2ADXK-S13Pulse Oximeter

制作说明： 黑白印刷，双面印刷,采用80g书写纸。 纸张大小：（宽）25.5cm*（高）39cm 折叠后的尺寸为（宽）8.5cm *（高）6.5cm。 要求字迹清晰 此页不印刷 PulseOximeter Model:S13 UserManual DownloadApp Appname:ViHealth iOS:AppStore Android:GooglePlay Notice:Ifyouhaveinstalledthe Appbefore,pleaseupdateittothe latestversion. 1.Introduction 1.1Intendeduse Thisproductisintendedtobeusedformeasuring, displayingandstoringofoxygenlevel(SpO 2 ),pulserateof adults. It'snotamedicaldevice.ThisdeviceisforSportsand Aviationuseonlyandnotintendedformedicaluse. 1.2WarningsandCautions TheOximeterisnotintendedformedicaluse. TheOximeterisnotanapneamonitorandshould notbeusedforarrhythmiaanalysis. Donotself-diagnoseorself-medicateonthebasis ofthemeasurements.Alwaysconsultyourdoctor. Itisintendedforspot-checkuseonly. DONOTsqueezethesensorpartorapplyexcessive forceonit. DonotusethisdeviceduringMRIexamination. Donotusethisdevicewithadefibrillator. Donotstorethedeviceinthefollowinglocations: locationsinwhichthedeviceisexposedtodirect sunlight,hightemperaturesorlevelsofmoisture,or heavycontamination;locationsneartosourcesof waterorfire;orlocationsthataresubjecttostrong electromagneticinfluences. Donotusethedeviceinacombustible environment(i.e.,oxygen-enrichedenvironment). Neversubmergethedeviceinwaterorotherliquids. Donotcleanthedevicewithacetoneorother volatilesolutions. Donotdropthisdeviceorsubjectittostrong impact. Thedeviceandaccessoriesareprovidednon-sterile. Donotplacethisdeviceinpressurevesselsorgas sterilizationdevice. Donotdismantlethedevice,asthiscouldcause damageormalfunctionsorimpedetheoperationof thedevice. Consultyourdoctorimmediatelyifyouexperience symptomsthatcouldindicateacutedisease. Useonlycables,sensorsandotheraccessories specifiedinthismanual. Prolongedusingmayincreasetheriskof undesirablechangesinskincharacteristics,suchas irritation,reddening,blisteringorburns. Donotopenthedevicecoverwithoutauthorization. Thecovershouldonlybeopenedbyaqualified servicepersonnel. 1.3GuidetoSymbols Symbol Description Manufacturer Dateofmanufacture Serialnumber Uniquedeviceidentifier Indicatesthattheproductshouldnotbe discardedasunsortedwastebutmustbe senttoseparatecollectionfacilitiesfor recoveryandrecycling Refertoinstructionmanual TypeBFAppliedPart Noalarmsystem MRunsafe IP64 Indicatesthattheproductisdust-tight;and protectedagainstsplashingwater Non-ionizingradiation Indicatesthatthemarkeditemorits materialispartofarecoveryorrecycling process Indicatesthattheproductcomplieswith theapplicableFCCrequirements Temperaturelimit Humiditylimitation Atmosphericpressurelimitation 1.4Unpacking Device(mainunit) UserManual USBCable 2UsingthedeviceandApp 2.1Overview OxygenLevelPulseRate Wearthedevice.Ittracksyouroxygenlevel,pulserate andmotion. Takeoffthedevice,runapptosyncdata. 2.2Charging Chargethebatterybeforeusing. ConnectthedevicetoUSBofcomputerorUSBcharging adapter. Afterfullycharged,thedevicewillpoweroff automatically. 2.3POWERON/OFF POWERON: Clickthebuttononthesidetoturnonthedevice. POWEROFF: Automatically:deviceturnsoffautomaticallyin2minutes ifnomeasurement,nooperation,withoutApp connection. Manually:pressthebuttonforabout2secondstoturn off. 2.4Typicalsteps START.Chargethebattery.Wearthedevice,pressthe buttontopoweron. STOP.Takeoffthedevice,therecordingwillbeoverafter thecountdown. DATASYNC.Afterthecountdown,runApptosyncdata. CheckresultsinApp. 2.5Startworking 1)Wearthedeviceonthumbfinger,indexfingeras optionincaseoftootightforthumb.Trytomove thesensoralongtheforefingertofindoutabest fit.Avoidbeingloose.Loosewearingcauses inaccuratemeasure. 2)Turnonthedevice.Afterafewseconds,the devicewillbegintowork. Notice: Avoidmiddlefinger;avoidloosewearing. Iftheworkingtimeislessthan2minutes,thedata willnotbesaved. Pleaseavoidexcessivemotionforthesensedfinger duringrecordingandavoidanystrongambientlight condition. 2.6Stopworking&syncdata Takeoffthedevice,thecountdown willbegin. (Iftheworkingtimeislessthan2minutes,therewillbe nocountdown) Duringthecountdown,ifyouwearthedeviceagain,the recordwillberesumed. Afterthecountdown,thedatawillbereadyforsync. Syncdata: 1)Afterthecountdown,runApptosyncdata; 2)Ornexttimeafteryouturnonthedevice,runApp tosync. Notice:Thedevicecanstoremaximum4records.The oldestrecordwillbeoverwrittenwhenthe5 th recordis comingin.Pleasesyncdatatoyourphoneintime. 2.7ScreenDisplay Thescreenisalwaysonandisplayingthemeasuringvalue duringmonitoring. YoucanpressthePowerbuttontoswitchtodisplaying thetimeandbatterylevel. 2.8UnavailableSymbol Whenthissymboldisplaysondevicescreen,itindicates thereadingsisunavailablerightnow. Itmaybecausedby: Excessivemovement; Poorsignal,fingeristoocold; Usually,thereadingswillrecoverinafewsecondswhen atrest. 2.9BluetoothConnection ThedeviceBluetoothwillbeenabledautomaticallyafter it’sturnedon. ToestablishaBluetoothconnection, 1)keepthedeviceBluetoothenabled. 2)MakesurethephoneBluetoothisenabled. 3)RuntheApp. Notice:DONOTPAIRinthesettingsofyoursmartphone. 2.10ViewResultsandCharts InApp,youcanreviewallthehistorydata.Taparecord, therecomesoutthedetailedreport,whichincludes analysisresultsandcharts. Slidearecordtoleft,youcandeleteit. 3Maintenance 3.1Time&Date AfterconnectionwithApp,devicetimewillsyncfrom yourphonetimeautomatically. 3.2Cleaning Useasoftclothmoistenedwithwateroralcoholtoclean thedevicesurface. 3.3Battery Tokeepthebatteryingoodcondition,chargethebattery every6monthswhenthedeviceisnotinuse. 4Troubleshooting ProblemPossibleCausePossibleSolution Device doesnot turnonor no response Batterymaybe low. Chargebatteryandtry again. Unexpected software condition. Pressthebuttonfor about10secondsto reset. Devicemight bedamaged. Pleasecontactyourlocal distributor. Theapp cannot findthe device TheBluetooth ofyourphone isoff. TurnontheBluetoothin thephone. Thedevice Bluetoothisoff. Pressthebutton,the Bluetoothwillbeturned onwhenthescreen lightsup. ForAndroid, Bluetooth cannotwork without location permission. Allowlocationaccess. The device screen displays “Error1”. Errorsoccur duringdata analysis. Connectthepower supplyandplu…

Text truncated - open the document above for the full version.

ShenzhenViatomTechnologyCo.,Ltd. Address：901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet, NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Date:2026-01-16 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Ref:AttestationStatementsPart2.911(d)(7)Filing SUBJECT:FCCApplicationforFCCID:2ADXK-S13 FRN:0024194888 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthat,asofthedateofthefilingofthe application,GOLDENVICTORYINTERNATIONALTRADINGCOLTDisourdesignatedU.S. agentforserviceofprocessfortheabovereferencedFCCID.(“ShenzhenViatomTechnology Co.,Ltd.”)acceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. GOLDENVICTORYINTERNATIONALTRADINGCOLTDaccepts,asofthedateofthefiling oftheapplication,theobligationofthedesignatedU.S.agentforserviceofprocessforthe abovereferencedFCCID. DesignatedU.S.AgentInformation: Name:GOLDENVICTORYINTERNATIONALTRADINGCOLTD Address:11016THSTREETSUITE1400DENVER,CO80202UnitedStates FRN：0036377570 ContactPerson:LeonHowar Tel.:(337)255-0461 Email:[email protected] Sincerely, Signedonbehalfof（ShenzhenViatom TechnologyCo.,Ltd.） SignedonbehalfofGOLDENVICTORY INTERNATIONALTRADINGCOLTD Name:BingWangName:LeonHowar Title:ManagerTitle:Manager Date:2026-01-16Date:2026-01-16

Rev1/26/2023 (ShenzhenViatomTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:1-16-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2ADXK-S13 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthattheequipmentforwhichauthorizationissought isnot“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuanttosection 2.903oftheFCCrules. (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthattheequipmentforwhichauthorizationissought doesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.orany ofitssuccessorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofits successorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446 D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, (Applicantsignature): (Applicantprintedname):BingWang Rev1/26/2023 (ShenzhenViatomTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:1-16-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2ADXK-S13 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthat,asofthedateofthefilingoftheapplication, ShenzhenViatomTechnologyCo.,Ltd.isnotidentifiedontheCoveredList(asaspecificallynamedentity oranyofitssubsidiariesoraffiliates)asanentityproducing“covered”equipment. Sincerely, (Applicantsignature): (Applicantprintedname):BingWang

1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245H05 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WAN8010F245H05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 H 05 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245H05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 5/11 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 50 ohm transmission Line Matching Circuit ◆ Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Storage and Transportation Information Storage…

Text truncated - open the document above for the full version.

ShenzhenViatomTechnologyCo.,Ltd. Date:January16,2026 ProductModelNumber:S13,S13B,S4,Oxiband-1 FCCID:2ADXK-S13 Towhomitmayconcern, Re:ProductCertificationRepresentativeAuthorizationLetter WeauthorizeQAILaboratoriesLtd.3980NorthFraserWay,BurnabyB.C. CanadaV5J5K5toactonourbehalfonallmattersconcerningtheabove namedequipment. Thisshallincludethefollowing: Testing Approvalapplicationsandprocedures WedeclarethatQAILaboratoriesLtd.isallowedtoforwardallinformation relatedtotheapprovalprojecttotheappliedcertificationbodyandtothe notificationentitiesandtodiscussanyissuesconcerningtheapproval application.AnyandallactscarriedoutbyQAILaboratoriesLtd.onour behalfshallhavethesameeffectasactsofourown. By: ContactListedonFCCWesbite Title:Manager Email:[email protected] Telephone:+8675586638929 Onbehalfof:ShenzhenViatomTechnologyCo.,Ltd.

ShenzhenViatomTechnologyCo.,Ltd. OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:January16,2026 Subject;RequestforConfidentiality FCCID:2ADXK-S13 ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthese documentsmightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantage inthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure SoftwareSecurityRequirementsforUNIIdevices Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:BingWang Title:Manager

ShenzhenViatomTechnologyCo.,Ltd. ModelDifference Date:Jun.16,2026 Productdescription:PulseOximeter Modelname:S13,S13B,S4,Oxiband-1 FCCID:2ADXK-S13 S13istestedmodel,othermodelsarederivativemodels.Themodelsareidenticalincircuit,o nlydifferentonthemodelnamesandshellcolorandsiliconefinger covers.SothetestdataofS13canrepresentthe remainingmodels. Client’ssignature: Client’sname/title:BingWang/Manager Contactinformation/address:901,BuildingWest,LepuTower,No.66XingkeRoad, XiliCommunity,XiliStreet,NanshanDistrict,Shenzhen,518055,Guangdong,P.R. China

FCCID:2ADXK-S13 EUTPHOTOSExternalPhotos FCCID:2ADXK-S13 FCCID:2ADXK-S13 FCCID:2ADXK-S13 ※※※※※ENDOFREPORT※※※※※

Scale 1:1 Unit: mm Size: 7mm x 35mm InternalPower: 3.7V/130mAh Shenzhen Viatom Technology Co., Ltd. 25B2A00001 SN (01)06934440102847 (11)251101 (21)25B2A00001 2025-11-01 Pulse Oximeter FCC ID: 2ADXK-S13 ModelS13

FCCID:2ADXK-S13 EUTPHOTOSInternalPhotos FCCID:2ADXK-S13 ANT FCCID:2ADXK-S13 ※※※※※ENDOFREPORT※※※※※

FCCID:2ADXK-S13 RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1093，Unless specificallyrequiredbythepublishedRFexposureKDBprocedures,standalone1-gheador bodyand10-gextremitySARevaluationforgeneralpopulationexposureconditions,by measurementornumericalsimulation,isnotrequiredwhenthecorrespondingSARTest ExclusionThresholdcondition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, ForBluetooth Mode Max Power (dBm) Tune-up power (dBm) Max Power (mW) Frequency(MHz) Min. Distance (mm) Calc. thresholds limit BLE-13.19 -13±1 0.0624405 0.0186 3.0 SoaSARtestisnotrequired

ProjectNo.:ZHT-251231107W01 Page 1 of 45 Intheconfigurationtested,theEUTcompliedwiththestandardsspecifiedabove. PreparedbyReviewedby:Approvedby: LeonLi/EngineerBaretWu/DirectorLeviLee/Manager Note:ThisdevicedescribedabovehasbeentestedbyZHT,andthetestresultsshowthattheequipment undertest(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport.Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZHT, thisdocumentmaybealteredorrevisedbyZHT,personalonly,andshallbenotedintherevisionofthe document. FCCTESTREPORT FCCID:2ADXK-S13 ReportNo........................:ZHT-251231107W01 Product............................:PulseOximeter Trademark.......................:/ Model(s)...........................:S13,S13B,S4,Oxiband-1 ModelDifference..............:S13istestedmodel,othermodelsarederivativemodels.Themodelsare identicalincircuit,onlydifferentonthemodelnamesandshellcolorand siliconefingercovers.SothetestdataofS13canrepresentthe remainingmodels. Applicant..........................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Manufacturer....................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Preparedby.....................:GuangdongZhonghanTestingTechnologyCo.,Ltd. Address............................:Room104/201,Building1,YibaolaiIndustrialPark,Qiaotou,Fuhai Subdistrict,Bao'anDistrict,Shenzhen,Guangdong,China DateofReceipt................:Dec.31,2025 DateofTest(s)................: Dec.31,2025toJan.9,2026 DateofIssue....................: Jan.9,2026 Standard..........................................::FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure................................::KDB558074D0115.247MeasGuidancev05r02 ANSIC63.10:2020 ProjectNo.:ZHT-251231107W01 Page 2 of 45 TableofContents Page 1.SUMMARYOFTESTRESULTS.............................................................................................................4 2.GENERALINFORMATION.....................................................................................................................5 2.1GENERALDESCRIPTIONOFEUT...............................................................................................5 2.2DESCRIPTIONOFTESTMODES..................................................................................................6 2.3TESTSETUPCONFIGURATION....................................................................................................7 2.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)......................................................7 3.TESTFACILITYANDTESTINSTRUMENTUSED................................................................................8 3.1TESTFACILITY...............................................................................................................................8 3.2INSTRUMENTLISTFORALLTESTITEMS..................................................................................8 3.3TESTINGSOFTWARE..................................................................................................................10 3.4MEASUREMENTUNCERTAINTY................................................................................................10 4.EMCEMISSIONTEST..........................................................................................................................11 4.1CONDUCTEDEMISSIONMEASUREMENT................................................................................11 4.1.1POWERLINECONDUCTEDEMISSIONLimits.................................................................11 4.1.2TESTPROCEDURE.............................................................................................................11 4.1.3DEVIATIONFROMTESTSTANDARD................................................................................11 4.1.4TESTSETUP........................................................................................................................12 4.1.5EUTOPERATINGCONDITIONS.........................................................................................12 4.1.6TESTRESULTS...................................................................................................................13 4.2RADIATEDEMISSIONMEASUREMENT.....................................................................................15 4.2.1RADIATEDEMISSIONLIMITS............................................................................................15 4.2.2TESTPROCEDURE.............................................................................................................16 4.2.3DEVIATIONFROMTESTSTANDARD................................................................................16 4.2.4TESTSETUP........................................................................................................................16 4.2.5EUTOPERATINGCONDITIONS.........................................................................................17 5.RADIATEDBANDEMISSIONMEASUREMENT..................................................................................21 5.1TESTREQUIREMENT:...........................................................................................................21 5.2TESTPROCEDURE................................................................................................................21 5.3DEVIATIONFROMTESTSTANDARD...................................................................................21 5.4TESTSETUP...........................................................................................................................22 5.5EUTOPERATINGCONDITIONS............................................................................................22 5.6TESTRESULT............................................…

Text truncated - open the document above for the full version.

FCCID:2ADXK-S13 EUTTESTPHOTOS FCCID:2ADXK-S13 ※※※※※ENDOFREPORT※※※※※