2ADXK-8624Blood Pressure Monitor

ShenzhenViatomTechnologyCo.,Ltd. Rev2026-04-24 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:08-05-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)andPart2.911(d)(5)(ii) FCCID:2ADXK-8624 Part2.911(d)(5)(i) [ShenzhenViatomTechnologyCo.,Ltd.](“theapplicant”)certifiesthattheequipmentforwhich authorizationissoughtisnot“covered”equipmentanddoesnotcontainanti-virussoftwareor cybersecuritysoftwareprohibitedfromreceivinganequipmentauthorizationpursuantto47CFR2.903, KDB986446D01CoveredEquipmentGuidance,andFCCCoveredList (www.fcc.gov/supplychain/coveredlist). Part2.911(d)(5)(ii) [ShenzhenViatomTechnologyCo.,Ltd.](“theapplicant”)certifiesthat,asofthedateofthefilingofthe application,theapplicantisnotidentifiedontheCoveredList(asaspecificallynamedentityoranyofits subsidiariesoraffiliates)asanentityproducing“covered”equipment. Sincerely, (Applicantsignature) (Applicantprintedname)BingWang

Rev1/26/2023 ShenzhenViatomTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:August5,2026 Ref:AttestationStatementsPart2.911(d)(7)Filing FCCID:2ADXK-8624 ApplicantFRN:0024194888 [ShenzhenViatomTechnologyCo.,Ltd.](“theapplicant”)certifiesthat,asofthedateofthefilingofthe application,[FCCUSAgent,LLC]isourdesignatedU.S.agentforserviceofprocessfortheabove referencedFCCID.[ShenzhenViatomTechnologyCo.,Ltd.]acceptstomaintainanagentfornolessthan oneyearafterthegranteehasterminatedallmarketingandimportationortheconclusionofany Commission-relatedproceedinginvolvingtheequipment. [FCCUSAgent,LLC]accepts,asofthedateofthefilingoftheapplication,theobligationofthe designatedU.S.agentforserviceofprocessfortheabovereferencedFCCID. DesignatedU.S.AgentInformation: Name:[FCCUSAgent,LLC] U.S.AgentFRN:[0033402884] Address:[3722IllinoisAvenue,SaintCharles,IL,60174,USA] ContactPerson:[TimPayne] Tel.:[708-571-3148] Email:[[email protected]] Sincerely, [ShenzhenViatomTechnologyCo.,Ltd.][FCCUSAgent,LLC] [BingWang][TimPayne] [][]

Rev11/20/07 ShenzhenViatomTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision ConfidentialityRequestregardingapplicationforcertificationofFCCID:2ADXK-8624 PursuanttoSections0.457and0.459oftheCommission’sRules,weherebyrequestconfidential treatmentofinformationaccompanyingthisapplicationasoutlinedbelow: ExhibitTypeFileName (BlockDiagram,Schematics,Operational Description) (BlockDiagram.pdf,Schematics.pdf, OperationalDescription.pdf Theabovematerialscontaintradesecretsandproprietaryinformationnotcustomarilyreleasedto thepublic.Thepublicdisclosureofthesematerialsmaybeharmfultotheapplicantandprovide unjustifiedbenefitstoitscompetitors. TheapplicantunderstandsthatpursuanttoSection0.457oftheRules,disclosureofthis applicationandallaccompanyingdocumentationwillnotbemadebeforethedateoftheGrant forthisapplication. PursuanttoDA04-1705June15,2004oftheCommission’spublicnotice,wealsorequestthat theinformationattachedtothisapplicationbetemporarilyconfidentialfor180daysasoutlined below: ExhibitTypeFileName UserManual.pdf ExternalPhotos.pdf InternalPhotos.pdf TestSetupPhotos.pdf UserManual.pdf ExternalPhotos.pdf InternalPhotos.pdf TestSetupPhotos.pdf Sincerely, Signature: printedname:BingWang Date:March25,2026

M:\MasterDocuments\TEMPLATES\POA_Letter.doc ShenzhenViatomTechnologyCo.,Ltd. FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Date:March25,2026 SUBJECT:FCCApplicationfor(FCCID:2ADXK-8624) ToWhomItMayConcern: We,theundersigned,herebyauthorizeLitingNongatCentreTestingInternationalGroup Co.,Ltd/BuildingC,HongweiIndustrialParkBlock70,Bao'anDistrict,Shenzhen,China onourbehalf,toapplytotheFederalCommunicationsCommissiononourequipment. AnyandallactscarriedoutbyLitingNongatCentreTestingInternationalGroupCo.,Ltd /BuildingC,HongweiIndustrialParkBlock70,Bao'anDistrict,Shenzhen,Chinaonour behalfshallhavethesameeffectasactsofourown. ThisistoadvisethatweareinfullcompliancewiththeAnti-DrugAbuseAct.We,the applicant,arenotsubjecttoadenialoffederalbenefitspursuanttoSection5301ofthe Anti-DrugActof1988,21USC853a,andnopartytotheapplicationissubjecttoadenial offederalbenefitspursuanttothatsection Regards, Signature: printedname:BingWang

1/1 ModelDifferencesStatement ThemodeldifferencesoftheBloodPressureMonitor(Model:BP2,BP2A)producedbyourcompany (ShenzhenViatomTechnologyCo.,Ltd.)areshowninthefollowingtable: ModelBP2BP2ARemark IntendeduseECG+BloodPressureBloodPressure/ Dimension 相同 Same 相同 Same/ LCDDimension 相同 Same 相同 Same/ PCB相同Same相同Same/ PCBlayouts相同Same相同Same/ Construction 心电 + 血压模块 + 蓝牙模块 ECG+BPmodule +Bluetoothmodule 血压模块 + 蓝牙模块 BPmodule +Bluetoothmodule 型号名称差异，BP2多了心电 功能 Differencesinmodelname,the modelBP2additionally featuresECGfunctionality. Schematic 同结构差异 Sameastheconstruction differences 同结构差异 Sameastheconstruction differences / Components 同结构差异 Sameastheconstruction differences 同结构差异 Sameastheconstruction differences / Enclosurematerial 相同 Same 相同 Same/ Operation相同Same相同Same/ Software相同Same相同Same/ ShenzhenViatomTechnologyCo.,Ltd. 2026-1-7

0000000000000 0000000000000 0000000000000 @ © 令 ＝ ＠ 旰 ＠ © Blood Pressure Monitor Model: BP2 Power: DC3.7V/580mAh Li-ion rechargeable Charging: DC 5V, 1AFCC ID: 2ADXK-8624 IP22 MD 2025-10-31 SN Shenzhen Viatom Technology Co.,Ltd 901, Building West, Lepu Tower, No.66 Xingke Road, Xili Community, Xili Street, Nanshan District, Shenzhen,518055, Guangdong P.R. China Made in China (01)00000000000000 (11)251031 (21)25A3B00003 25A3B00003 UDI

ReportNo.:EED32S80441802Page1of7 RFExposureEvaluationReport Product:BloodPressureMonitor Trademark:N/A Model/Typereference:BP2,BP2A SerialNumber:N/A ReportNumber:EED32S80441802 FCCID:2ADXK-8624 DateofIssue:Jul.31,2026 TestStandards: 47CFRPart1.1307 47CFRPart1.1310 47CFRPart2.1093 KDB447498D04InterimGeneralRF ExposureGuidancev01 Testresult:PASS Preparedfor: ShenzhenViatomTechnologyCo.,Ltd. 901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Preparedby: CentreTestingInternationalGroupCo.,Ltd. HongweiIndustrialPark,Zone70,Bao’anDistrict, Shenzhen,Guangdong,China TEL:+86-755-33683668 FAX:+86-755-33683385 Compiledby:Reviewedby: WinWeiKevenTan Approvedby:Date:Jul.31,2026 AaronMa CheckNo.:7350060326 ReportNo.:EED32S80441802Page2of7 1Contents Page 1CONTENTS........................................................................................................................................................................2 2GENERALINFORMATION..............................................................................................................................................3 2.1CLIENTINFORMATION...................................................................................................................................................3 2.2GENERALDESCRIPTIONOFEUT...................................................................................................................................3 2.3PRODUCTSPECIFICATIONSUBJECTIVETOTHISSTANDARD...........................................................................................3 2.4TESTLOCATION.............................................................................................................................................................4 2.5DEVIATIONFROMSTANDARDS......................................................................................................................................4 2.6ABNORMALITIESFROMSTANDARDCONDITIONS..........................................................................................................4 2.7OTHERINFORMATIONREQUESTEDBYTHECUSTOMER................................................................................................4 3SAREVALUATION...........................................................................................................................................................5 3.1RFEXPOSURECOMPLIANCEREQUIREMENT.................................................................................................................5 3.1.1Limits....................................................................................................................................................................5 3.1.2TestProcedure....................................................................................................................................................5 3.1.3EUTRFExposureEvaluation..........................................................................................................................6 ReportNo.:EED32S80441802Page3of7 2GeneralInformation 2.1ClientInformation Applicant: ShenzhenViatomTechnologyCo.,Ltd. AddressofApplicant: 901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet, NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Manufacturer: ShenzhenViatomTechnologyCo.,Ltd. AddressofManufacturer: 901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet, NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Factory: ShenzhenViatomTechnologyCo.,Ltd. AddressofFactory: Floor3,Building9,BaiwangxinIndustrialPark,No.1002SongbaiRoad,Yangguan gCommunity,XiliStreet,NanshanDistrict,Shenzhen,518055,Guangdong,P.R. China 2.2GeneralDescriptionofEUT ProductName: BloodPressureMonitor ModelNo.(EUT): BP2,BP2A TestModelNo.: BP2 Modeldifference: Theyhavesameelectrical,PCBandlayout,onlythemodelnameandfunctional configurationaredifferentformarketingrequirements. TradeMark: N/A 2.3 ProductSpecificationsubjectivetothisstandard FrequencyRange:BLE:2402MHz~2480MHz ModulationType:BLE:GFSK TestPowerGrade:Default TestSoftwareofEUT:662x_FCC_Rev1.7R_20260306.exe AntennaType: Chipantenna AntennaGain: 3.53dBi PowerSupply: Battery:DC3.7V SampleReceivedDate: Mar.06,2026 SampletestedDate: Mar.06,2026toMar.20,2026 ReportNo.:EED32S80441802Page4of7 2.4TestLocation Alltestswereperformedat: CentreTestingInternationalGroupCo.,Ltd HongweiIndustrialPark,Zone70,Bao'anDistrict,Shenzhen,Guangdong,China Telephone:+86(0)75533683668Fax:+86(0)75533683385 Notestsweresub-contracted. FCCDesignationNo.:CN1164,TestFirmRegistrationNo.:260439 2.5DeviationfromStandards None. 2.6AbnormalitiesfromStandardConditions None. 2.7OtherInformationRequestedbytheCustomer None. ReportNo.:EED32S80441802Page5of7 3SAREvaluation 3.1RFExposureComplianceRequirement 3.1.1Limits TheSAR-basedexemptionformulaof§1.1307(b)(3)(i)(B),repeatedhereasFormula(B.2),appliesfor singlefixed,mobile,andportableRFsourceswithavailablemaximumtime-averagedpoweroreffective radiatedpower(ERP),whicheverisgreater,oflessthanorequaltothethresholdPth(mW). Thismethodshallonlybeusedatseparationdistancesfrom0.5cmto40cmandatfrequenciesfrom 0.3GHzto6GHz(inclusive).PthisgivenbyFormula andfisinGHz,distheseparationdistance(cm),andERP20cmisperFormula(B.1). The1mWBlanketExemptionof§1.1307(b)(3)(i)(A)appliesforsinglefixed,mobile,andportableRF sourceswithavailablemaximumtime-averagedpowerofnomorethan1mW,regardlessofseparation distance. 3.1.2TestProcedure SoftwareprovidedbyclientenabledtheEUTtotransmitandreceivedataatlowest,middleandhighest channelindividually. ReportNo.:EED32S80441802Page6of7 3.1.3EUTRFExposureEvaluation ForStandalone: Band Freq. (MHz) Estimation distance (cm) Max. Conducted Output power (dBm) Antenna Gain (dBi) ERP (dBm) ERP (mW) Limit (mW) MPE ratio Result BLE24400.5-3.23.53-1.820.662.7530.2389Pass Note： ①EIRP=conductedpower+antennagain； ②ERP=EIRP-2.15; ③EIRP(dBm)=Fieldstrengthofthefundamentalsignal(dBuV/m@3m)–95.23; ④ERP(mW)=10^ (ERP(dBm)/1…

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ReportNo.:EED32S80441801Page 1 of 44 TESTREPORT Product:BloodPressureMonitor Trademark:N/A Model/Typereference:BP2,BP2A SerialNumber:N/A ReportNumber:EED32S80441801 FCCID:2ADXK-8624 DateofIssue:Jul.31,2026 TestStandards:47CFRPart15SubpartC Testresult:PASS Preparedfor: ShenzhenViatomTechnologyCo.,Ltd. 901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Preparedby: CentreTestingInternationalGroupCo.,Ltd. HongweiIndustrialPark,Zone70,Bao’anDistrict, Shenzhen,Guangdong,China TEL:+86-755-33683668 FAX:+86-755-33683385 Compiledby:Reviewedby: WinWeiKevenTan Approvedby:Date:Jul.31,2026 AaronMa CheckNo.:7350060326 ReportNo.:EED32S80441801Page 2 of 44 1Content 1CONTENT............................................................................................................................................................................2 2TESTSUMMARY...............................................................................................................................................................3 3GENERALINFORMATION...............................................................................................................................................4 3.1CLIENTINFORMATION....................................................................................................................................................4 3.2GENERALDESCRIPTIONOFEUT.................................................................................................................................4 3.3TESTCONFIGURATION..................................................................................................................................................5 3.4TESTENVIRONMENT.....................................................................................................................................................6 3.5DESCRIPTIONOFSUPPORTUNITS...............................................................................................................................6 3.6TESTLOCATION.............................................................................................................................................................6 3.7MEASUREMENTUNCERTAINTY(95%CONFIDENCELEVELS,K=2).............................................................................7 4EQUIPMENTLIST..............................................................................................................................................................8 5TESTRESULTSANDMEASUREMENTDATA.........................................................................................................12 5.1ANTENNAREQUIREMENT............................................................................................................................................12 5.2CONDUCTEDEMISSIONS.............................................................................................................................................13 5.3MAXIMUMCONDUCTEDOUTPUTPOWER..................................................................................................................17 5.4DTSBANDWIDTH........................................................................................................................................................18 5.5MAXIMUMPOWERSPECTRALDENSITY.....................................................................................................................19 5.6BANDEDGEMEASUREMENTSANDCONDUCTEDSPURIOUSEMISSION...................................................................20 5.7RADIATEDSPURIOUSEMISSION&RESTRICTEDBANDS...........................................................................................21 6APPENDIXA.....................................................................................................................................................................42 7PHOTOGRAPHS..............................................................................................................................................................43 ReportNo.:EED32S80441801Page 3 of 44 2TestSummary TestItemTestRequirementResult AntennaRequirement 47CFRPart15SubpartCSection 15.203/15.247(c) PASS ACPowerLineConducted Emission 47CFRPart15SubpartCSection 15.207 PASS DTSBandwidth 47CFRPart15SubpartCSection 15.247(a)(2) PASS MaximumConductedOutput Power 47CFRPart15SubpartCSection 15.247(b)(3) PASS MaximumPowerSpectral Density 47CFRPart15SubpartCSection15.247(e)PASS BandEdgeMeasurements 47CFRPart15SubpartCSection 15.247(d) PASS ConductedSpuriousEmissions 47CFRPart15SubpartCSection 15.247(d) PASS RadiatedSpuriousEmission& Restrictedbands 47CFRPart15SubpartCSection 15.205/15.209 PASS ReportNo.:EED32S80441801Page 4 of 44 3GeneralInformation 3.1ClientInformation Applicant:ShenzhenViatomTechnologyCo.,Ltd. AddressofApplicant:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Manufacturer:ShenzhenViatomTechnologyCo.,Ltd. AddressofManufacturer:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Factory:ShenzhenViatomTechnologyCo.,Ltd. AddressofFactory:Floor3,Building9,BaiwangxinIndustrialPark,No.1002SongbaiRoad,Ya ngguangCommunity,XiliStreet,NanshanDistrict,Shenzhen,518055,Gu angdong,P.R.China 3.2GeneralDescriptionofEUT ProductName: BloodPressureMonitor ModelNo.(EUT): BP2,BP2A TestModelNo.: BP2 Modeldifference: Theyhavesameelectrical,PCBandlayout,onlythemodelnameand functionalconfigurationaredifferentformarketingrequirements. Trademark: N/A ProductType: MobilePortableFixLocation OperationFrequency: 2402MHz~2480MHz ModulationType: GFSK TransferRate:1Mbps NumberofChannel: 40 AntennaType: Chipantenna AntennaGain: 3.53dBi PowerSupply: Battery:DC3.7V TestVoltage:DC3.7V SampleReceivedDate:Mar.06,2026 SampletestedDate:Mar.06,2026toMar.20,2026 ReportNo.:EED32S80441801Page 5 of 44 OperationFrequencyeachofchannel …

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1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245H05 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WAN8010F245H05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 H 05 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245H05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 50 ohm transmission Line Matching Circuit ◆ Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Stor…

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ReportNo.:EED32S80441801Page1of24 Appendix:BluetoothLE ReportNo.:EED32S80441801Page2of24 Contents DutyCycle..................................................................................................................................................................................................3 MaximumPeakConductedOutputPower..................................................................................................................................................6 -6dBBandwidth..........................................................................................................................................................................................9 OccupiedChannelBandwidth..................................................................................................................................................................12 MaximumPowerSpectralDensityLevel..................................................................................................................................................15 BandEdge................................................................................................................................................................................................18 ConductedRFSpuriousEmission............................................................................................................................................................21 ReportNo.:EED32S80441801Page3of24 DutyCycle ConditionModeFrequency(MHz)AntennaDutyCycle(%)CorrectionFactor(dB)1/T(kHz) NVNTBLE1M2402Ant161.442.122.6 NVNTBLE1M2440Ant161.122.142.62 NVNTBLE1M2480Ant161.122.142.62 ReportNo.:EED32S80441801Page4of24 TestGraphs DutyCycleNVNTBLE1M2402MHzAnt1 DutyCycleNVNTBLE1M2440MHzAnt1 ReportNo.:EED32S80441801Page5of24 DutyCycleNVNTBLE1M2480MHzAnt1 ReportNo.:EED32S80441801Page6of24 MaximumPeakConductedOutputPower ConditionModeFrequency (MHz) AntennaConductedPower (dBm) Limit (dBm) Verdict NVNTBLE1M2402Ant1-3.6630Pass NVNTBLE1M2440Ant1-3.230Pass NVNTBLE1M2480Ant1-3.3930Pass ReportNo.:EED32S80441801Page7of24 TestGraphs PeakPowerNVNTBLE1M2402MHzAnt1 PeakPowerNVNTBLE1M2440MHzAnt1 ReportNo.:EED32S80441801Page8of24 PeakPowerNVNTBLE1M2480MHzAnt1 ReportNo.:EED32S80441801Page9of24 -6dBBandwidth ConditionModeFrequency(MHz)Antenna-6dBBandwidth(MHz)Limit-6dBBandwidth(MHz)Verdict NVNTBLE1M2402Ant10.6990.5Pass NVNTBLE1M2440Ant10.6990.5Pass NVNTBLE1M2480Ant10.6970.5Pass ReportNo.:EED32S80441801Page10of24 TestGraphs -6dBBandwidthNVNTBLE1M2402MHzAnt1 -6dBBandwidthNVNTBLE1M2440MHzAnt1 ReportNo.:EED32S80441801Page11of24 -6dBBandwidthNVNTBLE1M2480MHzAnt1 ReportNo.:EED32S80441801Page12of24 OccupiedChannelBandwidth ConditionModeFrequency(MHz)Antenna99%OBW(MHz) NVNTBLE1M2402Ant11.039 NVNTBLE1M2440Ant11.037 NVNTBLE1M2480Ant11.037 ReportNo.:EED32S80441801Page13of24 TestGraphs OBWNVNTBLE1M2402MHzAnt1 OBWNVNTBLE1M2440MHzAnt1 ReportNo.:EED32S80441801Page14of24 OBWNVNTBLE1M2480MHzAnt1 ReportNo.:EED32S80441801Page15of24 MaximumPowerSpectralDensityLevel ConditionModeFrequency (MHz) AntennaConductedPSD (dBm/3kHz) Limit (dBm/3kHz) Verdict NVNTBLE1M2402Ant1-18.148Pass NVNTBLE1M2440Ant1-18.528Pass NVNTBLE1M2480Ant1-18.748Pass ReportNo.:EED32S80441801Page16of24 TestGraphs PSDNVNTBLE1M2402MHzAnt1 PSDNVNTBLE1M2440MHzAnt1 ReportNo.:EED32S80441801Page17of24 PSDNVNTBLE1M2480MHzAnt1 ReportNo.:EED32S80441801Page18of24 BandEdge ConditionModeFrequency(MHz)AntennaMaxValue(dBc)Limit(dBc)Verdict NVNTBLE1M2402Ant1-51.98-20Pass NVNTBLE1M2480Ant1-51.3-20Pass ReportNo.:EED32S80441801Page19of24 TestGraphs BandEdgeNVNTBLE1M2402MHzAnt1Ref BandEdgeNVNTBLE1M2402MHzAnt1Emission ReportNo.:EED32S80441801Page20of24 BandEdgeNVNTBLE1M2480MHzAnt1Ref BandEdgeNVNTBLE1M2480MHzAnt1Emission ReportNo.:EED32S80441801Page21of24 ConductedRFSpuriousEmission ConditionModeFrequency(MHz)AntennaMaxValue(dBc)Limit(dBc)Verdict NVNTBLE1M2402Ant1-54.38-20Pass NVNTBLE1M2440Ant1-55.79-20Pass NVNTBLE1M2480Ant1-54.93-20Pass ReportNo.:EED32S80441801Page22of24 TestGraphs Tx.SpuriousNVNTBLE1M2402MHzAnt1Ref Tx.SpuriousNVNTBLE1M2402MHzAnt1Emission ReportNo.:EED32S80441801Page23of24 Tx.SpuriousNVNTBLE1M2440MHzAnt1Ref Tx.SpuriousNVNTBLE1M2440MHzAnt1Emission ReportNo.:EED32S80441801Page24of24 Tx.SpuriousNVNTBLE1M2480MHzAnt1Ref Tx.SpuriousNVNTBLE1M2480MHzAnt1Emission ***EndofReport***