Ltd. (901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet,Nanshan District,Shenzhen,518055,Guangdong,P.R.China) Date:September27,2025 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Subject:AgentAuthorizationforFCCID:2ADXK-1680 I,theundersigned,herebyauthorize(GuangdongZhonghanTestingTechnologyCo.,Ltd.)toactonour behalfinallmattersrelatingtothisapplicationforequipmentcertification. Anyactcarriedoutby(GuangdongZhonghanTestingTechnologyCo.,Ltd.)shallhavethesameeffect asourownandIacknowledgethatallresponsibilityforcomplyingwiththetermsandconditionsof certification,asspecifiedbyDERYCOMCERTIFICATIONSERVICES,INC.,stillresideswith(Shenzhen ViatomTechnologyCo.,Ltd.). WecertifythatwearenotsubjecttoadenialoffederalbenefitsthatincludesFCCbenefitspursuantto Section5301oftheAnti-DrugAbuseActof1988,21U.S.C.§862,andthatnopartytotheapplication,as definedin47CFR§1.2002(b),issubjecttoadenialoffederalbenefitsthatincludesFCCbenefits pursuanttothatsection. Sincerely, (Signature) (FullnameofcontactpersonlistedonFCC’swebsite) Title:ManagerofR&D Tel:+8675586638929 Fax:+8675522649904 Email:[email protected]

ShenzhenViatomTechnologyCo.,Ltd. ModelDifference Productdescription:PulseOximeter Modelname:Oxiband,Oxiduckm FCCID:2ADXK-1680 Oxibandistestedmodel,othermodelsarederivativemodels.Themodelsare identicalincircuit,onlydifferentonthemodelnamesandprobetype.Sothetestdata ofOxibandcanrepresenttheremainingmodels. Client’ssignature: Client’sname/title:BingWang/ManagerofR&D Contactinformation/address:901,BuildingWest,LepuTower,No.66XingkeRoad, XiliCommunity,XiliStreet,NanshanDistrict,Shenzhen,518055,Guangdong,P.R. China probetypedifferent Photo Probe1 Probe2

FCCID:2ADXK-1680 EUTPHOTOSExternalPhotos FCCID:2ADXK-1680 FCCID:2ADXK-1680 FCCID:2ADXK-1680 ※※※※※ENDOFREPORT※※※※※

FCCID:2ADXK-1680 RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1093，Unless specificallyrequiredbythepublishedRFexposureKDBprocedures,standalone1-gheador bodyand10-gextremitySARevaluationforgeneralpopulationexposureconditions,by measurementornumericalsimulation,isnotrequiredwhenthecorrespondingSARTest ExclusionThresholdcondition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, ForBluetooth Mode Max Power (dBm) Tune-up power (dBm) Max Power (mW) Frequency(MHz) Min. Distance (mm) Calc. thresholds limit BLE-5.97 -5±10.40 24025 0.124 3.0 SoaSARtestisnotrequired

1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245M0X 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type 03,04,05 版本 VERSION ： V2.2 日期 ISSUE DATE ： 2016/08/09 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray James Thor 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區中央南路二段36號3樓 2F., No.163, Sec. 1, Xi'an St., Beitou Dist., Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.11 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 P/N: WAN8010F245M03 WAN8010F245M04 WAN8010F245M05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 M 0X A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type X=03,04,05 / Type=03,04,05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245M03 WAN8010F245M04 WAN8010F245M05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.45 dBi Impedance 50 Ohm Operating Temperature -40～+85 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 5/11 ONEWAVE TECHNOLOGY CO., LTD. Layout Dimensions in Clearance area( Size=10.0*5.0mm) 50 ohm transmission Line Matching Circuit  Layout Dimensions in Clearance area( Size=10.0*3.0mm) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.13 % 3.39 dBi 5.53 dBi 2450MHz 74.79 % 3.45 dBi 5.20 dBi 2500MHz 65.65 % 2.75 dBi 5.14 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +85±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +85°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 85±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information  Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05  Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TEC…

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ProjectNo.:ZHT-250606122W02 Page 1 of 44 Intheconfigurationtested,theEUTcompliedwiththestandardsspecifiedabove. PreparedbyReviewedby:Approvedby: LeonLi/EngineerBaretWu/DirectorLeviLee/Manager Note:ThisdevicedescribedabovehasbeentestedbyZHT,andthetestresultsshowthattheequipment undertest(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport.Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZHT, thisdocumentmaybealteredorrevisedbyZHT,personalonly,andshallbenotedintherevisionofthe document. FCCTESTREPORT FCCID:2ADXK-1680 ReportNo........................:ZHT-250606122W02 Product............................:PulseOximeter Trademark.......................:/ Model(s)...........................:Oxiband,Oxiduckm ModelDifference..............:Oxibandistestedmodel,othermodelsarederivativemodels.Themodels areidenticalincircuit,onlydifferentonthemodelnamesandprobetype. SothetestdataofOxibandcanrepresenttheremainingmodels. Applicant..........................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity, XiliStreet,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Manufacturer....................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity, XiliStreet,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Preparedby.....................:GuangdongZhonghanTestingTechnologyCo.,Ltd. Address............................:Room104/201,Building1,YibaolaiIndustrialPark,Qiaotou,Fuhai Subdistrict,Bao'anDistrict,Shenzhen,Guangdong,China DateofReceipt................:June6,2025 DateofTest(s)................: June6,2025toAug.19,2025 DateofIssue....................: Aug.19,2025 Standard..........................................::FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure................................::KDB558074D0115.247MeasGuidancev05r02 ANSIC63.10:2013 ProjectNo.:ZHT-250606122W02 Page 2 of 44 TableofContentsPage 1.VERSION.................................................................................................................................................4 2.SUMMARYOFTESTRESULTS.............................................................................................................5 3.GENERALINFORMATION.....................................................................................................................6 3.1GENERALDESCRIPTIONOFEUT...............................................................................................6 3.2DESCRIPTIONOFTESTMODES..................................................................................................7 3.3TESTSETUPCONFIGURATION....................................................................................................7 3.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)......................................................8 4.TESTFACILITYANDTESTINSTRUMENTUSED................................................................................9 4.1TESTFACILITY...............................................................................................................................9 4.2INSTRUMENTLISTFORALLTESTITEMS..................................................................................9 4.3TESTINGSOFTWARE..................................................................................................................11 5.CHANNELBANDWIDTH......................................................................................................................12 5.1CONDUCTEDEMISSIONMEASUREMENT................................................................................12 5.1.1POWERLINECONDUCTEDEMISSIONLimits.................................................................12 5.1.2TESTPROCEDURE.............................................................................................................12 5.1.3DEVIATIONFROMTESTSTANDARD................................................................................12 5.1.4TESTSETUP........................................................................................................................13 5.1.5EUTOPERATINGCONDITIONS.........................................................................................13 5.1.6TESTRESULTS...................................................................................................................14 5.2RADIATEDEMISSIONMEASUREMENT.....................................................................................16 5.2.1RADIATEDEMISSIONLIMITS............................................................................................16 5.2.2TESTPROCEDURE.............................................................................................................17 5.2.3DEVIATIONFROMTESTSTANDARD................................................................................17 5.2.4TESTSETUP........................................................................................................................17 5.2.5EUTOPERATINGCONDITIONS.........................................................................................18 6.RADIATEDBANDEMISSIONMEASUREMENT..................................................................................22 6.1TESTREQUIREMENT:...........................................................................................................22 6.2TESTPROCEDURE................................................................................................................22 6.3DEVIATIONFROMTESTSTANDARD...................................................................................22 6.4TESTSETUP...........................................................................................................................23 6.5EUTOPERATINGCONDITIONS............................................................................................23 6.6TESTRESULT.....................................…

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